JPS6362393A - Flame-retardant circuit board - Google Patents
Flame-retardant circuit boardInfo
- Publication number
- JPS6362393A JPS6362393A JP20594586A JP20594586A JPS6362393A JP S6362393 A JPS6362393 A JP S6362393A JP 20594586 A JP20594586 A JP 20594586A JP 20594586 A JP20594586 A JP 20594586A JP S6362393 A JPS6362393 A JP S6362393A
- Authority
- JP
- Japan
- Prior art keywords
- circuit board
- flame
- resin composition
- resin
- hollow spheres
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
- RNFJDJUURJAICM-UHFFFAOYSA-N 2,2,4,4,6,6-hexaphenoxy-1,3,5-triaza-2$l^{5},4$l^{5},6$l^{5}-triphosphacyclohexa-1,3,5-triene Chemical compound N=1P(OC=2C=CC=CC=2)(OC=2C=CC=CC=2)=NP(OC=2C=CC=CC=2)(OC=2C=CC=CC=2)=NP=1(OC=1C=CC=CC=1)OC1=CC=CC=C1 RNFJDJUURJAICM-UHFFFAOYSA-N 0.000 title claims description 12
- 239000003063 flame retardant Substances 0.000 title claims description 12
- 239000011342 resin composition Substances 0.000 claims description 21
- ADCOVFLJGNWWNZ-UHFFFAOYSA-N antimony trioxide Chemical compound O=[Sb]O[Sb]=O ADCOVFLJGNWWNZ-UHFFFAOYSA-N 0.000 claims description 14
- WKBOTKDWSSQWDR-UHFFFAOYSA-N Bromine atom Chemical compound [Br] WKBOTKDWSSQWDR-UHFFFAOYSA-N 0.000 claims description 11
- 239000012792 core layer Substances 0.000 claims description 11
- 239000000463 material Substances 0.000 claims description 11
- GDTBXPJZTBHREO-UHFFFAOYSA-N bromine Substances BrBr GDTBXPJZTBHREO-UHFFFAOYSA-N 0.000 claims description 10
- 229910052794 bromium Inorganic materials 0.000 claims description 10
- 239000002131 composite material Substances 0.000 claims description 10
- 239000010410 layer Substances 0.000 claims description 9
- 229910000831 Steel Inorganic materials 0.000 claims description 7
- 239000003822 epoxy resin Substances 0.000 claims description 7
- 239000011888 foil Substances 0.000 claims description 7
- 229920000647 polyepoxide Polymers 0.000 claims description 7
- 239000010959 steel Substances 0.000 claims description 7
- 239000004753 textile Substances 0.000 claims description 6
- 229920005989 resin Polymers 0.000 description 23
- 239000011347 resin Substances 0.000 description 23
- 239000000758 substrate Substances 0.000 description 11
- 238000000034 method Methods 0.000 description 8
- 239000011521 glass Substances 0.000 description 5
- 239000000203 mixture Substances 0.000 description 5
- 239000003795 chemical substances by application Substances 0.000 description 4
- ISWSIDIOOBJBQZ-UHFFFAOYSA-N Phenol Chemical compound OC1=CC=CC=C1 ISWSIDIOOBJBQZ-UHFFFAOYSA-N 0.000 description 3
- GYZLOYUZLJXAJU-UHFFFAOYSA-N diglycidyl ether Chemical compound C1OC1COCC1CO1 GYZLOYUZLJXAJU-UHFFFAOYSA-N 0.000 description 3
- 230000005484 gravity Effects 0.000 description 3
- CURLTUGMZLYLDI-UHFFFAOYSA-N Carbon dioxide Chemical compound O=C=O CURLTUGMZLYLDI-UHFFFAOYSA-N 0.000 description 2
- VYPSYNLAJGMNEJ-UHFFFAOYSA-N Silicium dioxide Chemical compound O=[Si]=O VYPSYNLAJGMNEJ-UHFFFAOYSA-N 0.000 description 2
- MCMNRKCIXSYSNV-UHFFFAOYSA-N Zirconium dioxide Chemical compound O=[Zr]=O MCMNRKCIXSYSNV-UHFFFAOYSA-N 0.000 description 2
- 238000007796 conventional method Methods 0.000 description 2
- QGBSISYHAICWAH-UHFFFAOYSA-N dicyandiamide Chemical compound NC(N)=NC#N QGBSISYHAICWAH-UHFFFAOYSA-N 0.000 description 2
- 230000000694 effects Effects 0.000 description 2
- 238000011156 evaluation Methods 0.000 description 2
- 239000000945 filler Substances 0.000 description 2
- 239000010419 fine particle Substances 0.000 description 2
- 239000007789 gas Substances 0.000 description 2
- 239000007788 liquid Substances 0.000 description 2
- 239000005011 phenolic resin Substances 0.000 description 2
- XNWFRZJHXBZDAG-UHFFFAOYSA-N 2-METHOXYETHANOL Chemical compound COCCO XNWFRZJHXBZDAG-UHFFFAOYSA-N 0.000 description 1
- KXGFMDJXCMQABM-UHFFFAOYSA-N 2-methoxy-6-methylphenol Chemical compound [CH]OC1=CC=CC([CH])=C1O KXGFMDJXCMQABM-UHFFFAOYSA-N 0.000 description 1
- VEORPZCZECFIRK-UHFFFAOYSA-N 3,3',5,5'-tetrabromobisphenol A Chemical compound C=1C(Br)=C(O)C(Br)=CC=1C(C)(C)C1=CC(Br)=C(O)C(Br)=C1 VEORPZCZECFIRK-UHFFFAOYSA-N 0.000 description 1
- 239000004593 Epoxy Substances 0.000 description 1
- CTKINSOISVBQLD-UHFFFAOYSA-N Glycidol Chemical compound OCC1CO1 CTKINSOISVBQLD-UHFFFAOYSA-N 0.000 description 1
- 229920000877 Melamine resin Polymers 0.000 description 1
- CTQNGGLPUBDAKN-UHFFFAOYSA-N O-Xylene Chemical compound CC1=CC=CC=C1C CTQNGGLPUBDAKN-UHFFFAOYSA-N 0.000 description 1
- 229920000180 alkyd Polymers 0.000 description 1
- PNEYBMLMFCGWSK-UHFFFAOYSA-N aluminium oxide Inorganic materials [O-2].[O-2].[O-2].[Al+3].[Al+3] PNEYBMLMFCGWSK-UHFFFAOYSA-N 0.000 description 1
- 229910052787 antimony Inorganic materials 0.000 description 1
- WATWJIUSRGPENY-UHFFFAOYSA-N antimony atom Chemical compound [Sb] WATWJIUSRGPENY-UHFFFAOYSA-N 0.000 description 1
- 239000012752 auxiliary agent Substances 0.000 description 1
- 229910002092 carbon dioxide Inorganic materials 0.000 description 1
- 239000001569 carbon dioxide Substances 0.000 description 1
- 239000003054 catalyst Substances 0.000 description 1
- 150000001805 chlorine compounds Chemical class 0.000 description 1
- 150000001875 compounds Chemical class 0.000 description 1
- XXBDWLFCJWSEKW-UHFFFAOYSA-N dimethylbenzylamine Chemical compound CN(C)CC1=CC=CC=C1 XXBDWLFCJWSEKW-UHFFFAOYSA-N 0.000 description 1
- 239000004744 fabric Substances 0.000 description 1
- 239000000835 fiber Substances 0.000 description 1
- 239000007849 furan resin Substances 0.000 description 1
- 239000003365 glass fiber Substances 0.000 description 1
- LNEPOXFFQSENCJ-UHFFFAOYSA-N haloperidol Chemical compound C1CC(O)(C=2C=CC(Cl)=CC=2)CCN1CCCC(=O)C1=CC=C(F)C=C1 LNEPOXFFQSENCJ-UHFFFAOYSA-N 0.000 description 1
- 238000007731 hot pressing Methods 0.000 description 1
- 238000005470 impregnation Methods 0.000 description 1
- 239000012770 industrial material Substances 0.000 description 1
- 239000004615 ingredient Substances 0.000 description 1
- 238000010030 laminating Methods 0.000 description 1
- 239000004850 liquid epoxy resins (LERs) Substances 0.000 description 1
- 238000004519 manufacturing process Methods 0.000 description 1
- 229910052757 nitrogen Inorganic materials 0.000 description 1
- IJGRMHOSHXDMSA-UHFFFAOYSA-N nitrogen Substances N#N IJGRMHOSHXDMSA-UHFFFAOYSA-N 0.000 description 1
- QJGQUHMNIGDVPM-UHFFFAOYSA-N nitrogen group Chemical group [N] QJGQUHMNIGDVPM-UHFFFAOYSA-N 0.000 description 1
- 229920003986 novolac Polymers 0.000 description 1
- 239000002245 particle Substances 0.000 description 1
- 229920001568 phenolic resin Polymers 0.000 description 1
- 150000003018 phosphorus compounds Chemical class 0.000 description 1
- 239000000843 powder Substances 0.000 description 1
- 239000004065 semiconductor Substances 0.000 description 1
- 238000000926 separation method Methods 0.000 description 1
- 239000000377 silicon dioxide Substances 0.000 description 1
- 229910000679 solder Inorganic materials 0.000 description 1
- 239000007787 solid Substances 0.000 description 1
- 239000000126 substance Substances 0.000 description 1
- 150000005846 sugar alcohols Polymers 0.000 description 1
- 229940124530 sulfonamide Drugs 0.000 description 1
- 150000003456 sulfonamides Chemical class 0.000 description 1
- 230000002195 synergetic effect Effects 0.000 description 1
- 239000012209 synthetic fiber Substances 0.000 description 1
- 229920002994 synthetic fiber Polymers 0.000 description 1
- 229920001187 thermosetting polymer Polymers 0.000 description 1
- 229920006337 unsaturated polyester resin Polymers 0.000 description 1
- 239000008096 xylene Substances 0.000 description 1
Abstract
(57)【要約】本公報は電子出願前の出願データであるた
め要約のデータは記録されません。(57) [Abstract] This bulletin contains application data before electronic filing, so abstract data is not recorded.
Description
【発明の詳細な説明】
［産業上の利用分野］
一般に、民生用には紙／フェノール基板が、産業用には
ガラス／エポキシ基板が１１ノント基板素材の主流を占
めている。半導体の技術進歩に伴い、プリント配線板の
需要はますます多くなり、また高性能化が要求されてき
ている。[Detailed Description of the Invention] [Industrial Field of Application] In general, paper/phenol substrates are the mainstream substrate materials for consumer use, and glass/epoxy substrates are the mainstream substrate materials for industrial use. With the advancement of semiconductor technology, the demand for printed wiring boards is increasing, and higher performance is also required.
従来、中空球体を回路基板に導入して誘電率の低い基板
を得ることは公知でおる。（特公昭５７−１Ｂ３５３＠
）。また、中空球体を含む樹脂層と、樹脂と基材とから
なる層、および鋼箔が積層されてなる回路基板について
は特開昭６０−１６７３９４号においてすでに提案した
。また、中空球体のような比重の異なるフィラーが混合
された樹脂組成物から均一、かつ厚みの必るシートを得
るには特開昭６１−１０４３０号および特願昭６０−８
７１６４か有用である。Conventionally, it has been known to introduce hollow spheres into a circuit board to obtain a board with a low dielectric constant. (Tokuko Sho 57-1B353@
). Furthermore, a circuit board formed by laminating a resin layer containing hollow spheres, a layer consisting of resin and a base material, and steel foil has already been proposed in JP-A-60-167394. In addition, in order to obtain a uniform and thick sheet from a resin composition in which fillers such as hollow spheres having different specific gravities are mixed, Japanese Patent Application Laid-Open No. 61-10430 and Japanese Patent Application No. 60-8
7164 is useful.
樹脂に難燃性を付与するには、経験的に燐化合物、臭素
化合物、塩素化合物を添加や反応させる方法が古くから
知られている。また、三酸化アンチモンを助剤として添
加すると相乗効果をもつことも公知である（たとえば、
工業材料 ２１巻、Ｎｏ、 ４． ＡＰＲ（１９７３）
Ｐ、 ７参照〉。In order to impart flame retardancy to resins, it has long been known to empirically add or react with phosphorus compounds, bromine compounds, and chlorine compounds. It is also known that adding antimony trioxide as an auxiliary agent has a synergistic effect (for example,
Industrial Materials Volume 21, No. 4. APR (1973)
See page 7>.
以上のように、樹脂に中空球体を導入することによりプ
リント基板の性能のうち最も重要なものである誘電特性
の優れた基板を得ることができる。As described above, by introducing hollow spheres into the resin, a board with excellent dielectric properties, which is the most important performance of a printed circuit board, can be obtained.
［発明が解決しようとする問題点コ
しかしながら、単に中空球体をフィラーとして樹脂に添
加する従来の技術では誘電特性以外の回路基板としての
性能、特に難燃性について満足なものが得られないとい
う欠点があった。[Problems to be Solved by the Invention] However, the conventional technique of simply adding hollow spheres to resin as fillers has the disadvantage that satisfactory performance as a circuit board other than dielectric properties, especially flame retardance, cannot be obtained. was there.
中空球体の中には通常不燃性ガスである窒素、または、
炭酸ガスが含有されているが、そのために中空球体を混
合した組成物を炎に暴した場合、樹脂の見かけの表面積
が増加することになり、燃焼しやすくなるのでおる。Inside the hollow sphere is nitrogen, which is usually a nonflammable gas, or
Although carbon dioxide gas is contained, when a composition containing hollow spheres is exposed to a flame, the apparent surface area of the resin increases, making it more likely to burn.
また、中空球体を大量に導入すると混合樹脂の粘度が増
加するので樹脂板への加工性が悪くなるという問題点も
あった。Furthermore, when a large number of hollow spheres are introduced, the viscosity of the mixed resin increases, resulting in poor processability into resin plates.
上述のように中空球体を導入した樹脂組成物を難燃化し
、それによって基板の難燃規格を満足させることはかな
りの困難を伴うものでめった。As mentioned above, it was very difficult and rare to make a resin composition into which hollow spheres were introduced flame retardant and thereby satisfy the flame retardant standards for the substrate.
そこで本発明は、回路基板に中空球体を導入する際、製
造法を考慮し、かつ基板としても重要な種々の特性を満
足しなから難燃性を十分に与える方法について検討した
結果つきの結論に到達したものである。Therefore, the present invention has been made based on the results of considering the manufacturing method when introducing hollow spheres into a circuit board, and examining a method for providing sufficient flame retardance while satisfying various important characteristics for the board. It has been reached.
［問題を解決するための手段］
本発明は、かかる従来技術の欠点を解消するために下記
の構成を有する。[Means for Solving the Problems] The present invention has the following configuration in order to eliminate the drawbacks of the prior art.
すなわち、本発明は、芯層の両面に、樹脂組成物と織物
基材との複合層を形成し、さらにその各複合層の表面に
鋼箔を貼着してなる回路基板であって、前記芯層は、臭
素化エポキシ樹脂を主体とする樹脂組成物と、微小中空
球体との複合材料からなり、かつ前記微小中空球体の含
有量が４０〜６０％であることを特徴とする難燃性回路
基板に関するものである。That is, the present invention provides a circuit board in which composite layers of a resin composition and a textile base material are formed on both sides of a core layer, and steel foil is further adhered to the surface of each composite layer, the circuit board comprising: The core layer is made of a composite material of a resin composition mainly composed of brominated epoxy resin and micro hollow spheres, and the content of the micro hollow spheres is 40 to 60%. It relates to circuit boards.
微小中空球体としては、アルミナ、シリカ、ジルコニア
、ガラス、シラスなどの無機物からなるもの、およびフ
ェノール樹脂からなるものがあげられる。たとえば、商
品名では、フィライト（日本フィライト）、シラスバル
ーン（三機工業）、エコスフイア（ＥＨＥＲ３ＯＮ Ｃ
ＵＨＩＮＧ ＩＮＣ，）、グラスバブルス（３Ｍ社）、
フェノールバルー ン（ＵＮＩＯＮＣＡＲＢＩＤＥ）な
どが該当する。中空球体の特性としては、その強度およ
び誘電率から１０〜２００μｍ直径の大きざのもの、ま
た、嵩比重が０．２〜０．８の範囲のものが用いられる
。Examples of the microscopic hollow spheres include those made of inorganic substances such as alumina, silica, zirconia, glass, and shirasu, and those made of phenolic resin. For example, product names include Phyllite (Nippon Phyllite), Shirasu Balloon (Sanki Kogyo), and Ecosphere (EHER3ON C).
UHING INC, ), Glass Bubbles (3M Company),
Examples include phenol balloons (UNIONCARBIDE). As for the characteristics of the hollow sphere, one having a diameter of 10 to 200 μm and one having a bulk specific gravity of 0.2 to 0.8 are used in view of its strength and dielectric constant.
本発明で記述する微小中空球体と樹脂組成物とからなる
芯層を以後コアシートと呼ぶことにする。The core layer composed of micro hollow spheres and a resin composition described in the present invention will be referred to as a core sheet hereinafter.
コアシート用樹脂としては、臭素を含有するフェノール
樹脂、エポキシ樹脂、フラン樹脂、不飽和ポリエステル
樹脂、キシレン樹脂、アルキド樹脂、スルホンアミド樹
脂、メラミン樹脂などの熱硬化性樹脂が挙げられる。Examples of the resin for the core sheet include thermosetting resins such as bromine-containing phenol resins, epoxy resins, furan resins, unsaturated polyester resins, xylene resins, alkyd resins, sulfonamide resins, and melamine resins.
臭素を導入するには、種々の方法がある。たとえば、主
剤を臭素化する方法、硬化剤を臭素化する方法、臭素含
有化合物を添加する方法などいずれの方法でも可能であ
る。There are various ways to introduce bromine. For example, any method such as brominating the base agent, brominating the curing agent, or adding a bromine-containing compound can be used.
臭素の含有量はコアシート用樹脂組成物すなわち、主剤
、硬化剤および少量の触媒の合計重量に対して１０−３
０重量％が好ましい。The bromine content is 10-3 based on the total weight of the core sheet resin composition, that is, the main resin, curing agent, and a small amount of catalyst.
0% by weight is preferred.
コアシートの中空球体の含有量は、得られるコアシート
の特性および作業性から体積百分率で４０〜６０が適当
である。樹脂組成物がこの範囲を越えて多いと樹脂と中
空球体が分離を起しやすく、また、中空球体がこの範囲
を越えると粘度が高くなりすぎて取扱いが困難となるか
らである。The content of hollow spheres in the core sheet is suitably 40 to 60 in volume percentage in view of the properties and workability of the core sheet obtained. If the amount of the resin composition exceeds this range, the resin and the hollow spheres are likely to separate, and if the content of the hollow spheres exceeds this range, the viscosity of the hollow spheres will become too high, making handling difficult.
コアシートは特開昭６１−０１０４３０＠および特願昭
６０−８７１６４号を参考にして反りのない均一なもの
を作成することができる。A uniform core sheet without warping can be prepared by referring to Japanese Patent Application Laid-Open No. 61-010430@ and Japanese Patent Application No. 60-87164.
三酸化アンチモンはできるだけ平均粒子径１μｍ以下に
微粉化したもの、たとえば王国精練（株〉製の微粒子量
が用いられる。樹脂組成物への添加は通常の方法に従え
ば良いが分散を充分に行うために三本ロールなどを用い
てさらに微粉化した方が好ましい。Antimony trioxide is preferably pulverized to an average particle size of 1 μm or less, for example, fine particles manufactured by Kingdom Seiren Co., Ltd. It can be added to the resin composition by following the usual method, but be sure to disperse it thoroughly. Therefore, it is preferable to further pulverize the powder using a three-roll mill or the like.
三酸化アンチモンの添加量はコアシート用樹脂組成物に
対して１〜５重量部が好ましい。１より小さいと難燃効
果が小さい、また５より大きいと分離などの障害があり
作業面から不都合が生じるためである。The amount of antimony trioxide added is preferably 1 to 5 parts by weight based on the resin composition for the core sheet. This is because if it is smaller than 1, the flame retardant effect will be small, and if it is larger than 5, problems such as separation may occur, resulting in inconvenience in terms of work.
樹脂組成物と織物基材との複合層を以後プリプレグと呼
ぶことにする。プリプレグ用の樹脂組成物はコアシート
用樹脂組成物と同じでも良いし異なっても良い。耐燃性
の面からは、これも臭素○有組成物の方が好ましい。The composite layer of the resin composition and the textile base material will hereinafter be referred to as prepreg. The resin composition for the prepreg may be the same as or different from the resin composition for the core sheet. From the standpoint of flame resistance, bromine-containing compositions are also preferred.
織物基材は、ガラス繊維、合成繊維、天然繊維などから
なる織物が使用される。含浸方法としては通常の方法、
すなわち、樹脂溶液の中に基材を連続的に浸し、次いで
連続的に加熱乾燥する方法が採用されている。As the textile base material, a textile made of glass fiber, synthetic fiber, natural fiber, etc. is used. The impregnation method is the usual method,
That is, a method is adopted in which a base material is continuously immersed in a resin solution and then continuously heated and dried.
鋼箔は厚さ９．１８，３５．７０ｔｉｍのものがよく用
いられている。Steel foils with thicknesses of 9.18 and 35.70 tim are often used.
［実施例］
臭素含有の液状エポキシ樹脂（テトラブロモビスフェノ
ールＡのジグリシジルエーテル、グリシドールのジグリ
シジルエーテル、多価アルコールのジグリシジルエーテ
ル、硬化剤゛エピクロンパＢ６５０ （大日本インキ（
株）製）、ジメチルベンジルアミン） （いずれも常温
で液体）を樹脂成分として、この樹脂成分と平均直径６
０μｍ、比重０．３８の中空球体（“グラスバブル”
３３Ｂ／４０００、３Ｍ社製）を所定の容積比になるよ
うに混合した。なお、臭素含有間は上記エポキシ樹脂３
成分の比率を変えることによって制御した。[Example] Bromine-containing liquid epoxy resin (diglycidyl ether of tetrabromobisphenol A, diglycidyl ether of glycidol, diglycidyl ether of polyhydric alcohol, curing agent "Epiclompa B650" (Dainippon Ink)
Co., Ltd.), dimethylbenzylamine) (both are liquid at room temperature) as a resin component, and this resin component and an average diameter of 6
Hollow sphere with a diameter of 0 μm and a specific gravity of 0.38 (“glass bubble”)
33B/4000, manufactured by 3M Company) were mixed at a predetermined volume ratio. Note that the epoxy resin 3 above contains bromine.
Controlled by changing the ratio of ingredients.
王国精練（株）製の三駿化アンチモン（微粒子）を“エ
ピコート”８２８（油化シェル（株））に３本ロールを
用いて充分に分散させ、６０％（重量）のペーストを作
った。このペーストを上記成分に所定量を添加して樹脂
混合物とした。Antimony trisunide (fine particles) manufactured by Kingdom Seiren Co., Ltd. was sufficiently dispersed in "Epicoat" 828 (Yuka Shell Co., Ltd.) using three rolls to form a 60% (by weight) paste. A predetermined amount of this paste was added to the above components to prepare a resin mixture.
この混合物を真空脱泡した後、特願昭５９−１３０８５
７号の第１図に示す鉛直型ダブルベルト装置を用いて、
回転ベルト間にスリットから押し出した。After vacuum defoaming of this mixture,
Using the vertical double belt device shown in Figure 1 of No. 7,
It was pushed out through a slit between rotating belts.
そして鉛直方向に走行させながら、ベルト温度１５０’
Ｃ，時間は３０分で硬化させて１．２ｍｍのクリアラン
スのダブルベルト間から平板をひき取り、１．２ｍｍの
樹脂シートを得た。このものは’１３０℃加熱しても流
動性は全くなくいわゆるＣステージの状態にあった。Then, while running in the vertical direction, the belt temperature was increased to 150'.
C. After curing for 30 minutes, a flat plate was removed from between the double belts with a clearance of 1.2 mm to obtain a 1.2 mm resin sheet. This material had no fluidity at all even when heated to 130° C. and was in a so-called C-stage state.
ついで、゛′エピコート”１０４５（臭素エポキシ樹脂
、常温で固体）、“′エピコート”１５４（フェノール
ノボラック型エポキシ樹脂、常温で液体）、ジシアンジ
アミド（ＤＩＣＹ） 、メチルセロソルブをそれぞれ８
０．２０．４．１００部の割合で混合し、これをガラス
クロス（ＷＥ１ＢＫ日束紡績製〉に常法により含浸させ
Ｂステージのプリプレグ作成した。樹脂シートを中央に
してプリプレグ２枚、鋼箔２枚を重ねて、温度１６０’
Ｃ，圧力３５ｋｇ／−で３０分間、加熱プレスし図面の
断面をもつ基板を作った。Next, 80% each of ``Epicoat'' 1045 (brominated epoxy resin, solid at room temperature), ``Epicoat'' 154 (phenol novolak type epoxy resin, liquid at room temperature), dicyandiamide (DICY), and methyl cellosolve were added.
0.20.4.100 parts were mixed, and this was impregnated into a glass cloth (manufactured by WE1BK Nichizuka Spinning Co., Ltd.) using a conventional method to create a B-stage prepreg.With the resin sheet in the center, two sheets of prepreg and a steel foil were mixed. Stack two sheets and heat to 160'.
C. A substrate having the cross section shown in the drawing was produced by hot pressing at a pressure of 35 kg/- for 30 minutes.
厚さは、’１．５ｍｍであった。得られた基板は厚み班
も小さく、２６０℃の半田浴に浸漬して剥離や膨れは全
く見られなかった。The thickness was 1.5 mm. The obtained substrate had a small thickness area, and no peeling or blistering was observed when immersed in a 260° C. solder bath.
評価のうち、耐燃性は、ＪＩＳ ６９１１垂直法（ＵＬ
−９４に相当）に従って測定し、■−０の場合○印、Ｖ
−Ｏを満たさなかった場合Ｘ印により区別した。作業性
とは直接的には粘度を指し、樹脂／中空球体の混合物の
粘度が低く作業し易く、中空球体、三酸化アンチモンが
分離しない場合○印を、そうでない場合にＸ印を付した
。基板の性能としては、直接的には基板中の中空球体お
よび三酸化アンチモンの分散性を示し、分散性の良好な
ものに○そうでないものにＸ印を付した。Among the evaluations, flame resistance was determined according to JIS 6911 vertical method (UL
-94), and if -0, mark ○, V
If -O was not satisfied, it was distinguished by an X mark. Workability directly refers to viscosity, and if the viscosity of the resin/hollow sphere mixture is low and easy to work with, and the hollow spheres and antimony trioxide do not separate, it is marked with an ○, and if not, it is marked with an X. The performance of the substrate directly indicates the dispersibility of the hollow spheres and antimony trioxide in the substrate, and those with good dispersibility are marked with an ○ and those with poor dispersibility are marked with an X.
得られた１、６ｍｍ厚さの回路基板の評価結果を第１表
に示した。表から分るように、本発明において提案した
条件下において難燃性、作業性、基板性能をすべて満足
する結果が得られた。Table 1 shows the evaluation results of the obtained circuit board with a thickness of 1.6 mm. As can be seen from the table, results satisfying all of the flame retardance, workability, and substrate performance were obtained under the conditions proposed in the present invention.
［発明の効果］
本発明は、樹脂組成物に対する中空球体の割合、臭素含
有量を考１ｍすることにより、作業性、基板性能などの
種々の特性を満足しながら、充分な難燃性を持つ回路基
板を提供するものである。[Effects of the Invention] By considering the ratio of hollow spheres to the resin composition and the bromine content of 1 m, the present invention has sufficient flame retardancy while satisfying various characteristics such as workability and substrate performance. The present invention provides a circuit board.
図面に本発明に係わる回路基板の一例を示す。
その椙成は、鋼箔１、樹脂２、基材３、樹脂４、中空球
体５である。
特許出願人 東 し 株 式 会 社手続ネ市正書
１、事件の表示
昭和６１年特許願第２０５９４５号
２、発明の名称
難燃性回路基板
３、補正をする者
事件との関係 特許出願人
住所 東京都中央区日本橋室町２丁目２番地名称 （３
１５）東し株式会社
５、補正により増加する発明の数 なし明細書中
（１） 特許請求の範囲を別紙のとおり補正します。
（２）第４頁１３行のｒ６０％であることをＪを「６０
％（容積）であることをＪと補正します。
特許請求の範囲
（１）芯層の両面に、樹脂組成物と織物基材との複合層
を形成し、さらにその各複合層の表面に鋼箔を貼着して
なる回路基板であって、前期芯層は、臭素化エポキシ樹
脂を主体とする樹脂組成物と、微小中空球体との複合材
料からなり、かつ前記微小中空体の含有量が４０〜６０
％（容積）で必ることを特徴とする難燃性回路基板。
（２） 芯層が、樹脂組成物に対し、１〜５重量部の
三酸化アンチモンを含有することを特徴とする特許請求
の範囲第（１）項記載の難燃性回路基板。
（３〉 芯層が、樹脂組成物に対し、１０〜３０重量
％の臭素を含有することを特徴とする特許請求の範囲第
（１）項記載の難燃性回路基板。
手続ネ１ｎ正書
昭和 年６２．丹１５日
？？ｒ５’ＦＩＴＦｚＳ’ ＲＦＢ Ｆ’ｆＪ Ｍ Ｖ
昏、１、事件の表示
昭和６１年特許願第２０５９４５号
２、発明の名称
難燃性回路基板
３、補正をする者
変更
名称 （３１５）東し株式会社
５、補正により増加する発明の数 なし６、補正の対
象
明細書中
（１）第１頁第２０行目に、
「 本発明は、難燃性に優れた回路基板に関する。
［従来の技術］」
を挿入します。The drawings show an example of a circuit board according to the present invention. Its components are a steel foil 1, a resin 2, a base material 3, a resin 4, and a hollow sphere 5. Patent Applicant Higashi Shi Co., Ltd. Company Procedure Ne City Official Book 1, Indication of Case Patent Application No. 205945 of 1985 2, Name of Invention Flame Retardant Circuit Board 3, Person Making Amendment Relationship with Case Patent Applicant Address 2-2 Nihonbashi Muromachi, Chuo-ku, Tokyo Name (3
15) Toshi Co., Ltd. 5. Number of inventions increased by amendment None In the specification (1) The scope of claims will be amended as shown in the attached sheet. (2) On page 4, line 13, r60% is expressed by J as “60
Correct the fact that it is % (volume) with J. Claims (1) A circuit board formed by forming composite layers of a resin composition and a textile base material on both sides of a core layer, and further adhering steel foil to the surface of each composite layer, The first core layer is made of a composite material of a resin composition mainly composed of brominated epoxy resin and micro hollow spheres, and the content of the micro hollow spheres is 40 to 60.
% (volume) flame retardant circuit board. (2) The flame-retardant circuit board according to claim (1), wherein the core layer contains 1 to 5 parts by weight of antimony trioxide based on the resin composition. (3) The flame-retardant circuit board according to claim (1), wherein the core layer contains 10 to 30% by weight of bromine based on the resin composition. Showa 62.Tan 15th??r5'FITFzS' RFB F'fJ M V
1. Indication of the incident 1985 Patent Application No. 205945 2. Name of the invention Flame-retardant circuit board 3. Changed name of the person making the amendment (315) Toshi Co., Ltd. 5. Number of inventions increased by the amendment None. 6. Insert "The present invention relates to a circuit board with excellent flame retardancy. [Prior art]" in (1) page 1, line 20 of the specification subject to amendment.
Claims (3)
を形成し、さらにその各複合層の表面に鋼箔を貼着して
なる回路基板であって、前記芯層は、臭素化エポキシ樹
脂を主体とする樹脂組成物と、微小中空球体との複合材
料からなり、かつ前記微小中空球体の含有量が４０〜６
０％であることを特徴とする難燃性回路基板。(1) A circuit board formed by forming composite layers of a resin composition and a textile base material on both sides of a core layer, and further adhering steel foil to the surface of each composite layer, wherein the core layer is , is made of a composite material of a resin composition mainly composed of a brominated epoxy resin and micro hollow spheres, and the content of the micro hollow spheres is 40 to 6
A flame retardant circuit board characterized by having a flame retardance of 0%.
化アンチモンを含有することを特徴とする特許請求の範
囲第（１）項記載の難燃性回路基板。(2) The flame-retardant circuit board according to claim (1), wherein the core layer contains 1 to 5 parts by weight of antimony trioxide based on the resin composition.
臭素を含有することを特徴とする特許請求の範囲第（１
）項記載の難燃性回路基板。(3) Claim (1) characterized in that the core layer contains 10 to 30% by weight of bromine based on the resin composition.
) The flame-retardant circuit board described in item 2.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP20594586A JPS6362393A (en) | 1986-09-03 | 1986-09-03 | Flame-retardant circuit board |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP20594586A JPS6362393A (en) | 1986-09-03 | 1986-09-03 | Flame-retardant circuit board |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| JPS6362393A true JPS6362393A (en) | 1988-03-18 |
Family
ID=16515315
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP20594586A Pending JPS6362393A (en) | 1986-09-03 | 1986-09-03 | Flame-retardant circuit board |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPS6362393A (en) |
Cited By (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPH09321412A (en) * | 1996-05-27 | 1997-12-12 | Noda Screen:Kk | Manufacture of printed wiring board |
| US6042936A (en) * | 1997-09-23 | 2000-03-28 | Fibermark, Inc. | Microsphere containing circuit board paper |
| US6165544A (en) * | 1998-01-09 | 2000-12-26 | Noda Screen Co., Ltd. | Method of exposure of photo-curing resin applied to printed circuit board |
| JP2010111115A (en) * | 2008-10-10 | 2010-05-20 | Hitachi Chem Co Ltd | Metal foil-clad laminate, double-sided metal foil-clad laminate, method of manufacturing the same, and printed wiring board |
-
1986
- 1986-09-03 JP JP20594586A patent/JPS6362393A/en active Pending
Cited By (5)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPH09321412A (en) * | 1996-05-27 | 1997-12-12 | Noda Screen:Kk | Manufacture of printed wiring board |
| US6042936A (en) * | 1997-09-23 | 2000-03-28 | Fibermark, Inc. | Microsphere containing circuit board paper |
| US6165544A (en) * | 1998-01-09 | 2000-12-26 | Noda Screen Co., Ltd. | Method of exposure of photo-curing resin applied to printed circuit board |
| US6583849B1 (en) | 1998-01-09 | 2003-06-24 | Noda Screen Co., Ltd. | Apparatus for exposure of photo-curing resin applied to printed circuit board |
| JP2010111115A (en) * | 2008-10-10 | 2010-05-20 | Hitachi Chem Co Ltd | Metal foil-clad laminate, double-sided metal foil-clad laminate, method of manufacturing the same, and printed wiring board |
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