JPS6362120B2 - - Google Patents
Info
- Publication number
- JPS6362120B2 JPS6362120B2 JP14807881A JP14807881A JPS6362120B2 JP S6362120 B2 JPS6362120 B2 JP S6362120B2 JP 14807881 A JP14807881 A JP 14807881A JP 14807881 A JP14807881 A JP 14807881A JP S6362120 B2 JPS6362120 B2 JP S6362120B2
- Authority
- JP
- Japan
- Prior art keywords
- balls
- conductor
- die
- conductive
- ball
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired
Links
- 239000000919 ceramic Substances 0.000 claims description 25
- 239000004020 conductor Substances 0.000 claims description 21
- 239000000758 substrate Substances 0.000 claims description 13
- 238000000034 method Methods 0.000 claims description 9
- 238000003825 pressing Methods 0.000 claims description 4
- 238000004519 manufacturing process Methods 0.000 description 3
- 239000002184 metal Substances 0.000 description 2
- 229910052751 metal Inorganic materials 0.000 description 2
- 238000005520 cutting process Methods 0.000 description 1
- PCHJSUWPFVWCPO-UHFFFAOYSA-N gold Chemical compound [Au] PCHJSUWPFVWCPO-UHFFFAOYSA-N 0.000 description 1
- 239000010931 gold Substances 0.000 description 1
- 229910052737 gold Inorganic materials 0.000 description 1
- 238000004806 packaging method and process Methods 0.000 description 1
- 230000000149 penetrating effect Effects 0.000 description 1
- 238000004080 punching Methods 0.000 description 1
- 239000004065 semiconductor Substances 0.000 description 1
- 229910001220 stainless steel Inorganic materials 0.000 description 1
- 239000010935 stainless steel Substances 0.000 description 1
Landscapes
- Production Of Multi-Layered Print Wiring Board (AREA)
- Printing Elements For Providing Electric Connections Between Printed Circuits (AREA)
Description
【発明の詳細な説明】
本発明はセラミツク基板への導体ボール充填方
法の改良に関する。DETAILED DESCRIPTION OF THE INVENTION The present invention relates to an improved method of filling conductor balls into a ceramic substrate.
LSI、超LSIのような半導体装置を高密度実装
するために用いられるセラミツク多層回路基板を
製造するに際し、上記多層基板の各層を構成する
セラミツク基板に、基板の二つの主面間を貫通す
る導電路を設けなければならない。この基板を貫
通する導電路として、セラミツク基板中に金のよ
うな導電性の良い金属よりなる微小導体ボールを
充填し、この導体ボールにより基板の二つの主面
上に形成された導電回路間を電気的に接続する構
造が既に提唱されている。 When manufacturing ceramic multilayer circuit boards used for high-density packaging of semiconductor devices such as LSIs and VLSIs, the ceramic substrates constituting each layer of the multilayer board have electrical conductors that penetrate between the two main surfaces of the board. A road must be established. As a conductive path penetrating this substrate, micro conductive balls made of a highly conductive metal such as gold are filled in the ceramic substrate, and these conductive balls connect the conductive circuits formed on the two main surfaces of the substrate. Structures for electrical connection have already been proposed.
上記導体ボールをセラミツク基板に充填するの
は、先ずグリーンシートを呼ばれる未焼成セラミ
ツク基板(以下セラミツク生シートと称する)に
ガイド孔を開孔し、次いでダイユニツト(プレス
装置)の下型に設けられたガイドピンを前記ガイ
ド孔に挿通せしめることにより上記セラミツク生
シートを下型上に固定し、その上に同じくガイド
ホールを有し、且つこのガイド孔を基準に所定の
相互位置関係を保持して開孔された多数のボール
配列孔を有するボール配列用のガイド板をかぶ
せ、次いで上記配列孔に導体ボールを1個ずつ挿
入配列し、このボールを上型に前記配列孔に対応
して設けられた圧力ピンにより押圧するという方
法が用いられていた。 To fill a ceramic substrate with the conductive balls, first, guide holes are made in an unfired ceramic substrate (hereinafter referred to as green ceramic sheet) called a green sheet, and then guide holes are formed in the lower mold of a die unit (pressing device). The raw ceramic sheet is fixed on the lower mold by inserting the guide pin into the guide hole, and the raw ceramic sheet is opened while having the same guide hole thereon and maintaining a predetermined mutual positional relationship based on the guide hole. A ball arranging guide plate having a large number of ball arranging holes is covered, and then conductor balls are inserted and arranged one by one into the arranging holes, and these balls are placed in the upper mold in correspondence with the arranging holes. A method of pressing with a pressure pin was used.
かかる従来の導体ボール充填方法は、工程数が
多く、しかも前記配列孔にボールを確実に1個ず
つ挿入することが必ずしも容易ではないという難
点があつた。 Such conventional conductor ball filling methods require a large number of steps and have the disadvantage that it is not always easy to reliably insert the balls one by one into the arrangement holes.
本発明の目的は一工程でガイド孔を開孔すると
共に導体ボールを正確に充填し得る導体ボールの
充填方法を提供することにある。そのため本発明
はガイド孔を開孔するためのポンチと該ポンチと
所定の相互位置関係を有して開孔された真空吸引
口を有する上型の、前記真空吸引口に所定の導体
ボールを吸着せしめ、前記ポンチに対応するダイ
を有する下型上にセラミツク生シートを載置し、
前記上型及び下型よりなるダイユニツトを作動せ
しめることにより、前記セラミツク生シートにガ
イド孔を開孔すると共に導体ボールを充填するこ
とを特徴とする。 SUMMARY OF THE INVENTION An object of the present invention is to provide a method for filling conductor balls, which allows guide holes to be opened and conductor balls to be filled accurately in one step. Therefore, the present invention provides an upper mold having a punch for punching a guide hole and a vacuum suction port formed in a predetermined mutual positional relationship with the punch, and a predetermined conductive ball is attracted to the vacuum suction port. Then, a raw ceramic sheet is placed on a lower mold having a die corresponding to the punch,
The present invention is characterized in that guide holes are formed in the raw ceramic sheet and filled with conductor balls by operating the die unit consisting of the upper mold and the lower mold.
以下本発明の一実施例を図面により説明する。 An embodiment of the present invention will be described below with reference to the drawings.
第1図は本発明の導体ボール充填方法の一実施
例を説明するための正面図で、一部に断面を示
す。同図において、1はセラミツク生シート、2
は導体ボール、3及び4はそれぞれ下型及び上型
で両者でダイユニツトを構成し、5は上記上型4
の加圧面(図の下面)に開口された真空吸引口で
マニホールド6を介して真空排気装置(図示せ
ず)に接続する。7はポンチで上記真空吸引口と
相互位置関係を正確に保持して設けられ、8は上
記ポンチに対応するダイ、9はカツターである。
また10,11,12,13はそれぞれダイセツ
トの下ベース、上ベース、ポール及びシヤンクで
ある。 FIG. 1 is a front view for explaining one embodiment of the conductor ball filling method of the present invention, and a section is partially shown. In the figure, 1 is a raw ceramic sheet, 2
3 and 4 are a lower mold and an upper mold, respectively, and they constitute a die unit. 5 is the upper mold 4.
A vacuum suction port opened on the pressurizing surface (bottom surface in the figure) is connected to a vacuum evacuation device (not shown) via a manifold 6. Reference numeral 7 designates a punch which is provided in an accurate mutual positional relationship with the vacuum suction port, 8 a die corresponding to the punch, and 9 a cutter.
Further, 10, 11, 12, and 13 are a lower base, an upper base, a pole, and a shank, respectively, of the die set.
同図に見られる如くまず上型4の真空吸引口5
に導体ボール2を吸着せしめる。この真空吸引口
5の直径は吸着すべき導電ボールの外径の凡そ80
%程度とすることが実用上好ましい。このように
真空吸引口の直径を導体ボールの外径よりも僅か
に小さい寸法としておくと、外径の著しく小さい
導電ボールが混入した場合にこれを吸引除去する
ことが可能となり、導電ボールが小さ過ぎること
に起因するセラミツク基板の上下両主面間の導通
不良等の障害の発生を防止し得る。 As shown in the figure, first, the vacuum suction port 5 of the upper mold 4
The conductor ball 2 is attracted to the conductor ball 2. The diameter of this vacuum suction port 5 is approximately 80 mm of the outer diameter of the conductive ball to be sucked.
% is practically preferable. By making the diameter of the vacuum suction port slightly smaller than the outer diameter of the conductive ball in this way, if a conductive ball with an extremely small outer diameter gets mixed in, it will be possible to remove it by suction. It is possible to prevent problems such as poor conduction between the upper and lower main surfaces of the ceramic substrate caused by excessive heat transfer.
一方下型3上にセラミツク生シート1を載置す
る。このセラミツク生シートは作成すべきセラミ
ツク基板より大きいものであつても、連続シート
であつても良いことは言うまでもない。 On the other hand, the raw ceramic sheet 1 is placed on the lower mold 3. It goes without saying that this raw ceramic sheet may be larger than the ceramic substrate to be produced, or may be a continuous sheet.
このようにした後、上記ダイセツトを作動させ
て上型4を下降せしめることにより、ポンチ7及
びダイ8によりガイド孔の開孔と、カツタ9によ
り外形切断と、導電ボール2の充填とを1シヨツ
トで行なうことができる。 After doing this, by operating the die set and lowering the upper die 4, the punch 7 and die 8 open the guide hole, the cutter 9 cuts the outer shape, and the conductive balls 2 are filled in one shot. It can be done with
第2図は上述のようにして導電ボールを充填さ
れたセラミツクシートを示す断面図で、1はセラ
ミツク生シート、2は充填された導電ボール、1
4は開孔されたガイド孔である。 FIG. 2 is a cross-sectional view showing a ceramic sheet filled with conductive balls as described above, where 1 is a raw ceramic sheet, 2 is a filled conductive ball, 1
4 is a drilled guide hole.
本実施例においては上述の説明により既に明ら
かな如く、導体ボール2の充填と、ガイド孔14
の開孔と、外形の切断とを1シヨツトで行なうこ
とができるので、工程が著しく簡単化される。ま
たガイド孔14と導体ボール2の相互位置関係
は、上型を精度よく製作しておくことにより、各
シヨツトごとのバラツキのない一様且つ正確なも
のとなる。更に一つの真空吸引口5に導体ボール
2は1個のみ吸着されるので、同一場所に複数個
の導体ボール2が充填されることもない。 In this embodiment, as already clear from the above description, filling of the conductor balls 2 and guide holes 14 are performed.
Since the opening of the hole and the cutting of the outer shape can be performed in one shot, the process is significantly simplified. Further, the mutual positional relationship between the guide hole 14 and the conductor ball 2 can be made uniform and accurate with no variation from shot to shot by manufacturing the upper mold with high precision. Furthermore, since only one conductor ball 2 is attracted to one vacuum suction port 5, a plurality of conductor balls 2 are not filled in the same place.
なお前記第1図において上型4を説明の便宜上
一体物とした図を示したが、これは勿論割り型と
して良く、更に導体ボール2の充填に必要な加圧
力はごく小さいので、前述の上型4の加圧面の真
空吸引口5を設ける部分は例えばステンレスのよ
うな金属薄板を用いて作成してもよい。従つて本
発明は導体ボール2の数や位置が異なる複数種類
のセラミツク基板を製作する場合にも用いること
ができる。 Although the upper mold 4 is shown as an integral part for convenience of explanation in FIG. 1, it is of course possible to use a split mold, and since the pressing force required to fill the conductor balls 2 is very small, the above-mentioned The portion of the pressurizing surface of the mold 4 where the vacuum suction port 5 is provided may be made of a thin metal plate such as stainless steel. Therefore, the present invention can also be used when manufacturing a plurality of types of ceramic substrates having different numbers and positions of conductive balls 2.
以上説明した如く、本発明によればセラミツク
生シートに導体ボールを正確且つ容易に充填する
ことが可能となり、しかも工程が著しく簡単化さ
れる。 As explained above, according to the present invention, it is possible to accurately and easily fill conductor balls into a raw ceramic sheet, and the process is significantly simplified.
第1図は本発明の導体ボール充填方法の一実施
例を説明するための正面図、第2図は上記一実施
例により導体ボールが充填されたセラミツクシー
トを示す。
図において、1はセラミツク生シート、2は導
体ボール、3は下型、4は上型、5は真空吸引
口、7はポンチ、8はダイ、14はガイド孔を示
す。
FIG. 1 is a front view for explaining an embodiment of the conductor ball filling method of the present invention, and FIG. 2 shows a ceramic sheet filled with conductor balls according to the above embodiment. In the figure, 1 is a raw ceramic sheet, 2 is a conductor ball, 3 is a lower die, 4 is an upper die, 5 is a vacuum suction port, 7 is a punch, 8 is a die, and 14 is a guide hole.
Claims (1)
ツトの前記上型の加圧面に複数個の導体ボールを
吸着し、前記ダイユニツトの下型の表面に載置さ
れた未焼成セラミツク基板に対して前記上型によ
る加圧によつて、前記未焼成セラミツク基板にガ
イド孔を穿孔するとともに、前記導体ボールを充
填することを特徴とするセラミツク基板への導体
ボール充填方法。1 A plurality of conductive balls are adsorbed to the pressurizing surface of the upper die of the die unit in which a punch is disposed on the pressurizing surface of the upper die, and the balls are placed on the unfired ceramic substrate placed on the surface of the lower die of the die unit. A method for filling conductor balls into a ceramic substrate, characterized in that guide holes are bored in the unfired ceramic substrate and filled with the conductor balls by applying pressure with the upper die.
Priority Applications (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP14807881A JPS5848992A (en) | 1981-09-18 | 1981-09-18 | Method of filling conductive ball in ceramic substrate |
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP14807881A JPS5848992A (en) | 1981-09-18 | 1981-09-18 | Method of filling conductive ball in ceramic substrate |
Publications (2)
Publication Number | Publication Date |
---|---|
JPS5848992A JPS5848992A (en) | 1983-03-23 |
JPS6362120B2 true JPS6362120B2 (en) | 1988-12-01 |
Family
ID=15444724
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
JP14807881A Granted JPS5848992A (en) | 1981-09-18 | 1981-09-18 | Method of filling conductive ball in ceramic substrate |
Country Status (1)
Country | Link |
---|---|
JP (1) | JPS5848992A (en) |
Families Citing this family (3)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPS60105090U (en) * | 1983-12-23 | 1985-07-17 | 第一精工株式会社 | IC socket |
US5464652A (en) * | 1992-11-19 | 1995-11-07 | Hughes Aircraft Company | Green ceramic via metallization technique |
JP4463406B2 (en) * | 2000-09-27 | 2010-05-19 | イビデン株式会社 | Manufacturing method of laminated wiring board having interlayer connection structure |
-
1981
- 1981-09-18 JP JP14807881A patent/JPS5848992A/en active Granted
Also Published As
Publication number | Publication date |
---|---|
JPS5848992A (en) | 1983-03-23 |
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