JPS6351354B2 - - Google Patents

Info

Publication number: JPS6351354B2
Authority: JP; Japan
Prior art keywords: terminals; connection; metal particles; sintered; film
Prior art date: 1981-07-31
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.): Expired

Application number

JP56120071A

Other languages

English (en)

Japanese (ja)

Other versions

JPS5823174A (ja

Inventor

Ryoichi Sado

Toshuki Kawaguchi

Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)

Shin Etsu Chemical Co Ltd

Original Assignee

Shin Etsu Chemical Co Ltd

Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)

1981-07-31

Filing date

1981-07-31

Publication date

1988-10-13

1981-07-31 Application filed by Shin Etsu Chemical Co Ltd filed Critical Shin Etsu Chemical Co Ltd

1981-07-31 Priority to JP12007181A priority Critical patent/JPS5823174A/ja

1983-02-10 Publication of JPS5823174A publication Critical patent/JPS5823174A/ja

1988-10-13 Publication of JPS6351354B2 publication Critical patent/JPS6351354B2/ja

Status Granted legal-status Critical Current

Links

239000002923 metal particle Substances 0.000 claims description 25
230000001070 adhesive effect Effects 0.000 claims description 13
239000002861 polymer material Substances 0.000 claims description 13
239000000853 adhesive Substances 0.000 claims description 12
238000000034 method Methods 0.000 claims description 12
239000000126 substance Substances 0.000 claims description 9
238000010438 heat treatment Methods 0.000 claims description 8
229920000620 organic polymer Polymers 0.000 claims description 7
239000000758 substrate Substances 0.000 claims description 5
238000002156 mixing Methods 0.000 claims description 3
229910052751 metal Inorganic materials 0.000 description 12
239000002184 metal Substances 0.000 description 12
238000005245 sintering Methods 0.000 description 6
239000000463 material Substances 0.000 description 5
238000005260 corrosion Methods 0.000 description 4
230000007797 corrosion Effects 0.000 description 4
238000002844 melting Methods 0.000 description 4
239000002245 particle Substances 0.000 description 4
230000008018 melting Effects 0.000 description 3
239000002344 surface layer Substances 0.000 description 3
CURLTUGMZLYLDI-UHFFFAOYSA-N Carbon dioxide Chemical compound O=C=O CURLTUGMZLYLDI-UHFFFAOYSA-N 0.000 description 2
XEEYBQQBJWHFJM-UHFFFAOYSA-N Iron Chemical compound [Fe] XEEYBQQBJWHFJM-UHFFFAOYSA-N 0.000 description 2
230000015572 biosynthetic process Effects 0.000 description 2
238000005520 cutting process Methods 0.000 description 2
229920001971 elastomer Polymers 0.000 description 2
239000007769 metal material Substances 0.000 description 2
150000002739 metals Chemical class 0.000 description 2
239000000203 mixture Substances 0.000 description 2
238000000465 moulding Methods 0.000 description 2
-1 polyethylene Polymers 0.000 description 2
229920005989 resin Polymers 0.000 description 2
239000011347 resin Substances 0.000 description 2
239000005060 rubber Substances 0.000 description 2
239000007790 solid phase Substances 0.000 description 2
OKTJSMMVPCPJKN-UHFFFAOYSA-N Carbon Chemical compound [C] OKTJSMMVPCPJKN-UHFFFAOYSA-N 0.000 description 1
RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical compound [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 description 1
229920000459 Nitrile rubber Polymers 0.000 description 1
239000004952 Polyamide Substances 0.000 description 1
239000004698 Polyethylene Substances 0.000 description 1
239000004743 Polypropylene Substances 0.000 description 1
239000004793 Polystyrene Substances 0.000 description 1
230000005678 Seebeck effect Effects 0.000 description 1
BQCADISMDOOEFD-UHFFFAOYSA-N Silver Chemical compound [Ag] BQCADISMDOOEFD-UHFFFAOYSA-N 0.000 description 1
ATJFFYVFTNAWJD-UHFFFAOYSA-N Tin Chemical compound [Sn] ATJFFYVFTNAWJD-UHFFFAOYSA-N 0.000 description 1
229920006311 Urethane elastomer Polymers 0.000 description 1
HCHKCACWOHOZIP-UHFFFAOYSA-N Zinc Chemical compound [Zn] HCHKCACWOHOZIP-UHFFFAOYSA-N 0.000 description 1
229920000800 acrylic rubber Polymers 0.000 description 1
239000000654 additive Substances 0.000 description 1
229910045601 alloy Inorganic materials 0.000 description 1
239000000956 alloy Substances 0.000 description 1
229910052787 antimony Inorganic materials 0.000 description 1
WATWJIUSRGPENY-UHFFFAOYSA-N antimony atom Chemical compound [Sb] WATWJIUSRGPENY-UHFFFAOYSA-N 0.000 description 1
239000010426 asphalt Substances 0.000 description 1
229910052797 bismuth Inorganic materials 0.000 description 1
JCXGWMGPZLAOME-UHFFFAOYSA-N bismuth atom Chemical compound [Bi] JCXGWMGPZLAOME-UHFFFAOYSA-N 0.000 description 1
229910052793 cadmium Inorganic materials 0.000 description 1
BDOSMKKIYDKNTQ-UHFFFAOYSA-N cadmium atom Chemical compound [Cd] BDOSMKKIYDKNTQ-UHFFFAOYSA-N 0.000 description 1
229910052799 carbon Inorganic materials 0.000 description 1
229910002092 carbon dioxide Inorganic materials 0.000 description 1
239000001569 carbon dioxide Substances 0.000 description 1
239000003795 chemical substances by application Substances 0.000 description 1
YACLQRRMGMJLJV-UHFFFAOYSA-N chloroprene Chemical compound ClC(=C)C=C YACLQRRMGMJLJV-UHFFFAOYSA-N 0.000 description 1
239000011248 coating agent Substances 0.000 description 1
238000000576 coating method Methods 0.000 description 1
238000009833 condensation Methods 0.000 description 1
230000005494 condensation Effects 0.000 description 1
229920001577 copolymer Polymers 0.000 description 1
229910052802 copper Inorganic materials 0.000 description 1
239000010949 copper Substances 0.000 description 1
239000007822 coupling agent Substances 0.000 description 1
239000003431 cross linking reagent Substances 0.000 description 1
238000009826 distribution Methods 0.000 description 1
230000000694 effects Effects 0.000 description 1
239000003822 epoxy resin Substances 0.000 description 1
238000005530 etching Methods 0.000 description 1
230000002349 favourable effect Effects 0.000 description 1
238000011049 filling Methods 0.000 description 1
229910052738 indium Inorganic materials 0.000 description 1
APFVFJFRJDLVQX-UHFFFAOYSA-N indium atom Chemical compound [In] APFVFJFRJDLVQX-UHFFFAOYSA-N 0.000 description 1
238000009413 insulation Methods 0.000 description 1
230000010354 integration Effects 0.000 description 1
229910052742 iron Inorganic materials 0.000 description 1
JEIPFZHSYJVQDO-UHFFFAOYSA-N iron(III) oxide Inorganic materials O=[Fe]O[Fe]=O JEIPFZHSYJVQDO-UHFFFAOYSA-N 0.000 description 1
239000010410 layer Substances 0.000 description 1
239000007791 liquid phase Substances 0.000 description 1
239000000155 melt Substances 0.000 description 1
238000004806 packaging method and process Methods 0.000 description 1
239000004033 plastic Substances 0.000 description 1
229920003023 plastic Polymers 0.000 description 1
229920000058 polyacrylate Polymers 0.000 description 1
229920002647 polyamide Polymers 0.000 description 1
229920000647 polyepoxide Polymers 0.000 description 1
229920000728 polyester Polymers 0.000 description 1
229920000573 polyethylene Polymers 0.000 description 1
229920001155 polypropylene Polymers 0.000 description 1
229920002223 polystyrene Polymers 0.000 description 1
229920002635 polyurethane Polymers 0.000 description 1
239000004814 polyurethane Substances 0.000 description 1
229920002689 polyvinyl acetate Polymers 0.000 description 1
239000011118 polyvinyl acetate Substances 0.000 description 1
239000004800 polyvinyl chloride Substances 0.000 description 1
229920000915 polyvinyl chloride Polymers 0.000 description 1
238000004663 powder metallurgy Methods 0.000 description 1
239000010970 precious metal Substances 0.000 description 1
238000001556 precipitation Methods 0.000 description 1
238000003825 pressing Methods 0.000 description 1
230000003449 preventive effect Effects 0.000 description 1
230000008707 rearrangement Effects 0.000 description 1
150000004756 silanes Chemical class 0.000 description 1
229920002379 silicone rubber Polymers 0.000 description 1
239000004945 silicone rubber Substances 0.000 description 1
229910052709 silver Inorganic materials 0.000 description 1
239000004332 silver Substances 0.000 description 1
229910000679 solder Inorganic materials 0.000 description 1
239000002904 solvent Substances 0.000 description 1
229920003048 styrene butadiene rubber Polymers 0.000 description 1
229920001169 thermoplastic Polymers 0.000 description 1
229920001187 thermosetting polymer Polymers 0.000 description 1
239000004416 thermosoftening plastic Substances 0.000 description 1
150000003609 titanium compounds Chemical class 0.000 description 1
229920006305 unsaturated polyester Polymers 0.000 description 1
238000003466 welding Methods 0.000 description 1
229910052725 zinc Inorganic materials 0.000 description 1
239000011701 zinc Substances 0.000 description 1

JP12007181A 1981-07-31 1981-07-31 接続端子の電気接続方法 Granted JPS5823174A (ja)

Priority Applications (1)

Application Number	Priority Date	Filing Date	Title
JP12007181A JPS5823174A (ja)	1981-07-31	1981-07-31	接続端子の電気接続方法

Applications Claiming Priority (1)

Application Number	Priority Date	Filing Date	Title
JP12007181A JPS5823174A (ja)	1981-07-31	1981-07-31	接続端子の電気接続方法

Publications (2)

Publication Number	Publication Date
JPS5823174A JPS5823174A (ja)	1983-02-10
JPS6351354B2 true JPS6351354B2 (fr)	1988-10-13

Family

ID=14777171

Family Applications (1)

Application Number	Title	Priority Date	Filing Date
JP12007181A Granted JPS5823174A (ja)	1981-07-31	1981-07-31	接続端子の電気接続方法

Country Status (1)

Country	Link
JP (1)	JPS5823174A (fr)

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number	Priority date	Publication date	Assignee	Title
WO2012087520A1 (fr)	2010-12-20	2012-06-28	Irm Llc	Compositions et procédés de modulation des récepteurs farnésoïdes x

Families Citing this family (15)

* Cited by examiner, † Cited by third party
Publication number	Priority date	Publication date	Assignee	Title
JPS60130004A (ja) *	1983-12-15	1985-07-11	日立化成工業株式会社	透明導電異方性接着シ−ト
JPS60133677A (ja) *	1983-12-21	1985-07-16	株式会社精工舎	熱融着型接続ケ−ブル
JPS60170177A (ja) *	1984-02-13	1985-09-03	日本黒鉛工業株式会社	導電異方性ヒ−トシ−ルコネクタ部材
JPS6155809A (ja) *	1984-08-27	1986-03-20	日立化成工業株式会社	導電性接着フイルム巻重体
JPS6164085A (ja) *	1984-09-04	1986-04-02	ダイソー株式会社	電気部材
JPS6177278A (ja) *	1984-09-21	1986-04-19	日立化成工業株式会社	回路の接続部材
JPS6177279A (ja) *	1984-09-21	1986-04-19	日立化成工業株式会社	回路の接続部材
JPS61168574U (fr) *	1985-04-09	1986-10-18
JPS61168573U (fr) *	1985-04-09	1986-10-18
JPS61269873A (ja) *	1985-05-23	1986-11-29	信越ポリマ−株式会社	コネクタ−
US5502889A (en) *	1988-06-10	1996-04-02	Sheldahl, Inc.	Method for electrically and mechanically connecting at least two conductive layers
US5727310A (en) *	1993-01-08	1998-03-17	Sheldahl, Inc.	Method of manufacturing a multilayer electronic circuit
US5428190A (en) *	1993-07-02	1995-06-27	Sheldahl, Inc.	Rigid-flex board with anisotropic interconnect and method of manufacture
US5719749A (en) *	1994-09-26	1998-02-17	Sheldahl, Inc.	Printed circuit assembly with fine pitch flexible printed circuit overlay mounted to printed circuit board
JP4684439B2 (ja) *	2001-03-06	2011-05-18	富士通株式会社	伝導性粒子、伝導性組成物および、電子機器の製造方法

Citations (5)

* Cited by examiner, † Cited by third party
Publication number	Priority date	Publication date	Assignee	Title
US3541222A (en) *	1969-01-13	1970-11-17	Bunker Ramo	Connector screen for interconnecting adjacent surfaces of laminar circuits and method of making
JPS5121192A (ja) *	1974-08-14	1976-02-20	Seikosha Kk	Dodenseisetsuchakushiito
JPS51114439A (en) *	1975-04-02	1976-10-08	Seiko Epson Corp	An adhesive having anisotropic electroconductivity
JPS5259889A (en) *	1975-11-13	1977-05-17	Seiko Epson Corp	Sticking conductivity anisotropy
JPS5652885A (en) *	1979-10-03	1981-05-12	Shinetsu Polymer Co	Pressure nipping type connector

1981
- 1981-07-31 JP JP12007181A patent/JPS5823174A/ja active Granted

Patent Citations (5)

* Cited by examiner, † Cited by third party
Publication number	Priority date	Publication date	Assignee	Title
US3541222A (en) *	1969-01-13	1970-11-17	Bunker Ramo	Connector screen for interconnecting adjacent surfaces of laminar circuits and method of making
JPS5121192A (ja) *	1974-08-14	1976-02-20	Seikosha Kk	Dodenseisetsuchakushiito
JPS51114439A (en) *	1975-04-02	1976-10-08	Seiko Epson Corp	An adhesive having anisotropic electroconductivity
JPS5259889A (en) *	1975-11-13	1977-05-17	Seiko Epson Corp	Sticking conductivity anisotropy
JPS5652885A (en) *	1979-10-03	1981-05-12	Shinetsu Polymer Co	Pressure nipping type connector

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number	Priority date	Publication date	Assignee	Title
WO2012087520A1 (fr)	2010-12-20	2012-06-28	Irm Llc	Compositions et procédés de modulation des récepteurs farnésoïdes x

Also Published As

Publication number	Publication date
JPS5823174A (ja)	1983-02-10

Publication	Publication Date	Title
EP0549159B1 (fr)	1997-11-05	Procédé et adhésif pour réaliser des connexions électriques et mécaniques
JPS6351354B2 (fr)	1988-10-13
US6802446B2 (en)	2004-10-12	Conductive adhesive material with metallurgically-bonded conductive particles
US5853622A (en)	1998-12-29	Transient liquid phase sintering conductive adhesives
US4113981A (en)	1978-09-12	Electrically conductive adhesive connecting arrays of conductors
US6281040B1 (en)	2001-08-28	Methods for making circuit substrates and electrical assemblies
JP3045956B2 (ja)	2000-05-29	金属接合形成方法
Kang et al.	1998	Development of high conductivity lead (Pb)-free conducting adhesives
KR100629826B1 (ko)	2006-09-29	접합재 및 이를 이용한 회로 장치
CN106068059A (zh)	2016-11-02	电路部件的连接结构、连接方法以及连接材料
CN1322060C (zh)	2007-06-20	导电性树脂、使用导电性树脂的电子器件的组装体及电子器件的组装体的制造方法
JP5160813B2 (ja)	2013-03-13	導電性ペーストおよび基板
US5837356A (en)	1998-11-17	Wiring board and method for manufacturing the same
KR100724720B1 (ko)	2007-06-04	도전성 접착제와 이 도전성 접착제를 이용한 단자간의 접속 방법
JPH10507575A (ja)	1998-07-21	融点の異なる金属粒子を含む導電性インク
JPH07179832A (ja)	1995-07-18	導電性接着剤
JPS6331904B2 (fr)	1988-06-27
KR840009026A (ko)	1984-12-20	전기 전도체를 절연 기판에 접착하는 방법
US3535769A (en)	1970-10-27	Formation of solder joints across gaps
JPS6329391B2 (fr)	1988-06-13
JPS60140790A (ja)	1985-07-25	連結シ−ト
JP5113390B2 (ja)	2013-01-09	配線間接続方法
PL181590B1 (pl)	2001-08-31	Sposób wytwarzania struktur elektroprzewodzacych PL
JPS58111202A (ja)	1983-07-02	接続端子の接続構造および接続方法
JP4010717B2 (ja)	2007-11-21	電気接点の接合方法

JPS6351354B2 - - Google Patents

Info

Links

Priority Applications (1)

Applications Claiming Priority (1)

Publications (2)

Family

ID=14777171

Family Applications (1)

Country Status (1)

Cited By (1)

Families Citing this family (15)

Citations (5)

Patent Citations (5)

Cited By (1)

Also Published As

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