JPS6349413A - Mold equipment for resin molding for semiconductor equipment - Google Patents
Mold equipment for resin molding for semiconductor equipmentInfo
- Publication number
- JPS6349413A JPS6349413A JP19205886A JP19205886A JPS6349413A JP S6349413 A JPS6349413 A JP S6349413A JP 19205886 A JP19205886 A JP 19205886A JP 19205886 A JP19205886 A JP 19205886A JP S6349413 A JPS6349413 A JP S6349413A
- Authority
- JP
- Japan
- Prior art keywords
- gate
- cavity
- resin
- mold
- resin molding
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
- 239000004065 semiconductor Substances 0.000 title claims abstract description 17
- 238000000465 moulding Methods 0.000 title claims abstract description 13
- 239000011347 resin Substances 0.000 title claims description 27
- 229920005989 resin Polymers 0.000 title claims description 27
- 230000006866 deterioration Effects 0.000 abstract description 4
- 238000010276 construction Methods 0.000 abstract 1
- 238000000034 method Methods 0.000 description 4
- 238000007789 sealing Methods 0.000 description 4
- 230000015572 biosynthetic process Effects 0.000 description 1
- 230000002596 correlated effect Effects 0.000 description 1
- 230000003247 decreasing effect Effects 0.000 description 1
- 230000007547 defect Effects 0.000 description 1
- 230000000694 effects Effects 0.000 description 1
Classifications
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B29—WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
- B29C—SHAPING OR JOINING OF PLASTICS; SHAPING OF MATERIAL IN A PLASTIC STATE, NOT OTHERWISE PROVIDED FOR; AFTER-TREATMENT OF THE SHAPED PRODUCTS, e.g. REPAIRING
- B29C45/00—Injection moulding, i.e. forcing the required volume of moulding material through a nozzle into a closed mould; Apparatus therefor
- B29C45/17—Component parts, details or accessories; Auxiliary operations
- B29C45/26—Moulds
- B29C45/27—Sprue channels ; Runner channels or runner nozzles
- B29C45/2701—Details not specific to hot or cold runner channels
- B29C45/2708—Gates
Landscapes
- Engineering & Computer Science (AREA)
- Manufacturing & Machinery (AREA)
- Mechanical Engineering (AREA)
- Moulds For Moulding Plastics Or The Like (AREA)
- Injection Moulding Of Plastics Or The Like (AREA)
- Encapsulation Of And Coatings For Semiconductor Or Solid State Devices (AREA)
Abstract
Description
【発明の詳細な説明】
〔発明の目的〕
（産業上の利用分野）
この発明は半導体装置樹脂モールド金型装置にかかり、
特に樹脂封止型半導体装置の外囲器のモールド形成に用
いられる。[Detailed Description of the Invention] [Object of the Invention] (Industrial Application Field) The present invention relates to a resin molding device for a semiconductor device,
In particular, it is used to mold the envelope of a resin-sealed semiconductor device.
（従来の技術）
樹脂封止型半導体装置の外囲器形成に用いられる樹脂モ
ールド金型装置の下型の一例を第３図に斜視図で示す０
図において、１０１はモールド下型（以下下型と略称）
、 １０２は下型の上面（上型（図示省略）の下面との
圧接面）に穿設された溝状のランナ、１０３はランナか
ら分岐したゲート、１０４はランナに接続したキャビテ
ィで、ランナのキャビティへの接続部は溝が浅く形成さ
れたゲート口１０３ａになっている。そしてモールド樹
脂はランナ１０２からゲート１０３ を経てゲート口１
０３ａからキャビティ１０２に注入（圧入）され、テヤ
ビティに配置されたリードフレーム（図示省略）に所定
の樹脂モールドが施こされる。また、樹脂モールドの外
囲器が非常に小さい半導体装置の樹脂モールドの場合、
複数個連接した長い樹脂モールドを施し、のちに切断し
て個々の半導体装置を得る手段もあるが１次に述べるよ
うな問題点があった。(Prior Art) An example of the lower die of a resin molding device used for forming an envelope of a resin-sealed semiconductor device is shown in a perspective view in FIG.
In the figure, 101 is the lower mold mold (hereinafter abbreviated as the lower mold)
, 102 is a groove-shaped runner bored in the upper surface of the lower mold (the surface in pressure contact with the lower surface of the upper mold (not shown)), 103 is a gate branched from the runner, and 104 is a cavity connected to the runner. The connection to the cavity is a gate opening 103a with a shallow groove. Then, the mold resin passes from the runner 102 to the gate 103 to the gate port 1.
The resin is injected (press-fitted) into the cavity 102 from 03a, and a predetermined resin mold is applied to a lead frame (not shown) disposed in a tapered manner. In addition, in the case of resin molds for semiconductor devices where the resin mold envelope is very small,
There is also a method of forming a plurality of connected long resin molds and cutting them later to obtain individual semiconductor devices, but there are problems as described below.
（発明が解決しようとする問題点）
上記従来の樹脂モールド金型装置には次にあげる問題点
があった。すなわち、キャビティが小容積（外囲器が小
型）の場合、キャビティ面積に対しゲート面積の占める
割合が大きいためこのモールド形成後にゲートが製品に
残り除去工程を必要とするゲート残りやキャビティ内に
エヤが浸入してモールド内部巣が発生する。このモール
ド内部巣はゲートのサイズと相関があり、ゲートを小さ
くすればモールド内部巣の発生も減少するが、モールド
樹脂のゲート詰まり発生の確率が大きくなる。ところで
、上記ゲートのサイズは一般に幅０．８〜１ 、５ｍｍ
、深さ０．１５〜０．３ｍｍであるが、製品のサイズ
が小になるとゲートのサイズは幅０．６〜０．８１（７
５〜５０％）、深さ０．１５〜０．２ｍｍ（１００〜６
７％）になり、ランナからのゲートの絞り角度が急にな
りゲート詰まりおよびキャビティのゲート近傍のモール
ド表面に巣が発生する。この巣はモールド条件等を調整
することによって緩和することは可能であるが皆無には
できない。(Problems to be Solved by the Invention) The conventional resin mold device described above has the following problems. In other words, when the cavity has a small volume (the envelope is small), the gate area occupies a large proportion of the cavity area, so the gate remains on the product after the mold is formed, and air is trapped inside the cavity and the remaining gate that requires a removal process. enters the mold, creating cavities inside the mold. These cavities inside the mold are correlated with the size of the gate, and if the gate is made smaller, the occurrence of cavities inside the mold will be reduced, but the probability that the mold resin will clog the gate will increase. By the way, the size of the above gate is generally 0.8 to 1.5 mm in width.
, the depth is 0.15 to 0.3 mm, but as the product size becomes smaller, the gate size increases to a width of 0.6 to 0.81 (7 mm).
5-50%), depth 0.15-0.2mm (100-6
7%), and the drawing angle of the gate from the runner becomes steep, resulting in gate clogging and formation of cavities on the mold surface near the gate of the cavity. Although it is possible to alleviate this nest by adjusting mold conditions, etc., it cannot be completely eliminated.
この発明は上記問題点に鑑み改良された樹脂モールド金
型装置を提供することを目的とする。SUMMARY OF THE INVENTION An object of the present invention is to provide an improved resin molding device in view of the above problems.
（問題点を解決するための手段）
この発明の半導体装置用樹脂モールド金型装置は、函型
の樹脂モールド外囲器を備えた樹脂封止型半導体装置用
樹脂モールド金型装置のゲートが、函型のキャビティの
角部およびこれに隣接した側壁に跨がるゲート口でキャ
ビティに接続されたことを特徴とするものであり、また
、函型の樹脂モールド外囲器を備えた樹脂封止型半導体
装置用樹脂モールド金型装置のゲートが分岐され、かつ
それらの各端部は、函型のキャビティの角部およびこれ
に隣接した側壁に跨がるゲート口で各キャビティに接続
されたことを特徴とする。(Means for Solving the Problems) In the resin molding device for semiconductor devices of the present invention, the gate of the resin molding device for resin-sealed semiconductor devices equipped with a box-shaped resin molded envelope is It is characterized by being connected to the cavity through a gate opening that spans the corner of the box-shaped cavity and the side wall adjacent thereto, and also includes a resin-sealed box-shaped resin molded envelope. The gates of the resin molding device for type semiconductor devices are branched, and each end thereof is connected to each cavity with a gate opening spanning the corner of the box-shaped cavity and the side wall adjacent thereto. It is characterized by
（作 用）
この発明の樹脂モールド金型装置はキャビティへのゲー
ト口接続をキャビティの角部を含みこれに相隣る側壁に
跨がり設けることにより、ゲート残り、モールド内部巣
、ゲート詰まり等の問題点を解決できる。(Function) The resin molding device of the present invention prevents gate residue, mold internal cavities, gate clogging, etc. by providing the gate opening connection to the cavity, including the corner of the cavity, and straddling the adjacent side walls. Can solve problems.
（実施例）
以下、この発明の実施例につき図面を参照して説明する
。第１図ａにこの発明の一実例のゲート口１１ａの配設
を示す。このゲート口の特徴はゲート１１の先端がキャ
ビティ１２に対し、その角部とこれに隣接した側壁に跨
がって設けられている。例えば第１図ａにおいて短辺（
縦）方向への食いこみ寸法Ａを０．０５〜０．１ｍａ＋
、長辺（横）方向への寸法Ｂを０．０５〜０．８ｍｍに
夫々設けている。(Embodiments) Hereinafter, embodiments of the present invention will be described with reference to the drawings. FIG. 1a shows the arrangement of the gate opening 11a in an embodiment of the present invention. The feature of this gate opening is that the tip of the gate 11 is provided in the cavity 12 so as to straddle the corner thereof and the side wall adjacent thereto. For example, in Figure 1a, the short side (
The intrusion dimension A in the vertical) direction is 0.05 to 0.1 ma+
, the dimension B in the long side (horizontal) direction is set to 0.05 to 0.8 mm, respectively.
次に、第１図す、ｃに示す一実施例はゲート２１が先端
近傍で二つに分岐し、キャビティ２２にゲート口２２ａ
、キヤビテイ３２にゲート口３２ａで接続している。ゲ
ート口２２ａ、 ３２ａの各寸法はいずれも第１図ａで
述べた一例の寸法である。Next, in one embodiment shown in FIGS.
, and is connected to the cavity 32 through a gate port 32a. The dimensions of the gate openings 22a and 32a are the dimensions of the example described in FIG. 1a.
次に第２図には別の実施例を示す。上記第１図に比ベゲ
ート１１の分岐部に、ゲート分岐部の膨出部１３が設け
られている点が相違する。この膨出部１３は両キャビテ
ィ２２．３２の大きさとこれによってきまるゲート口２
２ａ、 ３２ａの寸法等によってきまる例えば０ 、３
ｃｃ程度でよく、封止樹脂中に含まれるエヤを貯蔵し、
ゲート口からキャビティに送入されるエヤを低減するの
に有効である。Next, FIG. 2 shows another embodiment. The difference from FIG. 1 is that a bulge portion 13 of the gate branch portion is provided at the branch portion of the gate 11. This bulge 13 is formed by the gate opening 2, which is determined by the size of both cavities 22 and 32.
For example, 0, 3 depending on the dimensions of 2a, 32a, etc.
It only takes about cc to store the air contained in the sealing resin,
This is effective in reducing air introduced into the cavity from the gate.
例えば４ビンタイプトランジスタカプラ（−例のＴＬＰ
５２１（東芝製品名））において従来の金型装置で３
〜８％発生していた巣による不良が０．１％以下（０，
０７〜０．０８％）に低減を見た。For example, a 4-bin type transistor coupler (-example TLP
521 (Toshiba product name)) with conventional mold equipment.
Defects due to nests, which occurred in ~8%, have decreased to less than 0.1% (0,
07-0.08%).
〔発明の効果〕
この発明によれば、樹脂封止部の小さい樹脂封止型半導
体装置の樹脂封止に適用してゲート残りによる工程の繁
雑と外観の劣化を低減し、モールド内部巣による半導体
装置の電気的特性劣化を防止し、ゲート詰まりを解消す
るなどの顕著な利点がある。[Effects of the Invention] According to the present invention, it is possible to reduce the complexity of the process and deterioration of the appearance due to gate residue when applied to the resin sealing of a resin-sealed semiconductor device with a small resin sealing portion, and to reduce the complexity of the process and the deterioration of the appearance due to the mold internal cavity. It has significant advantages such as preventing deterioration of the electrical characteristics of the device and eliminating gate clogging.
なお、この発明は小型の樹脂封止外囲器を備える半導体
装置の樹脂封止金型に限られるものでなく、一般のサイ
ズのものにも適用して効果がある。Note that the present invention is not limited to resin-sealing molds for semiconductor devices having small-sized resin-sealed envelopes, but can also be effectively applied to molds of general size.
第１図はこの発明にかかる樹脂封止型半導体装置の樹脂
封止金型を示し、ａは一実施例の金型装置の下型の一部
の上面図、ｂは別の一実施例の金型装置の一部の斜視図
、Ｃはｂの要部を説明するための上面図、第２図はさら
に別の実施例の金型装置の要部を説明するための上面図
、第３図は従来の金型装置の要部を説明するための上面
図である。
１１．２１−−−−−ゲートFIG. 1 shows a resin-sealed mold for a resin-sealed semiconductor device according to the present invention, in which a is a top view of a part of the lower mold of a mold apparatus according to one embodiment, and b is a top view of a part of a lower mold of a mold apparatus according to another embodiment. A perspective view of a part of the mold device, C is a top view for explaining the main parts of b, FIG. 2 is a top view for explaining the main parts of the mold device of still another embodiment, and FIG. The figure is a top view for explaining the main parts of a conventional mold device. 11.21-----Gate
Claims (2)
導体装置用樹脂モールド金型装置のゲートが、函型のキ
ャビティの角部およびこれに隣接した側壁に跨がるゲー
ト口でキャビティに接続されたことを特徴とする半導体
装置用樹脂モールド金型装置。(1) The gate of the resin mold equipment for resin-sealed semiconductor devices equipped with a box-shaped resin mold envelope is located at the gate opening that straddles the corner of the box-shaped cavity and the side wall adjacent to the corner of the box-shaped cavity. A resin molding device for semiconductor devices characterized by being connected to a cavity.
導体装置用樹脂モールド金型装置のゲートが分岐され、
かつそれらの各端部は、函型のキャビティの角部および
これに隣接した側壁に跨がるゲート口で各キャビティに
接続されたことを特徴とする半導体装置用樹脂モールド
金型装置。(2) The gate of a resin molding device for a resin-sealed semiconductor device equipped with a box-shaped resin molded envelope is branched,
A resin molding apparatus for a semiconductor device, wherein each end thereof is connected to each cavity through a gate opening extending over a corner of the box-shaped cavity and a side wall adjacent thereto.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP19205886A JPS6349413A (en) | 1986-08-19 | 1986-08-19 | Mold equipment for resin molding for semiconductor equipment |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP19205886A JPS6349413A (en) | 1986-08-19 | 1986-08-19 | Mold equipment for resin molding for semiconductor equipment |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| JPS6349413A true JPS6349413A (en) | 1988-03-02 |
Family
ID=16284916
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP19205886A Pending JPS6349413A (en) | 1986-08-19 | 1986-08-19 | Mold equipment for resin molding for semiconductor equipment |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPS6349413A (en) |
Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US5624691A (en) * | 1994-06-21 | 1997-04-29 | Texas Instruments Incorporated | Transfer mold design |
| US6015280A (en) * | 1997-04-28 | 2000-01-18 | Advanced Micro Devices | Apparatus for reducing warping of plastic packages |
-
1986
- 1986-08-19 JP JP19205886A patent/JPS6349413A/en active Pending
Cited By (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US5624691A (en) * | 1994-06-21 | 1997-04-29 | Texas Instruments Incorporated | Transfer mold design |
| US5744083A (en) * | 1994-06-21 | 1998-04-28 | Texas Instruments Incorporated | Method for molding semiconductor packages |
| US6015280A (en) * | 1997-04-28 | 2000-01-18 | Advanced Micro Devices | Apparatus for reducing warping of plastic packages |
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