JP2555919B2 - Lead frame for semiconductor parts - Google Patents
Lead frame for semiconductor partsInfo
- Publication number
- JP2555919B2 JP2555919B2 JP4331603A JP33160392A JP2555919B2 JP 2555919 B2 JP2555919 B2 JP 2555919B2 JP 4331603 A JP4331603 A JP 4331603A JP 33160392 A JP33160392 A JP 33160392A JP 2555919 B2 JP2555919 B2 JP 2555919B2
- Authority
- JP
- Japan
- Prior art keywords
- lead frame
- resin
- width
- gate
- semiconductor parts
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired - Fee Related
Links
Landscapes
- Structures Or Materials For Encapsulating Or Coating Semiconductor Devices Or Solid State Devices (AREA)
- Encapsulation Of And Coatings For Semiconductor Or Solid State Devices (AREA)
- Lead Frames For Integrated Circuits (AREA)
Description
【０００１】[0001]
【産業上の利用分野】本発明は、樹脂封止型パッケージ
の製造に関し、特に、樹脂充填性を考慮した半導体部品
用リードフレームに関する。BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to the manufacture of resin-encapsulated packages, and more particularly to a lead frame for semiconductor parts in consideration of resin filling property.
【０００２】[0002]
【従来の技術】従来の半導体部品は、図３に示すように
半導体素子が搭載されたリードフレーム２１のインナリ
ード部が樹脂パッケージ２２により封止成形されてい
る。2. Description of the Related Art In a conventional semiconductor component, an inner lead portion of a lead frame 21 on which a semiconductor element is mounted is molded by a resin package 22 as shown in FIG.
【０００３】この場合、樹脂パッケージ２２の幅寸法ａ
及びリードフレーム２１の幅寸法ｂは製品規格により定
まっていることが多く、またリードフレーム２１の幅も
図３のように一定幅で形成されているものが一般的であ
ったために、樹脂パッケージ２２への樹脂封止金型の樹
脂注入口に対応するゲート部２３の幅Ｗ２の寸法も制約
があった。In this case, the width dimension a of the resin package 22
Also, the width dimension b of the lead frame 21 is often determined by the product standard, and the lead frame 21 is generally formed to have a constant width as shown in FIG. There was also a restriction on the width W2 of the gate portion 23 corresponding to the resin injection port of the resin sealing mold.
【０００４】[0004]
【発明が解決しようとする課題】叙上のように、従来の
リードフレームでは、樹脂パッケージ幅とリードフレー
ム幅とにより、樹脂封止金型の樹脂注入口に対応するゲ
ート部の幅は制約されるために、製品によっては十分な
ゲート幅が確保できないことがあり、このような場合に
は、樹脂パッケージの未充填を惹起する等の課題があっ
た。As described above, in the conventional lead frame, the width of the gate portion corresponding to the resin injection port of the resin sealing mold is restricted by the width of the resin package and the width of the lead frame. Therefore, depending on the product, a sufficient gate width may not be ensured, and in such a case, there is a problem such as unfilling of the resin package.
【０００５】本発明は従来の上記実情に鑑みてなされた
ものであり、従って本発明の目的は、従来の技術に内在
する上記課題を解決することを可能とした新規な半導体
部品用リードフレームを提供することにある。The present invention has been made in view of the above-mentioned conventional circumstances, and therefore, an object of the present invention is to provide a novel lead frame for semiconductor parts which can solve the above problems inherent in the prior art. To provide.
【０００６】[0006]
【課題を解決するための手段】上記目的を達成するため
に、本発明に係る半導体部品用リードフレームは、樹脂
パッケージの外縁部分のリードの、ゲートが形成される
領域の一部を含む部分に切欠きを設けて構成され、しか
して、樹脂封止時における所定寸法のゲート幅を確保す
ることができ、従って、樹脂封止金型の樹脂注入口を任
意に形成することが可能となり、未充填等のない半導体
部品の樹脂封止が実現される。In order to achieve the above object, a semiconductor component lead frame according to the present invention is provided with a portion of a lead of an outer edge portion of a resin package including a part of a region where a gate is formed. It is configured by providing a notch, so that it is possible to secure a gate width of a predetermined dimension at the time of resin sealing, and thus it is possible to arbitrarily form the resin injection port of the resin sealing mold. Resin encapsulation of semiconductor parts without filling or the like is realized.
【０００７】[0007]
【実施例】次に本発明をその好ましい一実施例について
図面を参照して具体的に説明する。BEST MODE FOR CARRYING OUT THE INVENTION The present invention will now be described in detail with reference to the accompanying drawings with reference to the accompanying drawings.
【０００８】図１は本発明に係るリードフレームの一実
施例を示す平面図であり、図２は本発明に係るリードフ
レームの一実施例を示す斜視図である。FIG. 1 is a plan view showing an embodiment of a lead frame according to the present invention, and FIG. 2 is a perspective view showing an embodiment of a lead frame according to the present invention.
【０００９】図１、図２を参照するに、半導体素子（図
示せず）が搭載されたリードフレーム１のインナリード
部が樹脂パッケージ２により封止成形されている。リー
ドフレーム１の樹脂パッケージ２への付け根部分（外縁
部分）には切欠き１１が設けられている。Referring to FIGS. 1 and 2, an inner lead portion of a lead frame 1 on which a semiconductor element (not shown) is mounted is sealed and molded by a resin package 2. Base part of the lead frame 1 to the resin package 2 (outer edge
A notch 11 is provided in the portion) .
【００１０】通常この種のパッケージ２は、半導体素子
を搭載したリードフレーム１の所定の部分を上、下の樹
脂封止金型（図示せず）によりクランプし、この樹脂封
止金型のゲート部３に対応する部分に設けられた樹脂注
入口（図示せず）から樹脂を注入し、次いで上、下の樹
脂封止金型を除去することによって、形成される。従っ
て、リードフレーム１の切欠き１１はゲート部３の幅Ｗ
１を従来例のゲート部２３の幅Ｗ２よりも大きく（Ｗ
１》Ｗ２）することができ、ゲート部３に対応する樹脂
封止金型の樹脂注入口も任意の大きさに形成することが
可能となる。Usually, in this type of package 2, a predetermined portion of the lead frame 1 on which a semiconductor element is mounted is clamped by an upper and lower resin-sealing mold (not shown), and the gate of this resin-sealing mold is clamped. It is formed by injecting a resin from a resin injection port (not shown) provided in a portion corresponding to the portion 3 and then removing the upper and lower resin sealing molds. Therefore, the notch 11 of the lead frame 1 has a width W of the gate portion 3.
1 is larger than the width W2 of the gate portion 23 of the conventional example (W
1 >> W2), and the resin injection port of the resin sealing mold corresponding to the gate portion 3 can also be formed in an arbitrary size.
【００１１】このようにリードフレーム１に切欠き１１
を形成することにより樹脂パッケージ２の幅寸法ａ及び
リードフレーム１の幅寸法ｂに制約があり、従来では所
定のゲート幅を確保できない場合でも、所定幅Ｗ１のゲ
ート部３を確保することができる。Thus, the notch 11 is formed in the lead frame 1.
Since the width dimension “a” of the resin package 2 and the width dimension “b” of the lead frame 1 are limited by forming the above, the gate portion 3 having the predetermined width W1 can be secured even when the conventional gate width cannot be secured. .
【００１２】[0012]
【発明の効果】以上説明したように、本発明のリードフ
レームによれば、樹脂パッケージの付け根部分のリード
に切欠きを設けたことによりゲート幅を大きくとること
ができるようになったので、未充填等のない半導体部品
の樹脂封止が可能となる。As described above, according to the lead frame of the present invention, since the notch is provided in the lead of the root portion of the resin package, the gate width can be made large, so that it is not possible. It is possible to seal a semiconductor component with resin without filling or the like.
【図１】本発明の一実施例を示す平面図である。FIG. 1 is a plan view showing an embodiment of the present invention.
【図２】本発明の一実施例を示す斜視図である。FIG. 2 is a perspective view showing one embodiment of the present invention.
【図３】従来のリードフレームを示す平面図である。FIG. 3 is a plan view showing a conventional lead frame.
１、２１…リードフレーム １１…リードフレーム切欠き ２、２２…樹脂パッケージ ３、２３…ゲート部 ａ…樹脂パッケージの幅寸法 ｂ…リードフレームの幅寸法 1, 21 ... Lead frame 11 ... Lead frame notch 2, 22 ... Resin package 3, 23 ... Gate part a ... Width dimension of resin package b ... Width dimension of lead frame
Claims (1)
が樹脂パッケージで封止成形される半導体部品におい
て、樹脂パッケージの外縁部分におけるリードの、ゲー
ト部に対応する領域の一部を含む部分に切欠きを設けた
ことを特徴とする半導体部品用リードフレーム。1. A semiconductor component, in which an inner lead portion on which a semiconductor element is mounted is molded by a resin package, is cut into a portion of an outer edge portion of the resin package including a part of a region corresponding to a gate portion. A lead frame for semiconductor parts, which is provided with a notch.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP4331603A JP2555919B2 (en) | 1992-12-11 | 1992-12-11 | Lead frame for semiconductor parts |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP4331603A JP2555919B2 (en) | 1992-12-11 | 1992-12-11 | Lead frame for semiconductor parts |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| JPH06181274A JPH06181274A (en) | 1994-06-28 |
| JP2555919B2 true JP2555919B2 (en) | 1996-11-20 |
Family
ID=18245501
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP4331603A Expired - Fee Related JP2555919B2 (en) | 1992-12-11 | 1992-12-11 | Lead frame for semiconductor parts |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JP2555919B2 (en) |
Family Cites Families (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPH02146456U (en) * | 1989-05-16 | 1990-12-12 |
-
1992
- 1992-12-11 JP JP4331603A patent/JP2555919B2/en not_active Expired - Fee Related
Also Published As
| Publication number | Publication date |
|---|---|
| JPH06181274A (en) | 1994-06-28 |
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Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| LAPS | Cancellation because of no payment of annual fees |