JPS6329241B2 - - Google Patents
Info
- Publication number
- JPS6329241B2 JPS6329241B2 JP60082351A JP8235185A JPS6329241B2 JP S6329241 B2 JPS6329241 B2 JP S6329241B2 JP 60082351 A JP60082351 A JP 60082351A JP 8235185 A JP8235185 A JP 8235185A JP S6329241 B2 JPS6329241 B2 JP S6329241B2
- Authority
- JP
- Japan
- Prior art keywords
- organic polymer
- polymer material
- radiation
- sensitive organic
- color separation
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired
Links
- 230000005855 radiation Effects 0.000 claims description 24
- 229920000620 organic polymer Polymers 0.000 claims description 22
- 239000002861 polymer material Substances 0.000 claims description 22
- 238000000926 separation method Methods 0.000 claims description 18
- 239000000758 substrate Substances 0.000 claims description 11
- 239000004065 semiconductor Substances 0.000 claims description 7
- 238000001514 detection method Methods 0.000 claims description 5
- 230000003595 spectral effect Effects 0.000 claims description 4
- 239000010410 layer Substances 0.000 description 21
- 239000000463 material Substances 0.000 description 18
- 238000004519 manufacturing process Methods 0.000 description 9
- 238000000034 method Methods 0.000 description 9
- 230000003287 optical effect Effects 0.000 description 5
- 230000035945 sensitivity Effects 0.000 description 4
- -1 Poly alkyl methacrylate Chemical compound 0.000 description 3
- 238000003384 imaging method Methods 0.000 description 3
- 239000011241 protective layer Substances 0.000 description 3
- 206010034972 Photosensitivity reaction Diseases 0.000 description 2
- 239000000853 adhesive Substances 0.000 description 2
- 230000001070 adhesive effect Effects 0.000 description 2
- 238000011109 contamination Methods 0.000 description 2
- 229920001577 copolymer Polymers 0.000 description 2
- 238000004043 dyeing Methods 0.000 description 2
- 230000000694 effects Effects 0.000 description 2
- 239000012535 impurity Substances 0.000 description 2
- 230000036211 photosensitivity Effects 0.000 description 2
- QCVGEOXPDFCNHA-UHFFFAOYSA-N 5,5-dimethyl-2,4-dioxo-1,3-oxazolidine-3-carboxamide Chemical compound CC1(C)OC(=O)N(C(N)=O)C1=O QCVGEOXPDFCNHA-UHFFFAOYSA-N 0.000 description 1
- 102000002322 Egg Proteins Human genes 0.000 description 1
- 108010000912 Egg Proteins Proteins 0.000 description 1
- IMROMDMJAWUWLK-UHFFFAOYSA-N Ethenol Chemical compound OC=C IMROMDMJAWUWLK-UHFFFAOYSA-N 0.000 description 1
- 108010010803 Gelatin Proteins 0.000 description 1
- 229920002367 Polyisobutene Polymers 0.000 description 1
- 125000000217 alkyl group Chemical group 0.000 description 1
- 239000005018 casein Substances 0.000 description 1
- BECPQYXYKAMYBN-UHFFFAOYSA-N casein, tech. Chemical compound NCCCCC(C(O)=O)N=C(O)C(CC(O)=O)N=C(O)C(CCC(O)=N)N=C(O)C(CC(C)C)N=C(O)C(CCC(O)=O)N=C(O)C(CC(O)=O)N=C(O)C(CCC(O)=O)N=C(O)C(C(C)O)N=C(O)C(CCC(O)=N)N=C(O)C(CCC(O)=N)N=C(O)C(CCC(O)=N)N=C(O)C(CCC(O)=O)N=C(O)C(CCC(O)=O)N=C(O)C(COP(O)(O)=O)N=C(O)C(CCC(O)=N)N=C(O)C(N)CC1=CC=CC=C1 BECPQYXYKAMYBN-UHFFFAOYSA-N 0.000 description 1
- 235000021240 caseins Nutrition 0.000 description 1
- 239000011248 coating agent Substances 0.000 description 1
- 238000000576 coating method Methods 0.000 description 1
- 238000007796 conventional method Methods 0.000 description 1
- 238000004132 cross linking Methods 0.000 description 1
- 230000006866 deterioration Effects 0.000 description 1
- 235000014103 egg white Nutrition 0.000 description 1
- 210000000969 egg white Anatomy 0.000 description 1
- 238000010894 electron beam technology Methods 0.000 description 1
- 229920000159 gelatin Polymers 0.000 description 1
- 239000008273 gelatin Substances 0.000 description 1
- 235000019322 gelatine Nutrition 0.000 description 1
- 235000011852 gelatine desserts Nutrition 0.000 description 1
- 239000011159 matrix material Substances 0.000 description 1
- 238000002156 mixing Methods 0.000 description 1
- 239000000203 mixture Substances 0.000 description 1
- 238000000465 moulding Methods 0.000 description 1
- 239000003921 oil Substances 0.000 description 1
- 230000002093 peripheral effect Effects 0.000 description 1
- 238000000016 photochemical curing Methods 0.000 description 1
- 239000011120 plywood Substances 0.000 description 1
- 229920002454 poly(glycidyl methacrylate) polymer Polymers 0.000 description 1
- 229920002451 polyvinyl alcohol Polymers 0.000 description 1
- 230000001681 protective effect Effects 0.000 description 1
- 229910052710 silicon Inorganic materials 0.000 description 1
- 239000010703 silicon Substances 0.000 description 1
- 238000005728 strengthening Methods 0.000 description 1
Classifications
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L31/00—Semiconductor devices sensitive to infrared radiation, light, electromagnetic radiation of shorter wavelength or corpuscular radiation and specially adapted either for the conversion of the energy of such radiation into electrical energy or for the control of electrical energy by such radiation; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof
- H01L31/02—Details
- H01L31/0216—Coatings
- H01L31/02161—Coatings for devices characterised by at least one potential jump barrier or surface barrier
- H01L31/02162—Coatings for devices characterised by at least one potential jump barrier or surface barrier for filtering or shielding light, e.g. multicolour filters for photodetectors
Landscapes
- Physics & Mathematics (AREA)
- Condensed Matter Physics & Semiconductors (AREA)
- Electromagnetism (AREA)
- General Physics & Mathematics (AREA)
- Engineering & Computer Science (AREA)
- Computer Hardware Design (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Power Engineering (AREA)
- Optical Filters (AREA)
- Solid State Image Pick-Up Elements (AREA)
- Color Television Image Signal Generators (AREA)
Description
〔発明の利用分野〕
本発明は固体撮像素子に関する。
本発明は特に光検知部上に直接色分解フイルタ
ーを搭載するカラー用固体撮像素子に有用であ
る。
〔発明の背景〕
従来、固体撮像素子と色分解フイルターを個別
に製造しておき、両者を位置合せしつつ光学用接
着剤等で貼合せるのが一般的な製造方法である。
また光学用接着剤のかわりに光学用マツチング・
オイルを用いる例も報告されている。
また、多色光学フイルターの製造方法につい
て、特開昭53−99822号公報に、色分解フイルタ
ーの製造方法について、特開昭50−147823号公報
に開示されているが、固体撮像素子にフイルター
を直接設けることは何ら記載されていない。
更に、カラーイメージングデバイスおよびその
製造方法について、特開昭53−47282号公報に開
示されているが放射線感応性材料については、全
く記載がない。
尚、被複用組成物について、特開昭50−83425
号公報に開示があり、当該公報中で放射線感応性
材料について記載されているがこれらは、容器
や、合板に関する技術にすぎないものである。
〔発明の目的〕
本発明の第１の目的は、固体撮像素子の光検知
部上に直接色分解フイルターを搭載し、素子製造
の作業性を向上させることにある。
本発明の第２の目的はこの場合の色分解フイル
ターを十分精度良く、高品位になすことにある。
〔発明の概要〕
本発明は色分解フイルターを構成するいわゆる
中間層や保護層を放射線感応性有機高分子材料を
用い、固体撮像素子のその後の製造工程に有利な
らしめることに第１の要点がある。
第２は、更に前述の有機高分子材料が熱架橋性
なる特性を有することがより好ましい。これは色
分解フイルターの積層構造に用いる中間層等の強
化に有用である。
第３に、前記放射線感応性有機高分子材料がい
わゆるポジ型であることが、工程簡略化の点から
極めて有利である。ネガ型の放射線感応性を有し
ていてもフイルター部の加工にこの特性を使用し
得る。しかし、各中間層を形成と共に、所定の放
射線を露光し架橋を施こす必要が生じ、工程数が
多くなる。勿論ポジ型の放射線感応性有機高分子
材料を用いても、上記各中間層を形成と共に所定
の放射線を露光し、次いで現像して所望の加工を
施して良いし、又複数層毎上述の加工を施して良
いことは当然である。各層毎に加工を行なつた場
合、工程数としてはネガ型の場合と同じ工程数と
なる。しかし、この場合でもポジ型の方が次の如
き利点を有する。即ち、ポジ型の場合、有機高分
子材料の層を除去する部位に放射線を露光する
が、一方、ネガ型の場合、残存させる部位に放射
線を露光する。色分解フイルター母材を有するの
は当然前記有機高分子材料の層が残存せしめられ
る部位となる。従つて、ネガ型の場合、色分解フ
イルター母材にも何度か露光用の放射線が照射さ
れることとなり、フイルター特性の劣化に影響を
およぼす。ポジ型においてはこの様な亜影響は全
くない。
また、多くの場合、フイルター母材にも感光性
を付与して用いるが、この場合フイルター母材の
感光特性と、中間層および保護層の材料の光分特
性が異なつているのが好ましい。フイルター母材
の加工時に、その下部に存在する中間層および保
護層の材料に影響を及ぼさない必要がある。
本発明に用いるに有用な放射線感応性有機高分
子材料は次の如きものが掲げられる。
(1) ポリ・アルキル・メタクリレート又はその共
重合体
但し、Ｒはアルキル基、例えば、CH3、C4H9
(2) ポリグリシジル・メタクリレート又はその共
重合体
(3) ポリメタクリルアミド
(4) ポリメチルイソプロペニルケトン
(5) ポリ（ブテン−１スルホン）
(6) ポリイソブチレン
これらの例以外の放射線感応性有機高分子材料
を使用し得ることはいうまでもない。勿論、放射
線感応性有機高分子材料として紫外線感応性、電
子線感応性、Ｘ線感応性等のものを使用し得る。
本明細書の「放送線感応性」なる用語はこれら各
種のものを含むものである。
〔発明の実施例〕
以下、本発明を具体例に従つて詳細に説明す
る。
第１図から第４図までは本発明のカラー用固体
撮像素子の製造工程を示す。いすれも素子の主要
部の断面図である。第５図はその平面図である。
カラー用固体撮像素子基板１には多数の光検知
部１０およびこれらを駆動する駆動回路部１１が
少なくとも形成されている。なお、半導体基板１
中の詳細な構造は省略されている。一般に基板１
はシリコンで作製されている。光検知部は、これ
を動作させるための周辺回路を形づくる半導体集
積回路と同一基材で作られる場合と、別種の半導
体材料を用いる場合などがある。
こうしたカラー用固体撮像素子基板上に色分解
フイルターの母材の層を厚さ0.5〜2.5μｍ程度形
成する。この母材は一般にゼラチン、卵白、グリ
ー、カゼインおよびポバール等に感光性を与えた
材料が用いられる。感光特性としてはネガ型を用
い365nｍないし435nｍに感度を持たせるのが一
般的である。
この層にマスク露光法で第１色目の部分２だけ
光硬化させ現像することによつて、色分解フイル
ター母材の部分２だけが残される。この部分に所
定の分光特性を有する染料で染色する。なお、染
色法を従来から行なわれている染料水溶液を用い
る方法で良い。
なお、この第１色目のフイルター母材の層を形
成する際、基板１の表面に約0.5〜1μｍの厚さに
有機高分子材料の被膜を形成しておくのが好まし
い。この有機高分子材料の被膜によつて基板表面
がより平坦化される。これによつて次の様な利点
を生ずる。
(1) 基板１中に設けられた半導体装置部分に対
し、不純物等の汚染の保護効果が生ずる。
(2) 基板１の表面が平坦化され、この上部に形成
される中間層、フイルター母材の層等の形成が
容易になると共に、特に中間層の変形に伴ない
生ずる染色時の混色を防止することが出来る。
(3) 色フイルターの加工工程で、不純物の付着面
積が小さくなり、基板中の半導体装置の汚染防
止に有用である。
なお、この有機高分子材料も前述の中間層等を
形成するための放射線感応性有機高分子材料を用
いるのが、後の加工に有利である。
次いで透明な耐染色性の中間層５を厚さ0.5〜
1.5μｍに被覆する。第１図がこの状態である。こ
の中間層に前述の放射線感応性有機高分子材料を
用いる。この場合、色分解フイルター母材の感光
特性と異なる放射線感応特性を有する如く選択す
るのが良いことは前述した。
次に、同様に第２図に示す様に色フイルター母
材の層を形成し、マスク露光法で露光し、現像を
施こし、第２色目のフイルター部分３を形成、所
定の分光特性を有する染料で染色する。更に透明
な中間層６を被覆する。
さらに同様に第３図に示すように色フイルター
[Field of Application of the Invention] The present invention relates to a solid-state image sensor. The present invention is particularly useful for a color solid-state image sensor in which a color separation filter is mounted directly on a photodetector. [Background of the Invention] Conventionally, a common manufacturing method is to manufacture a solid-state image sensor and a color separation filter separately, and then bond them together using an optical adhesive or the like while aligning the two.
Also, instead of optical adhesive, optical matching
Examples of using oil have also been reported. Further, a method for manufacturing a polychromatic optical filter is disclosed in Japanese Patent Application Laid-Open No. 53-99822, and a method for manufacturing a color separation filter is disclosed in Japanese Patent Application Laid-open No. 147823-1989. There is no mention of providing it directly. Further, although a color imaging device and a method for manufacturing the same are disclosed in Japanese Patent Application Laid-Open No. 53-47282, there is no mention of radiation-sensitive materials at all. Regarding the composition to be copied, Japanese Patent Application Laid-Open No. 50-83425
Although the publication discloses radiation-sensitive materials in the publication, these are merely techniques related to containers and plywood. [Object of the Invention] A first object of the present invention is to mount a color separation filter directly on the light detection section of a solid-state image sensor, thereby improving the workability of manufacturing the device. A second object of the present invention is to make the color separation filter in this case sufficiently accurate and of high quality. [Summary of the Invention] The first key point of the present invention is to use a radiation-sensitive organic polymer material for the so-called intermediate layer and protective layer constituting the color separation filter, which is advantageous for the subsequent manufacturing process of the solid-state image sensor. be. Second, it is more preferable that the organic polymer material described above has thermal crosslinkability. This is useful for strengthening intermediate layers used in the laminated structure of color separation filters. Thirdly, it is extremely advantageous for the radiation-sensitive organic polymer material to be of a so-called positive type in terms of process simplification. Even if it has negative radiation sensitivity, this property can be used for processing the filter part. However, as each intermediate layer is formed, it becomes necessary to perform crosslinking by exposing to a predetermined radiation, which increases the number of steps. Of course, even if a positive radiation-sensitive organic polymer material is used, each of the intermediate layers described above may be formed and exposed to a predetermined radiation, and then developed and subjected to the desired processing. Of course, it is okay to do so. When each layer is processed, the number of steps is the same as in the case of negative molding. However, even in this case, the positive type has the following advantages. That is, in the case of a positive type, a portion of the organic polymer material layer to be removed is exposed to radiation, whereas in the case of a negative type, a portion of the organic polymer material to be left is exposed to radiation. Naturally, the color separation filter base material is the part where the layer of the organic polymer material remains. Therefore, in the case of a negative type, the color separation filter base material is also irradiated with exposure radiation several times, which affects the deterioration of the filter characteristics. Positive types have no such sub-effects at all. Furthermore, in many cases, the filter base material is also used by imparting photosensitivity, but in this case, it is preferable that the photosensitivity characteristics of the filter base material and the optical characteristics of the materials of the intermediate layer and the protective layer are different. When processing the filter base material, it is necessary not to affect the materials of the intermediate layer and protective layer that exist below it. The following radiation-sensitive organic polymer materials are useful for use in the present invention. (1) Poly alkyl methacrylate or its copolymer However, R is an alkyl group, for example, CH 3 , C 4 H 9 (2) Polyglycidyl methacrylate or a copolymer thereof (3) Polymethacrylamide (4) Polymethylisopropenylketone (5) Poly(butene-1 sulfone) (6) Polyisobutylene It goes without saying that radiation-sensitive organic polymer materials other than these examples may be used. Of course, as the radiation-sensitive organic polymer material, those sensitive to ultraviolet rays, electron beams, X-rays, etc. can be used.
As used herein, the term "broadcast line sensitivity" includes these various types. [Embodiments of the Invention] The present invention will be described in detail below with reference to specific examples. 1 to 4 show the manufacturing process of the color solid-state image sensing device of the present invention. All are sectional views of the main parts of the elements. FIG. 5 is a plan view thereof. The color solid-state image sensor substrate 1 is provided with at least a large number of photodetecting sections 10 and a drive circuit section 11 for driving them. Note that the semiconductor substrate 1
The detailed structure inside has been omitted. Generally board 1
is made of silicon. The photodetector may be made of the same base material as the semiconductor integrated circuit that forms the peripheral circuitry for operating the photodetector, or may be made of a different type of semiconductor material. A layer of a base material of a color separation filter is formed to a thickness of about 0.5 to 2.5 μm on such a color solid-state image sensor substrate. This matrix is generally made of gelatin, egg white, green, casein, poval, or the like, which has been made photosensitive. As for photosensitive characteristics, it is common to use a negative type and have sensitivity in the range of 365 nm to 435 nm. By photo-curing and developing only the first color portion 2 of this layer using a mask exposure method, only the portion 2 of the color separation filter base material remains. This area is dyed with a dye having predetermined spectral characteristics. Note that the dyeing method may be a conventional method using an aqueous dye solution. In addition, when forming this layer of the filter base material of the first color, it is preferable to form a film of an organic polymer material on the surface of the substrate 1 to a thickness of about 0.5 to 1 μm. The surface of the substrate is further planarized by this coating of organic polymer material. This brings about the following advantages. (1) The semiconductor device portion provided in the substrate 1 is protected from contamination such as impurities. (2) The surface of the substrate 1 is flattened, making it easier to form the intermediate layer, filter base material layer, etc. formed on the top thereof, and preventing color mixing during dyeing, which occurs especially when the intermediate layer is deformed. You can. (3) In the color filter processing process, the area on which impurities adhere is reduced, which is useful for preventing contamination of semiconductor devices on the substrate. Note that it is advantageous for later processing to use a radiation-sensitive organic polymer material for forming the above-mentioned intermediate layer and the like as the organic polymer material. Next, a transparent dye-resistant intermediate layer 5 is formed to a thickness of 0.5~
Coat to 1.5μm. FIG. 1 shows this state. The aforementioned radiation-sensitive organic polymer material is used for this intermediate layer. In this case, as described above, it is preferable to select a material having radiation sensitivity characteristics different from those of the color separation filter base material. Next, as shown in FIG. 2, a layer of color filter base material is formed, exposed using a mask exposure method, and developed to form a second color filter portion 3, which has predetermined spectral characteristics. Dye with dye. Furthermore, a transparent intermediate layer 6 is coated. Furthermore, as shown in Figure 3, a color filter is applied.
本発明によれば、固体撮像素子上に直接色分解
フイルターを搭載でき、素子製造の作業性を向上
させることができる。
更に、色分解フイルターを精度良く、高品位に
設けることができる。
According to the present invention, it is possible to directly mount a color separation filter on a solid-state image sensor, thereby improving the workability of manufacturing the device. Furthermore, color separation filters can be provided with high precision and high quality.
第１図より第４図は本発明のカラー用固体撮像
素子の製造方法を示す素子断面図、第５図はカラ
ー用固体撮像素子の平面図である。
１……固体撮像素子基板、２，３，４……色フ
イルター部、５，６……中間層、７……保護膜。
1 to 4 are cross-sectional views of the color solid-state imaging device according to the present invention, and FIG. 5 is a plan view of the color solid-state imaging device. 1... Solid-state image sensor substrate, 2, 3, 4... Color filter section, 5, 6... Intermediate layer, 7... Protective film.
Claims (1)
配線部とを少なくとも有する半導体基体上部に色
分解用フイルター部が透光性の放射線感応性有機
高分子材料層を介して設けられ、前記色分解用フ
イルター部は所望形状且所定の分光特性を有する
フイルター層および透光性の放射線感応性有機高
分子材料層が所定の数だけ順次積層され、且上記
放射線感応性有機高分子材料層を局部的に除去
し、この局部的に除去した領域を通して施こされ
た配線を少なくとも有することを特徴とする固体
撮像素子。 ２ 複数の光検知要素が配置された光検知部と、
配線部とを少なくとも有する半導体基体上部に色
分解用フイルター部が透光性のポジ型放射線感応
性有機高分子材料層を介して設けられ、前記色分
解用フイルター部は所望形状且所定の分光特性を
有するフイルター層および透光性のポジ型放射線
感応性有機高分子材料層が所定の数だけ順次積層
され、且上記ポジ型放射線感応性有機高分子材料
層を局部的に除去し、この局所的に除去した領域
を通して施こされた配線を少なくとも有すること
を特徴とする固体撮像素子。[Claims] 1. A light detection section in which a plurality of light detection elements are arranged;
A color separation filter section is provided on the semiconductor substrate having at least a wiring section via a transparent radiation-sensitive organic polymer material layer, and the color separation filter section has a desired shape and predetermined spectral characteristics. A predetermined number of filter layers and light-transmitting radiation-sensitive organic polymer material layers are sequentially laminated, and the radiation-sensitive organic polymer material layer is locally removed, and the radiation-sensitive organic polymer material layer is applied through the locally removed area. 1. A solid-state image sensing device comprising at least traced wiring. 2. A light detection section in which a plurality of light detection elements are arranged;
A color separation filter section is provided on the semiconductor substrate having at least a wiring section through a translucent positive radiation-sensitive organic polymer material layer, and the color separation filter section has a desired shape and a predetermined spectral characteristic. A predetermined number of filter layers and translucent positive radiation-sensitive organic polymer material layers are sequentially laminated, and the positive radiation-sensitive organic polymer material layer is locally removed. What is claimed is: 1. A solid-state image sensing device comprising at least wiring that is routed through a region that has been removed.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP60082351A JPS60258962A (en) | 1985-04-19 | 1985-04-19 | Solid-state image pickup element |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP60082351A JPS60258962A (en) | 1985-04-19 | 1985-04-19 | Solid-state image pickup element |
Related Parent Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP54020801A Division JPS6046401B2 (en) | 1979-02-26 | 1979-02-26 | Manufacturing method of solid-state image sensor |
Related Child Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP1107618A Division JPH0215201A (en) | 1989-04-28 | 1989-04-28 | Solid-state image pickup element |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| JPS60258962A JPS60258962A (en) | 1985-12-20 |
| JPS6329241B2 true JPS6329241B2 (en) | 1988-06-13 |
Family
ID=13772147
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP60082351A Granted JPS60258962A (en) | 1985-04-19 | 1985-04-19 | Solid-state image pickup element |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPS60258962A (en) |
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP2608907B2 (en) * | 1988-01-28 | 1997-05-14 | 株式会社日立製作所 | Rotary tape guide mechanism for magnetic recording / reproducing device |
Citations (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS5217375A (en) * | 1975-07-21 | 1977-02-09 | Kanegafuchi Chem Ind Co Ltd | Membrane separating apparatus |
| JPS5228547U (en) * | 1975-08-14 | 1977-02-28 | ||
| JPS5324291A (en) * | 1976-08-18 | 1978-03-06 | Nec Corp | Production of semiconductor devi ce |
| JPS53134324A (en) * | 1977-04-28 | 1978-11-22 | Sony Corp | Manufacture for color pick up element |
-
1985
- 1985-04-19 JP JP60082351A patent/JPS60258962A/en active Granted
Patent Citations (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS5217375A (en) * | 1975-07-21 | 1977-02-09 | Kanegafuchi Chem Ind Co Ltd | Membrane separating apparatus |
| JPS5228547U (en) * | 1975-08-14 | 1977-02-28 | ||
| JPS5324291A (en) * | 1976-08-18 | 1978-03-06 | Nec Corp | Production of semiconductor devi ce |
| JPS53134324A (en) * | 1977-04-28 | 1978-11-22 | Sony Corp | Manufacture for color pick up element |
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP2608907B2 (en) * | 1988-01-28 | 1997-05-14 | 株式会社日立製作所 | Rotary tape guide mechanism for magnetic recording / reproducing device |
Also Published As
| Publication number | Publication date |
|---|---|
| JPS60258962A (en) | 1985-12-20 |
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