JPS63263753A - Semiconductor manufacturing device - Google Patents
Semiconductor manufacturing deviceInfo
- Publication number
- JPS63263753A JPS63263753A JP10060787A JP10060787A JPS63263753A JP S63263753 A JPS63263753 A JP S63263753A JP 10060787 A JP10060787 A JP 10060787A JP 10060787 A JP10060787 A JP 10060787A JP S63263753 A JPS63263753 A JP S63263753A
- Authority
- JP
- Japan
- Prior art keywords
- solder
- soldering
- hot plate
- semiconductor manufacturing
- pool
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
- 239000004065 semiconductor Substances 0.000 title claims abstract description 29
- 238000004519 manufacturing process Methods 0.000 title claims description 15
- 238000005476 soldering Methods 0.000 claims abstract description 34
- 229910000679 solder Inorganic materials 0.000 claims abstract description 33
- 238000002844 melting Methods 0.000 claims description 3
- 230000008018 melting Effects 0.000 claims description 3
- XEEYBQQBJWHFJM-UHFFFAOYSA-N Iron Chemical compound [Fe] XEEYBQQBJWHFJM-UHFFFAOYSA-N 0.000 abstract description 24
- 229910052742 iron Inorganic materials 0.000 abstract description 12
- 238000010438 heat treatment Methods 0.000 abstract description 3
- 238000000034 method Methods 0.000 abstract description 2
- XAGFODPZIPBFFR-UHFFFAOYSA-N aluminium Chemical compound [Al] XAGFODPZIPBFFR-UHFFFAOYSA-N 0.000 description 6
- 229910052782 aluminium Inorganic materials 0.000 description 6
- 239000000758 substrate Substances 0.000 description 5
- 230000000694 effects Effects 0.000 description 3
- 230000017525 heat dissipation Effects 0.000 description 2
- 241000277269 Oncorhynchus masou Species 0.000 description 1
- 239000003795 chemical substances by application Substances 0.000 description 1
- 238000005516 engineering process Methods 0.000 description 1
- 239000000203 mixture Substances 0.000 description 1
- 230000002747 voluntary effect Effects 0.000 description 1
Landscapes
- Lead Frames For Integrated Circuits (AREA)
Abstract
Description
【発明の詳細な説明】
〔産業上の利用分野〕
この発明は半導体製造装置に関し、特に半導体装置の半
田付けを必要とする部分の組み立て作業を行う場合に使
用する半導体製造装置に関するものである。DETAILED DESCRIPTION OF THE INVENTION [Industrial Application Field] The present invention relates to semiconductor manufacturing equipment, and particularly to a semiconductor manufacturing equipment used when assembling parts of a semiconductor device that require soldering.
第２図（ａ）および（ｂ）は従来の半導体製造装置を示
す平面図および断面図である。同図において、■は図示
しないヒータを内蔵するホットプレート、２は半導体装
置の放熱板、３は半導体装置のアルミ基板、４は外部電
極リード、５は半田ごて、６は糸半田を示す。FIGS. 2(a) and 2(b) are a plan view and a sectional view showing a conventional semiconductor manufacturing apparatus. In the figure, ■ indicates a hot plate incorporating a heater (not shown), 2 indicates a heat sink of a semiconductor device, 3 indicates an aluminum substrate of a semiconductor device, 4 indicates an external electrode lead, 5 indicates a soldering iron, and 6 indicates a solder wire.
このように構成された半導体製造装置においては、ヒー
タを内蔵するホットプレート１の表面に放熱板２とアル
ミ基板３が一体となった半導体装置を裁置することによ
って予熱を行っている。次に、アルミ基板３の表面に設
けられている図示しないリード端子取付部に外部電極リ
ード４をビンセット等で置きながら、その都度半田ごて
５と糸半田６を用いて半田付けによる組み立て作業を行
っている。In the semiconductor manufacturing apparatus configured as described above, preheating is performed by placing a semiconductor device including a heat sink 2 and an aluminum substrate 3 integrated on the surface of a hot plate 1 having a built-in heater. Next, the external electrode leads 4 are placed on the lead terminal attachment parts (not shown) provided on the surface of the aluminum substrate 3 using a bottle set, etc., and each time an assembly process is performed by soldering using a soldering iron 5 and a wire solder 6. It is carried out.
従来の半導体製造装置は以上のように構成されているの
で、半田付特性を良好にするためには、各半田付作業毎
に半田ごての先端に糸半田を適当量加えてなじませるこ
とが必要である。この結果、半田作業を行うに際しては
、糸半田を供給するためのピンセットと半田ごてを両手
に持った状態での作業となることから、作業効率が低下
する問題点を有している。Conventional semiconductor manufacturing equipment is configured as described above, so in order to improve the soldering characteristics, it is necessary to add an appropriate amount of thread solder to the tip of the soldering iron for each soldering operation and let it blend in. is necessary. As a result, when performing soldering work, the user must hold tweezers for supplying thread solder and a soldering iron in both hands, which poses the problem of reduced work efficiency.
この発明は、上記のような問題点を解消するためになさ
れたもので、半田付作業の効率を大幅に向上させること
が出来る半導体製造装置を得ることを目的とする。The present invention has been made to solve the above-mentioned problems, and an object of the present invention is to provide a semiconductor manufacturing apparatus that can significantly improve the efficiency of soldering work.
〔問題点を解決するための手段］
この発明による半導体製造装置は、半導体装置を予備加
熱するホットプレートの表面一部に凹部を形成して、半
田を溶融して置く半田溶融プール部を設けたものである
。[Means for Solving the Problems] In the semiconductor manufacturing apparatus according to the present invention, a recess is formed in a part of the surface of a hot plate for preheating a semiconductor device, and a solder melting pool portion is provided in which solder is melted and placed. It is something.
このように構成された半導体製造装置においては、ホッ
トプレートが半導体装置を予熱すると共に、半田溶融プ
ール部には常に即使用が可能な状態に溶融された半田が
備えられることから、この半田熔融プール部の半田を使
用することによって、半田付作業を両手で行うことが出
来、これに伴って作業効率が向上することになる。In semiconductor manufacturing equipment configured in this way, the hot plate preheats the semiconductor device, and the solder melt pool is always provided with melted solder ready for immediate use. By using the solder in the section, soldering work can be performed with both hands, and work efficiency is improved accordingly.
〔発明の実施例〕
以下、この発明の一実施例を図について説明する。第１
図（ａ）、 （ｂ）は、この発明による半導体製造装
置の一実施例を示す平面図および断面図であって、同図
において１は図示しないヒータを内蔵するホットプレー
ト、２は半導体装置の放熱板、３は半導体装置のアルミ
基板、４は外部電極レード、５は半田ごて、６は糸半田
、７は内部に図示しないヒータを有して、半導体装置を
予備加熱するホットプレートの表面の一部に凹部を形成
し、その内部に半田を溶融して置く半田溶融プール部で
ある。[Embodiment of the Invention] An embodiment of the invention will be described below with reference to the drawings. 1st
Figures (a) and (b) are a plan view and a sectional view showing an embodiment of a semiconductor manufacturing apparatus according to the present invention, in which numeral 1 denotes a hot plate incorporating a heater (not shown), and 2 denotes a hot plate of a semiconductor device. A heat dissipation plate, 3 is an aluminum substrate of a semiconductor device, 4 is an external electrode layer, 5 is a soldering iron, 6 is a wire solder, 7 is a surface of a hot plate that has a heater (not shown) inside and preheats the semiconductor device. A recess is formed in a part of the recess, and the solder is melted and placed inside the recess.
このように構成された半導体製造装置においては、半田
作業を行うに際しては、先ず半田溶融プール部７に例え
ば糸半田等を投入して加熱することにより、溶融半田を
用意する。 また、このホットプレート１の上に半導体
装置構成する放熱板２とアルミ基板３の積層体を所定時
間放置することによってこれらを予熱する。次に、ビン
セット等を使用して、外部電極レード４を図示しないリ
ード端子取付部に位置させる。この状態で、先端に適量
の溶融半田を有する半田ごて５の該先端部を係る半田付
部分に押し当てると、前記半田ごて５の先端部分に位置
する溶融半田が該半田付部分に流れて、良好な半田が行
えることになる。ここで、半田ごて５の先端部分に対す
る半田の供給は、既に半田溶融プール部７の中に溶融半
田が溜められていることから、半田ごて５の先端部分を
この半田溶融プール部７の中に挿入することによって、
係る半田の供給が用意に行える。従って、半田付作業に
おいては、糸半田を手に持って供給することが不要にな
ることから、一方の手にビンセットを持ち、他方の手に
半田ごて５を持った状態で半田付作業を進めることが出
来るために、係る半田付作業が安定となって、良好な半
田付けが得られるとともに、作業効率が大幅に向上する
ことになる。In the semiconductor manufacturing apparatus configured as described above, when performing a soldering operation, first, molten solder is prepared by charging, for example, solder wire or the like into the solder molten pool 7 and heating it. Further, a stack of a heat sink 2 and an aluminum substrate 3 constituting a semiconductor device is left on the hot plate 1 for a predetermined period of time to preheat them. Next, using a bin set or the like, the external electrode wire 4 is positioned at a lead terminal mounting portion (not shown). In this state, when the tip of the soldering iron 5, which has an appropriate amount of molten solder at its tip, is pressed against the soldering part, the molten solder located at the tip of the soldering iron 5 flows into the soldering part. Therefore, good soldering can be performed. Here, the solder is supplied to the tip of the soldering iron 5 because the molten solder is already stored in the solder molten pool 7. By inserting it into
Such solder can be easily supplied. Therefore, during soldering work, it is no longer necessary to hold and supply the solder thread, so soldering work is performed while holding the bottle set in one hand and the soldering iron 5 in the other hand. As a result, the soldering work becomes stable, good soldering can be achieved, and working efficiency is greatly improved.
以上のように、この発明によれば、半導体装置の加熱用
に設けられているホットプレートの一部表面に半田溶融
プールを設けたものであるために、半田付作業に際して
、半田ごてを持ちながら部品を半田付部分に固定する作
業を用意にかつ確実に行うことが出来、これに伴って良
好な半田付特性が得られると共に、作業効率が大幅に向
上する等の種々優れた効果を有する。As described above, according to the present invention, since a solder melt pool is provided on a part of the surface of a hot plate provided for heating semiconductor devices, it is difficult to hold a soldering iron during soldering work. However, it is possible to easily and reliably fix parts to the soldering part, and this has various excellent effects such as obtaining good soldering characteristics and greatly improving work efficiency. .
第１図（ａ）、（ｂ）はこの発明の一実施例による半導
体製造装置を示す平面図および断面図、第２図（ａ）、
（ｂ）は従来の半導体製造装置を示す平面図および断面
図である。
１はホットプレート、２は放熱讐反、３はアルミ基板、
４は外部電極リード、５は半田ごて、６は糸半田、７は
半田溶融プール部。
なお、図中同一符号は同−又は相当部分を示す。
代理人 大 岩 増 ａ （外２名）第１図
１・・・ホットプレート
７・・・半田溶融プール
（ｂ）
手続補正書（自発）FIGS. 1(a) and 1(b) are a plan view and a sectional view showing a semiconductor manufacturing apparatus according to an embodiment of the present invention, FIG. 2(a),
(b) is a plan view and a sectional view showing a conventional semiconductor manufacturing apparatus. 1 is a hot plate, 2 is a heat dissipation plate, 3 is an aluminum board,
4 is an external electrode lead, 5 is a soldering iron, 6 is a solder wire, and 7 is a solder molten pool. Note that the same reference numerals in the figures indicate the same or equivalent parts. Agent Masu Oiwa A (2 others) Figure 1 1...Hot plate 7...Solder melt pool (b) Procedural amendment (voluntary)
Claims (1)
田付けによる組み立てを行う半導体装置を載置して、予
備加熱を行いながら半田付作業を行う半導体製造装置に
おいて、前記ホットプレートの一部表面部分に、投入さ
れた半田を溶融状態で収容する半田溶融プールを設けた
ことを特徴とする半導体製造装置。(1) In a semiconductor manufacturing apparatus in which a semiconductor device to be assembled by soldering is placed on a hot plate having a heater inside and soldering work is performed while preheating, a part of the surface of the hot plate is used. 1. A semiconductor manufacturing device characterized in that a solder melting pool is provided in a portion of the solder melting pool for accommodating injected solder in a molten state.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP10060787A JPS63263753A (en) | 1987-04-22 | 1987-04-22 | Semiconductor manufacturing device |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP10060787A JPS63263753A (en) | 1987-04-22 | 1987-04-22 | Semiconductor manufacturing device |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| JPS63263753A true JPS63263753A (en) | 1988-10-31 |
Family
ID=14278543
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP10060787A Pending JPS63263753A (en) | 1987-04-22 | 1987-04-22 | Semiconductor manufacturing device |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPS63263753A (en) |
-
1987
- 1987-04-22 JP JP10060787A patent/JPS63263753A/en active Pending
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