JPS63248211A - Electronic component and its manufacture - Google Patents
Electronic component and its manufactureInfo
- Publication number
- JPS63248211A JPS63248211A JP8338487A JP8338487A JPS63248211A JP S63248211 A JPS63248211 A JP S63248211A JP 8338487 A JP8338487 A JP 8338487A JP 8338487 A JP8338487 A JP 8338487A JP S63248211 A JPS63248211 A JP S63248211A
- Authority
- JP
- Japan
- Prior art keywords
- electronic component
- packing member
- resin case
- elastic body
- main body
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
- 238000004519 manufacturing process Methods 0.000 title claims abstract description 14
- 239000012530 fluid Substances 0.000 claims abstract description 7
- 239000011347 resin Substances 0.000 claims description 33
- 229920005989 resin Polymers 0.000 claims description 33
- 239000000945 filler Substances 0.000 claims description 21
- 238000002347 injection Methods 0.000 claims description 15
- 239000007924 injection Substances 0.000 claims description 15
- 239000002184 metal Substances 0.000 claims description 10
- 229910052751 metal Inorganic materials 0.000 claims description 10
- 238000000034 method Methods 0.000 claims description 4
- 229920002379 silicone rubber Polymers 0.000 claims description 4
- 239000004945 silicone rubber Substances 0.000 claims description 4
- 238000012856 packing Methods 0.000 abstract 10
- 239000000463 material Substances 0.000 description 7
- 230000000694 effects Effects 0.000 description 6
- 239000011800 void material Substances 0.000 description 3
- 230000007812 deficiency Effects 0.000 description 1
- 239000013013 elastic material Substances 0.000 description 1
- 229920001971 elastomer Polymers 0.000 description 1
- PCHJSUWPFVWCPO-UHFFFAOYSA-N gold Chemical compound [Au] PCHJSUWPFVWCPO-UHFFFAOYSA-N 0.000 description 1
- 239000010931 gold Substances 0.000 description 1
- 229910052737 gold Inorganic materials 0.000 description 1
Landscapes
- Piezo-Electric Or Mechanical Vibrators, Or Delay Or Filter Circuits (AREA)
Abstract
Description
【発明の詳細な説明】
産業上の利用分野
本発明は、容器形のケース内に電子部品本体エレメント
を収容し、且つ、弾性体を充填した電子部品およびその
製造方法に関する。DETAILED DESCRIPTION OF THE INVENTION Field of the Invention The present invention relates to an electronic component in which an electronic component body element is housed in a container-shaped case and filled with an elastic body, and a method for manufacturing the same.
従来技術 従来のこの種の電子部品の一例を第５図に示す。Conventional technology An example of a conventional electronic component of this type is shown in FIG.
この電子部品５１は、容器形の樹脂製ケース５２からリ
ード端子５３□、５３しを突出した状態で、そのリード
端子５３１，５３１．と導電ペースト５４ｍ 、５４ｂ
で接合して電子部品本体エレメント５５を樹脂製ケース
５２内に収納し、隙間部分に弾性体５６を充・填した上
で、樹脂製の蓋５７を接着して構成されている。This electronic component 51 has lead terminals 53 □, 53 2 protruding from a container-shaped resin case 52 . and conductive paste 54m, 54b
The electronic component main body element 55 is housed in a resin case 52, the gap is filled with an elastic body 56, and a resin lid 57 is bonded.
電子部品本体エレメント５５としては例えば圧ｔ１振動
エレメントが挙げられる。また、弾性体５６としては例
えばシリコンゴムが挙げられる。この場合、シリコンゴ
ムは圧’ｆｆ１ｌＨ動エレメントの不要振動を抑制する
ために充填される。The electronic component main body element 55 includes, for example, a pressure t1 vibration element. Further, as the elastic body 56, for example, silicone rubber can be used. In this case, silicone rubber is filled in order to suppress unnecessary vibrations of the pressure moving element.
従来技術の問題点
上記従来の電子部品５１では、弾性体５６を樹脂製ケー
ス５２内に充填した後、蓋５７を接着していたが、この
場合、弾性体５６の充Ｊｌ！Ｘ量が少なすぎると、蓋５
７の内面に沿って広がった隙間状の空隙５８が生じて弾
性体を充填する効果が半減し、一方、弾性体５６の充填
量が多すぎると、蓋５７をすることが出来なくなる。こ
のため充填量の管理を厳格にする必要があり、製造に困
難性がある問題点がある。Problems with the Prior Art In the conventional electronic component 51 described above, the elastic body 56 is filled in the resin case 52 and then the lid 57 is glued. If the amount of X is too small, the lid 5
A gap-shaped void 58 is formed along the inner surface of the elastic body 7, and the effect of filling the elastic body is halved. On the other hand, if the amount of the elastic body 56 filled is too large, the lid 57 cannot be closed. For this reason, it is necessary to strictly control the amount of filling, which poses a problem that makes manufacturing difficult.
更に、盃５７が樹脂製であったために、その厚さをあま
り薄くすることができず、電子部品５１の薄型化に障害
となる問題点がある。Furthermore, since the cup 57 is made of resin, its thickness cannot be made very thin, which poses a problem that becomes an obstacle to making the electronic component 51 thinner.
発明の目的
本発明の目的とするところは、上記製造上の問題点と薄
型化の問題点とを解消した電子部品およびその製造方法
を提供することにある。OBJECTS OF THE INVENTION It is an object of the present invention to provide an electronic component and a method for manufacturing the same that solve the above manufacturing problems and thinning problems.
発明の構成
本発明の電子部品は、容器形の樹脂製ケースと、その樹
脂製ケースの内部に収容された電子部品本体エレメント
と、充填材注入口を穿設され且つ前記樹脂製ケースに固
着された金属板製の蓋と、内部空間に充填された弾性体
とを具備してなることを構成上の特徴とするものである
。Structure of the Invention The electronic component of the present invention includes a container-shaped resin case, an electronic component main body element housed inside the resin case, and a filler injection port formed and fixed to the resin case. The structure is characterized by comprising a lid made of a metal plate and an elastic body filled in the internal space.
また、本発明の電子部品の製造方法は、容器形の樹脂製
ケース中に電子部品本体エレメントを収納し、充填材注
入口を開けた金属板製の蓋をＭｉ前記樹脂製ケースに固
着し、前記充填材注入口より流動状態の充填材を注入し
、内部で弾性体に硬化せしめることを構成上の特徴とす
るものである。Further, the method for manufacturing an electronic component of the present invention includes storing an electronic component main body element in a container-shaped resin case, and fixing a metal plate lid with a filler injection port opened to the resin case, The structure is characterized in that a fluid filler is injected from the filler injection port and hardened into an elastic body inside.
作用
本発明では、蓋をした後、流動状態の充填材を注入し、
弾性体に硬化せしめる。Operation In the present invention, after the lid is closed, the filling material in a fluid state is injected,
Harden into an elastic body.
このため、注入部近傍から順に完全充填されていくので
、弾性体の充填量が仮に少なかったとしても、生じる空
隙は、蓋の内面に沿って広がった隙間状の空隙ではな（
、内部空間の隅に坤しやられた空隙となる。すなわち、
電子部品本体エレメントと蓋の間には空隙を生じず、完
全に弾性体で充填されるから、弾性体の充頃の効果を十
分得ることができる。For this reason, the injection part is completely filled starting from the vicinity of the injection part, so even if the amount of filling of the elastic body is small, the gap that is created is not a gap-like gap that spreads along the inner surface of the lid (
, becoming a void that is forced into the corner of the internal space. That is,
Since no gap is created between the electronic component main body element and the lid, and the lid is completely filled with the elastic body, the full effect of the elastic body can be obtained.
また、充填前に蓋をするから、弾性体の充填量が多すぎ
て蓋ができなくなるという問題点は生じない。Furthermore, since the lid is placed before filling, there is no problem that the lid cannot be closed due to too much filling of the elastic body.
従って、製造が容易となり、品質も向上する。Therefore, manufacturing becomes easier and quality is improved.
さらに、蓋を金属板製としたので、厚さを薄くすること
ができ、電子部品の薄型化に貢献できる。Furthermore, since the lid is made of a metal plate, the thickness can be reduced, contributing to thinning of electronic components.
実方缶ｆタリ
以下、図に示す実施例に基づいて本発明を更に詳しく説
明する。ここに第１図（ａｌは樹脂製ケースの一例の斜
視図、第１図中）は第１図（ａｌに示す樹脂製ケースを
垂直に切断した端面図、第３図１ａｌは第１図に示す樹
脂製ケースに電子部品本体エレメントの一例を収納した
状態の斜視図、第２図ｆｂｌは第２図ｆａ）に示す状態
における垂直に切断した端面図、第３図１ａｌは蓋をし
た第２図に示す樹脂製ケースに充填材を充填する状態を
示す斜視図、第３図（ｂｌは第３図（旬における垂直に
切断した端面図、第４図１５１は完成した電子部品の一
実施例の斜視図、第４図（′ｂ）は第３図１ａｌにおけ
る垂直に切断した端面図である。なお、図に示す実施例
により本発明が限定されるものではない。DETAILED DESCRIPTION OF THE PREFERRED EMBODIMENTS The present invention will be explained in more detail below based on embodiments shown in the drawings. Here, Fig. 1 (al is a perspective view of an example of a resin case, in Fig. 1) is a vertically cut end view of the resin case shown in Fig. 1 (al), and Fig. A perspective view of an example of an electronic component main body element housed in a resin case shown in FIG. 3 is a perspective view showing the state in which the filler is filled into the resin case shown in the figure. 4('b) is an end view cut vertically in FIG. 3 1al.The present invention is not limited to the embodiment shown in the figures.
第１図は箱状容器形の樹脂製ケース２を示しており、そ
の樹脂製ケース２の上部開口には段部２゜と縁部２トと
が形成されている。また、底部にはリード端子３＠、３
１．．３Ｃ９３ａが内部から外部へ突出するように設置
されている。FIG. 1 shows a box-shaped container-shaped resin case 2, and the upper opening of the resin case 2 is formed with a stepped portion 2° and an edge portion 2T. In addition, lead terminals 3@, 3 are provided at the bottom.
1. ．． 3C93a is installed so as to protrude from the inside to the outside.
この＋ａ脂部製ケース２内、第２図ｆａ）に示すように
、電子部品本体エレメント５を収納する。ここで、第２
図中１に示すように、電子部品本体エレメント５が導電
ペースト４ｍ、４ｈ等でリード端子３ｍ、３ｂ等に電気
的に接続するようにする。かかる電子部品本体エレメン
ト５としては、例えば圧電振動エレメントが挙げられる
。As shown in FIG. 2 fa), an electronic component main body element 5 is housed inside this case 2. Here, the second
As shown in 1 in the figure, the electronic component main body element 5 is electrically connected to lead terminals 3m, 3b, etc. using conductive pastes 4m, 4h, etc. An example of such electronic component main body element 5 is a piezoelectric vibrating element.
次に、第３図１ａｌ 、 ｆｂｌに示すように、充填材
注入ロア８．７６を穿設した金Ｎ坂製の蓋７を樹脂製ケ
ース２の段部２．上にｆ２置し、縁部２＋、を加熱し、
樹脂製ケース２と１７とを固着する。更に、充填材注入
ロア、に充填材ディスペンサのノズルＮを配し、そのノ
ズルＮから流動状態の充填材を注入する。他方の充填材
注入ロアらは、空気抜きとして機能する。Next, as shown in FIGS. 3A and 3B, the lid 7 made of gold N-saka with the filler injection lower 8.76 drilled therein is inserted into the stepped portion 2.7 of the resin case 2. Place f2 on top, heat edge 2+,
The resin cases 2 and 17 are fixed together. Further, a nozzle N of a filler dispenser is arranged on the filler injection lower, and a fluidized filler is injected from the nozzle N. The other filler injection lowers function as air vents.
適量の充填材を注入後、第４図（ａｌ、 （ｂｌに示す
ように充填材を弾性体６に硬化せしめれば、電子部品１
が得られる。この弾性体６としては、例えばソリコンゴ
ムが挙げられる。After injecting an appropriate amount of filler, if the filler is hardened into an elastic body 6 as shown in FIGS.
is obtained. This elastic body 6 may be, for example, soric rubber.
弾性体６の充填量が少ないときは、第４図（′ｂ）に示
すように、内部に空隙８．８を生じるが、この空隙８，
８は流動状態の充填材の流れによって内部空間の隅に形
成され、電子部品本体エレメント５と蓋７の間には形成
されない、従って、弾性体の先議効果は十分前られる。When the filling amount of the elastic body 6 is small, a void 8.8 is created inside as shown in FIG. 4('b);
8 is formed at the corner of the internal space by the flow of the filling material in a fluid state, and is not formed between the electronic component main body element 5 and the lid 7, so that the antecedent effect of the elastic body is sufficiently prevented.
そこで例えば電子部品本体エレメント５たる圧電振動エ
レメントの不要振動を弾性体６たるシリコンゴムにて抑
制することができる。Therefore, for example, unnecessary vibrations of the piezoelectric vibrating element, which is the electronic component main body element 5, can be suppressed by using silicone rubber, which is the elastic body 6.
また、充填前に蓋７を固着するから、充填量が多すぎて
Ｍ７が出来なくなる問題を生じることはない。Furthermore, since the lid 7 is fixed before filling, there is no problem that M7 cannot be formed due to too large a filling amount.
さらに、蓋７は金属板製であり、薄肉にできるから、こ
の電子部品１は全体として薄型化可能となる。Furthermore, since the lid 7 is made of a metal plate and can be made thin, the electronic component 1 as a whole can be made thinner.
発明の効果
本発明によれば、容器形の樹脂製ケースと、その樹脂製
ケースの内部に収容された電子部品本体エレメントと、
充頃材注入口を穿設され且つ前記樹脂製ケースに固着さ
れた金属板製の蓋と、内部空間に充填された弾性体とを
具備してなることを特徴とする電子部品が提供される。Effects of the Invention According to the present invention, a container-shaped resin case, an electronic component main body element housed inside the resin case,
Provided is an electronic component comprising: a lid made of a metal plate, which is provided with a filling material inlet and is fixed to the resin case; and an elastic body filled in an internal space. .
また、容器形の樹脂製ケース中に電子部品本体エレメン
トを収納し、充填材注入口を開けて金属板製の蓋を前記
樹脂製ケースに固着し、前記充場材注入口より流動状態
の充填材を注入し、内部で弾性体に硬化せしめることを
特徴とする電子部品の製造方法が提供される。そして、
これにより次のような効果が得られる。In addition, the electronic component main body element is housed in a container-shaped resin case, a filler injection port is opened, a metal plate lid is fixed to the resin case, and a fluid state is filled from the filler material injection port. Provided is a method of manufacturing an electronic component, characterized by injecting a material and hardening it into an elastic body inside. and,
This provides the following effects.
■弾性体の充填量の過不足による不都合を生じないので
、充ｋｔｆｉの管理が容易となり、製造が容易となる。(2) Since there is no problem caused by excess or deficiency in the amount of elastic material filled, it becomes easier to manage the filling amount and facilitate manufacturing.
即ち、充填量が不足ぎみでも、内部に生じる空隙が隅の
位置に押しやられ、電子部品本体エレメントと苦の間に
は十分充填されるから、弾性体の充填効果を十分前られ
る。また、弾性体の充填前に蓋を固着するので、弾性体
の充［１が多すぎて蓋ができなくなる問題を生じない、
従って、製造が容易となる。That is, even if the amount of filling is insufficient, the voids generated inside are pushed to the corner positions, and the space between the electronic component main body element and the gap is sufficiently filled, so that the filling effect of the elastic body can be sufficiently prevented. In addition, since the lid is fixed before filling with the elastic body, there is no problem that the lid cannot be formed due to too much filling of the elastic body.
Therefore, manufacturing becomes easy.
さらに、このことから製品の品質を向上できる。Furthermore, the quality of the product can be improved from this.
■蓋が金属板製であり、薄肉にできるから、製品高さを
薄型化できる。■Since the lid is made of metal plate and can be made thin, the height of the product can be reduced.
第１図＋ａ）は樹脂製ケースの一例の斜視図、第１回申
）は第１図（８）に示す樹脂製ケースを垂直に切断した
端面図、第２図ｆａｔは第１図に示す樹脂製ケースに電
子部品本体エレメントの一例を収納した状態の斜視図、
第２図［ｂｌは第２図（ａｌに示す状態における垂直に
切断した端面図、第３図ｆａｔは蓋をした第２図に示す
樹脂製ケースに充填材を充填する状態を示す斜視図、第
３図中）は第３図（ａｌにおける垂直に切断した端面図
、第４図（８）は完成した電子部品の一実施例の斜視図
、第４図（ｂｌは第４図（ａｌにおける垂直に切断した
端面図、第５図は従来の電子部品の一例を垂直に切断し
た端面図である。
（符号の説明）
１・・・電子部品 ２・・・樹脂製ケース３ａ、
３ｔ、、 ３ｃ、 ３− ・・・リード端子４１
．４＆・・・導電ペースト
５・・・電子部品本体エレメント
６・・・弾性体（充填材）
７・・・金属板製の蓋
７１．７＆・・・充坊材注入孔
８・・・空間
Ｎ・・・充填材ディスペンサのノズル
５１・・・従来の電子部品。Figure 1+a) is a perspective view of an example of a resin case, 1st figure) is an end view of the resin case shown in Figure 1 (8) cut vertically, and Figure 2 fat is shown in Figure 1. A perspective view of an example of an electronic component main body element housed in a resin case,
Figure 2 [bl is an end view cut vertically in the state shown in Figure 2 (al), Figure 3 fat is a perspective view showing the state in which the resin case shown in Figure 2 with a lid is filled with filler; 3) is an end view cut vertically in FIG. 3 (al), FIG. 4 (8) is a perspective view of an example of a completed electronic component, and FIG. Vertically cut end view. FIG. 5 is a vertically cut end view of an example of a conventional electronic component. (Explanation of symbols) 1...Electronic component 2...Resin case 3a,
3t, 3c, 3-...Lead terminal 41
．． 4 &... Conductive paste 5... Electronic component main body element 6... Elastic body (filling material) 7... Metal plate lid 71. 7 &... Filling material injection hole 8... Space N ... Filler dispenser nozzle 51 ... Conventional electronic component.
Claims (1)
に収容された電子部品本体エレメントと、充填材注入口
を穿設され且つ前記樹脂製ケースに固着された金属板製
の蓋と、内部空間に充填された弾性体とを具備してなる
ことを特徴とする電子部品。 ２、充填材注入口が、電子部品本体エレメントに面する
蓋上の位置に穿設されてなる特許請求の範囲第１項記載
の電子部品。 ３、容器形の樹脂製ケース中に電子部品本体エレメント
を収納し、充填材注入口を開けた金属板製の蓋を前記樹
脂製ケースに固着し、前記充填材注入口より流動状態の
充填材を注入し、内部で弾性体に硬化せしめることを特
徴とする電子部品の製造方法。 ４、電子部品本体エレメントが圧電振動エレメントであ
り、弾性体がシリコンゴムである特許請求の範囲第３項
記載の電子部品の製造方法。[Scope of Claims] 1. A container-shaped resin case, an electronic component body element housed inside the resin case, and a metal having a filler injection port and fixed to the resin case. An electronic component characterized by comprising a cover made of a plate and an elastic body filled in an internal space. 2. The electronic component according to claim 1, wherein the filler injection port is provided at a position on the lid facing the electronic component main body element. 3. The electronic component body element is housed in a container-shaped resin case, a metal plate lid with a filler injection port opened is fixed to the resin case, and the filler in a fluid state is poured from the filler injection port. A method for manufacturing electronic parts, characterized by injecting and hardening it into an elastic body internally. 4. The method of manufacturing an electronic component according to claim 3, wherein the electronic component main body element is a piezoelectric vibrating element and the elastic body is silicone rubber.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP8338487A JPS63248211A (en) | 1987-04-03 | 1987-04-03 | Electronic component and its manufacture |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP8338487A JPS63248211A (en) | 1987-04-03 | 1987-04-03 | Electronic component and its manufacture |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| JPS63248211A true JPS63248211A (en) | 1988-10-14 |
Family
ID=13800927
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP8338487A Pending JPS63248211A (en) | 1987-04-03 | 1987-04-03 | Electronic component and its manufacture |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPS63248211A (en) |
Cited By (5)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPH02134734U (en) * | 1989-04-15 | 1990-11-08 | ||
| JPH03243011A (en) * | 1990-02-20 | 1991-10-30 | Murata Mfg Co Ltd | Piezo-electric resonator |
| JPH0434015U (en) * | 1990-07-16 | 1992-03-19 | ||
| JPH04233311A (en) * | 1990-12-28 | 1992-08-21 | Murata Mfg Co Ltd | Piezoelectric parts |
| JPH04119128U (en) * | 1991-04-05 | 1992-10-26 | 株式会社村田製作所 | Surface mount ladder filter |
-
1987
- 1987-04-03 JP JP8338487A patent/JPS63248211A/en active Pending
Cited By (5)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPH02134734U (en) * | 1989-04-15 | 1990-11-08 | ||
| JPH03243011A (en) * | 1990-02-20 | 1991-10-30 | Murata Mfg Co Ltd | Piezo-electric resonator |
| JPH0434015U (en) * | 1990-07-16 | 1992-03-19 | ||
| JPH04233311A (en) * | 1990-12-28 | 1992-08-21 | Murata Mfg Co Ltd | Piezoelectric parts |
| JPH04119128U (en) * | 1991-04-05 | 1992-10-26 | 株式会社村田製作所 | Surface mount ladder filter |
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