JPS63197343U - - Google Patents
Info
- Publication number
- JPS63197343U JPS63197343U JP8903687U JP8903687U JPS63197343U JP S63197343 U JPS63197343 U JP S63197343U JP 8903687 U JP8903687 U JP 8903687U JP 8903687 U JP8903687 U JP 8903687U JP S63197343 U JPS63197343 U JP S63197343U
- Authority
- JP
- Japan
- Prior art keywords
- mainly made
- molded part
- aluminum nitride
- ceramic
- part mainly
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
- 239000000919 ceramic Substances 0.000 claims description 5
- KZHJGOXRZJKJNY-UHFFFAOYSA-N dioxosilane;oxo(oxoalumanyloxy)alumane Chemical compound O=[Si]=O.O=[Si]=O.O=[Al]O[Al]=O.O=[Al]O[Al]=O.O=[Al]O[Al]=O KZHJGOXRZJKJNY-UHFFFAOYSA-N 0.000 claims description 4
- 229910052863 mullite Inorganic materials 0.000 claims description 4
- PMHQVHHXPFUNSP-UHFFFAOYSA-M copper(1+);methylsulfanylmethane;bromide Chemical compound Br[Cu].CSC PMHQVHHXPFUNSP-UHFFFAOYSA-M 0.000 claims description 3
- 238000001465 metallisation Methods 0.000 description 2
- 239000002131 composite material Substances 0.000 description 1
- 239000004020 conductor Substances 0.000 description 1
- 238000010586 diagram Methods 0.000 description 1
- 229910052751 metal Inorganic materials 0.000 description 1
- 239000002184 metal Substances 0.000 description 1
- 239000005394 sealing glass Substances 0.000 description 1
Landscapes
- Lead Frames For Integrated Circuits (AREA)
Description
図１は本考案による積層パツケージの１例の分
解図であり、図２はメタルリードが取りつけられ
たその外観図であり、図３は本考案によるサーデ
イタイプの複合パツケージの１例の垂直断面図で
ある。
１……第層窒化アルミニウム、２……第層
ムライトセラミツクス、３……第層ムライトセ
ラミツクス、４……導体回路パターン、５……メ
タライズ、６……キヤビテイ、７……リード、８
……キヤツプ、１１……窒化アルミニウムベース
、１２……メタライズ、１３……集積回路チツプ
、１４……リード、１５……ワイヤ、１６……ム
ライトセラミツクキヤツプ、１７……封着ガラス
。
Figure 1 is an exploded view of an example of a laminated package according to the present invention, Figure 2 is an external view of the laminated package with metal leads attached, and Figure 3 is a vertical cross-section of an example of a Thursday type composite package according to the present invention. It is a diagram. DESCRIPTION OF SYMBOLS 1... Aluminum nitride layer, 2... Mullite ceramic layer, 3... Mullite ceramic layer, 4... Conductor circuit pattern, 5... Metallization, 6... Cavity, 7... Lead, 8
... Cap, 11 ... Aluminum nitride base, 12 ... Metallization, 13 ... Integrated circuit chip, 14 ... Lead, 15 ... Wire, 16 ... Mullite ceramic cap, 17 ... Sealing glass.
Claims (1)
クス部分が窒化アルミニウムを主体とした成形体
部分とムライトを主体とした成形体部分とからな
る、集積回路用セラミツクスパツケージ。 A ceramic package for integrated circuits, the ceramic part of which consists of a molded part mainly made of aluminum nitride and a molded part mainly made of mullite.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP8903687U JPS63197343U (en) | 1987-06-11 | 1987-06-11 |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP8903687U JPS63197343U (en) | 1987-06-11 | 1987-06-11 |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| JPS63197343U true JPS63197343U (en) | 1988-12-19 |
Family
ID=30947654
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP8903687U Pending JPS63197343U (en) | 1987-06-11 | 1987-06-11 |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPS63197343U (en) |
Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS63314855A (en) * | 1987-06-17 | 1988-12-22 | Shinko Electric Ind Co Ltd | Ceramic package |
| JPS63318146A (en) * | 1987-06-20 | 1988-12-27 | Shinko Electric Ind Co Ltd | Ceramic package and manufacture thereof |
Citations (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS60178647A (en) * | 1984-02-27 | 1985-09-12 | Toshiba Corp | Semiconductor device |
| JPS60202955A (en) * | 1984-03-28 | 1985-10-14 | Hitachi Ltd | Semiconductor device |
-
1987
- 1987-06-11 JP JP8903687U patent/JPS63197343U/ja active Pending
Patent Citations (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS60178647A (en) * | 1984-02-27 | 1985-09-12 | Toshiba Corp | Semiconductor device |
| JPS60202955A (en) * | 1984-03-28 | 1985-10-14 | Hitachi Ltd | Semiconductor device |
Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS63314855A (en) * | 1987-06-17 | 1988-12-22 | Shinko Electric Ind Co Ltd | Ceramic package |
| JPS63318146A (en) * | 1987-06-20 | 1988-12-27 | Shinko Electric Ind Co Ltd | Ceramic package and manufacture thereof |