JPS6317541A - Inspection method for series of electronic parts - Google Patents
Inspection method for series of electronic partsInfo
- Publication number
- JPS6317541A JPS6317541A JP61162880A JP16288086A JPS6317541A JP S6317541 A JPS6317541 A JP S6317541A JP 61162880 A JP61162880 A JP 61162880A JP 16288086 A JP16288086 A JP 16288086A JP S6317541 A JPS6317541 A JP S6317541A
- Authority
- JP
- Japan
- Prior art keywords
- chip
- shaped electronic
- electronic component
- electronic components
- series
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
- 238000000034 method Methods 0.000 title claims description 8
- 238000007689 inspection Methods 0.000 title abstract description 16
- 238000003384 imaging method Methods 0.000 claims description 8
- 238000007789 sealing Methods 0.000 claims 1
- 230000005856 abnormality Effects 0.000 description 3
- 238000010586 diagram Methods 0.000 description 3
- 238000003860 storage Methods 0.000 description 2
- 230000032258 transport Effects 0.000 description 2
- 238000011179 visual inspection Methods 0.000 description 2
- 230000001133 acceleration Effects 0.000 description 1
- 239000003990 capacitor Substances 0.000 description 1
- 210000000078 claw Anatomy 0.000 description 1
- 230000007547 defect Effects 0.000 description 1
- 230000000694 effects Effects 0.000 description 1
- 238000004519 manufacturing process Methods 0.000 description 1
- 239000005022 packaging material Substances 0.000 description 1
- 238000004806 packaging method and process Methods 0.000 description 1
- 230000002093 peripheral effect Effects 0.000 description 1
- 230000001105 regulatory effect Effects 0.000 description 1
- 239000011347 resin Substances 0.000 description 1
- 229920005989 resin Polymers 0.000 description 1
- 238000009987 spinning Methods 0.000 description 1
- 238000004804 winding Methods 0.000 description 1
Landscapes
- Investigating Materials By The Use Of Optical Means Adapted For Particular Applications (AREA)
- Testing Or Measuring Of Semiconductors Or The Like (AREA)
- Supply And Installment Of Electrical Components (AREA)
- Container, Conveyance, Adherence, Positioning, Of Wafer (AREA)
- Length Measuring Devices By Optical Means (AREA)
Abstract
Description
【発明の詳細な説明】
(産業上の利用分野)
本発明はテープを包装材として使用する電子部品連の検
査方法に関する。DETAILED DESCRIPTION OF THE INVENTION (Field of Industrial Application) The present invention relates to a method for inspecting a series of electronic components using tape as a packaging material.
(従来技術)
近年、電子機器の小形化および高密度実装化に伴い、コ
ンデンサや抵抗器等の電子部品もチップ化されたものが
多用されている。(Prior Art) In recent years, with the miniaturization and high-density packaging of electronic devices, chip-based electronic components such as capacitors and resistors are increasingly being used.
このようにチップ化された電子部品は、通常、自動機械
により、プリント基板にマウントされるが、自動機械に
よるチップ状電子部品のマウントには、テープを包装材
として使用するチップ状電子部品連が有効に利用されて
いる。Electronic components that have been made into chips in this way are usually mounted on printed circuit boards using automatic machines. It is being used effectively.
このチップ状電子部品連は、第4図に示すように、長手
方向に一定のピッチをおいてチップ状電子部品lを収容
するための四角形状の穴2.2.・・・が形成された厚
紙からなるベーステープ3を使用するもので、上記穴2
.2.・・・内には、チップ状電子部品1.■、・・・
が収容されるとともに、上記ベーステープ3の上下には
透明フィルムよりなるカバーテープ4.5が貼着され、
この状態で図示しないリールに巻回される。このリール
は部品マウント用の自動マウント装置(図示仕ず。)に
装填され、リールに巻回された第4図のチップ状電子部
品連8は、その一端より引き出されてカバーテープ4が
引き剥がされ、ベーステープ3の穴2,2.・・・内に
収容されたチップ状電子部品!、1.・・・が吸引ノズ
ル(図示せず。)に吸引されて、プリント基板(図示せ
ず。)の所定の位置にマウントされる。上記チップ状電
子部品連8の送りは、ベーステープ3に形成された送り
穴6を利用して行なわれる。また、具体的には図示しな
いが、上記ベーステープ3に代えて、チップ状電子部品
1を収容する凹部を形成した樹脂製のいわゆるエンボス
テープが使用されることもある。As shown in FIG. 4, this series of chip-shaped electronic components consists of rectangular holes 2.2. . . . is formed using a base tape 3 made of cardboard, and the holes 2 are
.. 2. ...Inside there are chip-shaped electronic components 1. ■,...
is accommodated, and a cover tape 4.5 made of a transparent film is attached to the top and bottom of the base tape 3,
In this state, it is wound onto a reel (not shown). This reel is loaded into an automatic component mounting device (not shown), and the chip-shaped electronic component chain 8 shown in FIG. 4 wound around the reel is pulled out from one end and the cover tape 4 is peeled off. and the holes 2, 2 of the base tape 3. ...Chip-shaped electronic components housed inside! , 1. ... is sucked into a suction nozzle (not shown) and mounted at a predetermined position on a printed circuit board (not shown). The series of chip-shaped electronic components 8 is fed using feed holes 6 formed in the base tape 3. Further, although not specifically shown, instead of the base tape 3, a so-called embossed tape made of resin and having a recessed portion for accommodating the chip-shaped electronic component 1 may be used.
ところで、上記のようなチップ状電子部品連8の製造後
、このチップ状電子部品連8をリールに巻回するに際し
、チップ状電子部品lがベーステープ3の穴2に入って
いるかいないか、また、ベーステープ3の穴2内に収容
されているチップ状電子部品1に割れや欠は等による外
観上の異常がないか等を検査した後、上記チップ状電子
部品連8をリールに巻回している。By the way, after manufacturing the chip-shaped electronic component chain 8 as described above, when winding the chip-shaped electronic component chain 8 onto a reel, it is important to check whether the chip-shaped electronic component l is in the hole 2 of the base tape 3 or not. Further, after inspecting the chip-shaped electronic components 1 housed in the holes 2 of the base tape 3 for any abnormalities in appearance due to cracks, chips, etc., the chip-shaped electronic component string 8 is wound onto a reel. It's spinning.
従来、ベーステープ3の穴2内にチップ状電子部品lが
入っているか否かの検査は、チップ状電子部品連8の上
下に夫々受光素子と発光素子(いずれも図示せず。)を
配置し、発光素子から発射された光がベーステープ3の
上記穴2内を透過するか否かにより、この穴2内にチッ
プ状電子部品lが存在するか否かを光学的に検出してい
た。しかしながら、ベーステープ3の穴2内に収容され
たチップ状電子部品lに割れや欠は等の外観上の異常が
存在するか否か等の外観検査は、上記のような発光素子
と受光素子とにより行うことは困難で、検査者の目視に
よる検査に穎っていた。Conventionally, in order to check whether or not a chip-shaped electronic component l is contained in the hole 2 of the base tape 3, a light-receiving element and a light-emitting element (both not shown) are placed above and below a chip-shaped electronic component series 8, respectively. Then, depending on whether the light emitted from the light emitting element passes through the hole 2 of the base tape 3, it is optically detected whether or not the chip-shaped electronic component l is present in the hole 2. . However, an external appearance inspection, such as whether or not there are any external abnormalities such as cracks or chips, in the chip-shaped electronic component l accommodated in the hole 2 of the base tape 3 is performed by checking the light emitting element and the light receiving element as described above. This made it difficult to carry out the inspection, and the inspection had to be done visually by the inspector.
ところで、このような目視による電子部品連8の検査で
は、検査者の疲労等により、チップ状電子部品lの外観
不良の見落し等が発生し、検査の信頼性が低く、検査効
率も低いという問題があった。By the way, in such visual inspection of electronic components 8, defects in appearance of chip-shaped electronic components 1 may be overlooked due to inspector fatigue, resulting in low inspection reliability and low inspection efficiency. There was a problem.
そこで、チップ状電子部品lの有無および外観検査にビ
デオカメラ(図示せず。)を使用し、ビデオカメラの撮
像位置に順次、ベーステープ3の穴2内に収容されたチ
ップ状電子部品1を送り込んでチップ状電子部品lを撮
像し、その撮像パターンと予め記憶しているパターンと
を比較し、チップ状電子部品Iの外観異常を自動的に検
査することが考えられる。Therefore, a video camera (not shown) is used to inspect the appearance and presence of chip-shaped electronic components 1, and the chip-shaped electronic components 1 accommodated in the holes 2 of the base tape 3 are sequentially placed at the imaging position of the video camera. It is conceivable to automatically inspect the chip-like electronic component I for abnormalities in appearance by sending it in and taking an image of the chip-like electronic component I, and comparing the imaged pattern with a pre-stored pattern.
このようにすれば、チップ状電子部品lの外観検査は、
目視によるよりも正確かつ効率よく行える。しかしなが
ら、ビデオカメラにより自動的にチップ状電子部品1の
外観を検査する際、第5図に示すように、チップ状電子
部品lとベーステープ3の穴2の内壁面との間には、チ
ップ状電子部品1を穴2の内部に容易に収容しうるよう
に、ギャップ7が設けであるため、電子部品連8の姿勢
や電子部品連8の搬送の加減速により、ビデオカメラの
撮像位置に搬送されてきたときのチップ状電子部品lの
穴2に対する位置が変動し、各チップ状電子部品lに対
して一定の撮像パターンを得ることができないという問
題があった。In this way, the appearance inspection of the chip-shaped electronic component l can be carried out by
This can be done more accurately and efficiently than by visual inspection. However, when the appearance of the chip-shaped electronic component 1 is automatically inspected using a video camera, as shown in FIG. Since the gap 7 is provided so that the shaped electronic component 1 can be easily accommodated inside the hole 2, the position of the electronic component series 8 and the acceleration/deceleration of the conveyance of the electronic component series 8 may cause the video camera to move to the imaging position. There was a problem in that the position of the chip-shaped electronic component 1 with respect to the hole 2 fluctuates when it is transported, making it impossible to obtain a constant imaging pattern for each chip-shaped electronic component 1.
(発明の目的)
本発明の目的は、ビデオカメラを使用してチップ状電子
部品連におけるチップ状電子部品の有無および外観の検
査を正確かつ効率よく行うようにした電子部品連の検査
方法を提供することである。(Object of the Invention) An object of the present invention is to provide a method for inspecting a series of electronic components, which uses a video camera to accurately and efficiently inspect the presence or absence of chip-shaped electronic components in a series of chip-shaped electronic components and the appearance thereof. It is to be.
(発明の構成)
このため、本発明は、ベーステープの収容部にチップ状
電子部品が収容されてカバーテープにより封止された電
子部品連を上記ベーステープの幅方向に立て、各チップ
状電子部品を上記収容部内で落下させてその一つの内壁
面に当接させた後、上記チップ状電子部品連を静電チャ
ックに対して相対移動させて上記収容部内にてチップ状
電子部品を静電チャックの静電気力により上記内壁面に
沿ってそれに隣るいま一つの内壁面まで移動させ、この
位置にて上記チップ状電子部品の像を撮像し、撮像した
チップ状電子部品のパターンからその外観を検査するよ
うにしたことを特徴としている。(Structure of the Invention) For this reason, the present invention provides for a series of electronic components in which chip-shaped electronic components are housed in a housing portion of a base tape and sealed with a cover tape to be erected in the width direction of the base tape, and each chip-shaped electronic component is After the components are dropped into the storage section and brought into contact with one of the inner walls, the chip-shaped electronic component series is moved relative to the electrostatic chuck, and the chip-shaped electronic components are electrostatically moved within the storage section. The electrostatic force of the chuck moves the chip-shaped electronic component along the inner wall surface to another inner wall surface next to it, and at this position, an image of the chip-shaped electronic component is taken, and the appearance of the chip-shaped electronic component is determined from the pattern of the imaged chip-shaped electronic component. It is characterized by being designed to be inspected.
(発明の効果)
本発明によれば、ビデオカメラの撮像位置に搬送されて
くるチップ状電子部品の位置が常に一定の位置となるよ
うに規制されるので、ビデオカメラによるチップ状電子
部品の撮像条件が一定し、正確で効率よくチップ状電子
部品連の有無、外観および寸法等の検査を簡単に行うこ
とができる。(Effects of the Invention) According to the present invention, the position of the chip-shaped electronic component conveyed to the imaging position of the video camera is regulated so that it is always at a constant position, so that the chip-shaped electronic component is captured by the video camera. Under constant conditions, it is possible to easily and accurately and efficiently inspect the presence, appearance, dimensions, etc. of a series of chip-shaped electronic components.
(実施例)
以下、第4図において説明した電子部品連8の検査に本
発明方法を適用した実施例について具体的に説明する。(Example) Hereinafter, an example in which the method of the present invention is applied to the inspection of the electronic component series 8 described in FIG. 4 will be specifically described.
本発明方法を実施するための検査装置の全体斜視図を第
1図に、また、その要部拡大図を第2図に示す。FIG. 1 shows an overall perspective view of an inspection apparatus for carrying out the method of the present invention, and FIG. 2 shows an enlarged view of the main parts thereof.
上記検査装置は、電子部品連8をそのベーステープ3の
幅方向に立てた状態で、ビデオカメラ12の撮像位置に
搬送するスプロケット1!と、ビデオカメラ12と、上
記スプロケット11の上に配置された円弧状の静電チャ
ック16とからなる。The above-mentioned inspection device transports the electronic component series 8 in the width direction of the base tape 3 to the imaging position of the video camera 12! , a video camera 12 , and an arc-shaped electrostatic chuck 16 placed above the sprocket 11 .
上記スプロケット11は、垂直方向の回転軸13のまわ
りに矢印A1で示す向きに回転する円板14の外周面か
ら外向きに等角度間隔に突出する送り爪15を有する。The sprocket 11 has feed pawls 15 that protrude outward at equal angular intervals from the outer peripheral surface of a disc 14 that rotates in the direction indicated by arrow A1 around a vertical rotation axis 13.
この送り爪15は電子部品連8のベーステープ3に形成
された送り穴6に嵌入して上記電子部品連8を矢印A2
の向きに搬送する。This feed pawl 15 is fitted into a feed hole 6 formed in the base tape 3 of the electronic component chain 8, and moves the electronic component chain 8 along the arrow A2.
Transport in the direction of
また、静電チャック16は、その外側面がスプロケット
2の円板14の半径と等しい曲率半径を有する。この静
電チャック16は、その外側面が上記回転軸13の中心
からの距離が上記スプロケット11の円板14の半径に
等しくなるように、上記円板14上に配置される。Furthermore, the electrostatic chuck 16 has an outer surface having a radius of curvature equal to the radius of the disc 14 of the sprocket 2 . This electrostatic chuck 16 is arranged on the disc 14 such that the distance of its outer surface from the center of the rotating shaft 13 is equal to the radius of the disc 14 of the sprocket 11.
電子部品連8は、上記静電チャック16の一端にて、そ
のベーステープ3の送り穴6にスプロケット11の送り
爪15が嵌入し、静電チャック16の外側面に摺接しつ
つ、矢印A、の向きに静電チャック16の他端まで送ら
れる。At one end of the electrostatic chuck 16, the electronic parts chain 8 has the feed pawl 15 of the sprocket 11 fitted into the feed hole 6 of the base tape 3, and while slidingly contacting the outer surface of the electrostatic chuck 16, the electronic component chain 8 moves as shown by the arrow A. It is sent to the other end of the electrostatic chuck 16 in the direction shown in FIG.
ビデオカメラ12の撮像位置は、好ましくは、上記スプ
ロケットllが電子部品連8と接している部分のほぼ中
央部に設定される。これは、上記接触部のほぼ中央部で
は、送り穴6に送り爪15が入り始める部分と送り爪が
出る部分で電子部品連を両端から引き合うようになるた
め、上記接触部分の中央部が最も、送り穴6と送り爪1
5が同心となり、最も位置が安定となっているからであ
る。The imaging position of the video camera 12 is preferably set at approximately the center of the portion where the sprocket 11 is in contact with the electronic component chain 8. This is because at approximately the center of the contact area, the electronic component chain is pulled together from both ends at the part where the feed pawl 15 begins to enter the feed hole 6 and the part where the feed pawl exits. , feed hole 6 and feed claw 1
This is because 5 is concentric and the position is the most stable.
上記電子部品連8は、静電チャック16の他端にて、ス
プロケット11から離れ、図示しないリールに巻回され
る。The electronic component chain 8 is separated from the sprocket 11 at the other end of the electrostatic chuck 16 and wound around a reel (not shown).
電子部品連8は、以上に説明した装置により、次のよう
にして検査される。The electronic component series 8 is inspected as follows using the apparatus described above.
先ず、電子部品連8を、そのベーステープ3の幅方向に
立てた状態で、第1図に矢印A、で示すように、スプロ
ケット11に供給すると、ベーステープ3の穴2に収容
されたチップ状電子部品lは、上記穴2の内部にてカバ
ーテープ4.5間を落下し、第2図に示すように、上記
ベーステープ3の穴2の内壁面のうち、スプロケット1
1の直上の内壁面2a上に載置される。First, when the electronic component chain 8 is placed upright in the width direction of the base tape 3 and is fed to the sprocket 11 as shown by arrow A in FIG. The shaped electronic component 1 falls between the cover tapes 4.5 inside the hole 2, and as shown in FIG.
It is placed on the inner wall surface 2a directly above the wall 1.
この状態で、チップ状電子部品lを静電チャック16ま
で搬送すると、上記チップ状電子部品lは、上記静電チ
ャック16の静電気力により、上記静電チャック16に
吸着される。このため、上記チップ状電子部品1は、ベ
ーステープ3の穴2の内部にて、その上記内壁面2a上
を矢印A、で示す電子部品連8の搬送方向と逆の向きに
、上記内壁面2aに隣るいま一つの内側壁2bに当接す
るまでスライドする。In this state, when the chip-shaped electronic component l is conveyed to the electrostatic chuck 16, the chip-shaped electronic component l is attracted to the electrostatic chuck 16 by the electrostatic force of the electrostatic chuck 16. Therefore, the chip-shaped electronic component 1 is placed inside the hole 2 of the base tape 3 on the inner wall surface 2a in a direction opposite to the conveyance direction of the electronic component series 8 indicated by arrow A. Slide until it comes into contact with another inner wall 2b adjacent to 2a.
すなわち、チップ状電子部品lは、第3図に示すように
、チップ状電子部品連8をそのベーステープ3の幅方向
に立てることにより、矢印A、で示すように、穴2の内
壁面2aに向かって下方に落下する。次いで、静電チャ
ック16まで搬送されてくると、矢印A4で示すように
、穴2のいま一つの内側壁2bに向かってスライドする
。従って、上記チップ状電子部品lは、静電チャック1
6まで搬送されてくると、上記穴2の隣り合う2つの内
壁面2aと2bとが形成するコーナ部2Cに位置決めさ
れることになる。That is, as shown in FIG. 3, the chip-shaped electronic component 1 is manufactured by standing the chip-shaped electronic component series 8 in the width direction of the base tape 3, so that the inner wall surface 2a of the hole 2 is fixed as shown by the arrow A. fall downwards towards. Next, when it is conveyed to the electrostatic chuck 16, it slides toward the other inner wall 2b of the hole 2, as shown by arrow A4. Therefore, the above-mentioned chip-shaped electronic component l is the electrostatic chuck 1.
6, it is positioned at a corner 2C formed by two adjacent inner wall surfaces 2a and 2b of the hole 2.
ビデオカメラ12は、上記のようにして電子部品連8の
ベーステープ3の穴2内にて位置決めされたチップ状電
子部品lが静電チャック16のほぼ中央部の撮像位置ま
でくると、チップ状電子部品lを撮像し、その撮像パタ
ーンを予め記憶させた所定のパターンと比較し、外観や
寸法あるいはチップ状電子部品1が上記穴2内に収容さ
れているか否か等の検査を行う。When the chip-shaped electronic component l positioned in the hole 2 of the base tape 3 of the electronic component series 8 as described above reaches the imaging position approximately in the center of the electrostatic chuck 16, the video camera 12 An image of the electronic component 1 is taken, and the imaged pattern is compared with a predetermined pattern stored in advance to inspect the appearance, dimensions, and whether or not the chip-shaped electronic component 1 is accommodated in the hole 2.
このようにすれば、ビデオカメラ12に対してチップ状
電子部品1の位置が、電子部品連8のベーステープ3の
長手方向に対しても、また、ベーステープ3の幅方向に
対しても一定に規定される。In this way, the position of the chip-shaped electronic component 1 with respect to the video camera 12 is kept constant both in the longitudinal direction of the base tape 3 of the electronic component series 8 and in the width direction of the base tape 3. stipulated in
また、チップ状電子部品lとビデオカメラ!2との距離
も、チップ状電子部品lが静電チャック16に吸着され
るので、一定に規定される。Also, chip-shaped electronic components and a video camera! Since the chip-shaped electronic component l is attracted to the electrostatic chuck 16, the distance between the chip and the electrostatic chuck 16 is also fixed.
従って、チップ状電子部品lのビデオカメラ12による
上記検査を正確かつ効率よく行うことができる。また、
電子部品連8の搬送が開始もしくは停止された場合や、
電子部品連8が間欠送りされた場合にも、デツプ状電子
部品lの位置が正確に規定されるので、同様に、上記検
査を正確に行える。Therefore, the above inspection of the chip-shaped electronic component 1 using the video camera 12 can be performed accurately and efficiently. Also,
When the transportation of the electronic parts group 8 is started or stopped,
Even when the electronic component series 8 is intermittently fed, the position of the dip-shaped electronic component 1 is accurately defined, so that the above-mentioned inspection can be performed accurately as well.
【図面の簡単な説明】
第1図は本発明方法を実施するための検査装置の斜視図
、
第2図は第1図の検査装置の要部を示す斜視図、第3図
はチップ状電子部品の位置決めの説明図、第4図はチッ
プ状電子部品連の一例の説明図、第5図は従来のチップ
状電子部品連の検査方法の説明図である。
l・・・チップ状電子部品、
2・・・穴(2a、2b・・・内側壁、2c・・・コー
ナ部)3・・ベーステープ、 4,5・・・カバーテー
プ、7・・・ギャップ、 8・・・電子部品連、
I2・・・ビデオカメラ、16・・・静電チャック。
特許出願人 株式会社 村田製作所
代理人 弁理士 青 山 葆ほか2名*1 図
第5図 □[Brief Description of the Drawings] Fig. 1 is a perspective view of an inspection device for carrying out the method of the present invention, Fig. 2 is a perspective view showing the main parts of the inspection device of Fig. 1, and Fig. 3 is a perspective view of a chip-shaped electronic FIG. 4 is an explanatory diagram of the positioning of components, FIG. 4 is an explanatory diagram of an example of a series of chip-shaped electronic components, and FIG. 5 is an explanatory diagram of a conventional inspection method for a series of chip-shaped electronic components. l... Chip-shaped electronic component, 2... Hole (2a, 2b... inner wall, 2c... corner part) 3... Base tape, 4, 5... Cover tape, 7... Gap, 8...Electronic components,
I2...video camera, 16...electrostatic chuck. Patent applicant Murata Manufacturing Co., Ltd. Representative Patent attorney Aoyama Aoyama and 2 others *1 Figure 5 □
Claims (1)
れたチップ状電子部品の各収容部にチップ状電子部品を
収容し、上記ベーステープに透明なカバーテープを貼着
して上記各収容部にチップ状電子部品を封止してなる電
子部品連をビデオカメラの撮像位置に搬送し、このビデ
オカメラにより上記カバーテープを通してチップ状電子
部品を撮像し、撮像したチップ状電子部品のパターンか
ら上記チップ状電子部品の外観を検査するに際し、上記
電子部品連をそのベーステープの幅方向に立て、各チッ
プ状電子部品を上記収容部内で落下させてその一つの内
壁面に当接させた後、上記チップ状電子部品連を静電チ
ャックに対して相対移動させて上記収容部内にてチップ
状電子部品を静電チャックの静電気力により上記内壁面
に沿って上記内壁面に隣るいま一つの内壁面に当接する
まで移動させ、この位置にて上記チップ状電子部品の像
を撮像することを特徴とする電子部品連の検査方法。(1) A chip-shaped electronic component is accommodated in each accommodating section of the chip-shaped electronic component formed at a predetermined pitch in the longitudinal direction of the base tape, and a transparent cover tape is pasted on the base tape, and a transparent cover tape is attached to the above-mentioned base tape. The series of electronic components, which are made by sealing chip-shaped electronic components, is transported to the imaging position of a video camera, and the video camera images the chip-shaped electronic components through the cover tape. When inspecting the external appearance of chip-shaped electronic components, the electronic component series is erected in the width direction of its base tape, and each chip-shaped electronic component is dropped within the housing section so as to come into contact with the inner wall surface of one of the electronic components. The series of chip-shaped electronic components is moved relative to the electrostatic chuck, and the chip-shaped electronic components are moved along the inner wall surface by the electrostatic force of the electrostatic chuck in the housing section to another inner wall adjacent to the inner wall surface. A method for inspecting a series of electronic components, comprising moving the chip-shaped electronic components until they come into contact with a wall surface, and capturing an image of the chip-shaped electronic components at this position.
Priority Applications (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP61162880A JPS6317541A (en) | 1986-07-09 | 1986-07-09 | Inspection method for series of electronic parts |
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP61162880A JPS6317541A (en) | 1986-07-09 | 1986-07-09 | Inspection method for series of electronic parts |
Publications (1)
Publication Number | Publication Date |
---|---|
JPS6317541A true JPS6317541A (en) | 1988-01-25 |
Family
ID=15763017
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
JP61162880A Pending JPS6317541A (en) | 1986-07-09 | 1986-07-09 | Inspection method for series of electronic parts |
Country Status (1)
Country | Link |
---|---|
JP (1) | JPS6317541A (en) |
Cited By (6)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPH04114820A (en) * | 1990-08-24 | 1992-04-15 | Mitsubishi Electric Corp | Packaging device |
JPH04244905A (en) * | 1991-01-31 | 1992-09-01 | Nec Corp | Method for inspecting appearance of carrier taping product |
JP2003121369A (en) * | 2001-08-09 | 2003-04-23 | Matsushita Electric Ind Co Ltd | Polarity-inspecting method for chip-type electronic component |
JP2007070032A (en) * | 2005-09-06 | 2007-03-22 | Kanehiro Kk | Lamp member conveying method |
JP2008516453A (en) * | 2004-10-05 | 2008-05-15 | サイバーオプティクス コーポレーション | Pick and place machine with improved component pick-up inspection |
CN109691256A (en) * | 2016-09-13 | 2019-04-26 | 环球仪器公司 | Batcher system, pick and place machine and method |
-
1986
- 1986-07-09 JP JP61162880A patent/JPS6317541A/en active Pending
Cited By (9)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPH04114820A (en) * | 1990-08-24 | 1992-04-15 | Mitsubishi Electric Corp | Packaging device |
JPH04244905A (en) * | 1991-01-31 | 1992-09-01 | Nec Corp | Method for inspecting appearance of carrier taping product |
JP2003121369A (en) * | 2001-08-09 | 2003-04-23 | Matsushita Electric Ind Co Ltd | Polarity-inspecting method for chip-type electronic component |
JP2008516453A (en) * | 2004-10-05 | 2008-05-15 | サイバーオプティクス コーポレーション | Pick and place machine with improved component pick-up inspection |
JP4839314B2 (en) * | 2004-10-05 | 2011-12-21 | サイバーオプティクス コーポレーション | Pick and place machine with improved component pick-up inspection |
JP2007070032A (en) * | 2005-09-06 | 2007-03-22 | Kanehiro Kk | Lamp member conveying method |
CN109691256A (en) * | 2016-09-13 | 2019-04-26 | 环球仪器公司 | Batcher system, pick and place machine and method |
US11044841B2 (en) | 2016-09-13 | 2021-06-22 | Universal Instruments Corporation | Feeder system, pick and place machine, and method |
CN109691256B (en) * | 2016-09-13 | 2022-03-04 | 环球仪器公司 | Feeder system, pick and place machine and method |
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