JPS63164245U - - Google Patents

Info

Publication number
JPS63164245U
JPS63164245U JP1987056960U JP5696087U JPS63164245U JP S63164245 U JPS63164245 U JP S63164245U JP 1987056960 U JP1987056960 U JP 1987056960U JP 5696087 U JP5696087 U JP 5696087U JP S63164245 U JPS63164245 U JP S63164245U
Authority
JP
Japan
Prior art keywords
circuit board
support plates
wiring conductor
insulator
circuit
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Granted
Application number
JP1987056960U
Other languages
English (en)
Other versions
JPH0451488Y2 (ja
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed filed Critical
Priority to JP1987056960U priority Critical patent/JPH0451488Y2/ja
Publication of JPS63164245U publication Critical patent/JPS63164245U/ja
Application granted granted Critical
Publication of JPH0451488Y2 publication Critical patent/JPH0451488Y2/ja
Expired legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/42—Wire connectors; Manufacturing methods related thereto
    • H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
    • H01L2224/49—Structure, shape, material or disposition of the wire connectors after the connecting process of a plurality of wire connectors
    • H01L2224/491—Disposition
    • H01L2224/4912—Layout
    • H01L2224/49171—Fan-out arrangements
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/19—Details of hybrid assemblies other than the semiconductor or other solid state devices to be connected
    • H01L2924/191—Disposition
    • H01L2924/19101—Disposition of discrete passive components
    • H01L2924/19107—Disposition of discrete passive components off-chip wires

Landscapes

  • Lead Frames For Integrated Circuits (AREA)

Description

【図面の簡単な説明】
第１図は本考案の実施例に係わる絶縁物封止型
ハイブリツドＩＣを封止体を除去して示す平面図
、第２図は支持板及び外部リードを示す平面図、
第３図は第１図の貫通孔部分の断面図である。 １〜５……パワートランジスタチツプ、６……
モノリシツクＩＣチツプ、７……回路基板、８〜
１０……支持板、１１〜２５……外部リード、２
６……配線導体、３１……絶縁物封止体。

Claims (1)

  1. 【実用新案登録請求の範囲】 (1) 複数の支持板８〜１０と、 前記複数の支持板８〜１０の内の少なくとも２
    つに固着されている複数の半導体チツプ１〜５と
    、 前記複数の支持板８〜１０の内の少なくとも２
    つにまたがるように配置されて前記複数の支持板
    ８〜１０の内の少なくとも１つに固着されている
    回路基板７と、 前記回路基板７上に形成された配線導体２６と
    、 前記回路基板７上に支持され且つ前記配線導体
    ２６に接続されている回路部品又は素子と、 複数の外部リード１１〜２５と、 前記回路基板７の前記配線導体２６と前記半導
    体チツプ１〜５とを接続する第１の接続導体と、 前記回路基板７の前記配線導体２６と前記複数
    の外部リード１１〜２５の一部又は全部とを接続
    する第２の接続導体と、 前記複数の支持板８〜１０、前記半導体チツプ
    １〜５、前記回路基板７、前記配線導体２６、前
    記回路部品又は素子、前記外部リード１１〜２５
    の一部分、及び前記第１及び第２の接続導体を被
    覆する絶縁物封止体３１と から成る絶縁物封止型回路装置。 (2) 前記半導体チツプ１〜５及び前記回路基板
    ７の固着は半田固着である実用新案登録請求の範
    囲第１項記載の絶縁物封止型回路装置。 (3) 前記回路部品又は素子は、モノリシツクＩ
    Ｃである実用新案登録請求の範囲第１項又は第２
    項記載の絶縁物封止型回路装置。 (4) 前記第１及び第２の接続導体はそれぞれ細
    線から成る内部リード２７，２８である実用新案
    登録請求の範囲第１項又は第２項又は第３項記載
    の絶縁物封止型回路装置。
JP1987056960U 1987-04-15 1987-04-15 Expired JPH0451488Y2 (ja)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP1987056960U JPH0451488Y2 (ja) 1987-04-15 1987-04-15

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP1987056960U JPH0451488Y2 (ja) 1987-04-15 1987-04-15

Publications (2)

Publication Number Publication Date
JPS63164245U true JPS63164245U (ja) 1988-10-26
JPH0451488Y2 JPH0451488Y2 (ja) 1992-12-03

Family

ID=30886237

Family Applications (1)

Application Number Title Priority Date Filing Date
JP1987056960U Expired JPH0451488Y2 (ja) 1987-04-15 1987-04-15

Country Status (1)

Country Link
JP (1) JPH0451488Y2 (ja)

Citations (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS60160154A (ja) * 1984-01-30 1985-08-21 Nec Kansai Ltd Ｈｉｃ

Patent Citations (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS60160154A (ja) * 1984-01-30 1985-08-21 Nec Kansai Ltd Ｈｉｃ

Also Published As

Publication number Publication date
JPH0451488Y2 (ja) 1992-12-03

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