JPS63140625U - - Google Patents

Info

Publication number
JPS63140625U
JPS63140625U JP3270287U JP3270287U JPS63140625U JP S63140625 U JPS63140625 U JP S63140625U JP 3270287 U JP3270287 U JP 3270287U JP 3270287 U JP3270287 U JP 3270287U JP S63140625 U JPS63140625 U JP S63140625U
Authority
JP
Japan
Prior art keywords
semiconductor integrated
metal
metal conductor
external connection
lead electrode
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
JP3270287U
Other languages
English (en)
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed filed Critical
Priority to JP3270287U priority Critical patent/JPS63140625U/ja
Publication of JPS63140625U publication Critical patent/JPS63140625U/ja
Pending legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/42—Wire connectors; Manufacturing methods related thereto
    • H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
    • H01L2224/49—Structure, shape, material or disposition of the wire connectors after the connecting process of a plurality of wire connectors
    • H01L2224/491—Disposition
    • H01L2224/4912—Layout
    • H01L2224/49171—Fan-out arrangements

Landscapes

  • Wire Bonding (AREA)

Description

【図面の簡単な説明】
第１図は本考案の半導体集積回路用パツケージ
の一実施例を示す図、第２図は従来の半導体集積
回路用パツケージを示す図である。 １はセラミツク基板、２は金属導電体、２ａ〜
２ｆは特定外部接続用リード電極に接続される金
属導電体、３は外部接続用リード電極、３ａ〜３
ｆは特定外部接続用リード電極、４は半導体チツ
プ、５はボンデイングワイヤ。なお、図中、同一
符号は同一、又は相当部分を示す。

Claims (1)

    【実用新案登録請求の範囲】
  1. 半導体集積回路を搭載する金属導電体を有する
    絶縁基板において、外部接続用リード電極の特定
    ピンに接続されている金属導電体であることを表
    示するために、他の金属導電体と形状を一部異に
    して絶縁基板に印刷配線した金属導電体を有する
    半導体集積回路用パツケージ。
JP3270287U 1987-03-06 1987-03-06 Pending JPS63140625U (ja)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP3270287U JPS63140625U (ja) 1987-03-06 1987-03-06

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP3270287U JPS63140625U (ja) 1987-03-06 1987-03-06

Publications (1)

Publication Number Publication Date
JPS63140625U true JPS63140625U (ja) 1988-09-16

Family

ID=30839634

Family Applications (1)

Application Number Title Priority Date Filing Date
JP3270287U Pending JPS63140625U (ja) 1987-03-06 1987-03-06

Country Status (1)

Country Link
JP (1) JPS63140625U (ja)

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