JPS63154743A - Adhesive for copper-clad laminate - Google Patents
Adhesive for copper-clad laminateInfo
- Publication number
- JPS63154743A JPS63154743A JP30117686A JP30117686A JPS63154743A JP S63154743 A JPS63154743 A JP S63154743A JP 30117686 A JP30117686 A JP 30117686A JP 30117686 A JP30117686 A JP 30117686A JP S63154743 A JPS63154743 A JP S63154743A
- Authority
- JP
- Japan
- Prior art keywords
- resin
- epoxy resin
- adhesive
- epoxy
- copper
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Granted
Links
- 239000000853 adhesive Substances 0.000 title claims abstract description 35
- 230000001070 adhesive effect Effects 0.000 title claims abstract description 35
- 239000003822 epoxy resin Substances 0.000 claims abstract description 28
- 229920000647 polyepoxide Polymers 0.000 claims abstract description 28
- 229920005989 resin Polymers 0.000 claims abstract description 13
- 239000011347 resin Substances 0.000 claims abstract description 13
- 229920002037 poly(vinyl butyral) polymer Polymers 0.000 claims abstract description 11
- 125000003700 epoxy group Chemical group 0.000 claims abstract description 10
- 239000007858 starting material Substances 0.000 claims abstract description 10
- 239000005011 phenolic resin Substances 0.000 claims abstract description 7
- 229920003986 novolac Polymers 0.000 claims abstract description 6
- -1 amine compound Chemical class 0.000 claims description 14
- ZWEHNKRNPOVVGH-UHFFFAOYSA-N 2-Butanone Chemical compound CCC(C)=O ZWEHNKRNPOVVGH-UHFFFAOYSA-N 0.000 abstract description 9
- 239000000203 mixture Substances 0.000 abstract description 7
- KXGFMDJXCMQABM-UHFFFAOYSA-N 2-methoxy-6-methylphenol Chemical compound [CH]OC1=CC=CC([CH])=C1O KXGFMDJXCMQABM-UHFFFAOYSA-N 0.000 abstract description 4
- 150000001875 compounds Chemical class 0.000 abstract description 4
- LNEPOXFFQSENCJ-UHFFFAOYSA-N haloperidol Chemical compound C1CC(O)(C=2C=CC(Cl)=CC=2)CCN1CCCC(=O)C1=CC=C(F)C=C1 LNEPOXFFQSENCJ-UHFFFAOYSA-N 0.000 abstract description 4
- 229920001568 phenolic resin Polymers 0.000 abstract description 4
- 239000000758 substrate Substances 0.000 abstract description 4
- 238000002156 mixing Methods 0.000 abstract description 3
- OTMSDBZUPAUEDD-UHFFFAOYSA-N Ethane Chemical compound CC OTMSDBZUPAUEDD-UHFFFAOYSA-N 0.000 abstract description 2
- 238000006116 polymerization reaction Methods 0.000 abstract description 2
- 239000002904 solvent Substances 0.000 abstract description 2
- 230000015572 biosynthetic process Effects 0.000 abstract 1
- DYFXGORUJGZJCA-UHFFFAOYSA-N phenylmethanediamine Chemical compound NC(N)C1=CC=CC=C1 DYFXGORUJGZJCA-UHFFFAOYSA-N 0.000 abstract 1
- 238000005549 size reduction Methods 0.000 abstract 1
- RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical compound [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 description 4
- 239000011889 copper foil Substances 0.000 description 4
- ZZTCPWRAHWXWCH-UHFFFAOYSA-N diphenylmethanediamine Chemical compound C=1C=CC=CC=1C(N)(N)C1=CC=CC=C1 ZZTCPWRAHWXWCH-UHFFFAOYSA-N 0.000 description 2
- 230000000694 effects Effects 0.000 description 2
- 239000010680 novolac-type phenolic resin Substances 0.000 description 2
- 238000000059 patterning Methods 0.000 description 2
- 239000002966 varnish Substances 0.000 description 2
- LMVLMHGTZULBRX-UHFFFAOYSA-N 2-[2,2,2-tris(2-hydroxyphenyl)ethyl]phenol Chemical compound OC1=CC=CC=C1CC(C=1C(=CC=CC=1)O)(C=1C(=CC=CC=1)O)C1=CC=CC=C1O LMVLMHGTZULBRX-UHFFFAOYSA-N 0.000 description 1
- 229920001342 Bakelite® Polymers 0.000 description 1
- ZTQSAGDEMFDKMZ-UHFFFAOYSA-N Butyraldehyde Chemical compound CCCC=O ZTQSAGDEMFDKMZ-UHFFFAOYSA-N 0.000 description 1
- 239000004593 Epoxy Substances 0.000 description 1
- 239000000654 additive Substances 0.000 description 1
- 150000001412 amines Chemical class 0.000 description 1
- 230000000052 comparative effect Effects 0.000 description 1
- 229920001577 copolymer Polymers 0.000 description 1
- 230000007423 decrease Effects 0.000 description 1
- 239000005007 epoxy-phenolic resin Substances 0.000 description 1
- 239000003292 glue Substances 0.000 description 1
- 229920001519 homopolymer Polymers 0.000 description 1
- 238000007731 hot pressing Methods 0.000 description 1
- 125000002887 hydroxy group Chemical group [H]O* 0.000 description 1
- 125000004464 hydroxyphenyl group Chemical group 0.000 description 1
- 239000000463 material Substances 0.000 description 1
- ISWSIDIOOBJBQZ-UHFFFAOYSA-N phenol group Chemical group C1(=CC=CC=C1)O ISWSIDIOOBJBQZ-UHFFFAOYSA-N 0.000 description 1
- 239000002994 raw material Substances 0.000 description 1
- 229920002545 silicone oil Polymers 0.000 description 1
- 229920005992 thermoplastic resin Polymers 0.000 description 1
Classifications
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/38—Improvement of the adhesion between the insulating substrate and the metal
- H05K3/386—Improvement of the adhesion between the insulating substrate and the metal by the use of an organic polymeric bonding layer, e.g. adhesive
Landscapes
- Laminated Bodies (AREA)
- Adhesives Or Adhesive Processes (AREA)
Abstract
Description
【発明の詳細な説明】
［発明の目的１
（産業上の利用分野）
本発明は、高温時の接着強度に優れており、ファインパ
ターン化や電子機器の小形化の要請に対応することが可
能な銅張積層板用接着剤に関する。[Detailed description of the invention] [Objective of the invention 1 (Industrial application field) The present invention has excellent adhesive strength at high temperatures and can meet the demands for fine patterning and miniaturization of electronic devices. This invention relates to an adhesive for copper-clad laminates.
（従来の技術）
従来から、銅張積層板用接着剤としてポリビニルブチラ
ール樹脂−エボキシ樹脂−フェ、ノール樹脂系のものが
使用されてきた。 しかし、この三成分系の接着剤は、
ポリビニルブチラール樹脂の含有量が多く非常に可どう
性に富んでいるしのの、熱可塑性樹脂分が多く高温時（
加熱状態）では接着剤が軟化し、接着強度が低下する欠
点があった。(Prior Art) Conventionally, adhesives based on polyvinyl butyral resin, epoxy resin, and phenolic resin have been used as adhesives for copper-clad laminates. However, this three-component adhesive
Shino has a high content of polyvinyl butyral resin and is extremely flexible, but has a high content of thermoplastic resin and is highly flexible at high temperatures (
In a heated state), the adhesive softens and the adhesive strength decreases.
また、上記接着剤軟化や低い接着強度のため、基板をフ
ァインパターン化することができず、従って電子機器の
小形化等に対応することができないという欠点があった
。Furthermore, due to the softening of the adhesive and low adhesive strength, it is not possible to form fine patterns on the substrate, and therefore, there is a drawback that it is not possible to respond to miniaturization of electronic devices.
（発明が解決しようとする問題点）
本発明は、上記の欠点を解消するためになされたもので
、高温時の接着強度に優れた、基板のファインパターン
化や電子機器の小形化に対応可能な銅張積層板用接着剤
を提供しようとするものである。(Problems to be Solved by the Invention) The present invention has been made to eliminate the above-mentioned drawbacks, and has excellent adhesive strength at high temperatures, and is compatible with fine patterning of substrates and miniaturization of electronic devices. The present invention aims to provide an adhesive for copper-clad laminates.
［発明の構成］
（問題点を解決するための手段）
本発明は、上記の目的を達成するため鋭意研究を重ねた
結果、非アミン系化合物を出発原料とする４官能性のエ
ポキシ樹脂とアミン系化合物を出発原料とする４官能性
のエポキシ樹脂を併用することによっ工、高温時に優れ
た接着強度を示すことを見いだし、本発明を完成させた
ものである。[Structure of the Invention] (Means for Solving the Problems) As a result of extensive research to achieve the above object, the present invention has developed a tetrafunctional epoxy resin using a non-amine compound as a starting material and an amine. The present invention was completed based on the discovery that the use of a tetrafunctional epoxy resin made from a compound based on the above-mentioned compound as a starting material exhibits excellent adhesive strength at high temperatures.
すなわち、本発明は、
（Ａ）ポリビニルブチラール樹脂、（Ｂ）分子内に４個
のエポキシ基を有する非アミン系化合物を出発原料とす
るエポキシ樹脂、（Ｃ）分子内に４個のエポキシ基を有
するアミン系化合物を出発原料とするエポキシ樹脂、（
Ｃ）ノボラック型フェノール樹脂を必須成分とすること
を特徴とする銅張積層板用接着剤である。 そして（Ｃ
）の分子内に４個のエポキシ基を有するアミン系化合物
を出発原料とするエポキシ樹脂を、エポキシ樹脂分［（
Ｂ）＋ （Ｃ）］に対して３〜３０重口％の割合で含有
するようにしだ銅張積層板用接着剤である。That is, the present invention provides (A) a polyvinyl butyral resin, (B) an epoxy resin starting from a non-amine compound having four epoxy groups in the molecule, and (C) a polyvinyl butyral resin having four epoxy groups in the molecule. An epoxy resin whose starting material is an amine compound with (
C) An adhesive for copper-clad laminates characterized by containing a novolac type phenolic resin as an essential component. And (C
) is made from an amine compound having four epoxy groups in its molecule as a starting material.
B) + (C)] is an adhesive for copper-clad laminates containing 3 to 30% by weight.
本発明の必須成分の１つである（△）ポリビニルブチラ
ール樹脂としては、ブチラール単独重合体およびホルマ
ール共重合体が使用でき、重合度２０００以上の高分子
量タイプのものであることが望ましい。 これらの樹脂
は単独もしくは２種以上の混合系として使用する。As the (Δ) polyvinyl butyral resin, which is one of the essential components of the present invention, a butyral homopolymer and a formal copolymer can be used, and a high molecular weight type having a degree of polymerization of 2000 or more is preferable. These resins may be used alone or as a mixture of two or more.
本発明の必須成分の１つである（Ｂ）分子内に４個のエ
ポキシ基を有する非アミン系化合物を出発原料とするエ
ポキシ樹脂としては、例えば、次の構造式で示されるテ
トラ（ヒドロキシフェニル）エタンを
出発原料とする４官能性のエポキシ樹脂等が挙げられ、
これらは単独もしくは２種以上の混合系として用いる。Examples of epoxy resins starting from (B) a non-amine compound having four epoxy groups in the molecule, which is one of the essential components of the present invention, include tetra(hydroxyphenyl) represented by the following structural formula. ) Tetrafunctional epoxy resins using ethane as a starting material, etc.
These may be used alone or as a mixture of two or more.
本発明の他の必須成分である（Ｃ）分子内に４個のエポ
キシ基を有するアミン系化合物を出発原料とするエポキ
シ樹脂としては、例えば、次の構造式で示されるジアミ
ノジフェニルメタンを出発原料とする４官能性のエポキ
シ樹脂等が挙げられ、これらは単独もしくは２種以上の
混合系として用いる。 アミン系化合物を出発原料とす
るエポキシ樹脂は、エポキシ樹脂分［（Ｂ）＋ （Ｃ）
］の３３〜３０重Ｍを含有するように配合することが望
ましい。 配合量が３重量％未満では、接着剤の耐熱性
および接着強度が劣り好ましくない。For example, as a starting material for an epoxy resin starting from an amine compound having four epoxy groups in the molecule (C), which is another essential component of the present invention, for example, diaminodiphenylmethane represented by the following structural formula may be used as a starting material. Examples include tetrafunctional epoxy resins, which can be used alone or as a mixture of two or more. An epoxy resin using an amine compound as a starting material has an epoxy resin content [(B) + (C)
] is preferably blended to contain 33 to 30 weight M. If the amount is less than 3% by weight, the heat resistance and adhesive strength of the adhesive will be poor, which is not preferable.
また３０重Ｍ％を超えると耐熱性、接着強度は向上する
ものの、可使時間が短くなり好ましくない。Moreover, if it exceeds 30% by weight, heat resistance and adhesive strength are improved, but the pot life is shortened, which is not preferable.
従って上記範囲内であることが望ましい。Therefore, it is desirable that it be within the above range.
本発明の他の必須成分である（Ｄ）ノボラック型フェノ
ール樹脂としては、特に限定はなく通常使用されるもの
を広く包含することができる。The novolac type phenol resin (D), which is another essential component of the present invention, is not particularly limited and can include a wide range of commonly used resins.
ノボラック型フェノール樹脂の配合割合は、エポキシ樹
脂分［、（Ｂ）＋ （Ｃ）］のエポキシ樹脂１当間に対
して、フェノール性水酸基０．７〜１．５当世、より好
ましくは０．８〜１．２当世となるような範囲内である
ことが望ましい。The blending ratio of the novolac type phenolic resin is 0.7 to 1.5 phenolic hydroxyl groups, more preferably 0.8 to 1 epoxy resin of epoxy resin [, (B) + (C)]. It is desirable that the value be within the range of 1.2 to 1.2.
、 本発明の銅張積層板用接着剤は、前述した各成分を
メチルエチルケトン等のような溶剤に溶解して容易に製
造することができる。 また、必要に応じて本発明の趣
旨に反しない範囲において、他の添加剤等添加配合する
ことができる。The adhesive for copper-clad laminates of the present invention can be easily produced by dissolving the above-mentioned components in a solvent such as methyl ethyl ketone. Further, other additives may be added and blended as necessary within a range that does not go against the spirit of the present invention.
（作用）
可使時間に優れた（Ｂ）非アミン系化合物を出発原料と
する４官能性工ポキシ樹脂９７〜７０重量％に、耐熱性
、接着強度に優れた（Ｃ）アミン系化合物を出発原料と
する４官能性工ポキシ樹脂３〜３０重量％を併用して特
性の調整をした。 そしてこの併用したエポキシ樹脂分
をノボラック型フェノール樹脂で硬化させ、さらにポリ
ビニルブチラール樹脂で粘度調整を行って高温時におい
ても優れた接着強度を有する接着剤を得ることができた
。(Function) 97 to 70% by weight of a tetrafunctional epoxy resin starting from (B) a non-amine compound with excellent pot life and (C) an amine compound with excellent heat resistance and adhesive strength. Properties were adjusted by using 3 to 30% by weight of a tetrafunctional engineered poxy resin as a raw material. Then, by curing the epoxy resin used in combination with a novolac type phenol resin and further adjusting the viscosity with a polyvinyl butyral resin, it was possible to obtain an adhesive having excellent adhesive strength even at high temperatures.
（実施例）
次に本発明を実施例によって説明するが、本発明は実施
例によって限定されるものではない。(Example) Next, the present invention will be explained by examples, but the present invention is not limited by the examples.
以下実施例等に於て「部」とは「重量部」を意味する。In the Examples below, "parts" means "parts by weight."
実施例
ポリビニルブチラール樹脂エスレックＢ５５Ｚ（漬水化
学工業社製、商品名）２３部、ノボラック型フェノール
樹脂ＰＲ５１６８８（住友ベークライト社製、商品名）
４０部、テトラ（ヒドロキシフェニル）エタンを出発原
料とする４官能性工ポキシ樹脂２６部、およびジアミノ
ジフェニルメタンを出発原料とする４官能性工ポキシ樹
脂１１部をメチルエチルケトンに溶解し、不揮発分３０
％のワニス（接着剤）を得た。 このワニスを厚さ３５
μ…の銅箔に塗布し、６０℃で１０分間、１４０℃で５
分間乾燥して、Ｂステージ化した。 この銅箔を１’
Ｌ Ｃ１３４（当社積層板商品名）の基材と重ね合わせ
て １７０℃、 １２０ ｋｇ／ｃ１２の条件で１時間
、加熱加圧成形して銅張積層板をつくった。 この銅張
積層板について接着強度を試験したので第１表に示した
。 本発明の顕著な効果が認められた。Example 23 parts of polyvinyl butyral resin S-LEC B55Z (manufactured by Tsukimizu Kagaku Kogyo Co., Ltd., trade name), novolak type phenolic resin PR51688 (manufactured by Sumitomo Bakelite Co., Ltd., trade name)
40 parts, 26 parts of a tetrafunctional epoxy resin starting from tetra(hydroxyphenyl)ethane, and 11 parts of a tetrafunctional epoxy resin starting from diaminodiphenylmethane were dissolved in methyl ethyl ketone, and the non-volatile content was 30 parts.
% varnish (glue) was obtained. Apply this varnish to a thickness of 35
Coat it on a copper foil of
It was dried for a minute and B-staged. This copper foil is 1'
A copper-clad laminate was produced by superimposing it on a base material of L C134 (our company's laminate product name) and hot-pressing it at 170°C and 120 kg/c12 for 1 hour. The adhesive strength of this copper-clad laminate was tested and is shown in Table 1. Remarkable effects of the present invention were observed.
比較例
実施例において用いた接着剤の代わりに、ポリビニルブ
チラール樹脂−エボキシ樹脂−フェノール樹脂系接着剤
であるＴＶＣ３６２４（当社接着剤商品名）を用い、実
施例と同様に銅箔に塗布して銅張積層板をつくった。
この銅張積層板について実施例と同様にして接着強度を
試験したので、その結果を第１表に示した。Comparative Example Instead of the adhesive used in the example, TVC3624 (our adhesive product name), which is a polyvinyl butyral resin-epoxy resin-phenol resin adhesive, was used and applied to copper foil in the same manner as in the example. I made a tension laminate.
The adhesive strength of this copper-clad laminate was tested in the same manner as in the Examples, and the results are shown in Table 1.
第１表
＊２ ：Ｓｍｍ幅に加工した銅箔を１５０℃のシリコ
ーンオイル中に３分間浸漬した（その状態で剥離強度を
測定
［発明の効果コ
以上の説明および第１表から明らかなように、本発明の
銅張積層板用接着剤は、非アミン系化合物を出発原料と
するエポキシ樹脂とアミン系化合物を出発原料とするエ
ポキシ樹脂を併用することによって、接着強度、特に高
温における接着強度に優れたものである。 この接着剤
を使用することによって基板のファインパターン化や電
子機器の小形化が可能となり、工業上大変有益なもので
ある。Table 1 *2: Copper foil processed to a width of Smm was immersed in silicone oil at 150°C for 3 minutes (peeling strength was measured in that state [Effects of the invention] As is clear from the above explanation and Table 1) The adhesive for copper-clad laminates of the present invention improves adhesive strength, especially adhesive strength at high temperatures, by using both an epoxy resin starting from a non-amine compound and an epoxy resin starting from an amine compound. This is an excellent adhesive. By using this adhesive, it is possible to create fine patterns on substrates and downsize electronic devices, making it extremely useful in industry.
Claims (1)
４個のエポキシ基を有する非アミン系化合物を出発原料
とするエポキシ樹脂、（Ｃ）分子内に４個のエポキシ基
を有するアミン系化合物を出発原料とするエポキシ樹脂
、（Ｄ）ノボラック型フェノール樹脂を必須成分とする
ことを特徴とする銅張積層板用接着剤。 ２ （Ｃ）の分子内に４個のエポキシ基を有するアミン
系化合物を出発原料とするエポキシ樹脂を、エポキシ樹
脂分［（Ｂ）＋（Ｃ）］に対して３〜３０重量％の割合
で含有する特許請求の範囲第１項記載の銅張積層板用接
着剤。[Scope of Claims] 1 (A) polyvinyl butyral resin, (B) an epoxy resin starting from a non-amine compound having 4 epoxy groups in the molecule, (C) 4 epoxy groups in the molecule An adhesive for copper-clad laminates, characterized in that an epoxy resin containing an amine compound having the following as a starting material, and (D) a novolac type phenol resin as an essential component. 2. An epoxy resin starting from an amine compound having four epoxy groups in the molecule of (C) is used at a ratio of 3 to 30% by weight based on the epoxy resin content [(B) + (C)]. An adhesive for copper-clad laminates according to claim 1 containing:
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP61301176A JPH0692571B2 (en) | 1986-12-19 | 1986-12-19 | Adhesive for copper clad laminates |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP61301176A JPH0692571B2 (en) | 1986-12-19 | 1986-12-19 | Adhesive for copper clad laminates |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| JPS63154743A true JPS63154743A (en) | 1988-06-28 |
| JPH0692571B2 JPH0692571B2 (en) | 1994-11-16 |
Family
ID=17893699
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP61301176A Expired - Lifetime JPH0692571B2 (en) | 1986-12-19 | 1986-12-19 | Adhesive for copper clad laminates |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPH0692571B2 (en) |
Citations (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS4933987A (en) * | 1972-07-28 | 1974-03-28 | ||
| JPS58102969A (en) * | 1981-12-16 | 1983-06-18 | Matsushita Graphic Commun Syst Inc | Flash fixation device |
| JPS61159475A (en) * | 1985-01-07 | 1986-07-19 | Hitachi Cable Ltd | Bonding composition |
-
1986
- 1986-12-19 JP JP61301176A patent/JPH0692571B2/en not_active Expired - Lifetime
Patent Citations (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS4933987A (en) * | 1972-07-28 | 1974-03-28 | ||
| JPS58102969A (en) * | 1981-12-16 | 1983-06-18 | Matsushita Graphic Commun Syst Inc | Flash fixation device |
| JPS61159475A (en) * | 1985-01-07 | 1986-07-19 | Hitachi Cable Ltd | Bonding composition |
Also Published As
| Publication number | Publication date |
|---|---|
| JPH0692571B2 (en) | 1994-11-16 |
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