JPS63153107A - Production of prepreg - Google Patents
Production of prepregInfo
- Publication number
- JPS63153107A JPS63153107A JP30086586A JP30086586A JPS63153107A JP S63153107 A JPS63153107 A JP S63153107A JP 30086586 A JP30086586 A JP 30086586A JP 30086586 A JP30086586 A JP 30086586A JP S63153107 A JPS63153107 A JP S63153107A
- Authority
- JP
- Japan
- Prior art keywords
- base material
- resin varnish
- prepreg
- squeeze
- thermosetting resin
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Granted
Links
- 238000004519 manufacturing process Methods 0.000 title claims description 11
- 239000002966 varnish Substances 0.000 claims abstract description 26
- 239000000463 material Substances 0.000 claims abstract description 25
- 229920001187 thermosetting polymer Polymers 0.000 claims abstract description 21
- 239000011347 resin Substances 0.000 claims abstract description 20
- 229920005989 resin Polymers 0.000 claims abstract description 20
- 238000001035 drying Methods 0.000 claims abstract description 4
- 238000000034 method Methods 0.000 claims description 6
- 239000004744 fabric Substances 0.000 abstract description 8
- 238000000465 moulding Methods 0.000 abstract description 8
- 239000003822 epoxy resin Substances 0.000 abstract description 6
- 239000011521 glass Substances 0.000 abstract description 6
- 229920000647 polyepoxide Polymers 0.000 abstract description 6
- 238000010438 heat treatment Methods 0.000 abstract description 4
- 238000005470 impregnation Methods 0.000 abstract description 4
- 230000007246 mechanism Effects 0.000 abstract description 3
- 238000009413 insulation Methods 0.000 abstract 1
- 239000011800 void material Substances 0.000 abstract 1
- 230000000052 comparative effect Effects 0.000 description 4
- 229920001721 polyimide Polymers 0.000 description 4
- RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical compound [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 description 2
- 239000004593 Epoxy Substances 0.000 description 2
- 239000004642 Polyimide Substances 0.000 description 2
- 238000007796 conventional method Methods 0.000 description 2
- 239000011889 copper foil Substances 0.000 description 2
- 238000007747 plating Methods 0.000 description 2
- 239000009719 polyimide resin Substances 0.000 description 2
- 239000003795 chemical substances by application Substances 0.000 description 1
- 238000010586 diagram Methods 0.000 description 1
- 230000000694 effects Effects 0.000 description 1
- 238000005562 fading Methods 0.000 description 1
- 238000007654 immersion Methods 0.000 description 1
- 238000010030 laminating Methods 0.000 description 1
- 238000003475 lamination Methods 0.000 description 1
- 238000005259 measurement Methods 0.000 description 1
- 230000002093 peripheral effect Effects 0.000 description 1
- 238000003825 pressing Methods 0.000 description 1
- 230000001737 promoting effect Effects 0.000 description 1
Landscapes
- Reinforced Plastic Materials (AREA)
Abstract
Description
【発明の詳細な説明】
［発明の目的・コ
゛（産業上の利用分野）
本発明は、プリント配線板の製造に用いられるプリプレ
グく積層板用樹脂含浸基材）を製造する方法に関する。DETAILED DESCRIPTION OF THE INVENTION [Object of the Invention (Industrial Application Field) The present invention relates to a method for manufacturing a prepreg or resin-impregnated base material for a laminate used in the manufacture of printed wiring boards.
（従来の技術）
近年、電気電子機構用のプリント配線板においては、機
構の軽薄短小化に伴い、配線パターンの高密度化や導通
用スルーホールの縮径化等が進められている。(Prior Art) In recent years, in printed wiring boards for electrical and electronic mechanisms, as mechanisms have become lighter, thinner, shorter, and smaller, wiring patterns have become denser and conductive through holes have become smaller in diameter.
このようなプリント配線板の製造に使用されるプリプレ
グには、紙布等の多孔質絶縁基材中に熱硬化性ｖ！Ｍ脂
が均一にかつ空隙がないように充填されることが必要で
ある。The prepreg used to manufacture such printed wiring boards includes thermosetting v! It is necessary that the M fat be filled uniformly and without any voids.
（発明が解決しようとする問題点）
このため従来から、多孔質絶縁基材を熱硬化性樹脂ワニ
ス槽中に通して熱硬化性樹脂を含浸させた後、スクイズ
ロールを通して余分に付着した熱硬化性樹脂ワニスを除
去することが行われている。しかしながらこの方法では
多孔質絶縁基材中に存在する微細なフィラメント状の空
隙中の空気まで完全に除去することは困難であり、プリ
プレグの内部に残留空気によるボイドが形成されるてし
よう、このようなプリプレグを■いてプリント配線板用
の積層板を製造した場合には、メッキボイドや周辺部の
かすれが生じやすくなるという問題があった。また、残
留ボイドの多いプリプレグを積層成形する場合には、ボ
イドを抜くために成形圧力を高くしなければならず、そ
の高圧成形により積層板に反りやねじれが生じやすいと
いう問題もあった。(Problem to be Solved by the Invention) For this reason, conventionally, a porous insulating base material is passed through a thermosetting resin varnish bath to impregnate it with a thermosetting resin, and then passed through a squeeze roll to remove any excess thermosetting resin. Removal of resin varnish is being carried out. However, with this method, it is difficult to completely remove the air in the fine filament-like voids that exist in the porous insulating base material, and voids may be formed due to residual air inside the prepreg. When a laminate for a printed wiring board is manufactured using prepreg, there is a problem in that plating voids and smearing in the peripheral areas tend to occur. Furthermore, when laminating prepregs with many residual voids, the molding pressure must be increased to remove the voids, and the high-pressure molding tends to cause warping and twisting of the laminate.
本発明はこれらの問題を解決するためになされたもので
、ボイドが極めて少なく、低圧成形による積層板製造が
可能なプリプレグを製造する方法を提供することを目的
とする。The present invention was made to solve these problems, and an object of the present invention is to provide a method for manufacturing a prepreg that has extremely few voids and can be manufactured into a laminate by low-pressure molding.
〔発明の構成］
（問題点を解決するための手段）
本発明のプリプレグの製造方法は、積層板用多孔質絶縁
基材を熱硬化性樹脂ワニス中に連続的に浸漬して含浸さ
せた後、これを周面に多数の微細な穴を有しかつこれら
の穴から減圧吸引する機梢を備えたスクイズロールに通
して、前記基材中の空気および過剰の熱硬化性樹脂ワニ
スを前記微細な穴を介して吸引除去するとともに前記熱
硬化性樹脂ワニスの前記基材への含浸を促進させつつ圧
搾し、しかる後前記基材中に含浸された熱硬化性ワニス
を乾燥させることを特徴としている。[Structure of the Invention] (Means for Solving the Problems) The prepreg manufacturing method of the present invention comprises continuously immersing a porous insulating base material for a laminate in a thermosetting resin varnish to impregnate it, and then impregnating it with a thermosetting resin varnish. The air and excess thermosetting resin varnish in the base material are removed by passing it through a squeeze roll that has a large number of fine holes on its circumference and is equipped with a machine that vacuums suction through these holes. The thermosetting resin varnish is removed by suction through a hole, and is squeezed while promoting impregnation of the thermosetting resin varnish into the base material, and then the thermosetting varnish impregnated into the base material is dried. There is.
本発明の方法に用いるスクイズロールは、例えば第２図
に示すように、スクイズロール本体１１の周面に、例え
ば直径１〜３ｎ＋１の微細な穴１２を、密度が５〜２０
個／ｄ程度となるよう多数あけかつ回転軸に吸引通路１
３を形成した構造とされている。このスクイズロールは
、運転中図示を省略した真空ポンプにより吸引通路１３
から吸引され多孔質絶縁基材中の空気や過剰の熱硬化性
樹脂ワニスを吸引除去する。For example, as shown in FIG. 2, the squeeze roll used in the method of the present invention has fine holes 12 with a diameter of 1 to 3n+1 on the circumferential surface of a squeeze roll main body 11 and a density of 5 to 20.
A large number of suction passages are opened and one suction passage is provided on the rotating shaft.
It is said that it has a structure that forms 3. During operation, this squeeze roll is moved through the suction passage 13 by a vacuum pump (not shown).
The air and excess thermosetting resin varnish in the porous insulating base material are removed by suction.
なお減圧吸引の際の真空度は１．００〜６５０ Ｔｏｒ
ｒ程度が適している。The degree of vacuum during vacuum suction is 1.00 to 650 Torr.
Approximately r is suitable.
（作用）
本発明の製造方法においては、熱硬化性樹脂ワニスが含
浸されな紙、布のような多孔質絶縁基材を、周面に多数
の微細な穴を有しかつこれらの穴から減圧吸引するＲＭ
を儂えたスクイズロールに通すことにより、基材中のフ
ィラメント中の空気のように離脱し難い空気までその微
細な穴から吸引除去される。(Function) In the production method of the present invention, a porous insulating base material such as paper or cloth that is not impregnated with a thermosetting resin varnish has a large number of fine holes on its circumferential surface, and a vacuum is applied through these holes. RM to suck
By passing the material through a squeeze roll made of a special material, even the air that is difficult to separate from, like the air in filaments in the base material, is suctioned and removed through the fine holes.
このため微細なフィラメント状のボイドも消滅し、かつ
熱硬化性樹脂ワニスの含浸が促進される。As a result, fine filament-like voids also disappear, and impregnation with the thermosetting resin varnish is promoted.
したがって積層成形の際、残留ボイドを除くための高圧
を必要とせず、したがって高圧成形に伴うＷＩ層板の反
りやねじれの問題も解消される。Therefore, during lamination molding, there is no need for high pressure to remove residual voids, and therefore the problems of warping and twisting of the WI laminate due to high pressure molding are also solved.
（実施例） 以下本発明の実施例について説明する。(Example) Examples of the present invention will be described below.
実施例１
第１図に示すように、基材供給ロール１から連続的に送
り出された厚さ１００μｌのガラスクロス（日東紡社製
−［＾−１１６） ２を、ディップロール３に沿わせて
合浸用エポキシ樹脂ワニス［４に通した後、スクイズロ
ール装置５を通過させた。このスクイズロール装置！ｆ
５は、第２図に示したように基材と接触する面に、直径
１〜３ｎｎで密度が５〜２０個／ｄ程度の微細な穴を有
するスクイズロール本体６と、このスクイズロール本体
６の吸引通路とトラップ７を介して接続された真空ポン
プ８とから構成されており、運転中は真空ポンプ８を駆
動させて１００〜６５０ Ｔｏｒｒの真空度で吸引する
ようになっている。次いでスクイズローラ装置５を通過
して空気が除去され適量のエポキシｔ！１ｄｌｌｆｆワ
ニス°の含浸されたガラスクロスを加熱乾燥塔９に通し
加熱乾燥して、５０重量％のエポキシ樹脂（ＦＲ−４用
樹脂）が含浸されたＢステージのプリプレグを得た。尚
、図中符号１０はガイドロールを示す。Example 1 As shown in FIG. 1, glass cloth (manufactured by Nittobo Co., Ltd. - [^-116) 2 with a thickness of 100 μl, which was continuously fed out from the base material supply roll 1, was placed along the dip roll 3. After passing through the epoxy resin varnish for co-immersion [4], it was passed through a squeeze roll device 5. This squeeze roll device! f
5 is a squeeze roll main body 6 having fine holes with a diameter of 1 to 3 nn and a density of about 5 to 20 holes/d on the surface in contact with the base material, as shown in FIG. The vacuum pump 8 is connected to a suction passage through a trap 7, and during operation, the vacuum pump 8 is driven to suction at a vacuum level of 100 to 650 Torr. It then passes through a squeeze roller device 5 to remove air and dispense an appropriate amount of epoxy t! A glass cloth impregnated with 1 dllff varnish was passed through a heating drying tower 9 and dried by heating to obtain a B-stage prepreg impregnated with 50% by weight of epoxy resin (resin for FR-4). In addition, the code|symbol 10 in the figure shows a guide roll.
次に得られたプリプレグの複数枚と厚さ０．３圓の内層
板および銅箔の複数枚を常法により積層し、１７０℃、
２０ｋｇ／−の条件で９０分間加熱加圧成形して、厚さ
１．６ｍ＋、サイズ５００ ｘ３００ ｒｍの６ＮＩ板
を製造した。Next, a plurality of sheets of the obtained prepreg, an inner layer plate with a thickness of 0.3 circles, and a plurality of sheets of copper foil were laminated by a conventional method, and heated at 170°C.
A 6NI plate having a thickness of 1.6 m+ and a size of 500 x 300 rm was manufactured by heat-pressing molding for 90 minutes under the condition of 20 kg/-.
実施例２
厚さ５０μｌのガラスクロス（旭化成社製、商品基地シ
ューベル１０８０）を用いて実施例１と同じ方法で、７
０重量％のポリイミド樹脂を含浸させＢ−ステージのポ
リイミドプリプレグを製造した。Example 2 In the same manner as in Example 1, 7
A B-stage polyimide prepreg was manufactured by impregnating 0% by weight of polyimide resin.
次にこのプリプレグの複数枚と０．１■厚の内層板およ
び銅箔のそれぞれ複数枚を常法によりｗ４層し、これを
１９０℃、２０ｋｇ／ａＪの条件で９０分間加熱加圧成
形して、厚さ２．Ｏｒｍ、サイズ５００ ×３３０鴎の
１２層板を製造した。Next, multiple sheets of this prepreg, multiple sheets of 0.1-thick inner layer plates, and multiple sheets of copper foil were layered using a conventional method, and this was heated and pressure-molded at 190°C and 20 kg/aJ for 90 minutes. , thickness 2. Orm, a 12-layer board of size 500 x 330 was manufactured.
比較例１．２
比較のなめに実施例１および２に用いたと同じガラスク
ロスに、従来の方法でエポキシ樹脂ワニスおよびポリイ
ミド樹脂ワニスをそれぞれ含浸させ加熱乾燥させてプリ
プレグを製造した１次いで得られたガラス−エポキシプ
リプレグ（比較例１）およびポリイミドプリプレグ（比
較例２）を、それぞれ実施例１および２と同様にして積
層して成形し、６層板および１２層板を製造した。Comparative Example 1.2 For comparison, prepregs were produced by impregnating the same glass cloth used in Examples 1 and 2 with epoxy resin varnish and polyimide resin varnish in a conventional manner and drying them by heating. Glass-epoxy prepreg (Comparative Example 1) and polyimide prepreg (Comparative Example 2) were laminated and molded in the same manner as in Examples 1 and 2, respectively, to produce a 6-layer board and a 12-layer board.
次に実施例および比較例でそれぞれ得られた積層板のメ
ッキボイドの発生の有無と、コーナーかすれ、および反
り、ねじれの値をそれぞれ測定した。Next, the presence or absence of plating voids, and the values of corner fading, warping, and twisting of the laminates obtained in Examples and Comparative Examples were measured.
これらの測定結果を次表に示す。The results of these measurements are shown in the table below.
［発明の効果］
以上の実施例からも明らかなように、本発明においては
多孔質の絶縁基材に熱硬化性樹脂ワニスを含浸させた後
、スクイズロール表面のＷ！１細な六を介して、空気と
過剰の熱硬化性樹脂ワニスとを吸引除去するとともに、
多孔質の絶縁基材への熱硬化性樹脂ワニスの含浸を促進
させているので、ボイドがほとんどないプリプレグを得
ることができる。そしてこのようなプリプレグを用いる
ことにより、低い圧力で成形を行うことができ、反りや
ねじれ、コーナ一部のかすれが少なく、かっボイドがほ
とんどなくて信頼性の高い積層板を製造することができ
る。[Effects of the Invention] As is clear from the above examples, in the present invention, after a porous insulating base material is impregnated with a thermosetting resin varnish, the W! 1. Air and excess thermosetting resin varnish are removed by suction through a fine six, and
Since the impregnation of the thermosetting resin varnish into the porous insulating base material is promoted, a prepreg with almost no voids can be obtained. By using such prepreg, it is possible to perform molding at low pressure, and it is possible to manufacture highly reliable laminates with less warping, twisting, and corner fraying, and almost no voids. .
第１図は本発明の詳細な説明するための模式図、第２図
は本発明に使用するスクイズロールの部分断面図である
。
２・・・・・・・・・ガラスクロス
３・・・・・・・・・ディップロール
４・・・・・・・・・エポキシ樹脂ワニス槽５・・・・
・・・・・スクイズロール装置６・・・・・・・・・ス
クイズロール
８・・・・・・・・・真空ポンプ
出願人 東芝ケミカル株式会社
代理人 弁理士 須 山 佐 −
乙１図FIG. 1 is a schematic diagram for explaining the present invention in detail, and FIG. 2 is a partial sectional view of a squeeze roll used in the present invention. 2...Glass cloth 3...Dip roll 4...Epoxy resin varnish tank 5...
・・・・・・Squeeze roll device 6・・・・・・・・・Squeeze roll 8・・・・・・・・・Vacuum pump Applicant Toshiba Chemical Co., Ltd. agent Patent attorney Satoshi Suyama − Figure Otsu 1
Claims (3)
に連続的に浸漬して含浸させた後、これを周面に多数の
微細な穴を有しかつこれらの穴から減圧吸引する機構を
備えたスクイズロールに通して、前記基材中の空気およ
び過剰の熱硬化性樹脂ワニスを前記微細な穴を介して吸
引除去するとともに前記熱硬化性樹脂ワニスの前記基材
への含浸を促進させつつ圧搾し、しかる後前記基材中に
含浸された熱硬化性ワニスを乾燥させることを特徴とす
るプリプレグの製造方法。(1) A porous insulating base material for a laminate is continuously dipped into a thermosetting resin varnish to impregnate it, and then the porous insulating base material has a large number of fine holes on its circumferential surface and is vacuum-suctioned through these holes. The air and excess thermosetting resin varnish in the base material are removed by suction through the fine holes, and the base material is impregnated with the thermosetting resin varnish. A method for producing a prepreg, which comprises compressing the base material while accelerating the process, and then drying the thermosetting varnish impregnated into the base material.
なわれることを特徴とする特許請求の範囲第１項記載の
プリプレグの製造方法。(2) The prepreg manufacturing method according to claim 1, wherein the vacuum suction is performed at a vacuum level of 100 to 650 torr.
３ｍｍで、かつ密度が５〜２０個／ｃｍ＾２であること
を特徴とする特許請求の範囲第１項または第２項記載の
プリプレグの製造方法。(3) The diameter of the fine holes on the circumferential surface of the squeeze roll is 1~
3 mm and a density of 5 to 20 pieces/cm^2, the method for manufacturing a prepreg according to claim 1 or 2, wherein the prepreg has a thickness of 5 to 20 pieces/cm^2.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP61300865A JPH07112703B2 (en) | 1986-12-17 | 1986-12-17 | Prepreg manufacturing method |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP61300865A JPH07112703B2 (en) | 1986-12-17 | 1986-12-17 | Prepreg manufacturing method |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| JPS63153107A true JPS63153107A (en) | 1988-06-25 |
| JPH07112703B2 JPH07112703B2 (en) | 1995-12-06 |
Family
ID=17890039
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP61300865A Expired - Fee Related JPH07112703B2 (en) | 1986-12-17 | 1986-12-17 | Prepreg manufacturing method |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPH07112703B2 (en) |
Cited By (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPH03211016A (en) * | 1990-01-13 | 1991-09-13 | Matsushita Electric Works Ltd | Removing method for excess resin in resin impregnation for base |
| US5225140A (en) * | 1990-03-30 | 1993-07-06 | Kuraray Co., Ltd. | Method and apparatus for manufacturing a fiber reinforced thermoplastic sheet-shaped molding by using suction to partially impregnate a fiber web |
| US6245383B1 (en) * | 1998-11-25 | 2001-06-12 | Matsushita Electric Works, Ltd. | Method for manufacturing prepreg in which reinforcing substrate is impregnated with thermosetting matrix resin |
| JP2002217538A (en) * | 2001-01-15 | 2002-08-02 | Matsushita Electric Works Ltd | Method for manufacturing prepreg |
Citations (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS4221756Y1 (en) * | 1966-11-17 | 1967-12-13 | ||
| JPS5464569A (en) * | 1977-11-02 | 1979-05-24 | Hitachi Chem Co Ltd | Method of impregnating sheet material with liquid resin |
-
1986
- 1986-12-17 JP JP61300865A patent/JPH07112703B2/en not_active Expired - Fee Related
Patent Citations (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS4221756Y1 (en) * | 1966-11-17 | 1967-12-13 | ||
| JPS5464569A (en) * | 1977-11-02 | 1979-05-24 | Hitachi Chem Co Ltd | Method of impregnating sheet material with liquid resin |
Cited By (6)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPH03211016A (en) * | 1990-01-13 | 1991-09-13 | Matsushita Electric Works Ltd | Removing method for excess resin in resin impregnation for base |
| US5225140A (en) * | 1990-03-30 | 1993-07-06 | Kuraray Co., Ltd. | Method and apparatus for manufacturing a fiber reinforced thermoplastic sheet-shaped molding by using suction to partially impregnate a fiber web |
| US6245383B1 (en) * | 1998-11-25 | 2001-06-12 | Matsushita Electric Works, Ltd. | Method for manufacturing prepreg in which reinforcing substrate is impregnated with thermosetting matrix resin |
| US6464783B1 (en) * | 1998-11-25 | 2002-10-15 | Matsushita Electric Works, Ltd. | Apparatus for manufacturing prepreg |
| JP2002217538A (en) * | 2001-01-15 | 2002-08-02 | Matsushita Electric Works Ltd | Method for manufacturing prepreg |
| JP4590740B2 (en) * | 2001-01-15 | 2010-12-01 | パナソニック電工株式会社 | Manufacturing method of prepreg |
Also Published As
| Publication number | Publication date |
|---|---|
| JPH07112703B2 (en) | 1995-12-06 |
Similar Documents
| Publication | Publication Date | Title |
|---|---|---|
| KR900005893B1 (en) | Dielectric materials having low dielectric constants and methods for their manufacture | |
| JPS63153107A (en) | Production of prepreg | |
| US4738890A (en) | Resin-impregnated base and method of manufacturing same | |
| JPH01272416A (en) | Manufacture of prepreg | |
| JPH05318482A (en) | Manufacture of laminate | |
| JPS63199612A (en) | Manufacture of resin-impregnated base for laminated sheet | |
| JP3362386B2 (en) | Resin-impregnated base material and method for producing the same, laminate and method for producing the same | |
| JPH04223113A (en) | Manufacture of laminated sheet | |
| JPH036093A (en) | Prepreg sheet for multilayer printed wiring board | |
| JPS63285997A (en) | Method and device for manufacturing multi-layer substrate | |
| WO2014095007A1 (en) | Circuit board with real wood ply composite material | |
| JPS60190430A (en) | Production of prepreg and apparatus therefor | |
| JPH0368557B2 (en) | ||
| JPS63212510A (en) | Manufacture of prepreg | |
| JPH0295845A (en) | Continuous manufacture of electrical laminate | |
| JPS59101330A (en) | Manufacture of laminated board | |
| JPS60135217A (en) | Preparation of prepreg | |
| JPS63214411A (en) | Production of prepreg | |
| JPH01165629A (en) | Production of prepreg for laminate | |
| JPH0234310B2 (en) | ||
| JPH0848797A (en) | Production of prepreg | |
| JPH0771839B2 (en) | Laminated board manufacturing method | |
| JPH048515A (en) | Manufacture of laminated plate | |
| JPH0439006A (en) | Manufacture of prepreg for laminated sheet | |
| JPH06107820A (en) | Production of prepreg |
Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| LAPS | Cancellation because of no payment of annual fees |