JPS59101330A - Manufacture of laminated board - Google Patents
Manufacture of laminated boardInfo
- Publication number
- JPS59101330A JPS59101330A JP57211842A JP21184282A JPS59101330A JP S59101330 A JPS59101330 A JP S59101330A JP 57211842 A JP57211842 A JP 57211842A JP 21184282 A JP21184282 A JP 21184282A JP S59101330 A JPS59101330 A JP S59101330A
- Authority
- JP
- Japan
- Prior art keywords
- tapes
- prepregs
- laminated
- laminated board
- prepared
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
Landscapes
- Casting Or Compression Moulding Of Plastics Or The Like (AREA)
- Moulding By Coating Moulds (AREA)
- Laminated Bodies (AREA)
Abstract
Description
【発明の詳細な説明】
本発明は電気部品、電子部品、コンピュータ一部品等に
用いられる@層板の製造方法に関するもので、その目的
とするところは不良発生を防止し生産効率を向上せしめ
ることにある。DETAILED DESCRIPTION OF THE INVENTION The present invention relates to a method for manufacturing @layer plates used for electrical parts, electronic parts, computer parts, etc., and its purpose is to prevent the occurrence of defects and improve production efficiency. It is in.
従来のfiIi層板は、積層板用樹脂を積層板用基材に
含浸、乾燥したプリプレグを所要枚数@層した積層体を
成形グレート間に挾み加熱加圧成形していたが、プリプ
レグ組込工程で組込されたfilt層体を履体プレス機
に搬送したり、成形プレス機の熱盤間に挿入して定位置
に配置した9する時にブリ(1)
プレグのズレを発生し、ズレ修正時間に費す労力と時間
ロスは大きく且つ加圧による熱盤接触時に発生するズレ
は避けることができなく不良発生を頻発していたもので
ある。Conventional fiIi laminates were made by impregnating the laminate base material with laminate resin and then layering the required number of dried prepregs, which was then sandwiched between molding plates and molded under heat and pressure. When the filt layer incorporated in the process is transported to the shoe press machine or inserted between the hot plates of the molding press machine and placed in a fixed position, the preg (1) may shift. The amount of effort and time lost during correction was large, and the misalignment that occurred when the hot plate came into contact with the pressurized plate was unavoidable, resulting in frequent occurrence of defects.
本発明は上記欠点を解決するもので、@履体の周辺端部
にテープを配設しておいてから加熱加圧成形するため、
積層体搬送時、成形プレス機への挿入配置時、加圧時等
でのグリプレグのズレを防止することができ不良発生を
防止し、生産効率を向上せしめることができたものであ
る。The present invention solves the above-mentioned drawbacks, since the tape is placed on the peripheral edge of the shoe body and then heated and press-molded.
It is possible to prevent the Gripreg from shifting when transporting the laminate, inserting it into a molding press, applying pressure, etc., thereby preventing the occurrence of defects and improving production efficiency.
以下本発明の方法の一実施例を図示実施例にもとすいて
説明すれば次のようである。第1図に示スヨウにフェノ
ール樹脂、クレゾール樹脂、エポキシ樹脂、不飽和ポリ
エステル樹脂、メラミン樹脂、ポリイミド、ポリブタジ
ェン、ポリアミド、ポリアミドイミド、ポリスルフォン
、ポリブチレンテレフタレート、ポリエーテルエーテル
ケトン、弗化樹脂等の単独、変性物、混合物等からなる
積層板用樹脂液をガラヌ、アスベヌト等の無機繊維やポ
リ・ニスデル、ポリアミド、ポリビニルアルコ(2)
−ル、アクリル等の有機合成繊維や木綿等の天然繊維か
らなる織布、不織布、マット或は紙等の積層板用基材に
含浸、乾燥したプリプレグ1を所要枚数i層した積層体
aの側面や周縁等の周辺端部2に紙テープ、布テープ、
グラスチックテープ、金属箔テープ等のテープ8を貼り
加熱加圧成形して積層板を得るものである。又、ブリプ
レグ潰履体aの上面又は上、下面に銅箔、アルミニウム
箔、ニッケル箔、真鍮箔等の金属箔を載1dすることに
よシ片面舎属張積層板や両面金属張積層板を得ることが
できるものである。更に@履体3の厚みが比較的大きい
場合はテープを11を扇体側面のみに貼ってもよいが薄
い場合は周縁、側面ともに貼るほうがズレ防止のために
よく望ましいことである。An embodiment of the method of the present invention will be described below with reference to the illustrated embodiment. The examples shown in Figure 1 include phenolic resin, cresol resin, epoxy resin, unsaturated polyester resin, melamine resin, polyimide, polybutadiene, polyamide, polyamideimide, polysulfone, polybutylene terephthalate, polyether ether ketone, fluorinated resin, etc. The resin solution for laminates, which can be used alone, as a modified product, or as a mixture, can be made from inorganic fibers such as galanu and asbenute, organic synthetic fibers such as poly/Nisdel, polyamide, polyvinyl alcohol(2)-alcohol, acrylic, and natural fibers such as cotton. Paper tape, cloth tape,
A tape 8 such as a glass tape or a metal foil tape is applied and molded under heat and pressure to obtain a laminate. In addition, by placing metal foil such as copper foil, aluminum foil, nickel foil, or brass foil on the upper surface, upper, or lower surface of the Bripreg crushing body a, single-sided metal-clad laminates or double-sided metal-clad laminates can be produced. It is something that can be obtained. Furthermore, if the shoe body 3 is relatively thick, the tape 11 may be applied only to the side surface of the fan body, but if it is thin, it is more desirable to apply it to both the periphery and the side surface to prevent slippage.
上記のように本発明によれば積層体のズレを防止するこ
とができるので積層体の搬送時、成形プレス機への挿入
配置時、加圧時でのプリプレグのズレを防止し不良発生
を減少させ且つ生産効率を向上せしめることができたも
のである。As described above, according to the present invention, it is possible to prevent misalignment of the laminate, thereby preventing misalignment of the prepreg when transporting the laminate, inserting it into a molding press, and applying pressure, thereby reducing the occurrence of defects. This made it possible to improve production efficiency.
第1図は本発明の一実施例を示す簡略断面図である。 1はプリプレグ、2け周辺端部、8はテープである。 特許出願人 松T電工株式会社 代理人升埋士 竹 元 敏 丸 (ほか2名) FIG. 1 is a simplified sectional view showing one embodiment of the present invention. 1 is a prepreg, 2 is a peripheral edge, and 8 is a tape. patent applicant Matsu T Denko Co., Ltd. Agent Masu Burialist Toshimaru Take Moto (2 others)
Claims (1)
リプレグを所要枚数種層したf*層履体加熱加圧成形し
てなる積層板の製造方法において、積層体の周辺端部に
テープを配設してから加熱加圧成形することを特徴とす
る積層板の製造方法。(1) In a method for producing a laminate by heating and press-molding an f*-layer shoe made by impregnating a laminate base material with a laminate resin and layering the required number of dried Gripregs, the peripheral edge of the laminate 1. A method for manufacturing a laminate, which comprises disposing a tape on the laminate and then heat-pressing it.
Priority Applications (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP57211842A JPS59101330A (en) | 1982-12-01 | 1982-12-01 | Manufacture of laminated board |
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP57211842A JPS59101330A (en) | 1982-12-01 | 1982-12-01 | Manufacture of laminated board |
Publications (1)
Publication Number | Publication Date |
---|---|
JPS59101330A true JPS59101330A (en) | 1984-06-11 |
Family
ID=16612484
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
JP57211842A Pending JPS59101330A (en) | 1982-12-01 | 1982-12-01 | Manufacture of laminated board |
Country Status (1)
Country | Link |
---|---|
JP (1) | JPS59101330A (en) |
Cited By (1)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US6281044B1 (en) * | 1995-07-31 | 2001-08-28 | Micron Technology, Inc. | Method and system for fabricating semiconductor components |
-
1982
- 1982-12-01 JP JP57211842A patent/JPS59101330A/en active Pending
Cited By (2)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US6281044B1 (en) * | 1995-07-31 | 2001-08-28 | Micron Technology, Inc. | Method and system for fabricating semiconductor components |
US6626222B1 (en) | 1995-07-31 | 2003-09-30 | Micron Technology, Inc. | System for fabricating semiconductor components |
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