JPS63150993A - Manufacture of printed wiring board - Google Patents
Manufacture of printed wiring boardInfo
- Publication number
- JPS63150993A JPS63150993A JP29699386A JP29699386A JPS63150993A JP S63150993 A JPS63150993 A JP S63150993A JP 29699386 A JP29699386 A JP 29699386A JP 29699386 A JP29699386 A JP 29699386A JP S63150993 A JPS63150993 A JP S63150993A
- Authority
- JP
- Japan
- Prior art keywords
- light
- photosensitive layer
- printed wiring
- wiring board
- layer
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
- 238000004519 manufacturing process Methods 0.000 title claims description 5
- 238000000034 method Methods 0.000 claims description 24
- 229910000679 solder Inorganic materials 0.000 claims description 12
- 238000007639 printing Methods 0.000 claims description 6
- 238000007650 screen-printing Methods 0.000 claims description 6
- 239000007788 liquid Substances 0.000 claims description 4
- 239000000463 material Substances 0.000 claims description 3
- 239000000976 ink Substances 0.000 description 11
- 239000004020 conductor Substances 0.000 description 7
- 229920002120 photoresistant polymer Polymers 0.000 description 3
- RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical compound [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 description 2
- 238000010923 batch production Methods 0.000 description 1
- 229910052802 copper Inorganic materials 0.000 description 1
- 239000010949 copper Substances 0.000 description 1
- 239000011889 copper foil Substances 0.000 description 1
- 238000010586 diagram Methods 0.000 description 1
- 238000007598 dipping method Methods 0.000 description 1
- 238000001035 drying Methods 0.000 description 1
- 230000000694 effects Effects 0.000 description 1
- 238000010292 electrical insulation Methods 0.000 description 1
- 238000005530 etching Methods 0.000 description 1
- 238000005476 soldering Methods 0.000 description 1
- 238000005507 spraying Methods 0.000 description 1
Landscapes
- Non-Metallic Protective Coatings For Printed Circuits (AREA)
Abstract
(57)【要約】本公報は電子出願前の出願データであるた
め要約のデータは記録されません。(57) [Summary] This bulletin contains application data before electronic filing, so abstract data is not recorded.
Description
【発明の詳細な説明】
［産業上の利用分野］
本発明はプリント配線板の製造方法、詳しくはソルダー
レジスト層の形成方法に関するものである。DETAILED DESCRIPTION OF THE INVENTION [Industrial Field of Application] The present invention relates to a method for manufacturing a printed wiring board, and more particularly to a method for forming a solder resist layer.
［従来の技術とその問題点］
一般的に、銅層などの導体回路パターンを・形成したプ
リント配線板は、その導体回路パターンの外部接続用ラ
ンド部分（半田付部分）を除いた表面全体をソルダーレ
ジスト層で被覆した構造となっている。[Prior art and its problems] In general, a printed wiring board on which a conductor circuit pattern such as a copper layer is formed has its entire surface excluding the external connection land part (soldering part) of the conductor circuit pattern. It has a structure covered with a solder resist layer.
このソルダーレジスト層を形成する方法として、スクリ
ーン印刷法およびフォトレジスト法が良く知られている
。Screen printing methods and photoresist methods are well known as methods for forming this solder resist layer.
スクリーン印刷法は公知のスクリーン印刷手法を利用し
、プリント配線板上にソルダーレジストインクを塗布し
、乾燥することによって、ソルダーレジスト層を形成す
るものである。このｔｊ法はプリント配線板を多量生産
するのには好ましいものであるが、スクリーン版上のイ
ンク透過面積比率が高いために画像の歪やインクのニジ
ミが生ずると共に、導体回路パターンの平行な導体パタ
ーン部分において被覆不良が生ずるという欠点かある９
また、フォトレジスト法はプリント配線板−ヒに液状レ
ジストまたはドライフィルムによる感光層を形成し、フ
ィトツールと組合せ、真空吸引工程や露光工程からなる
バッチ処理によりソルダーレジスト層を形成するもので
ある。この方法はバッチ処理を要するために生産性が低
く、かつプリント配線板の価格を引下げることか困難な
ものであった。The screen printing method uses a known screen printing method to apply solder resist ink onto a printed wiring board and dry it to form a solder resist layer. Although this TJ method is preferable for mass production of printed wiring boards, the high ratio of ink permeation area on the screen plate causes image distortion and ink smearing, and the parallel conductors of the conductor circuit pattern are The photoresist method has the disadvantage that poor coverage occurs in patterned areas9.Also, the photoresist method forms a photosensitive layer using a liquid resist or dry film on the printed wiring board, and combines it with a phytotool to create a batch process consisting of a vacuum suction process and an exposure process. A solder resist layer is formed by processing. Since this method requires batch processing, productivity is low and it is difficult to reduce the price of printed wiring boards.
［発明の概要］
しかるに、本発明は上述した欠点を解消するために、導
体回路パターンを形成したプリント配線板の全面に液状
レジストによる感光層を形成し、外部接続用ランド部分
には遮光マスクを形成し、同遮光マスク下を除いた部分
を露光し、現像することによって、この部分をソルダー
レジスト層となし、かつ外部接続用ランド部分上の遮光
マスクおよび未露光部分の感光層を除去したプリント配
線板の製造方法を提供するものである。[Summary of the Invention] However, in order to eliminate the above-mentioned drawbacks, the present invention forms a photosensitive layer of liquid resist on the entire surface of a printed wiring board on which a conductive circuit pattern is formed, and a light-shielding mask is applied to the land portion for external connection. A print that forms a solder resist layer by exposing and developing the area excluding the area under the light-shielding mask, and removing the light-shielding mask on the land for external connection and the photosensitive layer in the unexposed area. A method for manufacturing a wiring board is provided.
［実施例］ 以下に、本発明の一実施例を図面と共に説明する。[Example] An embodiment of the present invention will be described below with reference to the drawings.
先ず、第１図（ａ）に示すように、例えば銅張積層板の
銅箔をエツチングすることによって絶縁基材（１）上に
導体回路パターン（２）を形成したものを準備する。次
に、同図（ｂ）に示すように全面に液状レジストである
感光層（３）を形成する。この感光層（３）の形成方法
としては浸漬法、印刷法あるいは吹付法などがある。そ
して、この感光層（３）は温風あるいは自然乾燥により
、その表面を指触できる程度に予備硬化させておく。引
続き、同図（ｃ）に示すように外部接続用ランド部分（
４）を形成するために導体回路パターン（２）上の感光
層（３）上に遮光性インクをスクリーン印刷法によって
印刷し、遮光マスク（５）として形成する。次いで、同
図（ｄ）に示すように紫外線により感光層（３）を露光
する。First, as shown in FIG. 1(a), a conductor circuit pattern (2) is prepared on an insulating base material (1) by, for example, etching the copper foil of a copper-clad laminate. Next, as shown in FIG. 3(b), a photosensitive layer (3) made of liquid resist is formed on the entire surface. Methods for forming this photosensitive layer (3) include a dipping method, a printing method, and a spraying method. The surface of this photosensitive layer (3) is precured by hot air or natural drying to the extent that it can be touched with the finger. Next, as shown in the same figure (c), the external connection land part (
4), a light-shielding ink is printed on the photosensitive layer (3) on the conductor circuit pattern (2) by screen printing to form a light-shielding mask (5). Next, the photosensitive layer (3) is exposed to ultraviolet light as shown in FIG. 2(d).
ただし、遮光マスク（５）下の感光層（３）は露光され
ない。露光処理後、遮光マスク（５）を剥離し、現像す
ると、同図（ｅ）に示すように外部接続用ランド部分（
４）を除いた全面にツルターレジスト層（３Ａ）が形成
される。遮光マスク用インクとしてアルカリ剥離型イン
クを使用するならば、上述した剥踵工程と現像工程を同
一の工程で実施することができる。また、このようにし
て製造されたプリント配線板（６）は必要に応じて、ソ
ルダーレジスト層（３Ａ）をさらに完全なものとするた
めのボストキエアリング工程で処理されることもある。However, the photosensitive layer (3) under the light-shielding mask (5) is not exposed. After the exposure process, the light-shielding mask (5) is peeled off and developed, and the external connection land portion (
A sulter resist layer (3A) is formed on the entire surface except for 4). If an alkaline peelable ink is used as the ink for the light-shielding mask, the peeling process and the development process described above can be performed in the same process. Further, the printed wiring board (6) manufactured in this manner may be subjected to a Bostkie ring process to further perfect the solder resist layer (3A), if necessary.
［効果］
上述した本発明によると、スクリーン印刷法での遮光性
インクの印刷は外部接続用ランド部分のみで良いために
、相対的にスクリーン而の剛性が高まり、画像の歪を減
少することができるものである。また、遮光性インクは
遮光性があれば良いので、従来のソルダーレジストのよ
うな耐半田性および電気的な絶縁特性などの性能は要求
されず、印刷特性の優れたインクを使用することができ
る。さらに、遮光性インクの印刷に先立ち、感光層か全
面に形成され、平面となっているので、スキージの印圧
を下げてインクを印刷することができ、版の、ｆから生
ずる印刷精度の低下を改善することが可能となる。[Effect] According to the present invention described above, since the light-shielding ink can be printed only on the land portion for external connection using the screen printing method, the rigidity of the screen is relatively increased and image distortion can be reduced. It is possible. In addition, since the light-shielding ink only needs to have light-shielding properties, it is not required to have properties such as solder resistance and electrical insulation properties like conventional solder resists, and it is possible to use inks with excellent printing properties. . Furthermore, before printing the light-shielding ink, a photosensitive layer is formed on the entire surface and is flat, so the printing pressure of the squeegee can be lowered to print the ink, which reduces printing accuracy caused by f of the plate. It becomes possible to improve.
第１図は本発明の一実施例を説明するための工程図であ
る。
図中、（１）・・・絶縁基材、（２）・・・導体回路パ
ターン、（３）・・・感光層、（３Ａ）・・・ソルダー
レジスト層、（４）・・・外部接続用ランド部分、（５
）・・・遮光マスク。FIG. 1 is a process diagram for explaining one embodiment of the present invention. In the figure, (1)...Insulating base material, (2)...Conductor circuit pattern, (3)...Photosensitive layer, (3A)...Solder resist layer, (4)...External connection land part, (5
)...Light-blocking mask.
Claims (1)
状レジストである感光層を形成し、この感光層を予備硬
化させ、導体回路パターンの外部接続用ランド部分上の
感光層上に遮光性インクをスクリーン印刷法によって印
刷して遮光マスクを形成し、紫外線にて露光し、遮光性
マスクおよび未露光の感光層を除去することによってソ
ルダーレジスト層を形成するようにしたことを特徴とす
るプリント配線板の製造方法。[1] A photosensitive layer, which is a liquid resist, is formed on the entire surface of the insulating base material on which the conductive circuit pattern is formed, and this photosensitive layer is pre-cured, and a light-shielding layer is applied on the photosensitive layer on the external connection land portion of the conductive circuit pattern. A print characterized in that a light-shielding mask is formed by printing ink using a screen printing method, and a solder resist layer is formed by exposing the light-shielding mask to ultraviolet light and removing the light-shielding mask and the unexposed photosensitive layer. Method of manufacturing wiring boards.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP29699386A JPS63150993A (en) | 1986-12-13 | 1986-12-13 | Manufacture of printed wiring board |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP29699386A JPS63150993A (en) | 1986-12-13 | 1986-12-13 | Manufacture of printed wiring board |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| JPS63150993A true JPS63150993A (en) | 1988-06-23 |
Family
ID=17840863
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP29699386A Pending JPS63150993A (en) | 1986-12-13 | 1986-12-13 | Manufacture of printed wiring board |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPS63150993A (en) |
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS63213395A (en) * | 1987-02-27 | 1988-09-06 | タムラ化研株式会社 | Method of forming solder mask pattern on printed wiring board |
Citations (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS6120393A (en) * | 1984-07-09 | 1986-01-29 | 松下電器産業株式会社 | Method of producing printed circuit board |
| JPS6348890A (en) * | 1986-08-19 | 1988-03-01 | 松下電器産業株式会社 | Apparatus for manufacturing printed wiring board |
| JPS6348891A (en) * | 1986-08-19 | 1988-03-01 | 松下電器産業株式会社 | Manufacture of printed wiring board |
-
1986
- 1986-12-13 JP JP29699386A patent/JPS63150993A/en active Pending
Patent Citations (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS6120393A (en) * | 1984-07-09 | 1986-01-29 | 松下電器産業株式会社 | Method of producing printed circuit board |
| JPS6348890A (en) * | 1986-08-19 | 1988-03-01 | 松下電器産業株式会社 | Apparatus for manufacturing printed wiring board |
| JPS6348891A (en) * | 1986-08-19 | 1988-03-01 | 松下電器産業株式会社 | Manufacture of printed wiring board |
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS63213395A (en) * | 1987-02-27 | 1988-09-06 | タムラ化研株式会社 | Method of forming solder mask pattern on printed wiring board |
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