JPS63143296A - Electroplating device - Google Patents
Electroplating deviceInfo
- Publication number
- JPS63143296A JPS63143296A JP28987886A JP28987886A JPS63143296A JP S63143296 A JPS63143296 A JP S63143296A JP 28987886 A JP28987886 A JP 28987886A JP 28987886 A JP28987886 A JP 28987886A JP S63143296 A JPS63143296 A JP S63143296A
- Authority
- JP
- Japan
- Prior art keywords
- current
- plated
- reference cathode
- surface area
- cathode
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
- 238000009713 electroplating Methods 0.000 title claims description 9
- 238000007747 plating Methods 0.000 abstract description 15
- 239000007788 liquid Substances 0.000 abstract 1
- 238000000034 method Methods 0.000 description 8
- 230000001186 cumulative effect Effects 0.000 description 6
- 238000005259 measurement Methods 0.000 description 3
- 238000010586 diagram Methods 0.000 description 1
- 230000000694 effects Effects 0.000 description 1
Landscapes
- Electroplating Methods And Accessories (AREA)
Abstract
Description
【発明の詳細な説明】
０）利用分野
この発明は、電気めっき槽内に被めっき物を配置し、該
被めっき物と陽極間に直流電圧を印加することによりめ
っきを行う、電気めっき装置に関する。Detailed Description of the Invention 0) Field of Application The present invention relates to an electroplating apparatus that performs plating by placing an object to be plated in an electroplating tank and applying a DC voltage between the object to be plated and an anode. .
（０） 従来技術及びこの発明が解決しようとする問
題点
この種の電気めっき装置において、従来、被めっき物の
指定のめっき厚さを確保するため、該被めっき物の表面
積を前もって計算し、単位面積当りの通電量（以下、電
流密度と称する）を加味して被めっき物への全通電量を
決めていた。(0) Prior art and problems to be solved by the present invention In this type of electroplating apparatus, conventionally, in order to ensure a specified plating thickness of the object to be plated, the surface area of the object to be plated is calculated in advance; The total amount of current applied to the object to be plated was determined by taking into consideration the amount of current applied per unit area (hereinafter referred to as current density).
しかし、前述の電気めっき装置では、被めっき物の表面
積を算出するために手間がかかり、また被めっき物の表
面積がランダムに変化する場合には全通電量及び積算通
電量の設定は人手に顆らざるを得ない問題がある。この
問題は、めっき作業の自動化及び無人化を実現するうえ
で最大の技術的障害となっている。However, with the above-mentioned electroplating equipment, it takes time and effort to calculate the surface area of the object to be plated, and when the surface area of the object to be plated changes randomly, the total energization amount and the cumulative energization amount must be manually set. There is a problem that cannot be avoided. This problem is the biggest technical obstacle in realizing automation and unmanned plating operations.
この発明は、自動的に被めっき物に必要な全通電量及び
積算通電量を設定できる、電気めっき装置を提供するこ
とを目的とするものである。SUMMARY OF THE INVENTION An object of the present invention is to provide an electroplating apparatus that can automatically set the total amount of energization and the cumulative amount of energization required for the object to be plated.
Ｑ９ 問題点を解決するための手段
この発明は、電気めつき槽内の被めっき物の近傍に配置
された既知の表面積を有する基準陰極、この基準陰極及
び前記波めっき物を同一電位に印加する基準電源、基準
陰極に流れる電流を検出する電流検出器、この電流検出
器が検出しな検出電流を入力信号として積算電流を測定
する手段、前記検出信号を入力信号として前記基準電極
に流れる電流値を制御する電流制御手段を備えて構成さ
れている。Q9 Means for solving the problem This invention includes a reference cathode having a known surface area placed near the object to be plated in an electroplating tank, and applying the same potential to the reference cathode and the wave-plated object. A reference power source, a current detector that detects the current flowing through the reference cathode, means for measuring an integrated current using the detected current not detected by the current detector as an input signal, and a value of the current flowing through the reference electrode using the detected signal as an input signal. It is configured to include a current control means for controlling the current.
（９作 用
前記直流電源からの被めっき物及び基準陰極へ流れる電
流の電流密度は等しいことに着目し、該基準陰極に流れ
る電流を電流検出器で測定し、この電流が適正電流密度
範囲になるように前記直流電源から流れる電流を制御す
る。このため、被めっき物の表面積の変化にかかわらず
適正な電流密度が保たれ、めっき厚さは基準陰極に流れ
る電流の積算電流を求めることにより測定される。(9) Focusing on the fact that the current density of the current flowing from the DC power source to the object to be plated and the reference cathode is equal, the current flowing to the reference cathode is measured with a current detector, and this current is within the appropriate current density range. The current flowing from the DC power source is controlled so that the current density is maintained regardless of changes in the surface area of the object to be plated, and the plating thickness is determined by determining the cumulative current flowing through the reference cathode. be measured.
（小）実施例
第１図はこの発明の一実施例を示し、同図において符合
１はめつき槽で、めっき液２で満たされている。めつき
槽１のめっき液２の中には陽極３゜３、基準陰極４及び
被めっき物５が吊下されている。陽極３，３は直流電源
６の正極と電気的に接続され、一方基準陰極４及び竺め
っき物５は吊下棒７を介して夫々直流電源６の負極と電
気的に接続されている。基準陰極４はその表面積が知ら
れており、この基準電極４を通って直流電源６へと向う
電流は電流検出器８により検出される。電流検出器８に
よって検出された検出電流は入力インターフェース９を
介してコンピュータ１０に入力される。コンピュータ１
０には演算回路、制御回路、記憶回路等が備えられ、予
め格納されているプログラムを実行する。さらに、コン
ピュータ１０は出力インターフェース１１を介し、出力
調整器１２に制御信号を出力し、直流電源１０の出力の
上昇又は下降を行い、基準電！！４を流れる電流が適正
範囲にあるように制御する。(Small) Embodiment FIG. 1 shows an embodiment of the present invention, in which reference numeral 1 is a plating tank filled with a plating solution 2. In FIG. In the plating solution 2 of the plating tank 1, an anode 3.3, a reference cathode 4, and an object to be plated 5 are suspended. The anodes 3, 3 are electrically connected to the positive electrode of a DC power source 6, while the reference cathode 4 and the plated material 5 are electrically connected to the negative electrode of the DC power source 6 via a hanging rod 7, respectively. The reference cathode 4 has a known surface area, and the current flowing through the reference electrode 4 to the DC power supply 6 is detected by a current detector 8 . The detected current detected by the current detector 8 is input to the computer 10 via the input interface 9. computer 1
0 is equipped with an arithmetic circuit, a control circuit, a memory circuit, etc., and executes a program stored in advance. Furthermore, the computer 10 outputs a control signal to the output regulator 12 via the output interface 11 to raise or lower the output of the DC power supply 10, and to adjust the reference voltage to the reference voltage. ! The current flowing through 4 is controlled so that it is within an appropriate range.
次に、上述の装置の動作について説明する。直流電源６
の正極から陽極３，３を介して流れる電流工は基準電！
４を流れる電流ｉ。と被めっき物５を流れる１１とに分
割され、そして再び吊下棒７を介し合流して負極へと流
れる。表面積が既知の基準電！！４を流れる電流ｉ。を
制御することは被めっき物への電流密度を制御すること
と等価である。Next, the operation of the above-mentioned device will be explained. DC power supply 6
The electric current flowing from the positive electrode of the anode through the anodes 3 and 3 is the reference voltage!
The current i flowing through 4. and 11 that flow through the object to be plated 5, and then merge again via the hanging rod 7 and flow to the negative electrode. Reference voltage with known surface area! ! The current i flowing through 4. Controlling is equivalent to controlling the current density to the object to be plated.
第２図は前記電流ｉ。の検出電流がコンピュータに入力
されている間に実行されるフローチャートを示している
。第２図において、検出電流が入力するとステップＳ１
が実行され、この検出電流に基づいて前記電流ｉ。の測
定（演算）が演算回路において行なわれる６次０でステ
ップＳ２に移り、測定された電流ｉ。の値と測定間隔時
間Ｔが乗算されて、積算電流値Σ１ｏ−Ｔが算出される
。FIG. 2 shows the current i. 2 shows a flowchart that is executed while the detected current of is being input to the computer. In FIG. 2, when the detected current is input, step S1
is executed, and the current i is determined based on this detected current. The process moves to step S2 at the 6th order 0, where the measurement (calculation) of the current i is performed in the calculation circuit, and the measured current i. is multiplied by the measurement interval time T to calculate the integrated current value Σ1o-T.
次にステップＳ３に移り、前記ｉ。の積算電流値が設定
積算電流値Ｓに達したか否かの判断が実行され、Ｙｅｓ
と判断されると被めっきＰ！ＩＪ５が指定のめつき厚さ
になったと判断され、コンピュータ１０から出力インタ
ーフェース１１を介し、出力調整器１２へ制御信号を出
力し、直流電源６の出力を停止する。Next, the process moves to step S3, and the step i. A determination is made as to whether or not the cumulative current value has reached the set cumulative current value S, and the result is Yes.
If it is determined that P is plated! It is determined that the IJ 5 has reached the specified plating thickness, and the computer 10 outputs a control signal to the output regulator 12 via the output interface 11 to stop the output of the DC power supply 6.
ステップ３においてＮｏと判断された場合には被めっき
物５が指定の厚さに達していないからめっき動作が継続
されてステップＳ４に移る。ステップＳ において、電
流ｉ。の測定値とｉ。の設定上限電流値１Ｍとが比較さ
れ、ｉｏが１８以上（ｉ ≦１ ）と判断されるとステ
ップＳ５にＯ
移る。ステップＳ５で、コンピューター０からインター
フェース１１を介し出力調整器１２へ制御信号が出力さ
れ、直流電源６の出力を下降する、電流下降パターンが
実行され、この後ステップＳ１に戻る。If it is determined No in step 3, the plating operation is continued and the process moves to step S4 since the object to be plated 5 has not reached the specified thickness. In step S, the current i. The measured value of i. is compared with the set upper limit current value 1M, and if it is determined that io is 18 or more (i≦1), the process moves to step S5. In step S5, a control signal is output from the computer 0 to the output regulator 12 via the interface 11, and a current lowering pattern is executed to lower the output of the DC power supply 6, after which the process returns to step S1.
ステップＳ においてｉｏがｉＨ以下と判断されな場合
はｉ。は設定上限電流値の基準を満足しているからステ
ップＳ に移る。ステップＳ６において電流ｉ の測定
値と１゜の設定下限電流値１ とが比較され、ＩＬがｉ
。以上（ＩＬ≧ｉｏ）し
と判断されるとステップＳ７に移る。ステップＳ７にお
いて、出力調整器１２へ制御信号が出力されて直流電源
６の出力を上昇する、電流上昇パターンが実行され、こ
の後ステップ＄１に戻る。If io is not determined to be less than or equal to iH in step S, then i. satisfies the criteria for the set upper limit current value, so the process moves to step S. In step S6, the measured value of current i and the set lower limit current value 1 of 1° are compared, and IL is
. If it is determined that the above (IL≧io) is satisfied, the process moves to step S7. In step S7, a control signal is output to the output regulator 12 to increase the output of the DC power supply 6, so that a current increase pattern is executed, and then the process returns to step $1.
ステップＳ においてｉｏが１１以上と判断されな場合
には現在測定された電流ｌ。は設定適正範囲にあると判
断され、次にステップ＄１に戻り次回の測定を行う。If io is not determined to be 11 or more in step S, the currently measured current l. is determined to be within the appropriate setting range, and then returns to step $1 to perform the next measurement.
しかして、ステップ８１〜Ｓ７が実行される結果、基準
陰極４を流れる電流は適正範囲に維持され、この結果波
めっき物５の電流密度も適正値に制御されるから、被め
っき物５の表面積の如何にかかわらず指定のめつき厚を
形成できる。As a result of executing steps 81 to S7, the current flowing through the reference cathode 4 is maintained within an appropriate range, and as a result, the current density of the wave-plated object 5 is also controlled to an appropriate value, so that the surface area of the object 5 to be plated is A specified plating thickness can be formed regardless of the
（へ）効 果
この発明は被めっき物の表面積の変化と無関係にめっき
に必要な電流密度を適正範囲に自動的に調整できるから
、被めっき物の表面積算出の手間を省くことができ、ま
た、被めっき物の全通電量及び積算通電量を人手によっ
て設定する面倒を省け、作業の自動化、無人化を推進す
ることができる。(F) Effects This invention can automatically adjust the current density required for plating to an appropriate range regardless of changes in the surface area of the object to be plated, so it can save the trouble of calculating the surface area of the object to be plated, and This eliminates the trouble of manually setting the total energization amount and the cumulative energization amount of the object to be plated, and promotes automation and unmanned work.
第１図はこの発明の一実施例を示すシステム構成図、第
２図はこの発明の詳細な説明するフローチャートである
。
１・・・めつき槽 ４・・・基準陰極５・・
・被めっき物 ６・・・直流電源８・・・電流
検出器 １０・・・コンピュータ１２・・・出
力調整器FIG. 1 is a system configuration diagram showing an embodiment of the present invention, and FIG. 2 is a flow chart explaining the invention in detail. 1... Plating tank 4... Reference cathode 5...
・Object to be plated 6...DC power supply 8...Current detector 10...Computer 12...Output regulator
Claims (1)
表面積を有する基準陰極と、 前記基準陰極及び前記被めっき物を同一電位に印加する
直流電源と、 前記基準陰極に流れる電流を検出する電流検出器と、 前記電流検出器が検出した検出電流を入力信号として積
算電流を測定する手段と、 前記検出信号を入力信号として前記基準陰極に流れる電
流値を制御する電流制御手段と、 を備えてなる、電気めっき装置。[Scope of Claims] A reference cathode having a known surface area and arranged near the object to be plated in an electroplating bath; a DC power source that applies the same potential to the reference cathode and the object to be plated; and the reference cathode. a current detector for detecting a current flowing through the reference cathode; a means for measuring an integrated current using the detected current detected by the current detector as an input signal; and a current controlling the current value flowing through the reference cathode using the detected signal as an input signal. An electroplating device comprising: a control means;
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP28987886A JPS63143296A (en) | 1986-12-05 | 1986-12-05 | Electroplating device |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP28987886A JPS63143296A (en) | 1986-12-05 | 1986-12-05 | Electroplating device |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| JPS63143296A true JPS63143296A (en) | 1988-06-15 |
Family
ID=17748939
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP28987886A Pending JPS63143296A (en) | 1986-12-05 | 1986-12-05 | Electroplating device |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPS63143296A (en) |
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPH04131398A (en) * | 1990-09-20 | 1992-05-06 | Mitsubishi Electric Corp | Plating device |
-
1986
- 1986-12-05 JP JP28987886A patent/JPS63143296A/en active Pending
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPH04131398A (en) * | 1990-09-20 | 1992-05-06 | Mitsubishi Electric Corp | Plating device |
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