JPH04131398A - Plating device - Google Patents
Plating deviceInfo
- Publication number
- JPH04131398A JPH04131398A JP25257790A JP25257790A JPH04131398A JP H04131398 A JPH04131398 A JP H04131398A JP 25257790 A JP25257790 A JP 25257790A JP 25257790 A JP25257790 A JP 25257790A JP H04131398 A JPH04131398 A JP H04131398A
- Authority
- JP
- Japan
- Prior art keywords
- plating
- current
- current density
- standard plate
- immersed
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
- 238000007747 plating Methods 0.000 title claims abstract description 55
- 238000000034 method Methods 0.000 claims description 5
- 239000004020 conductor Substances 0.000 claims 3
- 239000008151 electrolyte solution Substances 0.000 description 11
- BQCADISMDOOEFD-UHFFFAOYSA-N Silver Chemical compound [Ag] BQCADISMDOOEFD-UHFFFAOYSA-N 0.000 description 9
- 229910052709 silver Inorganic materials 0.000 description 9
- 239000004332 silver Substances 0.000 description 9
- 238000012360 testing method Methods 0.000 description 9
- 229910052751 metal Inorganic materials 0.000 description 4
- 239000002184 metal Substances 0.000 description 4
- 230000000694 effects Effects 0.000 description 3
- 238000005259 measurement Methods 0.000 description 3
- 238000010586 diagram Methods 0.000 description 2
- 238000005868 electrolysis reaction Methods 0.000 description 2
- 238000009413 insulation Methods 0.000 description 2
- 238000012545 processing Methods 0.000 description 2
- 241000473391 Archosargus rhomboidalis Species 0.000 description 1
- RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical compound [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 description 1
- 238000004364 calculation method Methods 0.000 description 1
- 238000007796 conventional method Methods 0.000 description 1
- 229910052802 copper Inorganic materials 0.000 description 1
- 239000010949 copper Substances 0.000 description 1
- 238000001514 detection method Methods 0.000 description 1
- XPPKVPWEQAFLFU-UHFFFAOYSA-N diphosphoric acid Chemical compound OP(O)(=O)OP(O)(O)=O XPPKVPWEQAFLFU-UHFFFAOYSA-N 0.000 description 1
- 238000002955 isolation Methods 0.000 description 1
- 150000002739 metals Chemical class 0.000 description 1
- 239000000203 mixture Substances 0.000 description 1
- 238000001556 precipitation Methods 0.000 description 1
- 229940005657 pyrophosphoric acid Drugs 0.000 description 1
- 239000000243 solution Substances 0.000 description 1
- 229910001220 stainless steel Inorganic materials 0.000 description 1
- 239000010935 stainless steel Substances 0.000 description 1
Abstract
Description
【発明の詳細な説明】
〔産業上の利用分野〕
この発明は、めっき電流が容易に設定できるようにした
めっき装置に関するものである。DETAILED DESCRIPTION OF THE INVENTION [Industrial Field of Application] The present invention relates to a plating apparatus that allows the plating current to be easily set.
従来の被処理物の面積測定は特開昭５６−１６０６０８
号公報に記載されている。即ち、面積が既知で互いに異
なる面積の金属試験片を電解質溶液中に浸潰して一定の
電圧を与えて電流を測定し、電流値と試験片の面積との
関係を求める。この場合、試験片として平銅板、電解質
溶液としてピロリン酸鯛めっき液を使用し、１５０ｍマ
の電圧を与えたとき第２図の関係が実験により得られた
。The conventional method for measuring the area of objects to be processed is disclosed in Japanese Patent Application Laid-Open No. 56-160608.
It is stated in the No. That is, metal test pieces with known and different areas are immersed in an electrolyte solution, a constant voltage is applied, the current is measured, and the relationship between the current value and the area of the test piece is determined. In this case, a flat copper plate was used as the test piece, a pyrophosphoric acid sea bream plating solution was used as the electrolyte solution, and when a voltage of 150 mm was applied, the relationship shown in FIG. 2 was experimentally obtained.
次ｌこ、被処理物の面積を測定する場合は、面積が既知
の試験片の電流値測定に用いたと同一の電解質溶液を使
用して、同一の電解条件を採用し、同一の電圧を与えて
そのときに流れる電流を測定する。次いで、測定した電
流値を上記の方法で求めておいて電流と面積との関係か
ら被処理物の面積を求める。Next, when measuring the area of the workpiece, use the same electrolyte solution, adopt the same electrolytic conditions, and apply the same voltage as used to measure the current value of a test piece with a known area. and measure the current flowing at that time. Next, the measured current value is determined by the method described above, and the area of the object to be treated is determined from the relationship between the current and the area.
従来のめっき装置は、以上のように面積が既知で互いに
異なる面積の金属の試験片を電解質溶液中に浸漬して一
定の電圧を与えて電流を測定し、電流値と試験片の面積
との関係を求めておく。そして、試験片の電流を測定し
たのと同じ電解質溶液中に被処理物を浸漬して同一条件
で電流を測定し、この電流をもとに先に試験片で求めて
おいた電流と面積との関係から被処理物の面積を求める
、したがって、試験片の電流測定と被処理物の電流測定
とで、電解質溶液の濃度、温度等の設定条件を一致させ
るのが困難で、電流値の適正な設定が面倒であるという
問題点がめった。また、めっきの種類により電解質溶液
の組成も異なるので、それぞれの実験データが必要とな
る。Conventional plating equipment, as described above, immerses metal test pieces with known and different areas in an electrolyte solution, applies a constant voltage, measures the current, and calculates the relationship between the current value and the area of the test piece. Seek a relationship. Then, the object to be treated is immersed in the same electrolyte solution in which the current of the test piece was measured, and the current is measured under the same conditions, and based on this current, the current and area previously determined for the test piece are calculated. Therefore, it is difficult to match the setting conditions such as the electrolyte solution concentration and temperature between the current measurement of the test piece and the current measurement of the processing object, and it is difficult to determine the appropriate current value. The problem was that the settings were troublesome. Furthermore, since the composition of the electrolyte solution differs depending on the type of plating, experimental data for each type is required.
この発明は上記のような問題点を解決するためになされ
たもので、めっき電流の設定が容易にできるめっき装置
を得ることを目的とするものである。The present invention was made to solve the above-mentioned problems, and an object of the present invention is to provide a plating apparatus in which the plating current can be easily set.
この発明に擦るめっき装置は、被処理物と同一のめっき
槽に同時に面積が既知の標準板を浸漬し、めっき電流を
測定して第１の電流密度を算出し、めっきの種類に２っ
て設定されている第２の電流密度に第１の電流密度が一
致するように制御する制御手段を設けたものである。The plating apparatus according to the present invention simultaneously immerses a standard plate with a known area in the same plating bath as the object to be processed, measures the plating current, calculates the first current density, and calculates the first current density. A control means is provided for controlling the first current density to match the set second current density.
さらに、両電流密度が一致したことを検出して標準板の
接続を直流電源の正極から負極に切換える切換器を備え
たものである。Furthermore, the device is equipped with a switch that detects that the two current densities match and switches the connection of the standard plate from the positive electrode to the negative electrode of the DC power source.
この発明においては、同一のめっき槽で標準板の第１の
電流密度を実測値から検出し、めっきの種類によって設
定された第２の電流密度と比較演算して、両電流密度が
一致するように制御される。In this invention, the first current density of the standard plate is detected from the actual measurement value in the same plating bath, and compared with the second current density set depending on the type of plating, so that the two current densities match. controlled by.
また、両電流密度が一致したことを検出して標準板の接
続を切換えて逆電解するので、標準板に析出した金属が
溶解して除去される。Furthermore, since it is detected that the two current densities match, the connection of the standard plate is switched and reverse electrolysis is performed, so that the metal deposited on the standard plate is dissolved and removed.
以下、この発明の一実施例を図について説明する。第１
図において、（ｌ）はめっき用電解質溶液（２）が収容
されためっき槽、（３）は電解質溶液（りに浸漬された
極板、（４）は電解質溶液（２）に浸漬されたステンレ
ス製の標準板で、表面積がｌｄ＋ｍ”である。（５）は
電解質溶液（２）に浸漬された被処理物、（６）は８相
交流を整流して直流を出力する直流電源で、指令により
出力電圧が制御できる。なお、直流電源（Ｓ）の正極は
極板（３）と接続され、負極は被処理物（５）と接続さ
れる。（７）は自動めっきを指令するシーケンサで、被
処理物（５）をめっき槽（１）へ搬送したり、電流密度
の設定値（例えば銀めっき処理の場合ＩＡ／ｄが）を後
述のＣＰＵ（８）に送信を受けてＤ ／ Ａ変換器（９
）及び絶縁アンプα０を介して直流電源（６）の出力電
圧を昇圧させるＣＰＵで、後述のＡ 、／ Ｄ変換器（
至）からのフィードバックによりシーケンサ（７）で設
定された電流密度と実測値の電流密度とを比較演算する
。（ロ）は標準板（４）と接続されたシャント（２）は
ＣＰＵ（ｓ＋）の指令で作動する切換器で、標準板（４
）と直流電源（６）の正極との間に接続された接点（１
２ａ）及びシャント（ロ）と直流電源（６）の負極との
間に接続された接点（１２ｂ）とで構成されている。（
至）は絶縁アンプα尋を介してシャントμυと接続され
Ａ ／ Ｄ変換器で、標準板（４）に流れる電流から電
流密度をＣＰＵにフィードバックする。に）は電流密度
入力器で、シーケンサ（７）からの電流密度設定と同様
に應能する。An embodiment of the present invention will be described below with reference to the drawings. 1st
In the figure, (l) is a plating tank containing electrolyte solution (2) for plating, (3) is an electrode plate immersed in electrolyte solution (4) is stainless steel immersed in electrolyte solution (2). (5) is the workpiece immersed in the electrolyte solution (2), (6) is a DC power supply that rectifies 8-phase AC and outputs DC. The output voltage can be controlled by.The positive electrode of the DC power supply (S) is connected to the electrode plate (3), and the negative electrode is connected to the object to be processed (5).(7) is a sequencer that commands automatic plating. , the object to be processed (5) is transported to the plating tank (1), and the set value of current density (for example, IA/d in the case of silver plating processing) is sent to the CPU (8) described later and D/A is carried out. Converter (9
) and insulation amplifier α0 to boost the output voltage of the DC power supply (6), and the A/D converter (described later)
Based on the feedback from the sequencer (7), the current density set by the sequencer (7) and the actual measured current density are compared and calculated. (b) The shunt (2) connected to the standard plate (4) is a switching device operated by the command of the CPU (s+).
) and the positive pole of the DC power supply (6).
2a) and a contact (12b) connected between the shunt (b) and the negative electrode of the DC power supply (6). (
(to) is an A/D converter connected to the shunt μυ via the insulation amplifier αhiro, and feeds back the current density from the current flowing through the standard board (4) to the CPU. ) is a current density input device, which functions in the same way as the current density setting from the sequencer (7).
次に電気銀めっきを行う場合の動作について説明する。Next, the operation when electrolytic silver plating is performed will be explained.
第１図において、シーケンサ（７）からＣＰＵ（８）に
ＯＮ信号と銀めっき処理の固有値である電流密度ＩＡ／
ｄｍ” の設定値が送信されると、切換器＠の接点（
１２ｂ）がＯＮするｃ ＣＰＵ（８）はＤ／Ａ変換器（
９）及び絶縁アンプαＱを介して直流電源（６）の出力
電圧を昇圧して直流電源を出力する。これによって被処
理物（５）に銀めっきが始まる。同時に標準板（４）に
流れる電流がシャント（６）を介して検出され、Ａ／Ｄ
変換器（至）を介して電流密度としてＣＰＵ（ａ）にフ
ィードバックされる。ＣＰＵ（ｊｌ）ではフィードバッ
クされた実測値の第１の電流密度とＣＰＵ（ｇ）で記憶
している銀めっきの電流設定値である第２の電流密度と
を比較演算して、第１の電流密度が第２の電流密度に一
致するように直流′Ｉｔ源（６）の出力電圧を制御する
。そして、両電流密度が一致した状態、即ち電流密度Ｉ
Ａ／ｄｍ”を所定の時間保持した後、シーケンサ（７）
からのＱＦＦ信号でＣＰＵ（８）によって直流電源（６
）の出力を停止させる。In Figure 1, the sequencer (7) sends the ON signal to the CPU (8) and the current density IA/ which is the characteristic value of the silver plating process.
dm" setting value is sent, the contact of the switch @ (
c The CPU (8) turns on the D/A converter (
9) and an isolation amplifier αQ to boost the output voltage of the DC power supply (6) and output the DC power. As a result, silver plating begins on the object to be processed (5). At the same time, the current flowing through the standard plate (4) is detected via the shunt (6), and the A/D
The current density is fed back to the CPU (a) via the converter (to). The CPU (jl) compares and calculates the fed-back actual measured value of the first current density with the second current density, which is the silver plating current setting value stored in the CPU (g), and calculates the first current density. The output voltage of the DC 'It source (6) is controlled so that the density matches the second current density. Then, the state where both current densities match, that is, the current density I
After holding “A/dm” for a predetermined time, the sequencer (7)
The CPU (8) uses the QFF signal from the DC power supply (6
) output is stopped.
一方、標準板（４）で電流密度を実測する際に、表面に
銀が析出する。この析出量が多くなると標準板の面積が
増加し電流検出の誤差が大きくなるので、第１の電流密
度と第２の電流密度とが一致して被処理物（５）へのめ
っき電流の設定が完了した時点に、ＣＰＵ（ｇ）の信号
によって切換器＠の接点（１２ｂ）のＯＦＦ Ｌ、接点
（１２ａ）のＯＮする。これによって、標準板（４）が
直流電源（６）の正擺に切換えられるので、逆電解が始
まって標準板（４）に析出していた銀が除去される。こ
のように、被処理物（５）のめっき処理をしながら、標
準板（４）に析出した銀を除去することができる。On the other hand, when the current density is actually measured using the standard plate (4), silver is deposited on the surface. As the amount of precipitation increases, the area of the standard plate increases and the error in current detection increases, so the first current density and the second current density match to set the plating current to the workpiece (5). When this is completed, the contact (12b) of the switch @ is turned off and the contact (12a) is turned on according to a signal from the CPU (g). As a result, the standard plate (4) is switched to the normal voltage of the DC power source (6), so that reverse electrolysis begins and the silver deposited on the standard plate (4) is removed. In this way, silver deposited on the standard plate (4) can be removed while plating the object (5).
上記実施例では銀めっき処理について説明したが、他の
金属のめっき処理においてもめっきの種類によって決ま
る固有の電流密度を設定することによって、同様の効果
が期待される。In the above embodiment, a silver plating process was explained, but similar effects can be expected in plating processes for other metals by setting a specific current density determined by the type of plating.
以上のように、この発明によれば被処理物が浸漬された
めっき槽で同時に標準板の第１の電流密度を検出し、設
定された固有の第２の電流密度に第１の電流密度を一致
させるようにめっき電流を制御するので、電流密度の測
定が容易で適正なめっき電流を供給できる。As described above, according to the present invention, the first current density of the standard plate is simultaneously detected in the plating bath in which the workpiece is immersed, and the first current density is applied to the set specific second current density. Since the plating current is controlled to match, the current density can be easily measured and an appropriate plating current can be supplied.
第１図は従来のめっき装置における表面積の算出方法を
示す特性図、第２図はこの発明の一実施例を示す構成図
である。
図において、（１）はめっき槽、（３）は塊根、（４）
は標準板、（５）は被処理物、（６）は直流電源、（８
）はＣＰＵ（制御手段）、（６）は切換器である。FIG. 1 is a characteristic diagram showing a surface area calculation method in a conventional plating apparatus, and FIG. 2 is a configuration diagram showing an embodiment of the present invention. In the figure, (1) is the plating tank, (3) is the tuberous root, and (4) is the plating tank.
is the standard plate, (5) is the object to be processed, (6) is the DC power supply, (8
) is a CPU (control means), and (6) is a switch.
Claims (2)
処理液に浸漬できるように形成されためっき槽、上記め
っき処理液に浸漬できるように上記めっき槽に設けられ
た極板、この極板に正極が接続され、上記被処理物に負
極が接続できるように構成されて、出力電流が制御でき
るめっき用直流電源、この直流電源の負極に接続されて
上記めっき処理液に浸漬され、表面積が既知の導電部材
でつくられた標準板、この標準板によって検出されため
っき電流から算出された第１の電流密度とめっきの種類
によって設定された第２の電流密度とを一致させるよう
に上記直流電源の出力電流を制御する制御手段を備えた
めっき装置。(1) A plating tank formed to contain a plating solution so that the object to be processed can be immersed in the plating solution, an electrode plate provided in the plating tank so as to be immersed in the plating solution, and this electrode. A plating DC power source is configured such that a positive electrode is connected to the plate and a negative electrode is connected to the object to be treated, and the output current can be controlled. A standard plate made of a conductive material with a known conductive material, and the above-mentioned method is set so that the first current density calculated from the plating current detected by this standard plate matches the second current density set depending on the type of plating. A plating device equipped with a control means for controlling the output current of a DC power supply.
処理液に浸漬できるように形成されためっき槽、上記め
っき処理液に浸漬できるように上記めっき槽に設けられ
た極板、この極板に正極が接続され、上記被処理物に負
極が接続できるように構成されて、出力電流が制御でき
るめっき用直流電源、この直流電源の負極に接続されて
上記めっき処理液に浸漬され、表面積が既知の導電部材
でつくられた標準板、この標準板によって検出されため
つき電流から算出された第１の電流密度とめっきの種類
によって設定された第２の電流密度とを一致させるよう
に上記直流電源の出力電流を制御する制御手段、上記両
電流密度が一致したことを検出して上記標準板の接続を
上記直流電源の負極から正極に切替える切換器を備えた
めっき装置。(2) A plating tank formed to accommodate a plating solution so that the object to be processed can be immersed in the plating solution, an electrode plate provided in the plating tank so that it can be immersed in the plating solution, and a plating DC power source configured such that a positive electrode is connected to the electrode plate and a negative electrode connected to the object to be processed and whose output current can be controlled; connected to the negative electrode of the DC power source and immersed in the plating solution; A standard plate made of a conductive material with a known surface area, so that the first current density calculated from the flickering current detected by this standard plate matches the second current density set depending on the type of plating. A plating apparatus comprising a control means for controlling an output current of the DC power supply, and a switching device for detecting that the two current densities match and switching the connection of the standard plate from the negative electrode to the positive electrode of the DC power source.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP25257790A JPH04131398A (en) | 1990-09-20 | 1990-09-20 | Plating device |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP25257790A JPH04131398A (en) | 1990-09-20 | 1990-09-20 | Plating device |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| JPH04131398A true JPH04131398A (en) | 1992-05-06 |
Family
ID=17239310
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP25257790A Pending JPH04131398A (en) | 1990-09-20 | 1990-09-20 | Plating device |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPH04131398A (en) |
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN102864484A (en) * | 2012-09-05 | 2013-01-09 | 无锡惠嵘环保科技有限公司 | Digital automatic control device and method for electroplating |
Citations (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS5224940A (en) * | 1975-08-22 | 1977-02-24 | Fujitsu Ltd | Plating apparatus |
| JPS54155937A (en) * | 1978-05-31 | 1979-12-08 | Nippon Electric Co | Constant current density plating |
| JPS63143296A (en) * | 1986-12-05 | 1988-06-15 | Fuji Electric Co Ltd | Electroplating device |
-
1990
- 1990-09-20 JP JP25257790A patent/JPH04131398A/en active Pending
Patent Citations (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS5224940A (en) * | 1975-08-22 | 1977-02-24 | Fujitsu Ltd | Plating apparatus |
| JPS54155937A (en) * | 1978-05-31 | 1979-12-08 | Nippon Electric Co | Constant current density plating |
| JPS63143296A (en) * | 1986-12-05 | 1988-06-15 | Fuji Electric Co Ltd | Electroplating device |
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN102864484A (en) * | 2012-09-05 | 2013-01-09 | 无锡惠嵘环保科技有限公司 | Digital automatic control device and method for electroplating |
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