JPS6313396A - Multilayer printed board - Google Patents
Multilayer printed boardInfo
- Publication number
- JPS6313396A JPS6313396A JP15733786A JP15733786A JPS6313396A JP S6313396 A JPS6313396 A JP S6313396A JP 15733786 A JP15733786 A JP 15733786A JP 15733786 A JP15733786 A JP 15733786A JP S6313396 A JPS6313396 A JP S6313396A
- Authority
- JP
- Japan
- Prior art keywords
- multilayer printed
- printed board
- prepreg
- layer material
- reference hole
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Granted
Links
- 239000000463 material Substances 0.000 claims description 27
- 239000010410 layer Substances 0.000 claims description 12
- 239000002344 surface layer Substances 0.000 claims description 11
- 239000002759 woven fabric Substances 0.000 claims description 7
- 238000003475 lamination Methods 0.000 description 7
- 230000000694 effects Effects 0.000 description 2
- 239000000853 adhesive Substances 0.000 description 1
- 230000001070 adhesive effect Effects 0.000 description 1
- 239000000835 fiber Substances 0.000 description 1
- 239000003365 glass fiber Substances 0.000 description 1
- 238000004519 manufacturing process Methods 0.000 description 1
- 238000000034 method Methods 0.000 description 1
Classifications
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/46—Manufacturing multilayer circuits
- H05K3/4611—Manufacturing multilayer circuits by laminating two or more circuit boards
- H05K3/4638—Aligning and fixing the circuit boards before lamination; Detecting or measuring the misalignment after lamination; Aligning external circuit patterns or via connections relative to internal circuits
Landscapes
- Laminated Bodies (AREA)
- Casting Or Compression Moulding Of Plastics Or The Like (AREA)
- Production Of Multi-Layered Print Wiring Board (AREA)
Abstract
(57)【要約】本公報は電子出願前の出願データであるた
め要約のデータは記録されません。(57) [Summary] This bulletin contains application data before electronic filing, so abstract data is not recorded.
Description
【発明の詳細な説明】
〔概要〕
本発明の多層プリント板は、プリプレグ上に形成される
位置決め用基準穴を、プリプレグを構成する織布の織目
方向と対応させることによって、多層プリント板の積層
時に発生する歪を低減させた点に特徴がある。Detailed Description of the Invention [Summary] The multilayer printed board of the present invention has a positioning reference hole formed on the prepreg that corresponds to the weave direction of the woven fabric constituting the prepreg. The feature is that the strain that occurs during lamination is reduced.
本発明は多層プリント板構造の改良に係り、特にプリン
ト板積層時の歪を減少させた多層プリント板に関する。The present invention relates to an improvement in the structure of a multilayer printed board, and particularly to a multilayer printed board that reduces distortion during lamination of printed boards.
第４図は従来の多層プリント板の構造を示す要部斜視図
である。FIG. 4 is a perspective view of main parts showing the structure of a conventional multilayer printed board.
第４図に示すように、多層プリント板は、上下一対の表
面層材２と、少なくとも１枚以上のプリプレグ４および
中間層材３とによって構成されている。なお、プリプレ
グ４は、中間層材３と表面層材２間、或いは中間層材３
と中間層材３間に配設されるボンディング材で、ガラス
繊維、或いは紙繊維等を基材とする織布４ａに接着剤を
含浸させたものであることは周知のとおりである。As shown in FIG. 4, the multilayer printed board is composed of a pair of upper and lower surface layer materials 2, at least one prepreg 4, and an intermediate layer material 3. Note that the prepreg 4 is inserted between the intermediate layer material 3 and the surface layer material 2, or between the intermediate layer material 3 and the surface layer material 2.
As is well known, the bonding material is disposed between the intermediate layer material 3 and the bonding material, and is made of a woven fabric 4a whose base material is glass fiber or paper fiber, etc., impregnated with an adhesive.
以下第４図を用いて多層プリント板の積層工程を説明す
る。The lamination process of a multilayer printed board will be explained below using FIG. 4.
■、支持台１０上に植立されたガイドピン１に、表面層
材２．プリプレグ４．中間層材３の円形基準穴６を順次
挿入してそれぞれの位置決めを行う。(2) Surface layer material 2. Prepreg 4. The circular reference holes 6 of the intermediate layer material 3 are inserted one after another to determine their respective positions.
■６位置決めが終了すると上記多層プリント板母材（仮
称）は、ホットプレス装置（図示せず）に送られ、そこ
で上下から押圧され、且つ加熱されて多層プリント板と
なる。(6) When the positioning is completed, the multilayer printed board base material (tentative name) is sent to a hot press device (not shown), where it is pressed from above and below and heated to become a multilayer printed board.
しかしながら、前記プリプレグを構成する織布４ａの縦
糸方向（矢印Ａ−Ａ’方向）の積層時の収縮率は、表面
層材２および中間層材３のそれに比べて非常に大きいた
め、積層時、収縮応力がガイドピン１を介して表面層材
２および中間層材３の円形基準穴６に作用することとな
り、多層プリント板に歪が発生する。However, the shrinkage rate of the woven fabric 4a constituting the prepreg in the warp direction (direction of arrows AA') during lamination is much larger than that of the surface layer material 2 and the intermediate layer material 3. Shrinkage stress acts on the circular reference hole 6 of the surface layer material 2 and the intermediate layer material 3 through the guide pin 1, causing distortion in the multilayer printed board.
〔問題点を解決するための手段〕
本発明の多層プリント板は、表面層材２と中間層材３と
の間に配設されたプリプレグ４の３対の基準穴の内、中
央部の一対のみは従来と同じくガイドピン１が嵌合状態
で挿入される円形基準穴６のままとし、多層プリント板
の定尺サイズの長手方向（矢印Ａ−Ａ″）つまり縦糸方
向の両端部に形成された他の２対の基準穴は、横糸方向
く矢印Ｂ−Ｂ’方向）の寸法よりも縦糸方向の寸法の方
が長い変形基準穴７になっている。[Means for Solving the Problems] The multilayer printed board of the present invention has a central pair of reference holes in the prepreg 4 disposed between the surface layer material 2 and the intermediate layer material 3. The circular reference holes 6 into which the guide pins 1 are inserted in the fitted state are the same as in the past, and the holes are formed at both ends in the longitudinal direction (arrow A-A'') of the standard size of the multilayer printed board, that is, in the warp direction. The other two pairs of reference holes are deformed reference holes 7 in which the dimension in the warp direction is longer than the dimension in the weft direction (arrow B-B' direction).
このように構成された多層プリント板は、織布４ａが収
縮した時でもガイドピン１は変形基準穴フの作用によっ
て実質的には移動せず、このため、表面層材２ならびに
中間層材３に対するプリプレグ４の収縮応力の影響は少
なくなる。In the multilayer printed board configured in this way, even when the woven fabric 4a contracts, the guide pin 1 does not substantially move due to the action of the deformation reference hole, and therefore the surface layer material 2 and the intermediate layer material 3 The influence of the shrinkage stress of the prepreg 4 on the
従って、本発明を適用すれば、積層時における多層プリ
ント板の歪は大幅に減少する。Therefore, if the present invention is applied, the distortion of the multilayer printed board during lamination will be significantly reduced.
以下実施例図に基づいて本発明の詳細な説明する。 EMBODIMENT OF THE INVENTION The present invention will be described in detail below based on embodiment figures.
第１図（ａ）、 （ｂｌは本発明の多層プリント板の一
実施例を示す要部斜視図と部分拡大図であるが、前記第
４図と同一部分には同一符号を付している。FIGS. 1(a) and (bl) are a perspective view and a partially enlarged view of essential parts showing an embodiment of the multilayer printed board of the present invention, and the same parts as in FIG. 4 are given the same reference numerals. .
本発明の多層プリント板は、第１図（ａ）および山）に
示すように、プリプレグ４上に形成された３対（６個）
の基準穴の内、中央部の一対のみは従来と同じ（直径ｄ
の円形基準穴６となっているが、両端部に形成された他
の２対の基準穴は、プリプレグ４の縦糸方向く矢印Ａ−
Ａ”方向）の寸法が横糸方向（矢印Ｂ−８’方向）の寸
法ｄよりも大きいｄ＋αの寸法を持つ変形基準穴７にな
っている。The multilayer printed board of the present invention has three pairs (six pieces) formed on a prepreg 4, as shown in FIG.
Of the reference holes, only the central pair is the same as before (diameter d
However, the other two pairs of reference holes formed at both ends are in the direction of the warp of the prepreg 4 in the direction of the arrow A-
The deformation reference hole 7 has a dimension d+α in which the dimension in the weft direction (arrow B-8' direction) is larger than the dimension d in the weft direction (arrow B-8' direction).
このため、第１図（ｂｌの部分拡大図に示すように、積
層時にプリプレグ４が矢印＾−＾°方向に収縮しても、
ガイドピン１は変形基準穴７内を矢印へ−へ゛方向に移
動して収縮応力を吸収するので、積層時。For this reason, even if the prepreg 4 contracts in the direction of the arrow ^-^° during lamination, as shown in the partially enlarged view of Fig. 1 (bl),
The guide pin 1 moves in the direction of the arrow in the deformation reference hole 7 to absorb shrinkage stress during lamination.
表面層材２および中間層材３の円形基準穴６には応力が
作用しな°い。No stress acts on the circular reference holes 6 of the surface layer material 2 and the intermediate layer material 3.
第２図はプリプレグ構造の一実施例を示す平面図である
。FIG. 2 is a plan view showing an example of a prepreg structure.
第２図に示すように、プリプレグ４に形成される変形基
準穴７は、多層プリント板の定尺サイズの長手方向、即
ち織布４ａの縦糸方向く矢印Ａ−Ａ’方向）の寸法ｄ＋
αΦ方が、横糸方向（矢印Ｂ−８’方向）の寸法ｄより
も長い矩形型に形成されている（横糸方向、即ち矢印Ｂ
−８’方向の寸法は、円形基準穴６の直径ｄと同じであ
る）。As shown in FIG. 2, the deformation reference hole 7 formed in the prepreg 4 has a dimension d+ in the longitudinal direction of the regular size of the multilayer printed board, that is, in the warp direction of the woven fabric 4a (arrow A-A' direction).
αΦ is formed into a rectangular shape that is longer than the dimension d in the weft direction (arrow B-8' direction) (in the weft direction, that is, arrow B
The dimension in the -8' direction is the same as the diameter d of the circular reference hole 6).
第３図はプリプレグ構造の変形例を示す要部平面図であ
って、本変形例の場合は、変形基準穴７が小判型の長円
形基準穴７ａになっている。FIG. 3 is a plan view of a main part showing a modified example of the prepreg structure, and in the case of this modified example, the deformed reference hole 7 is an oval-shaped oblong reference hole 7a.
本発明の適用により、プリプレグの収縮に起因する多層
プリント板の全問題が解消されるので、多層プリント板
製造時の作業性と、製品の信頼性とが大幅に向上する。Application of the present invention eliminates all problems of multilayer printed boards caused by prepreg shrinkage, thereby greatly improving workability during multilayer printed board manufacturing and product reliability.
第１図（ａ）、 （ｂ）は本発明の多層プリント板の一
実施例を示す要部斜視図と部分拡大図、
第２図はプリプレグ構造の一実施例を示す平面図、
第３図はプリプレグ構造の変形例を示す要部平面図・
第４図は従来の多層プリント板の構造を示す要部斜視図
である。
図中、１はガイドピン、
２は表面層材、
３は中間層材、
４はプリプレグ、
４ａは織布、
６は円形基準穴、
７は変形基準穴、
７ａは長円形基準穴、
をそれぞれ示す。
千あ朗−１−’ｌｆａ例の
第 １ 図
７’ｌ＋７’し７′７葺お配の一つ乙ｙρづ？’Ｊｒｌ
Ｊ第２図
？シー７’ｐ７−ａ！ｎ＋ｉブｆ’ＪＩｆＪ第３図1(a) and 1(b) are a perspective view and partially enlarged view of essential parts showing an embodiment of a multilayer printed board according to the present invention, FIG. 2 is a plan view showing an embodiment of a prepreg structure, and FIG. 3 FIG. 4 is a plan view of the main part showing a modified example of the prepreg structure. FIG. 4 is a perspective view of the main part showing the structure of a conventional multilayer printed board. In the figure, 1 is a guide pin, 2 is a surface layer material, 3 is an intermediate layer material, 4 is a prepreg, 4a is a woven fabric, 6 is a circular reference hole, 7 is a deformation reference hole, 7a is an oblong reference hole, respectively. show. Chiaro-1-'lfa example 1 Figure 7'l+7' and 7'7 roof arrangement Otsuyρzu? 'Jrl
J Figure 2? Sea7'p7-a! n+ibuf'JIfJFigure 3
Claims (1)
介在させたプリプレグ（４）のそれぞれに基準穴を設け
、該基準穴にガイドピン（１）を挿通して関係位置の位
置決めを行う多層プリント板の構成において、前記プリ
プレグ（４）を構成する織布（４ａ）の縦糸方向を多層
プリント板の定尺サイズの長手方向に合致させるととも
に、該プリプレグ（４）の長手方向の中央部と両端部と
にそれぞれ対向して形成される合計３対の基準穴の内、
中央部の一対の基準孔は前記ガイドピン（１）を嵌合状
態で挿通させる円形基準穴（６）とし、両端部に形成さ
れる２対の基準穴は前記縦糸方向の寸法が横糸方向の寸
法よりも長い変形基準穴（７）としたことを特徴とする
多層プリント板。A reference hole is provided in each of the surface layer material (2), the intermediate layer material (3), and the prepreg (4) interposed between them, and the guide pin (1) is inserted into the reference hole to locate the relevant position. In the configuration of a multilayer printed board for positioning, the warp direction of the woven fabric (4a) constituting the prepreg (4) is made to match the longitudinal direction of the standard size of the multilayer printed board, and the longitudinal direction of the prepreg (4) is Of the total of three pairs of reference holes formed oppositely in the center and both ends of the
The pair of reference holes in the center are circular reference holes (6) through which the guide pin (1) is inserted in a fitted state, and the two pairs of reference holes formed at both ends are such that the dimension in the warp direction is equal to that in the weft direction. A multilayer printed board characterized by having a deformation reference hole (7) that is longer than its dimensions.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP15733786A JPH0680896B2 (en) | 1986-07-03 | 1986-07-03 | Multilayer printed board |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP15733786A JPH0680896B2 (en) | 1986-07-03 | 1986-07-03 | Multilayer printed board |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| JPS6313396A true JPS6313396A (en) | 1988-01-20 |
| JPH0680896B2 JPH0680896B2 (en) | 1994-10-12 |
Family
ID=15647483
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP15733786A Expired - Fee Related JPH0680896B2 (en) | 1986-07-03 | 1986-07-03 | Multilayer printed board |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPH0680896B2 (en) |
Cited By (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS58101519A (en) * | 1981-12-14 | 1983-06-16 | Mitsubishi Electric Corp | Failure detector for analog-to-digital converter |
| JPH04312997A (en) * | 1991-03-06 | 1992-11-04 | Mitsubishi Electric Corp | Manufacture of curved surface multilayer wiring board and verification method of nc data for laser exposure use |
| JP2014110422A (en) * | 2012-12-04 | 2014-06-12 | Samsung Electro-Mechanics Co Ltd | Printed circuit board and method for manufacturing the same |
-
1986
- 1986-07-03 JP JP15733786A patent/JPH0680896B2/en not_active Expired - Fee Related
Cited By (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS58101519A (en) * | 1981-12-14 | 1983-06-16 | Mitsubishi Electric Corp | Failure detector for analog-to-digital converter |
| JPH04312997A (en) * | 1991-03-06 | 1992-11-04 | Mitsubishi Electric Corp | Manufacture of curved surface multilayer wiring board and verification method of nc data for laser exposure use |
| JP2014110422A (en) * | 2012-12-04 | 2014-06-12 | Samsung Electro-Mechanics Co Ltd | Printed circuit board and method for manufacturing the same |
Also Published As
| Publication number | Publication date |
|---|---|
| JPH0680896B2 (en) | 1994-10-12 |
Similar Documents
| Publication | Publication Date | Title |
|---|---|---|
| DE69125354T2 (en) | Flexible circuit board | |
| JPS63147693A (en) | Manufacture of ic card | |
| JPH04212494A (en) | Manufacture of rigid/flexible printed circuit structure and multilayer flexible circuit board manufactured by this method | |
| JPH0819594B2 (en) | Three-dimensional fabric for composite materials | |
| JPS6313396A (en) | Multilayer printed board | |
| EP0320674A3 (en) | Two-pane panel with fixing and/or security means, and its use | |
| DE60028761T2 (en) | DEVICE FOR OPTICAL CONNECTION | |
| DE3838085A1 (en) | ACCELERATION-RESISTANT PACKAGING FOR INTEGRATED CIRCUITS AND METHOD FOR THEIR PRODUCTION | |
| JPS6386491A (en) | Metallic core printed wiring board | |
| JPS6313395A (en) | Manufacture of multilayer printed interconnection board | |
| DE8710924U1 (en) | Brake pad for spot-padded disc brakes | |
| DE112019001056T5 (en) | CIRCUIT BOARD WITH PIECE OF METAL AND METHOD OF MANUFACTURING A CIRCUIT BOARD WITH PIECE OF METAL | |
| JPH11163538A (en) | Multilayer printed wiring board and production thereof | |
| DE112021002950T5 (en) | current sensor | |
| JPH11135953A (en) | Multilayer printed wiring board and manufacture thereof | |
| JPS62291093A (en) | Munufacture of multilayer printed interconnection board | |
| JPS63161413A (en) | Circuit board and manufacture thereof | |
| JPH01257389A (en) | Flexible printed board | |
| JPS6232588B2 (en) | ||
| JPS586686Y2 (en) | copper clad laminate | |
| JPS62200789A (en) | Electronic parts mounting structure | |
| JPH0451588A (en) | Printed wiring board | |
| JPS6179599A (en) | Punching die for flexible wiring board | |
| DE1793346U (en) | INSULATING PLATE, EACH SIDE WITH A PRINTED CIRCUIT. | |
| DE202018106968U1 (en) | Flexible electronic assembly |
Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| LAPS | Cancellation because of no payment of annual fees |