JPH01257389A - Flexible printed board - Google Patents
Flexible printed boardInfo
- Publication number
- JPH01257389A JPH01257389A JP63086059A JP8605988A JPH01257389A JP H01257389 A JPH01257389 A JP H01257389A JP 63086059 A JP63086059 A JP 63086059A JP 8605988 A JP8605988 A JP 8605988A JP H01257389 A JPH01257389 A JP H01257389A
- Authority
- JP
- Japan
- Prior art keywords
- flexible printed
- board
- board part
- printed circuit
- substrate
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
- 239000000758 substrate Substances 0.000 claims description 72
- 239000002390 adhesive tape Substances 0.000 abstract description 17
- 238000000034 method Methods 0.000 abstract description 11
- 238000004519 manufacturing process Methods 0.000 abstract description 8
- 238000004080 punching Methods 0.000 description 3
- PXHVJJICTQNCMI-UHFFFAOYSA-N Nickel Chemical compound [Ni] PXHVJJICTQNCMI-UHFFFAOYSA-N 0.000 description 2
- 238000005452 bending Methods 0.000 description 2
- 238000010586 diagram Methods 0.000 description 2
- 238000005530 etching Methods 0.000 description 2
- 238000007747 plating Methods 0.000 description 2
- 230000015572 biosynthetic process Effects 0.000 description 1
- 230000000694 effects Effects 0.000 description 1
- PCHJSUWPFVWCPO-UHFFFAOYSA-N gold Chemical compound [Au] PCHJSUWPFVWCPO-UHFFFAOYSA-N 0.000 description 1
- 229910052737 gold Inorganic materials 0.000 description 1
- 239000010931 gold Substances 0.000 description 1
- 238000010030 laminating Methods 0.000 description 1
- 238000012986 modification Methods 0.000 description 1
- 230000004048 modification Effects 0.000 description 1
- 229910052759 nickel Inorganic materials 0.000 description 1
- 229910000679 solder Inorganic materials 0.000 description 1
Classifications
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K1/00—Printed circuits
- H05K1/02—Details
- H05K1/0277—Bendability or stretchability details
- H05K1/028—Bending or folding regions of flexible printed circuits
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K1/00—Printed circuits
- H05K1/02—Details
- H05K1/03—Use of materials for the substrate
- H05K1/0393—Flexible materials
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
- H05K2201/05—Flexible printed circuits [FPCs]
- H05K2201/055—Folded back on itself
Landscapes
- Engineering & Computer Science (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Combinations Of Printed Boards (AREA)
Abstract
Description
【発明の詳細な説明】
［産業上の利用分野］
この発明はフレキシブルプリント基板に関するものであ
り、特に、長尺化できるフレキシブルプリント基板に関
するものである。DETAILED DESCRIPTION OF THE INVENTION [Industrial Field of Application] The present invention relates to a flexible printed circuit board, and particularly to a flexible printed circuit board that can be made into a long length.
［従来の技術］
従来、フレキシブルプリント基板の主なユーザは、カメ
ラ業界や音響機器関係であり、フレキシブルプリント基
板の大きさも小型であった。しかしながら、最近は、Ｏ
Ａ機器や他の民生分野（たとえばプリンタ、ＨＤＤベン
プロッター）へとその採用が拡大されてきている。その
ため、現状の小型のフレキシブルプリント基板では事足
りず、長手方向の寸法の大型化したフレキシブルプリン
ト基板、すなわち長尺のフレキシブルプリント基板が要
望されている。[Prior Art] Conventionally, the main users of flexible printed circuit boards have been in the camera industry and audio equipment, and the size of flexible printed circuit boards has been small. However, recently, O
Its adoption is expanding to A equipment and other consumer fields (for example, printers, HDD Ben plotters). Therefore, the current small-sized flexible printed circuit boards are not sufficient, and there is a demand for flexible printed circuit boards with increased longitudinal dimensions, that is, long flexible printed circuit boards.
［発明が解決しようとする課題］
しかしながら、現行の生産設備は小型のフレキシブルプ
リント基板の製造を対象としたものであるため、長尺の
フレキシブルプリント基板の製造にそのまま使用できな
い。なぜなら、ここでいう長尺寸法とは４５０ｍ／ｍ以
上の寸法を指しているが、これ以上の寸法になると、エ
ツチングレジスト（印刷法、写真法ともに含む）の形成
工程に必要な設備、フィルムカバーレイをラミネートす
る熱プレス手段、外型を打ち抜くための金型、およびパ
ンチングプレス、金、ニッケル、半田等のめっき設備、
チエッカ、治具等を大型にしなければならないからであ
る。長尺のフレキシブルプリント基板の生産量が未だ少
ない現状において、新規投資を行なってまで上述の設備
を大型化するメリットは少ない。また、たとえ新規投資
をし、大型化を行なったとしても、フレキシブルプリン
ト基板の長さには限度が生じる。[Problems to be Solved by the Invention] However, since the current production equipment is intended for manufacturing small-sized flexible printed circuit boards, it cannot be used as is for manufacturing long flexible printed circuit boards. This is because the long dimension here refers to a dimension of 450 m/m or more, but if the dimension is larger than this, equipment necessary for the formation process of etching resist (including both printing method and photographic method), film cover, etc. A heat press means for laminating the lay, a mold for punching the outer mold, a punching press, equipment for plating gold, nickel, solder, etc.
This is because the checker, jig, etc. must be made large. In the current situation where the production volume of long flexible printed circuit boards is still small, there is little merit in increasing the size of the above-mentioned equipment by making new investment. Further, even if new investment is made and the size is increased, there is a limit to the length of the flexible printed circuit board.
しかしながら、一方において、長尺のフレキシブルプリ
ント基板の要望は少なからずあり、一種のジレンマの状
態に陥っているのが現状である。However, on the other hand, there is a considerable demand for long flexible printed circuit boards, and the current state of affairs is a kind of dilemma.
それゆえに、この発明は上述のような現状に鑑みてなさ
れたもので、現行設備で実現でき、かつ長尺化できるフ
レキシブルプリント基板を提供することを目的とする。Therefore, this invention was made in view of the above-mentioned current situation, and an object thereof is to provide a flexible printed circuit board that can be realized with existing equipment and can be made long.
［課題を解決するための手段］
この発明は長尺化できるフレキシブルプリント基板に係
るものであり、当該フレキシブルプリント基板は、互い
に平行な位置関係で直線的に延びている第１の基板部と
第２の基板部と、該第１の基板部と第２の基板部の端部
を互いに接続する第３の基板部とを備えている。[Means for Solving the Problems] The present invention relates to a flexible printed circuit board that can be made elongated, and the flexible printed circuit board includes a first board portion and a first board portion that extend linearly in a parallel positional relationship to each other. The present invention includes two substrate sections, and a third substrate section that connects the ends of the first substrate section and the second substrate section to each other.
［作用］
本発明に係るフレキシブルプリント基板は、互いに平行
な位置関係で直線的に延びている第１の基板部と第２の
基板部と、該第１の基板部と第２の基板部の端部を互い
に接続する第３の基板部とを備えたものであり、長手方
向の寸法が短いので、現行設備で製造可能である。そし
て、このフレキシブルプリント基板を適当に折曲げるこ
とにより、長手方向に直線的に延びる、長尺のフレキシ
ブルプリント基板にすることができる。[Function] The flexible printed circuit board according to the present invention includes a first substrate portion and a second substrate portion that extend linearly in a parallel positional relationship, and a first substrate portion and a second substrate portion that extend linearly in a parallel positional relationship to each other. It is equipped with a third substrate part whose ends are connected to each other, and since the longitudinal dimension is short, it can be manufactured using current equipment. By appropriately bending this flexible printed circuit board, it is possible to form a long flexible printed circuit board that extends linearly in the longitudinal direction.
［実施例］ 以下、この発明の実施例を図について説明する。[Example] Embodiments of the present invention will be described below with reference to the drawings.
第１Ａ図は希望する長尺フレキシブルプリント基板の平
面図である。第１Ｂ図は、本発明の一実施例に係るフレ
キシブルプリント基板の平面図である。第１Ｃ図、第１
Ｄ図および第１Ｅ図は長尺化の工程を示したものである
。FIG. 1A is a plan view of a desired long flexible printed circuit board. FIG. 1B is a plan view of a flexible printed circuit board according to an embodiment of the present invention. Figure 1C, 1st
Figure D and Figure 1E show the lengthening process.
第１Ｂ図を参照して、実施例に係るフレキシブルプリン
ト基板は、互いに平行な位置関係で直線的に延びている
第１の基板部１と第２の基板部２と、該第１基板部１と
第２の基板部２の端部を互いに接続する第３の基板部３
とを備えている。図中、１０．１０’は端子列である。Referring to FIG. 1B, the flexible printed circuit board according to the embodiment includes a first board part 1 and a second board part 2 that extend linearly in a mutually parallel positional relationship, and the first board part 1. and a third substrate section 3 that connects the ends of the second substrate section 2 and the second substrate section 2 to each other.
It is equipped with In the figure, 10 and 10' are terminal rows.
端子列１０と端子列１０’は配線（図示せず）で結ばれ
ている。The terminal rows 10 and 10' are connected by wiring (not shown).
このプリント配線基板は、長手方向の寸法が短いので、
現行のエツチング設備、熱プレス手段、金型、パンチン
グプレス、めっき設備等で容易に製造することができる
。This printed wiring board has short longitudinal dimensions, so
It can be easily manufactured using current etching equipment, hot press means, molds, punching presses, plating equipment, etc.
次に、実施例に係るフレキシブルプリント基板を長尺化
していく工程を説明する。Next, a process of lengthening the flexible printed circuit board according to the example will be explained.
第１Ｂ図および第１Ｃ図を参照して、第１の基板部１と
第２の基板部２の端部を互いに接続する第３の基板部３
の表面または裏面に、所定の寸法の両面接着テープ３０
を貼り付ける。図中、１ｆは第１の基板部１の表面、２
ｆは第２の基板部２の表面を表わしている。Referring to FIG. 1B and FIG. 1C, a third substrate section 3 connects the ends of the first substrate section 1 and the second substrate section 2 to each other.
Double-sided adhesive tape 30 of predetermined dimensions is attached to the front or back side of
Paste. In the figure, 1f is the surface of the first substrate part 1, 2
f represents the surface of the second substrate section 2.
次に、第１Ｃ図および第１Ｄ図を参照して、第２の基板
部２を、両面接着テープ３０を挾み込む方向に、１８０
°折曲げる。このとき、両面テープ３０が存在すること
により、第２の基板部２は１８０°折曲げられた状態で
接着固定される。図中、２ｂは第２の基板部２の裏面を
表わしている。Next, referring to FIG. 1C and FIG. 1D, the second substrate part 2 is moved 180 degrees
°Fold. At this time, due to the presence of the double-sided tape 30, the second substrate portion 2 is adhesively fixed in a 180° bent state. In the figure, 2b represents the back surface of the second substrate section 2.
次に、第１Ｄ図および第１Ｅ図を参照して、第１の基板
部１と第２の基板部２とが一列に並び続くように、第３
の基板部３、両面接着テープ３０を挾み込む方向に折曲
げる（この場合、第２の基板部２を折曲げても同じ形態
になる。）。すると、両面接着テープ３０の介在により
、第１の基板部１と第２の基板部２とは一列に並んだ状
態で接続固定され、第１Ｅ図に示した長尺フレキシブル
プリント基板が実現される。この第１Ｅ図に示す長尺フ
レキシブル基板は第１Ａ図に示す長尺フレキシブル基板
に対応するものである。第１Ａ図に示した長尺フレキシ
ブルプリント基板は現行設備では直接製造できないが、
第１Ｂ図に示す実施例に係る、長尺化可能なフレキシブ
ルプリント基板は現行の設備等で十分製造できる。それ
ゆえ、長尺化フレキシブルプリント基板を製造するにあ
たり、設備の改造、新規投資等は不要である。Next, with reference to FIGS. 1D and 1E, the third
(In this case, even if the second substrate part 2 is bent, the same shape will be obtained.) Then, with the interposition of the double-sided adhesive tape 30, the first board part 1 and the second board part 2 are connected and fixed in a line, and the long flexible printed circuit board shown in FIG. 1E is realized. . The long flexible substrate shown in FIG. 1E corresponds to the long flexible substrate shown in FIG. 1A. Although the long flexible printed circuit board shown in Figure 1A cannot be manufactured directly with current equipment,
The flexible printed circuit board according to the embodiment shown in FIG. 1B, which can be made into a long length, can be sufficiently manufactured using current equipment. Therefore, in manufacturing a long flexible printed circuit board, there is no need to modify equipment or make new investments.
第２Ａ図は、この発明の他の実施例の平面図であり、第
２Ｂ図、第２Ｃ図、第２Ｄ図および第２Ｅ図は長尺化の
工程を示したものである。第２Ａ図を参照して、この実
施例に係るフレキシブルブリント基板は、互いに平行な
位置関係で直線的に延びている第１の基板部１と第２の
基板部２と、上記第１の基板部１と第２の基板部の端部
を互いに接続する第３の基板部３とを備えている。さら
に当該フレキシブルプリント基板は、互いに平行な位置
関係で直線的に延びている第４の基板部４と第５の基板
部５と、該第４の基板部４と第５の基板部５の端部を互
いに接続する第６の基板部とを備えている。またさらに
、当該フレキシブルプリント基板は、第２の基板部２の
他端部と第４の基板部４の他端部とを互いに接続する第
７の基板部７を備えている。第２Ａ図に示すフレキシブ
ルプリント基板は、長手方向の寸法が短いので現行設備
で製造可能である。FIG. 2A is a plan view of another embodiment of the present invention, and FIGS. 2B, 2C, 2D, and 2E show the lengthening process. Referring to FIG. 2A, the flexible printed circuit board according to this embodiment includes a first substrate section 1 and a second substrate section 2 that extend linearly in a parallel positional relationship, and the first substrate section 1 and the second substrate section 2. The device includes a third substrate portion 3 that connects the end portions of the portion 1 and the second substrate portion to each other. Furthermore, the flexible printed circuit board includes a fourth board part 4 and a fifth board part 5 that extend linearly in a mutually parallel positional relationship, and ends of the fourth board part 4 and the fifth board part 5. and a sixth substrate part that connects the parts to each other. Furthermore, the flexible printed circuit board includes a seventh board part 7 that connects the other end of the second board part 2 and the other end of the fourth board part 4 to each other. The flexible printed circuit board shown in FIG. 2A has a short longitudinal dimension and can be manufactured using current equipment.
次に、長尺化していく工程を説明する。Next, the process of increasing the length will be explained.
第２Ａ図および第２Ｂ図を参照して、第３の基板部３の
表面または裏面に両面接着テープ３１を貼り付ける。第
６の基板部６の表面または裏面に両面接着テープ３３を
貼り付ける。第７の基板部７の表面または裏面に両面接
着テープ３２を貼り付ける。図中、１ｆは第１の基板部
１の表面、２ｆは第２の基板部２の表面、４ｆは第４の
基板部４の表面、５ｆは第５の基板部の表面を表わして
いる。Referring to FIGS. 2A and 2B, a double-sided adhesive tape 31 is attached to the front or back surface of the third substrate section 3. A double-sided adhesive tape 33 is attached to the front or back surface of the sixth substrate section 6. A double-sided adhesive tape 32 is attached to the front or back surface of the seventh substrate section 7. In the figure, 1f represents the surface of the first substrate portion 1, 2f represents the surface of the second substrate portion 2, 4f represents the surface of the fourth substrate portion 4, and 5f represents the surface of the fifth substrate portion.
次に、第２Ｂ図および第２Ｃ図を参照して、第１の基板
部１を、両面接着テープ３１を挾む込む方向に１８０°
折曲げる。このとき、両面テープ３１が存在することに
より、第１の基板部１は１８０°折曲げられた状態で接
着固定される。次に、第１の基板部１と第２の基板部２
とが一列に並び続くように、第３の基板部３を、両面接
着テープ３１を挾み込む方向に１８０°折曲げる。する
と、両面接着テープ３１の介在により、第１の基板部１
と第２の基板部２とは一列に並んだ状態で接着固定され
、第２Ｃ図の状態が実現される。Next, referring to FIGS. 2B and 2C, the first substrate part 1 is moved 180 degrees in the direction in which the double-sided adhesive tape 31 is inserted.
Fold. At this time, due to the presence of the double-sided tape 31, the first substrate portion 1 is adhesively fixed in a 180° bent state. Next, the first substrate section 1 and the second substrate section 2
The third substrate part 3 is bent 180 degrees in the direction in which the double-sided adhesive tape 31 is sandwiched so that the two sides remain in a line. Then, with the interposition of the double-sided adhesive tape 31, the first substrate part 1
and the second substrate part 2 are adhesively fixed in a line, and the state shown in FIG. 2C is realized.
次に、第２Ｃ図および第２Ｄ図を参照して、第４の基板
部４を両面接着テープ３２を挾み込む方向に１８０°折
曲げる。このとき、両面テープ３２の介在により、第４
の基板部４は１８０°折曲げられた状態で接着固定され
る。次に、第４の基板部４と第２の基板部２とが一列に
並び続くように、第７の基板部７を両面接着テープ３２
を挾み込む方向に１８０°折曲げる。すると、両面接着
テープ３２の介在により、第４の基板部４と第２の基板
部２とは、−列に並んだ状態で接着固定され、第２Ｄ図
の状態が実現される。図において、ｌｂ、２ｂ、４ｂ、
５ｂはそれぞれ第１の基板部１の裏面、第２の基板部２
の裏面、第４の基板部４の裏面、第５の基板部５の裏面
を表わしている。Next, referring to FIGS. 2C and 2D, the fourth substrate portion 4 is bent 180° in the direction in which the double-sided adhesive tape 32 is inserted. At this time, due to the intervention of the double-sided tape 32, the fourth
The substrate portion 4 is adhesively fixed in a 180° bent state. Next, the seventh board part 7 is attached to the double-sided adhesive tape 32 so that the fourth board part 4 and the second board part 2 are lined up and continue.
Bend 180° in the direction of sandwiching. Then, with the interposition of the double-sided adhesive tape 32, the fourth substrate section 4 and the second substrate section 2 are adhesively fixed in a state in which they are lined up in a negative row, and the state shown in FIG. 2D is realized. In the figure, lb, 2b, 4b,
5b are the back surface of the first substrate section 1 and the second substrate section 2, respectively.
, the back surface of the fourth substrate section 4, and the back surface of the fifth substrate section 5 are shown.
次に、第２Ｄ図および第２Ｅ図を参照して、第５の基板
部５を、両面接着テープ３３を挾み込む方向に１８０°
折曲げる。このとき、両面接着テープ３３が介在してい
るので、第５の基板部５は１８０°折曲げられた状態で
接着固定される。次に、第５の基板部５と第４の基板部
４とが一列に並び続くように、第６の基板部６を、両面
接着テープ３３を挾み込む方向に１８０°折曲げる。す
ると、両面接着テープ３３の介在により、第５の基板部
５と第４の基板部４とは、−列に並んだ状態で接着固定
され、第２Ｅ図に示した状態が実現される。Next, referring to FIG. 2D and FIG.
Fold. At this time, since the double-sided adhesive tape 33 is interposed, the fifth substrate portion 5 is adhesively fixed in a 180° bent state. Next, the sixth substrate section 6 is bent 180 degrees in a direction to sandwich the double-sided adhesive tape 33 so that the fifth substrate section 5 and the fourth substrate section 4 continue to be lined up in a row. Then, with the interposition of the double-sided adhesive tape 33, the fifth substrate section 5 and the fourth substrate section 4 are adhesively fixed in a state in which they are lined up in the - row, and the state shown in FIG. 2E is realized.
なお、上記実施例では、第１の基板部１と第２の基板部
２と第３の基板部３とを備えたフレキシブルプリント基
板、および第１の基板部１と第２の基板部２と第３の基
板部３と第４の基板部４と第５の基板部５と第６の基板
部６と第７の基板部７とを備えたフレキシブルプリント
基板について説明したが、この発明はこれに限られるも
のでなく、基板部の数をさらに増加することにより、ざ
らに長尺のフレキシブルプリント基板を製造することが
できる。現行の生産設備の寸法を測定し、単純に計算す
ると、この方法で約１０ｍの長尺フレキシブルプリント
基板が実現可能となる（最終外径幅を１０ｍ／ｍとした
場合）。In addition, in the above embodiment, a flexible printed circuit board including a first board part 1, a second board part 2, and a third board part 3, and a flexible printed circuit board including a first board part 1 and a second board part 2 are used. Although the flexible printed circuit board including the third board part 3, the fourth board part 4, the fifth board part 5, the sixth board part 6, and the seventh board part 7 has been described, this invention is not limited to this. However, by further increasing the number of substrate parts, a roughly elongated flexible printed circuit board can be manufactured. By measuring the dimensions of current production equipment and simply calculating, it is possible to realize a long flexible printed circuit board of approximately 10 m using this method (assuming the final outer diameter width is 10 m/m).
以上、具体的な実施例を挙げて、この発明のフレキシブ
ルプリント基板について説明したが、本発明は、その精
神または主要な特徴から逸脱することなく、他の色々な
形で実施することができる。Although the flexible printed circuit board of the present invention has been described above with reference to specific embodiments, the present invention can be implemented in various other forms without departing from its spirit or main characteristics.
それゆえ、前述の実施例はあらゆる点で単なる例示にす
ぎず、限定的に解釈してはならない。本発明の範囲は、
特許請求の範囲によって示すものであって、明細書本文
には何ら拘束されない。さらに、特許請求の範囲の均等
範囲に属する変形や変更は、すべて本発明の範囲内のも
のである。Therefore, the above-described embodiments are merely illustrative in all respects and should not be construed as limiting. The scope of the present invention is
This is indicated by the scope of the claims, and is not restricted in any way by the main text of the specification. Furthermore, all modifications and changes that come within the scope of equivalents of the claims are intended to be within the scope of the present invention.
［発明の効果］
以上説明したとおり、この発明に係るフレキシブルプリ
ント基板は互いに平行な位置関係で直線的に延びている
第１の基板部と第２の基板部と、上記第１の基板部と第
２の基板部の端部を互いに接続する第３の基板部とを備
えたものであり、長手方向の寸法が短いので、現行設備
で十分製造することができる。そして、このフレキシブ
ルプリント基板を適当に折曲げることにより、長手方向
に直線的に延びる長尺のフレキシブルプリント基板にす
ることができる。それゆえ、長尺フレキシブルプリント
基板の製造のための、設備の改造あるいは新規投資等は
不要となるという効果を奏する。[Effects of the Invention] As explained above, the flexible printed circuit board according to the present invention includes a first substrate portion and a second substrate portion that extend linearly in a parallel positional relationship with each other, and the first substrate portion and the first substrate portion. It is provided with a third substrate section that connects the ends of the second substrate sections to each other, and since the longitudinal dimension is short, it can be sufficiently manufactured using current equipment. By appropriately bending this flexible printed circuit board, it is possible to form a long flexible printed circuit board that extends linearly in the longitudinal direction. Therefore, the advantage is that there is no need to modify equipment or make new investments for manufacturing long flexible printed circuit boards.
第１Ａ図は、希望する長尺フレキシブルプリント基板の
平面図である。第１Ｂ図は、この発明の一実施例の平面
図であり、第１Ｃ図、第１Ｄ図および第１Ｅ図は実施例
に係るフレキシブルプリント基板を用いて長尺化する工
程を示した図である。
第２Ａ図はこの発明の他の実施例を示すものであり、第
２Ｂ図、第２Ｃ図、第２Ｄ図および第Ｅ図はその長尺化
の工程を示す図である。
図において、１は第１の基板部、２は第２の基板部、３
は第３の基板部である。
なお、各図中、同一符号は同一または相当部分を示す。FIG. 1A is a plan view of a desired long flexible printed circuit board. FIG. 1B is a plan view of an embodiment of the present invention, and FIGS. 1C, 1D, and 1E are diagrams showing a process of lengthening the flexible printed circuit board according to the embodiment. . FIG. 2A shows another embodiment of the present invention, and FIGS. 2B, 2C, 2D and E are diagrams showing the process of elongating the same. In the figure, 1 is the first substrate part, 2 is the second substrate part, 3
is the third substrate section. In each figure, the same reference numerals indicate the same or corresponding parts.
Claims (1)
部と第２の基板部と、 前記第１の基板部と第２の基板部の端部を互いに接続す
る第３の基板部とを備える、フレキシブルプリント基板
。[Claims] A first substrate portion and a second substrate portion that extend linearly in a parallel positional relationship, and end portions of the first substrate portion and the second substrate portion are connected to each other. A flexible printed circuit board, comprising: a third board section.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP63086059A JPH01257389A (en) | 1988-04-06 | 1988-04-06 | Flexible printed board |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP63086059A JPH01257389A (en) | 1988-04-06 | 1988-04-06 | Flexible printed board |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| JPH01257389A true JPH01257389A (en) | 1989-10-13 |
Family
ID=13876125
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP63086059A Pending JPH01257389A (en) | 1988-04-06 | 1988-04-06 | Flexible printed board |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPH01257389A (en) |
Cited By (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| WO1996007301A1 (en) * | 1994-08-29 | 1996-03-07 | Honeywell Inc. | Long flex circuits |
| US6969806B2 (en) | 2002-05-28 | 2005-11-29 | Lockheed Martin Corporation | Cable and method |
| WO2008090643A1 (en) * | 2007-01-22 | 2008-07-31 | Sharp Kabushiki Kaisha | Light source module and backlight light source |
| WO2016170621A1 (en) * | 2015-04-22 | 2016-10-27 | 堺ディスプレイプロダクト株式会社 | Light source device, display device, substrate unit manufacturing method, and light source device manufacturing method |
-
1988
- 1988-04-06 JP JP63086059A patent/JPH01257389A/en active Pending
Cited By (5)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| WO1996007301A1 (en) * | 1994-08-29 | 1996-03-07 | Honeywell Inc. | Long flex circuits |
| US6969806B2 (en) | 2002-05-28 | 2005-11-29 | Lockheed Martin Corporation | Cable and method |
| WO2008090643A1 (en) * | 2007-01-22 | 2008-07-31 | Sharp Kabushiki Kaisha | Light source module and backlight light source |
| WO2016170621A1 (en) * | 2015-04-22 | 2016-10-27 | 堺ディスプレイプロダクト株式会社 | Light source device, display device, substrate unit manufacturing method, and light source device manufacturing method |
| JPWO2016170621A1 (en) * | 2015-04-22 | 2018-02-15 | 堺ディスプレイプロダクト株式会社 | LIGHT SOURCE DEVICE, DISPLAY DEVICE, SUBSTRATE UNIT MANUFACTURING METHOD, AND LIGHT SOURCE DEVICE MANUFACTURING METHOD |
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