JPS63128181A - プラスチツク成形品の製法 - Google Patents
プラスチツク成形品の製法Info
- Publication number
- JPS63128181A JPS63128181A JP61273035A JP27303586A JPS63128181A JP S63128181 A JPS63128181 A JP S63128181A JP 61273035 A JP61273035 A JP 61273035A JP 27303586 A JP27303586 A JP 27303586A JP S63128181 A JPS63128181 A JP S63128181A
- Authority
- JP
- Japan
- Prior art keywords
- molded article
- molded product
- plastic
- plating
- primary
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Granted
Links
- 239000004033 plastic Substances 0.000 title claims abstract description 17
- 238000004519 manufacturing process Methods 0.000 title claims description 5
- 238000007747 plating Methods 0.000 claims abstract description 18
- 239000003054 catalyst Substances 0.000 claims abstract description 8
- 229910052763 palladium Inorganic materials 0.000 claims abstract description 7
- 229910052737 gold Inorganic materials 0.000 claims abstract description 4
- 238000000465 moulding Methods 0.000 claims description 15
- KDLHZDBZIXYQEI-UHFFFAOYSA-N Palladium Chemical compound [Pd] KDLHZDBZIXYQEI-UHFFFAOYSA-N 0.000 claims description 12
- PCHJSUWPFVWCPO-UHFFFAOYSA-N gold Chemical compound [Au] PCHJSUWPFVWCPO-UHFFFAOYSA-N 0.000 claims description 3
- 239000010931 gold Substances 0.000 claims description 3
- 238000000034 method Methods 0.000 abstract description 20
- 239000000463 material Substances 0.000 abstract description 14
- 239000003365 glass fiber Substances 0.000 abstract description 9
- 239000000945 filler Substances 0.000 abstract description 7
- 229920003002 synthetic resin Polymers 0.000 abstract description 3
- 239000000057 synthetic resin Substances 0.000 abstract description 3
- 239000000758 substrate Substances 0.000 description 14
- QAOWNCQODCNURD-UHFFFAOYSA-N Sulfuric acid Chemical compound OS(O)(=O)=O QAOWNCQODCNURD-UHFFFAOYSA-N 0.000 description 4
- 238000005530 etching Methods 0.000 description 4
- 229910052751 metal Inorganic materials 0.000 description 4
- 239000002184 metal Substances 0.000 description 4
- ZWEHNKRNPOVVGH-UHFFFAOYSA-N 2-Butanone Chemical compound CCC(C)=O ZWEHNKRNPOVVGH-UHFFFAOYSA-N 0.000 description 3
- RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical compound [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 description 3
- GRYLNZFGIOXLOG-UHFFFAOYSA-N Nitric acid Chemical compound O[N+]([O-])=O GRYLNZFGIOXLOG-UHFFFAOYSA-N 0.000 description 3
- 229910052802 copper Inorganic materials 0.000 description 3
- 239000010949 copper Substances 0.000 description 3
- 239000012778 molding material Substances 0.000 description 3
- 229910017604 nitric acid Inorganic materials 0.000 description 3
- TXUICONDJPYNPY-UHFFFAOYSA-N (1,10,13-trimethyl-3-oxo-4,5,6,7,8,9,11,12,14,15,16,17-dodecahydrocyclopenta[a]phenanthren-17-yl) heptanoate Chemical compound C1CC2CC(=O)C=C(C)C2(C)C2C1C1CCC(OC(=O)CCCCCC)C1(C)CC2 TXUICONDJPYNPY-UHFFFAOYSA-N 0.000 description 2
- DDFHBQSCUXNBSA-UHFFFAOYSA-N 5-(5-carboxythiophen-2-yl)thiophene-2-carboxylic acid Chemical compound S1C(C(=O)O)=CC=C1C1=CC=C(C(O)=O)S1 DDFHBQSCUXNBSA-UHFFFAOYSA-N 0.000 description 2
- CSCPPACGZOOCGX-UHFFFAOYSA-N Acetone Chemical compound CC(C)=O CSCPPACGZOOCGX-UHFFFAOYSA-N 0.000 description 2
- VEXZGXHMUGYJMC-UHFFFAOYSA-N Hydrochloric acid Chemical compound Cl VEXZGXHMUGYJMC-UHFFFAOYSA-N 0.000 description 2
- PXHVJJICTQNCMI-UHFFFAOYSA-N Nickel Chemical compound [Ni] PXHVJJICTQNCMI-UHFFFAOYSA-N 0.000 description 2
- 239000004734 Polyphenylene sulfide Substances 0.000 description 2
- 229910021626 Tin(II) chloride Inorganic materials 0.000 description 2
- 230000002378 acidificating effect Effects 0.000 description 2
- 238000005034 decoration Methods 0.000 description 2
- NJLLQSBAHIKGKF-UHFFFAOYSA-N dipotassium dioxido(oxo)titanium Chemical compound [K+].[K+].[O-][Ti]([O-])=O NJLLQSBAHIKGKF-UHFFFAOYSA-N 0.000 description 2
- 239000000835 fiber Substances 0.000 description 2
- 229910000510 noble metal Inorganic materials 0.000 description 2
- BASFCYQUMIYNBI-UHFFFAOYSA-N platinum Chemical compound [Pt] BASFCYQUMIYNBI-UHFFFAOYSA-N 0.000 description 2
- 229920000069 polyphenylene sulfide Polymers 0.000 description 2
- 239000002994 raw material Substances 0.000 description 2
- 229920005989 resin Polymers 0.000 description 2
- 239000011347 resin Substances 0.000 description 2
- 239000011342 resin composition Substances 0.000 description 2
- 238000007788 roughening Methods 0.000 description 2
- 239000001119 stannous chloride Substances 0.000 description 2
- 235000011150 stannous chloride Nutrition 0.000 description 2
- 239000000126 substance Substances 0.000 description 2
- VYZAMTAEIAYCRO-UHFFFAOYSA-N Chromium Chemical compound [Cr] VYZAMTAEIAYCRO-UHFFFAOYSA-N 0.000 description 1
- KRHYYFGTRYWZRS-UHFFFAOYSA-N Fluorane Chemical compound F KRHYYFGTRYWZRS-UHFFFAOYSA-N 0.000 description 1
- 239000004695 Polyether sulfone Substances 0.000 description 1
- 206010070834 Sensitisation Diseases 0.000 description 1
- BQCADISMDOOEFD-UHFFFAOYSA-N Silver Chemical compound [Ag] BQCADISMDOOEFD-UHFFFAOYSA-N 0.000 description 1
- ATJFFYVFTNAWJD-UHFFFAOYSA-N Tin Chemical compound [Sn] ATJFFYVFTNAWJD-UHFFFAOYSA-N 0.000 description 1
- 239000002253 acid Substances 0.000 description 1
- 230000003213 activating effect Effects 0.000 description 1
- 230000004913 activation Effects 0.000 description 1
- BIVUUOPIAYRCAP-UHFFFAOYSA-N aminoazanium;chloride Chemical compound Cl.NN BIVUUOPIAYRCAP-UHFFFAOYSA-N 0.000 description 1
- 239000003638 chemical reducing agent Substances 0.000 description 1
- 229910052804 chromium Inorganic materials 0.000 description 1
- 239000011651 chromium Substances 0.000 description 1
- 238000007796 conventional method Methods 0.000 description 1
- 238000005238 degreasing Methods 0.000 description 1
- 238000001035 drying Methods 0.000 description 1
- 230000000694 effects Effects 0.000 description 1
- 238000007772 electroless plating Methods 0.000 description 1
- 230000006870 function Effects 0.000 description 1
- 229910000040 hydrogen fluoride Inorganic materials 0.000 description 1
- 150000002500 ions Chemical class 0.000 description 1
- 239000007788 liquid Substances 0.000 description 1
- 239000006082 mold release agent Substances 0.000 description 1
- 229910052759 nickel Inorganic materials 0.000 description 1
- 239000003960 organic solvent Substances 0.000 description 1
- PIBWKRNGBLPSSY-UHFFFAOYSA-L palladium(II) chloride Chemical compound Cl[Pd]Cl PIBWKRNGBLPSSY-UHFFFAOYSA-L 0.000 description 1
- ACVYVLVWPXVTIT-UHFFFAOYSA-N phosphinic acid Chemical compound O[PH2]=O ACVYVLVWPXVTIT-UHFFFAOYSA-N 0.000 description 1
- 229910052697 platinum Inorganic materials 0.000 description 1
- 229920006122 polyamide resin Polymers 0.000 description 1
- 229920006393 polyether sulfone Polymers 0.000 description 1
- 230000008313 sensitization Effects 0.000 description 1
- 229910052709 silver Inorganic materials 0.000 description 1
- 239000004332 silver Substances 0.000 description 1
- 238000005476 soldering Methods 0.000 description 1
- 239000004094 surface-active agent Substances 0.000 description 1
- 229920005992 thermoplastic resin Polymers 0.000 description 1
- 238000005406 washing Methods 0.000 description 1
- XLYOFNOQVPJJNP-UHFFFAOYSA-N water Substances O XLYOFNOQVPJJNP-UHFFFAOYSA-N 0.000 description 1
Classifications
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/10—Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern
- H05K3/18—Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern using precipitation techniques to apply the conductive material
- H05K3/181—Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern using precipitation techniques to apply the conductive material by electroless plating
- H05K3/182—Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern using precipitation techniques to apply the conductive material by electroless plating characterised by the patterning method
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B29—WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
- B29C—SHAPING OR JOINING OF PLASTICS; SHAPING OF MATERIAL IN A PLASTIC STATE, NOT OTHERWISE PROVIDED FOR; AFTER-TREATMENT OF THE SHAPED PRODUCTS, e.g. REPAIRING
- B29C70/00—Shaping composites, i.e. plastics material comprising reinforcements, fillers or preformed parts, e.g. inserts
- B29C70/68—Shaping composites, i.e. plastics material comprising reinforcements, fillers or preformed parts, e.g. inserts by incorporating or moulding on preformed parts, e.g. inserts or layers, e.g. foam blocks
- B29C70/72—Encapsulating inserts having non-encapsulated projections, e.g. extremities or terminal portions of electrical components
-
- C—CHEMISTRY; METALLURGY
- C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
- C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
- C23C18/00—Chemical coating by decomposition of either liquid compounds or solutions of the coating forming compounds, without leaving reaction products of surface material in the coating; Contact plating
- C23C18/16—Chemical coating by decomposition of either liquid compounds or solutions of the coating forming compounds, without leaving reaction products of surface material in the coating; Contact plating by reduction or substitution, e.g. electroless plating
- C23C18/1601—Process or apparatus
- C23C18/1603—Process or apparatus coating on selected surface areas
- C23C18/1607—Process or apparatus coating on selected surface areas by direct patterning
- C23C18/1608—Process or apparatus coating on selected surface areas by direct patterning from pretreatment step, i.e. selective pre-treatment
-
- C—CHEMISTRY; METALLURGY
- C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
- C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
- C23C18/00—Chemical coating by decomposition of either liquid compounds or solutions of the coating forming compounds, without leaving reaction products of surface material in the coating; Contact plating
- C23C18/16—Chemical coating by decomposition of either liquid compounds or solutions of the coating forming compounds, without leaving reaction products of surface material in the coating; Contact plating by reduction or substitution, e.g. electroless plating
- C23C18/1601—Process or apparatus
- C23C18/1633—Process of electroless plating
- C23C18/1635—Composition of the substrate
- C23C18/1639—Substrates other than metallic, e.g. inorganic or organic or non-conductive
-
- C—CHEMISTRY; METALLURGY
- C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
- C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
- C23C18/00—Chemical coating by decomposition of either liquid compounds or solutions of the coating forming compounds, without leaving reaction products of surface material in the coating; Contact plating
- C23C18/16—Chemical coating by decomposition of either liquid compounds or solutions of the coating forming compounds, without leaving reaction products of surface material in the coating; Contact plating by reduction or substitution, e.g. electroless plating
- C23C18/1601—Process or apparatus
- C23C18/1633—Process of electroless plating
- C23C18/1635—Composition of the substrate
- C23C18/1639—Substrates other than metallic, e.g. inorganic or organic or non-conductive
- C23C18/1641—Organic substrates, e.g. resin, plastic
-
- C—CHEMISTRY; METALLURGY
- C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
- C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
- C23C18/00—Chemical coating by decomposition of either liquid compounds or solutions of the coating forming compounds, without leaving reaction products of surface material in the coating; Contact plating
- C23C18/16—Chemical coating by decomposition of either liquid compounds or solutions of the coating forming compounds, without leaving reaction products of surface material in the coating; Contact plating by reduction or substitution, e.g. electroless plating
- C23C18/18—Pretreatment of the material to be coated
- C23C18/1851—Pretreatment of the material to be coated of surfaces of non-metallic or semiconducting in organic material
- C23C18/1872—Pretreatment of the material to be coated of surfaces of non-metallic or semiconducting in organic material by chemical pretreatment
- C23C18/1875—Pretreatment of the material to be coated of surfaces of non-metallic or semiconducting in organic material by chemical pretreatment only one step pretreatment
- C23C18/1879—Use of metal, e.g. activation, sensitisation with noble metals
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- C—CHEMISTRY; METALLURGY
- C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
- C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
- C23C18/00—Chemical coating by decomposition of either liquid compounds or solutions of the coating forming compounds, without leaving reaction products of surface material in the coating; Contact plating
- C23C18/16—Chemical coating by decomposition of either liquid compounds or solutions of the coating forming compounds, without leaving reaction products of surface material in the coating; Contact plating by reduction or substitution, e.g. electroless plating
- C23C18/18—Pretreatment of the material to be coated
- C23C18/1851—Pretreatment of the material to be coated of surfaces of non-metallic or semiconducting in organic material
- C23C18/1872—Pretreatment of the material to be coated of surfaces of non-metallic or semiconducting in organic material by chemical pretreatment
- C23C18/1886—Multistep pretreatment
- C23C18/1893—Multistep pretreatment with use of organic or inorganic compounds other than metals, first
-
- C—CHEMISTRY; METALLURGY
- C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
- C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
- C23C18/00—Chemical coating by decomposition of either liquid compounds or solutions of the coating forming compounds, without leaving reaction products of surface material in the coating; Contact plating
- C23C18/16—Chemical coating by decomposition of either liquid compounds or solutions of the coating forming compounds, without leaving reaction products of surface material in the coating; Contact plating by reduction or substitution, e.g. electroless plating
- C23C18/18—Pretreatment of the material to be coated
- C23C18/20—Pretreatment of the material to be coated of organic surfaces, e.g. resins
- C23C18/2006—Pretreatment of the material to be coated of organic surfaces, e.g. resins by other methods than those of C23C18/22 - C23C18/30
- C23C18/2046—Pretreatment of the material to be coated of organic surfaces, e.g. resins by other methods than those of C23C18/22 - C23C18/30 by chemical pretreatment
- C23C18/2073—Multistep pretreatment
- C23C18/2086—Multistep pretreatment with use of organic or inorganic compounds other than metals, first
-
- C—CHEMISTRY; METALLURGY
- C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
- C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
- C23C18/00—Chemical coating by decomposition of either liquid compounds or solutions of the coating forming compounds, without leaving reaction products of surface material in the coating; Contact plating
- C23C18/16—Chemical coating by decomposition of either liquid compounds or solutions of the coating forming compounds, without leaving reaction products of surface material in the coating; Contact plating by reduction or substitution, e.g. electroless plating
- C23C18/18—Pretreatment of the material to be coated
- C23C18/20—Pretreatment of the material to be coated of organic surfaces, e.g. resins
- C23C18/22—Roughening, e.g. by etching
- C23C18/24—Roughening, e.g. by etching using acid aqueous solutions
-
- C—CHEMISTRY; METALLURGY
- C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
- C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
- C23C18/00—Chemical coating by decomposition of either liquid compounds or solutions of the coating forming compounds, without leaving reaction products of surface material in the coating; Contact plating
- C23C18/16—Chemical coating by decomposition of either liquid compounds or solutions of the coating forming compounds, without leaving reaction products of surface material in the coating; Contact plating by reduction or substitution, e.g. electroless plating
- C23C18/18—Pretreatment of the material to be coated
- C23C18/20—Pretreatment of the material to be coated of organic surfaces, e.g. resins
- C23C18/28—Sensitising or activating
- C23C18/285—Sensitising or activating with tin based compound or composition
-
- C—CHEMISTRY; METALLURGY
- C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
- C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
- C23C18/00—Chemical coating by decomposition of either liquid compounds or solutions of the coating forming compounds, without leaving reaction products of surface material in the coating; Contact plating
- C23C18/16—Chemical coating by decomposition of either liquid compounds or solutions of the coating forming compounds, without leaving reaction products of surface material in the coating; Contact plating by reduction or substitution, e.g. electroless plating
- C23C18/18—Pretreatment of the material to be coated
- C23C18/20—Pretreatment of the material to be coated of organic surfaces, e.g. resins
- C23C18/28—Sensitising or activating
- C23C18/30—Activating or accelerating or sensitising with palladium or other noble metal
-
- C—CHEMISTRY; METALLURGY
- C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
- C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
- C23C18/00—Chemical coating by decomposition of either liquid compounds or solutions of the coating forming compounds, without leaving reaction products of surface material in the coating; Contact plating
- C23C18/16—Chemical coating by decomposition of either liquid compounds or solutions of the coating forming compounds, without leaving reaction products of surface material in the coating; Contact plating by reduction or substitution, e.g. electroless plating
- C23C18/31—Coating with metals
- C23C18/32—Coating with nickel, cobalt or mixtures thereof with phosphorus or boron
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- C—CHEMISTRY; METALLURGY
- C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
- C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
- C23C18/00—Chemical coating by decomposition of either liquid compounds or solutions of the coating forming compounds, without leaving reaction products of surface material in the coating; Contact plating
- C23C18/16—Chemical coating by decomposition of either liquid compounds or solutions of the coating forming compounds, without leaving reaction products of surface material in the coating; Contact plating by reduction or substitution, e.g. electroless plating
- C23C18/31—Coating with metals
- C23C18/38—Coating with copper
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- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/10—Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern
- H05K3/18—Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern using precipitation techniques to apply the conductive material
- H05K3/181—Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern using precipitation techniques to apply the conductive material by electroless plating
- H05K3/182—Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern using precipitation techniques to apply the conductive material by electroless plating characterised by the patterning method
- H05K3/184—Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern using precipitation techniques to apply the conductive material by electroless plating characterised by the patterning method using masks
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- B—PERFORMING OPERATIONS; TRANSPORTING
- B29—WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
- B29C—SHAPING OR JOINING OF PLASTICS; SHAPING OF MATERIAL IN A PLASTIC STATE, NOT OTHERWISE PROVIDED FOR; AFTER-TREATMENT OF THE SHAPED PRODUCTS, e.g. REPAIRING
- B29C2791/00—Shaping characteristics in general
- B29C2791/001—Shaping in several steps
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
- H05K2201/01—Dielectrics
- H05K2201/0183—Dielectric layers
- H05K2201/0187—Dielectric layers with regions of different dielectrics in the same layer, e.g. in a printed capacitor for locally changing the dielectric properties
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
- H05K2201/09—Shape and layout
- H05K2201/09009—Substrate related
- H05K2201/09118—Moulded substrate
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2203/00—Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
- H05K2203/14—Related to the order of processing steps
- H05K2203/1407—Applying catalyst before applying plating resist
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2203/00—Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
- H05K2203/14—Related to the order of processing steps
- H05K2203/1476—Same or similar kind of process performed in phases, e.g. coarse patterning followed by fine patterning
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/0011—Working of insulating substrates or insulating layers
- H05K3/0014—Shaping of the substrate, e.g. by moulding
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/0011—Working of insulating substrates or insulating layers
- H05K3/0017—Etching of the substrate by chemical or physical means
- H05K3/0023—Etching of the substrate by chemical or physical means by exposure and development of a photosensitive insulating layer
-
- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
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- Y10S428/00—Stock material or miscellaneous articles
- Y10S428/901—Printed circuit
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- Y10T428/24—Structurally defined web or sheet [e.g., overall dimension, etc.]
- Y10T428/24802—Discontinuous or differential coating, impregnation or bond [e.g., artwork, printing, retouched photograph, etc.]
- Y10T428/24917—Discontinuous or differential coating, impregnation or bond [e.g., artwork, printing, retouched photograph, etc.] including metal layer
-
- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
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- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
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Abstract
(57)【要約】本公報は電子出願前の出願データであるた
め要約のデータは記録されません。
め要約のデータは記録されません。
Description
【発明の詳細な説明】
(産業上の利用分野)
本発明は、部分的にメッキを施しである回路基板、コネ
クタ等のプラスチック成形品の製法に関する。
クタ等のプラスチック成形品の製法に関する。
(従来の技術)
従来より、メッキを部分的に施したプラスチック成形品
の製法として、例えば特開昭57−108138号公報
のものがある。これは、メッキ適合材料で一次成形品を
成形してから、この一次成形品のメツキネ適合部分にメ
ツキネ適合材料を注入して二次成形品を成形し、成形後
この二次成形品をメッキするのである。こうすれば、メ
ッキが施せるメッキ適合材料でメッキ必要部分が形成さ
れ、メッキが困難又は不可能なメツキネ適合材料でメツ
キネ要部分が形成される。
の製法として、例えば特開昭57−108138号公報
のものがある。これは、メッキ適合材料で一次成形品を
成形してから、この一次成形品のメツキネ適合部分にメ
ツキネ適合材料を注入して二次成形品を成形し、成形後
この二次成形品をメッキするのである。こうすれば、メ
ッキが施せるメッキ適合材料でメッキ必要部分が形成さ
れ、メッキが困難又は不可能なメツキネ適合材料でメツ
キネ要部分が形成される。
(発明が解決しようとする問題点)
しかしながら、半田耐熱を必要とする回路基板、コネク
タなどに使用する成形材料はガラス繊維などのフィラー
(充填材)を混入したものが多いことは周知のとおりで
あるが、このフィラーが入った場合、従来例では、メツ
キネ要部分をメツキネ適合性にするには困難となる。何
故なら、エツチングによる表面粗化工程で混入されてい
るガラス繊維が表面に露出し、次の工程でパラジウム触
媒がガラス繊維に付着し、その結果無電界メッキ工程で
メッキがメツキネ要部分にも付着してしまうからである
。このメツキネ要部分のメッキの密着2強度はメッキ適
合材料の部分と比較して弱いが、回路基板、コネクタな
どに用いる場合は、回路部以外は完全に絶縁体でなけれ
ばならず、密着強度の如何にかかわらず、メッキで回路
同志が短絡していたならば、回路として或いはコネクタ
ーとして電気的に機能しないのである。従来例で実用化
されている分野が透光ボタンなどの装飾分野に限られて
いるのは、上記の問題点を解決できないためである。ボ
タンなどは耐熱性を上げるためのガラス繊維などのフィ
ラーを入れることがないためである。
タなどに使用する成形材料はガラス繊維などのフィラー
(充填材)を混入したものが多いことは周知のとおりで
あるが、このフィラーが入った場合、従来例では、メツ
キネ要部分をメツキネ適合性にするには困難となる。何
故なら、エツチングによる表面粗化工程で混入されてい
るガラス繊維が表面に露出し、次の工程でパラジウム触
媒がガラス繊維に付着し、その結果無電界メッキ工程で
メッキがメツキネ要部分にも付着してしまうからである
。このメツキネ要部分のメッキの密着2強度はメッキ適
合材料の部分と比較して弱いが、回路基板、コネクタな
どに用いる場合は、回路部以外は完全に絶縁体でなけれ
ばならず、密着強度の如何にかかわらず、メッキで回路
同志が短絡していたならば、回路として或いはコネクタ
ーとして電気的に機能しないのである。従来例で実用化
されている分野が透光ボタンなどの装飾分野に限られて
いるのは、上記の問題点を解決できないためである。ボ
タンなどは耐熱性を上げるためのガラス繊維などのフィ
ラーを入れることがないためである。
本発明の目的は、単なる装飾分野にとどまらず、回路基
板、コネクタなどとして機能性を備えたプラスチック成
形品にも適用できて、しかも低コストで確実に製品化で
きるようにすることにある。
板、コネクタなどとして機能性を備えたプラスチック成
形品にも適用できて、しかも低コストで確実に製品化で
きるようにすることにある。
(問題点を解決するための手段)
本発明は、一次成形品1を成形する工程と、この成形品
を表面粗化した後、例えばパラジウム、5金、銀、白金
などによる触媒賦与して一次成形品の前処理を行う工程
と、前処理した一次成形品をベースにしてプラスチック
によって加工を加えこの一次成形品の所定部分1aが露
出するように二次成形品2を成形する工程と、この二次
成形品をメッキする工程とを具備するものである。この
プラスチック材とは、単一の合成樹脂材のみならず、ガ
ラス繊維、チタン酸カリウム繊維などのフィラーを混入
したものも含む。上記前処理工程は公知の方法で行うこ
とができる。一次成形品1の成形後、この成形品の表面
が離型剤や脂分なとで汚れている場合は、特に脱脂を行
うことが望ましい。
を表面粗化した後、例えばパラジウム、5金、銀、白金
などによる触媒賦与して一次成形品の前処理を行う工程
と、前処理した一次成形品をベースにしてプラスチック
によって加工を加えこの一次成形品の所定部分1aが露
出するように二次成形品2を成形する工程と、この二次
成形品をメッキする工程とを具備するものである。この
プラスチック材とは、単一の合成樹脂材のみならず、ガ
ラス繊維、チタン酸カリウム繊維などのフィラーを混入
したものも含む。上記前処理工程は公知の方法で行うこ
とができる。一次成形品1の成形後、この成形品の表面
が離型剤や脂分なとで汚れている場合は、特に脱脂を行
うことが望ましい。
そしてプラスチックの種類によっては、例えばポリアミ
ド樹脂からなる一次成形品では、メチルエチルケトン、
アセトンなどの有機溶剤や、界面活性剤などにより脱脂
する。またこの前処理工程ではメッキの密着力を上げる
ため各種のエツチング液が使用されるが、ポリフエニレ
ンサルフフイド樹脂組成物の場合にはクロムM/硫酸、
酸性フッ化アンモニウム/硝酸、フッ化水素1/硝酸と
いったエツチング液が好適である。また触媒賦与の方法
には、実用的なものとしてキャタリスト−アクセレータ
ー法、センシタイジング→アクチベーチング法がある。
ド樹脂からなる一次成形品では、メチルエチルケトン、
アセトンなどの有機溶剤や、界面活性剤などにより脱脂
する。またこの前処理工程ではメッキの密着力を上げる
ため各種のエツチング液が使用されるが、ポリフエニレ
ンサルフフイド樹脂組成物の場合にはクロムM/硫酸、
酸性フッ化アンモニウム/硝酸、フッ化水素1/硝酸と
いったエツチング液が好適である。また触媒賦与の方法
には、実用的なものとしてキャタリスト−アクセレータ
ー法、センシタイジング→アクチベーチング法がある。
前者の方法は、錫、パラジウム系の混合触媒液に浸漬し
た後、塩酸、硫酸などの酸で活性化し、一次成形品の表
面にパラジウムを析出させる方法である。後者の方法は
、まず塩化第1錫、次亜リン酸、塩化ヒドラジンなどの
比較的強い還元剤を成形品表面に吸着させ、ついで金、
パラジウムなどの貴金属イオンを含む触媒溶液に浸漬し
、成形品表面に貴金属を析出させる方法である。二次成
形品2のメッキ工程では通常化学銅メッキ、化学ニッケ
ルメッキが使用されるが、成形品が例えば配線基板の場
合には銅メッキが望ましい。
た後、塩酸、硫酸などの酸で活性化し、一次成形品の表
面にパラジウムを析出させる方法である。後者の方法は
、まず塩化第1錫、次亜リン酸、塩化ヒドラジンなどの
比較的強い還元剤を成形品表面に吸着させ、ついで金、
パラジウムなどの貴金属イオンを含む触媒溶液に浸漬し
、成形品表面に貴金属を析出させる方法である。二次成
形品2のメッキ工程では通常化学銅メッキ、化学ニッケ
ルメッキが使用されるが、成形品が例えば配線基板の場
合には銅メッキが望ましい。
(発明の効果)
本発明によれば、プラスチック材として、−火成形材と
してはメッキ適合材料を使用するものの、二次成形材に
は従来のようなメツキネ適合材料のような特別なものを
選択する必要がなく、しかも板状(二次元的な形状)に
とどまらず、立体的(三次元的な形状)なもので、回路
基板などの電子部品など装飾以外の分野の製品化にも適
用でき、ざらに耐熱性を高めるため或いは強度を高める
ためにガラス繊維などのフィラーを混入した成形材料を
用いても、フィラーの有無にかかわらず、部分メッキを
施した製品を低コストでしかも確実に製造できる。
してはメッキ適合材料を使用するものの、二次成形材に
は従来のようなメツキネ適合材料のような特別なものを
選択する必要がなく、しかも板状(二次元的な形状)に
とどまらず、立体的(三次元的な形状)なもので、回路
基板などの電子部品など装飾以外の分野の製品化にも適
用でき、ざらに耐熱性を高めるため或いは強度を高める
ためにガラス繊維などのフィラーを混入した成形材料を
用いても、フィラーの有無にかかわらず、部分メッキを
施した製品を低コストでしかも確実に製造できる。
(実施例1)
く−火成形工程〉
第1図に示すような一次成形品としての基板1を金型に
よって成形した。この基板には突条のパターン1aを形
成しである。
よって成形した。この基板には突条のパターン1aを形
成しである。
基板1を脱脂処理後、酸性フッ化アンモニウム/硝酸か
ら成るエツチング液に40℃で5分間浸漬し、エツチン
グを行った。
ら成るエツチング液に40℃で5分間浸漬し、エツチン
グを行った。
水洗後、塩化第一錫によるセンシタイジング、塩化パラ
ジウムによるアクチベーションを行い、その後基板の乾
燥を行った。
ジウムによるアクチベーションを行い、その後基板の乾
燥を行った。
く二次成形工程〉
吃燥後、基板1を金型のキャビティ内にインサートして
、キャビティ内に液状プラスチックを充填して、第2図
に示す二次成形品としての基板2を成形した。この基板
2では基板1のパターン1aが外面に露出している。基
板2を脱脂処理した後、無電解銅メッキを20μmの厚
みで行った。
、キャビティ内に液状プラスチックを充填して、第2図
に示す二次成形品としての基板2を成形した。この基板
2では基板1のパターン1aが外面に露出している。基
板2を脱脂処理した後、無電解銅メッキを20μmの厚
みで行った。
これによって、基板は第3図に示すように外面のパター
ン1aのみがメッキされたプラスチック成形品としての
回路基板3が得られた。
ン1aのみがメッキされたプラスチック成形品としての
回路基板3が得られた。
−次及び二次の筒成形工程において、基板の原材料とし
て、ポリフェニレンサルファイド樹脂60重量%、ガラ
ス繊lf!、35重量%、チタン酸カリウム繊維(大家
化学“ティモスD”>5重量%からなる熱可塑性樹脂組
成物を用いた。
て、ポリフェニレンサルファイド樹脂60重量%、ガラ
ス繊lf!、35重量%、チタン酸カリウム繊維(大家
化学“ティモスD”>5重量%からなる熱可塑性樹脂組
成物を用いた。
(実施例2)
実施例1と同様の方法で基板3を製作した。但し、基板
の原材料として、ポリエーテルスルホン樹脂70%およ
びガラス繊維30重量%からなる熱可塑性樹脂組成物を
用いた。
の原材料として、ポリエーテルスルホン樹脂70%およ
びガラス繊維30重量%からなる熱可塑性樹脂組成物を
用いた。
(実施例3)
この例では、第一次成形工程は実施例1と同様であるが
、第二次成形工程では、二次成形品2を成形後、これを
再び触媒処理してからメッキをした。こうすることによ
ってメッキの密着強度を高めた。
、第二次成形工程では、二次成形品2を成形後、これを
再び触媒処理してからメッキをした。こうすることによ
ってメッキの密着強度を高めた。
各実施例におけるメッキされた回路パターンの密着状態
を測定した結果、密着強度は第3実施例が最も高く、第
1実施例がこれに続くものであった。
を測定した結果、密着強度は第3実施例が最も高く、第
1実施例がこれに続くものであった。
第1図乃至第3図工程は、基板の成形過程を段階的に示
す斜視図である。 1・・・−火成形量(基板)、 1a・・・成形品の所定部分(パターン)、2・・・二
次成形品、 3・・・部分メッキされた成形品(回路基板)。 以上 第1図 第2図 第3図 手続補正書(自制 昭和63年 2月16日
す斜視図である。 1・・・−火成形量(基板)、 1a・・・成形品の所定部分(パターン)、2・・・二
次成形品、 3・・・部分メッキされた成形品(回路基板)。 以上 第1図 第2図 第3図 手続補正書(自制 昭和63年 2月16日
Claims (1)
- 【特許請求の範囲】 1、一次成形品を表面粗化してから、パラジウム、金な
どによる触媒賦与をする第一次成形工程と、この工程で
処理された一次成形品に基づいてこの成形品の所定部分
が露出する二次成形品を成形し、この二次成形品をメッ
キする第二次成形工程とを具備することを特徴とするプ
ラスチック成形品の製法。 2、特許請求の範囲第1項において、第二次成形工程は
二次成形品の触媒付与工程を含むことを特徴とするプラ
スチック成形品の製法。
Priority Applications (4)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP61273035A JPH0660416B2 (ja) | 1986-11-18 | 1986-11-18 | プラスチック成形品の製法 |
US07/109,353 US4812275A (en) | 1986-11-18 | 1987-10-15 | Process for the production of molded articles having partial metal plating |
US07/180,923 US4908259A (en) | 1986-11-18 | 1988-04-13 | Molded article with partial metal plating and a process for producing such article |
US07/422,174 US5015519A (en) | 1986-11-18 | 1989-10-16 | Molded article with partial metal plating and a process for producing such article |
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP61273035A JPH0660416B2 (ja) | 1986-11-18 | 1986-11-18 | プラスチック成形品の製法 |
Publications (2)
Publication Number | Publication Date |
---|---|
JPS63128181A true JPS63128181A (ja) | 1988-05-31 |
JPH0660416B2 JPH0660416B2 (ja) | 1994-08-10 |
Family
ID=17522258
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
JP61273035A Expired - Lifetime JPH0660416B2 (ja) | 1986-11-18 | 1986-11-18 | プラスチック成形品の製法 |
Country Status (2)
Country | Link |
---|---|
US (2) | US4812275A (ja) |
JP (1) | JPH0660416B2 (ja) |
Cited By (2)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
KR100495340B1 (ko) * | 1999-12-21 | 2005-06-14 | 스미토모 쇼지 플라스틱 가부시키가이샤 | 베이스의 부분적 도금 방법 |
WO2005086548A1 (ja) | 2004-03-04 | 2005-09-15 | Sankyo Kasei Co., Ltd. | 立体回路基板 |
Families Citing this family (27)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPH0660416B2 (ja) * | 1986-11-18 | 1994-08-10 | 三共化成株式会社 | プラスチック成形品の製法 |
US4908259A (en) * | 1986-11-18 | 1990-03-13 | Sankyo Kasei Kabushiki Kaisha | Molded article with partial metal plating and a process for producing such article |
US5230927A (en) * | 1989-02-16 | 1993-07-27 | Mitsubishi Gas Chemical Company, Inc. | Method for metal-plating resin molded articles and metal-plated resin molded articles |
US5211803A (en) * | 1989-10-02 | 1993-05-18 | Phillips Petroleum Company | Producing metal patterns on a plastic surface |
JPH03197687A (ja) * | 1989-12-26 | 1991-08-29 | Mitsubishi Gas Chem Co Inc | 樹脂成形品の金属メッキ前処理方法 |
US5198793A (en) * | 1991-07-30 | 1993-03-30 | Eaton Corporation | Electric control apparatus comprising integral electrical conductors plated on a two-shot molded plastic insulating housing |
JPH09271155A (ja) * | 1996-03-29 | 1997-10-14 | Matsushita Electric Ind Co Ltd | 円筒型振動発生モータの取付方法 |
JPH10180799A (ja) * | 1996-12-24 | 1998-07-07 | Sankyo Kasei Co Ltd | 電子部品などの製造方法およびこの方法によって製造された電子部品 |
US6015523A (en) * | 1997-12-18 | 2000-01-18 | Sankyo Kasei Kabushiki Kaisha | Process for producing electronic parts |
US6296897B1 (en) | 1998-08-12 | 2001-10-02 | International Business Machines Corporation | Process for reducing extraneous metal plating |
EP1020947A3 (en) | 1998-12-22 | 2000-10-04 | Nokia Mobile Phones Ltd. | Method for manufacturing an antenna body for a phone and phone or handset having an internal antenna |
GB2345022B (en) * | 1998-12-23 | 2003-06-11 | Nokia Mobile Phones Ltd | Method for manufacturing an antenna body for a phone |
US6433728B1 (en) * | 1999-01-22 | 2002-08-13 | Lear Automotive Dearborn, Inc. | Integrally molded remote entry transmitter |
AU2001266835A1 (en) * | 2000-06-12 | 2001-12-24 | Bourns, Inc. | Molded electronic assembly |
US7061342B2 (en) * | 2001-12-28 | 2006-06-13 | Molex Incorporated | Differential transmission channel link for delivering high frequency signals and power |
FR2840761B1 (fr) * | 2002-06-06 | 2004-08-27 | Framatome Connectors Int | Pieces en matieres plastique metallisees |
FR2840550B1 (fr) * | 2002-06-06 | 2004-08-27 | Framatome Connectors Int | Procede de metallisation de supports en matiere plastique |
EP1383360B1 (de) * | 2002-07-18 | 2007-01-03 | FESTO AG & Co | Spritzgegossener Leiterträger und Verfahren zu seiner Herstellung |
WO2004084421A2 (en) | 2003-03-14 | 2004-09-30 | Molex Incorporated | Grouped element transmission channel link with pedestal aspects |
US7789674B2 (en) * | 2007-05-02 | 2010-09-07 | Finisar Corporation | Molded card edge connector for attachment with a printed circuit board |
EP2033756A1 (en) * | 2007-09-05 | 2009-03-11 | Nederlandse Organisatie voor toegepast- natuurwetenschappelijk onderzoek TNO | A process for preparing a moulded product |
US8006075B2 (en) | 2009-05-21 | 2011-08-23 | Oracle America, Inc. | Dynamically allocated store queue for a multithreaded processor |
US20110094778A1 (en) * | 2009-10-27 | 2011-04-28 | Cheng-Po Yu | Circuit board and fabrication method thereof |
TWI417013B (zh) * | 2010-05-14 | 2013-11-21 | Kuang Hong Prec Co Ltd | 立體電路元件及其製作方法 |
JP6199383B2 (ja) * | 2012-07-12 | 2017-09-20 | ラビナル・エル・エル・シー | 負荷母線アセンブリおよびその製造方法 |
US10737530B2 (en) * | 2015-05-14 | 2020-08-11 | Lacks Enterprises, Inc. | Two-shot molding for selectively metalizing parts |
DE102018222564B4 (de) | 2018-12-20 | 2022-07-21 | Vitesco Technologies GmbH | Kraftstoffförderaggregat und Kraftstofffördereinheit |
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JPS5660768U (ja) * | 1979-10-15 | 1981-05-23 | ||
JPS5716157A (en) * | 1980-07-02 | 1982-01-27 | Hitachi Ltd | Pretreating method for partial plating |
JPS57108138A (en) * | 1981-11-06 | 1982-07-06 | Yamashita Denki Kk | Partially plated plastic molded article |
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US3259559A (en) * | 1962-08-22 | 1966-07-05 | Day Company | Method for electroless copper plating |
US3737339A (en) * | 1970-12-18 | 1973-06-05 | Richardson Co | Fabrication of printed circuit boards |
US3902908A (en) * | 1973-03-21 | 1975-09-02 | Macdermid Inc | Catalyst system for activating surfaces prior to electroless deposition |
JPS5371272A (en) * | 1976-12-07 | 1978-06-24 | Tokyo Shibaura Electric Co | Method of producing printed circuit board |
US4389771A (en) * | 1981-01-05 | 1983-06-28 | Western Electric Company, Incorporated | Treatment of a substrate surface to reduce solder sticking |
NL8102620A (nl) * | 1981-05-29 | 1982-12-16 | Philips Nv | Werkwijze voor de vervaardiging van gedrukte bedrading en aldus verkregen produkten. |
JPS60217695A (ja) * | 1984-04-13 | 1985-10-31 | 株式会社日立製作所 | 無電解めつき前処理法及びプリント配線板の製造法 |
US4615763A (en) * | 1985-01-02 | 1986-10-07 | International Business Machines Corporation | Roughening surface of a substrate |
GB2171355B (en) * | 1985-02-22 | 1989-11-22 | Kollmorgen Tech Corp | Molded articles suitable for adherent metallization, molded metallized articles and processes for making the same |
US4574031A (en) * | 1985-03-29 | 1986-03-04 | At&T Technologies, Inc. | Additive processing electroless metal plating using aqueous photoresist |
US4908259A (en) * | 1986-11-18 | 1990-03-13 | Sankyo Kasei Kabushiki Kaisha | Molded article with partial metal plating and a process for producing such article |
JPH0660416B2 (ja) * | 1986-11-18 | 1994-08-10 | 三共化成株式会社 | プラスチック成形品の製法 |
-
1986
- 1986-11-18 JP JP61273035A patent/JPH0660416B2/ja not_active Expired - Lifetime
-
1987
- 1987-10-15 US US07/109,353 patent/US4812275A/en not_active Expired - Lifetime
-
1989
- 1989-10-16 US US07/422,174 patent/US5015519A/en not_active Expired - Lifetime
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JPS5660768U (ja) * | 1979-10-15 | 1981-05-23 | ||
JPS5716157A (en) * | 1980-07-02 | 1982-01-27 | Hitachi Ltd | Pretreating method for partial plating |
JPS57108138A (en) * | 1981-11-06 | 1982-07-06 | Yamashita Denki Kk | Partially plated plastic molded article |
Cited By (3)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
KR100495340B1 (ko) * | 1999-12-21 | 2005-06-14 | 스미토모 쇼지 플라스틱 가부시키가이샤 | 베이스의 부분적 도금 방법 |
WO2005086548A1 (ja) | 2004-03-04 | 2005-09-15 | Sankyo Kasei Co., Ltd. | 立体回路基板 |
US8528202B2 (en) | 2004-03-04 | 2013-09-10 | Sankyo Kasei Co., Ltd. | Method for manufacturing a three dimensional circuit board |
Also Published As
Publication number | Publication date |
---|---|
US4812275A (en) | 1989-03-14 |
JPH0660416B2 (ja) | 1994-08-10 |
US5015519A (en) | 1991-05-14 |
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