JPS63126292A - Interconnection system of printed wiring board - Google Patents
Interconnection system of printed wiring boardInfo
- Publication number
- JPS63126292A JPS63126292A JP27239586A JP27239586A JPS63126292A JP S63126292 A JPS63126292 A JP S63126292A JP 27239586 A JP27239586 A JP 27239586A JP 27239586 A JP27239586 A JP 27239586A JP S63126292 A JPS63126292 A JP S63126292A
- Authority
- JP
- Japan
- Prior art keywords
- printed wiring
- wiring board
- leads
- liquid crystal
- crystal display
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Granted
Links
- 238000000034 method Methods 0.000 claims description 19
- 239000004973 liquid crystal related substance Substances 0.000 description 24
- 239000004020 conductor Substances 0.000 description 8
- 239000000969 carrier Substances 0.000 description 7
- 239000000463 material Substances 0.000 description 4
- 239000000758 substrate Substances 0.000 description 3
- RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical compound [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 description 2
- 238000010586 diagram Methods 0.000 description 2
- 230000000694 effects Effects 0.000 description 2
- 230000002093 peripheral effect Effects 0.000 description 2
- 238000005476 soldering Methods 0.000 description 2
- 239000004642 Polyimide Substances 0.000 description 1
- BQCADISMDOOEFD-UHFFFAOYSA-N Silver Chemical compound [Ag] BQCADISMDOOEFD-UHFFFAOYSA-N 0.000 description 1
- 230000015572 biosynthetic process Effects 0.000 description 1
- 229910052802 copper Inorganic materials 0.000 description 1
- 239000010949 copper Substances 0.000 description 1
- 239000011889 copper foil Substances 0.000 description 1
- 238000005401 electroluminescence Methods 0.000 description 1
- 229920003223 poly(pyromellitimide-1,4-diphenyl ether) Polymers 0.000 description 1
- 229920001721 polyimide Polymers 0.000 description 1
- 239000011347 resin Substances 0.000 description 1
- 229920005989 resin Polymers 0.000 description 1
- 238000007789 sealing Methods 0.000 description 1
- 229910052709 silver Inorganic materials 0.000 description 1
- 239000004332 silver Substances 0.000 description 1
- 238000009751 slip forming Methods 0.000 description 1
- 239000010409 thin film Substances 0.000 description 1
Landscapes
- Printing Elements For Providing Electric Connections Between Printed Circuits (AREA)
- Combinations Of Printed Boards (AREA)
- Devices For Indicating Variable Information By Combining Individual Elements (AREA)
Abstract
(57)【要約】本公報は電子出願前の出願データであるた
め要約のデータは記録されません。(57) [Summary] This bulletin contains application data before electronic filing, so abstract data is not recorded.
Description
【発明の詳細な説明】
産業上の利用分野
本発明は、印刷配線基板の接続方式に関し、さらに詳し
くは、たとえば液晶、プラズマ、エレクトロルミネセン
ス（略称ＥＬ）等の表示素子パネルなどにおいて、駆動
用集積回路等の電子回路装置が実装された印刷配線基板
の接続方式に関する。DETAILED DESCRIPTION OF THE INVENTION Field of Industrial Application The present invention relates to a connection method for a printed wiring board, and more specifically, for example, a method for connecting a printed wiring board, for example, for driving a display element panel such as a liquid crystal, plasma, electroluminescence (abbreviated as EL), etc. The present invention relates to a connection method for a printed wiring board on which an electronic circuit device such as an integrated circuit is mounted.
従来技術
ｆｊｓＧ図は、、典型的な従来技術の接続方式を用いた
液晶表示装ｒ！１１の一部分の分解斜視図である。The prior art fjsG diagram shows a liquid crystal display using a typical prior art connection method. FIG. 11 is an exploded perspective view of a portion of FIG.
液晶表示素子パネル２の縁部２ａ、２ｂがらは、複数の
テープキャリア３，４が突出して設けられる。A plurality of tape carriers 3 and 4 are provided to protrude from the edges 2a and 2b of the liquid crystal display element panel 2.
このテープキャリア３．４は、テープ状の薄膜に形成さ
れ、各テープキャリア３，４の一表面上には、液晶表示
素子パネル２を駆動するために電子回路装置である大′
ｊＡ？５！某積回路５，６がそれぞれ実装される。The tape carriers 3 , 4 are formed into tape-like thin films, and on one surface of each tape carrier 3 , 4 , there is a large circuit board that is an electronic circuit device for driving the liquid crystal display element panel 2 .
jA? 5! Certain product circuits 5 and 6 are mounted respectively.
大規模１！積回路５，６のパネル駆動信号用端子５ａ、
６ａは、テープキャリア３．４上に形成され銅ｒｒｉ等
から成る複数本のパネル駆動信号配線用り−ド７，８と
電気的に接続される。このリード７．８は、パネル２の
縁部２ａ、２ｂにおいて、半田付あるいはヒートシール
接続等によりパネル２の端子と電気的に接続される。Large scale 1! panel drive signal terminals 5a of product circuits 5 and 6;
6a is formed on the tape carrier 3.4 and electrically connected to a plurality of panels 7 and 8 for panel drive signal wiring made of copper RI or the like. The leads 7.8 are electrically connected to the terminals of the panel 2 at the edges 2a, 2b of the panel 2 by soldering, heat sealing, or the like.
各テープキャリア３，４の一表面上に形成された大規模
集積回路５，６の入力信号用端子５ｂ、６ｂと接続され
る入力信号配線用リード１５．１６は、このテープキャ
リア３．４の端部から突出し、別途準備された基板９の
一表面上に形成されたリード１０．１１の端部１０ａ、
１１ａと電気的に接続される。基板９は、７レキシプル
プリント基板（略称ＦＰＣ）あるいは一般のプリント配
線基板（略称ＰＷＢ）などであってもよい。大規模集積
回路５゜６側のリード１５．１６と接続されたテープキ
ャリア３，４側のリード１０．１１は、導通孔１２゜１
３を介して、大規模集積回路５，６の入力信号用の共通
配線であり、基板９の裏面に形成されたり−ド１４と選
択的に接続される。リード１４は、映像信号源や電源等
と接続される。映像信号源からの信号が大災ＰＡ集積回
路５．６に入力され、これに応答する大規模集積回路５
，６の出力信号によって、液晶表示素子パネル２が表示
駆動される。Input signal wiring leads 15 and 16 connected to input signal terminals 5b and 6b of large-scale integrated circuits 5 and 6 formed on one surface of each tape carrier 3 and 4 are An end 10a of a lead 10.11 protruding from the end and formed on one surface of a separately prepared substrate 9;
It is electrically connected to 11a. The board 9 may be a lexical printed circuit board (abbreviated as FPC) or a general printed wiring board (abbreviated as PWB). The leads 10.11 on the tape carriers 3 and 4 side connected to the leads 15.16 on the large-scale integrated circuit 5°6 side are connected to the leads 10.11 on the conductive hole 12°1.
3 is a common wiring for input signals of the large-scale integrated circuits 5 and 6, and is formed on the back surface of the substrate 9 and selectively connected to the -domain 14. The lead 14 is connected to a video signal source, a power source, and the like. The signal from the video signal source is input to the large-scale integrated circuit 5.6, and the large-scale integrated circuit 5 responds to this signal.
, 6, the liquid crystal display element panel 2 is driven for display.
発明が解決しようとする問題点
このように従来の複数テープキャリア３．４の接続方式
では、別途に信号源や電源等と連結するだめの基板９を
設ける必要があり、上述のように、基板９の表裏両面に
印刷配線を施したいわゆる２層配線基板を利用する場合
、コスト高となる。また部品点数が多くなり、特に基板
９として一般のプリント基板を用いる場合、製品の厚み
が増す。Problems to be Solved by the Invention As described above, in the conventional connection method of multiple tape carriers 3.4, it is necessary to separately provide a board 9 for connecting to a signal source, a power supply, etc. When using a so-called two-layer wiring board in which printed wiring is printed on both the front and back sides of 9, the cost becomes high. Furthermore, the number of parts increases, and especially when a general printed circuit board is used as the board 9, the thickness of the product increases.
本発明の目的は、上述の問題点に鑑み、構成が簡略化さ
れ、薄形化が可能な印刷配線基板の接続方式を提供する
ことである。SUMMARY OF THE INVENTION In view of the above-mentioned problems, an object of the present invention is to provide a printed wiring board connection method that has a simplified configuration and can be made thinner.
問題点を解決するための手段
本発明は、複数の入出力端子を有する電子回路装置が実
装され、信号源に連結されて電子回路装置の入力端子に
接続された共通ラインが印刷配線され、該共通ラインの
端部は周縁部より外方へ延設された複数の印刷配線基板
を含み、
共通ラインの上記外方へ延設された部分が、隣接する印
刷配線基板の共通ラインの端部と重ねられて各共通ライ
ンが互いに接続され、
各印刷配線基板ごとに、電子回路装置の入力端子と共通
ラインとは個別に接続手段で電気的に接続されることを
特徴とする印刷配線基板の接続方式である。Means for Solving the Problems The present invention provides an electronic circuit device in which an electronic circuit device having a plurality of input/output terminals is mounted, and a common line connected to a signal source and connected to an input terminal of the electronic circuit device is printed and wired. The end of the common line includes a plurality of printed wiring boards extending outward from the peripheral edge, and the outwardly extending portion of the common line is connected to the end of the common line of an adjacent printed wiring board. Connection of printed wiring boards characterized in that the common lines are overlapped and connected to each other, and for each printed wiring board, the input terminal of the electronic circuit device and the common line are individually electrically connected by connecting means. It is a method.
作 用
本発明に従えば、複数の入出力端子を有する電子回路装
置がそれぞれに実装された複数の印刷配線基板には、そ
れら電子回路装置に関連した共通ラインが印刷配線され
、この共通ラインの端部は印刷配線基板の周縁部より外
方へ延設されており、隣接する印刷配線基板の共通ライ
ンの端部と重ねられることによって、各共通ラインは互
いに接続され信号源に連結される。また各電子回路装置
の入力端子は、該電子回路装置が実装された印刷配線基
板ごとに形成された接続手段によって、前記共通ライン
と個別に電気的に接続される。したがって信号源からの
信号を、複数の電子回路装置のそれぞれの入力端子に選
択的に与えることができる。Effect According to the present invention, a common line related to the electronic circuit devices is printed and wired on a plurality of printed wiring boards, each of which is mounted with an electronic circuit device having a plurality of input/output terminals, and the common line is printed and wired. The ends extend outward from the periphery of the printed wiring board and are overlapped with the ends of the common lines of adjacent printed wiring boards, thereby connecting the common lines to each other and to the signal source. Further, the input terminals of each electronic circuit device are individually electrically connected to the common line by connection means formed for each printed wiring board on which the electronic circuit device is mounted. Therefore, signals from the signal source can be selectively applied to the respective input terminals of the plurality of electronic circuit devices.
実施例
第１図は、本発明の一実施例の接続方式を用いた液晶表
示装ｒｆｉ２１の一部分の分解斜視図である。Embodiment FIG. 1 is an exploded perspective view of a portion of a liquid crystal display device RFI 21 using a connection method according to an embodiment of the present invention.
液晶表示素子パネル２２の縁部２２ａ＋２２１）からは
、複数のテープキャリア２３．２４が突出して設（すら
れる。二のテープキャリア２３．２４は、たとえばポリ
イミド系のカプトンあるい１土ユービレツクス等の材料
から成り、テープ状の薄膜に形成され、各テープキャリ
ア２３．２４の一表面には、液晶表示素子パネル２２を
駆動するために、電子回路装置である大規模集積回路２
５．２６がそれぞれ実装される。A plurality of tape carriers 23, 24 are provided to protrude from the edge 22a+221) of the liquid crystal display element panel 22. The second tape carrier 23, 24 is made of a material such as polyimide-based Kapton or Ubilex. A large-scale integrated circuit 2, which is an electronic circuit device, is formed on one surface of each tape carrier 23, 24 to drive the liquid crystal display element panel 22.
5.26 are implemented respectively.
大規模集積回路２５．２６のパネル駆動信号用端子２５
ａ、２６ａは、テープキャリア２３．２４上に形成され
、銅箔等から成る複数本のパネル駆動信号配線用リード
２７．２８と電気的に接続される。このリード２７．２
８は、パネル２２の縁部２２ａ、２２ｂにおいて半田付
、あるいはヒートシール接続等により、パネル２２の端
子と電気的に接続される。Panel drive signal terminal 25 of large-scale integrated circuit 25 and 26
a, 26a are formed on the tape carrier 23.24 and electrically connected to a plurality of panel drive signal wiring leads 27.28 made of copper foil or the like. This lead 27.2
8 is electrically connected to the terminals of the panel 22 at the edges 22a, 22b of the panel 22 by soldering, heat seal connection, or the like.
一方、予めテープキャリア２３．２４の一表面上には、
複数本の入力信号配線用リード２つ、３０が形成される
。このリード２９は、テープキャリア２３上に実装され
た大規模集積回路２５に入カイ３号を導くだけでなく、
隣接するテープキャリア２４のリード３０にもまた入力
信号を導くいわゆる送り配線の役割も果たす。リード３
０もまたリード２９と同様の役割を有する。On the other hand, on one surface of the tape carrier 23.24,
Two leads 30 for input signal wiring are formed. This lead 29 not only guides the input circuit 3 to the large-scale integrated circuit 25 mounted on the tape carrier 23, but also
The leads 30 of the adjacent tape carriers 24 also play the role of so-called feed wiring for guiding input signals. lead 3
0 also has a role similar to lead 29.
リード２９．３０は受は部分２９ａ、３０ａと送り部分
２９ｂ、３０ｂとから成り、送り部分２９ｂ、３０ ｂ
は、屈曲して形成され、受は部分２９ａ、３０ａを横切
る形で大災ｙ＆集積回路２５．２６の入力信号用端子２
５ｂ＝２６ｂに接続される。送り部分２９ｂ、３０ｂ上
には、絶縁層３１．３２を介して接続手段である導体層
３３．３４が積層して形成される。この導体層３３．３
４は、リード２９．３０と同様の機能を有する配線パタ
ーンであり、その一方の端部は受は部分２９ａ、３０ａ
と接続され、他方の端部は送り部分２９ｂ、３０ｂと選
択的に接続される。これによって受は部分２９ａ、３０
ａは、送り部分２９ｂ、３０ｂ、および大規模集積回路
２５．２６の入力信号用端子２５＆、２６ｂと電気的に
接続される。また送り部分２９ｂ、３０ｂと、導体層３
３．３４との間には、絶縁層３１．３２が介在され、こ
れによって両者はいわゆる立体交差して配置されるため
、テープキャリア２３．２４の一表面上に複数本形Ｉ＆
されたリード２９．３０が相互に短絡接触することが防
がれる。絶縁層３１゜３２は、絶縁樹脂等が印刷されて
形成されてもよく、また導体層３３．３４は銀ペースト
等の印刷、あるいはｆ：ＡＭ等の貼着等によって形成さ
れてもよＩ／１゜
上述のようにして構成されたテープキャリア２３．２４
において、テープキャリア２３に形成されたリード２９
の送り部分２９ｂは、テープキャリア２３の緑から延設
されており、隣り合うテープキャリア２４に形成された
り−ド３０の受は部分３０ａを覆うようにして電気的に
接続される。The lead 29.30 consists of receiving parts 29a, 30a and feeding parts 29b, 30b.
is bent and formed, and the receiver crosses the portions 29a and 30a to connect the input signal terminal 2 of the catastrophe y & integrated circuit 25, 26.
Connected to 5b=26b. Conductor layers 33.34, which serve as connection means, are laminated and formed on the feeding portions 29b, 30b via insulating layers 31.32. This conductor layer 33.3
4 is a wiring pattern having the same function as the leads 29 and 30, and one end of the wiring pattern has receiver portions 29a and 30a.
The other end is selectively connected to the feeding portions 29b, 30b. As a result, the receiver parts 29a, 30
a is electrically connected to the feed portions 29b, 30b and the input signal terminals 25&, 26b of the large-scale integrated circuits 25, 26. In addition, the feeding portions 29b and 30b and the conductor layer 3
3.34, an insulating layer 31.32 is interposed between the tape carrier 23.34 and the tape carrier 23.24.
This prevents the connected leads 29, 30 from coming into short-circuiting contact with each other. The insulating layers 31 and 32 may be formed by printing insulating resin or the like, and the conductor layers 33 and 34 may be formed by printing silver paste or the like or pasting f:AM or the like. 1° Tape carrier 23.24 configured as described above
, the leads 29 formed on the tape carrier 23
The feeding portion 29b extends from the green part of the tape carrier 23, and the receivers of the leads 30 formed on the adjacent tape carriers 24 are electrically connected so as to cover the portion 30a.
同様にテープキャリア２４の送り部分３０ｂは、隣り合
うテープキャリアの受は部分と接続される。Similarly, the feeding section 30b of the tape carrier 24 is connected to the receiving section of an adjacent tape carrier.
このようにして各テープキャリア２３．２４は、順次的
に共通入力配線され、大規模集積回路２５゜２６の入力
信号用端子２５ｂ、２６ｂは、映像信号源や電源等に選
択的に接続され、液晶表示素子・ネル２２が表示駆動さ
れる。In this way, each tape carrier 23, 24 is sequentially connected to common input wiring, and the input signal terminals 25b, 26b of the large-scale integrated circuits 25, 26 are selectively connected to a video signal source, a power source, etc. The liquid crystal display element/channel 22 is driven for display.
第２図は、本発明の他の実施例の接続方式を用いた液晶
表示装置４１の一部分の分解斜視図である。この実施例
は前述の実施例に類似し、対応する部分には同一の参照
符を付す。この実施例では、リード２９．３０の受は部
分２９ａ、３０ａと送り部分２９＋）、３０＋１との間
には、接続手段である微小７レキンプルプリント基板４
２．４３が介在される。この微小７レキシプルプリント
基板４２．４３は、電気絶縁性の基材４４．４５の一表
面上に配線パターン４Ｇ、４７が形成されて成る。こう
して受は部分２９ａ、３０ａは、送り部分２９ｂ、３０
ｂ、および大規模集積回路２５．２６の入力信号用端子
２５ｂ、２６ｂと選択的に接続され、液晶表示素子パネ
ル２２が表示駆動される。また送り部分２９ｂ、３０ｂ
と、配線パターン４６．４７との間には基材４４，４５
が介在され、これによって両者はいわゆる立体交差して
配置されるため、テープキャリア２３．２４の一表面上
に複数本形成されたリード２９．３０が相互に短絡接触
することが防がれる。FIG. 2 is an exploded perspective view of a portion of a liquid crystal display device 41 using a connection method according to another embodiment of the present invention. This embodiment is similar to the previous embodiment and corresponding parts are provided with the same reference numerals. In this embodiment, the receptacles of the leads 29, 30 are connected between the portions 29a, 30a and the feed portions 29+), 30+1, with a micro 7 rekin pull printed circuit board 4 serving as a connection means.
2.43 is interposed. This micro 7 lexical printed circuit board 42.43 is made up of wiring patterns 4G, 47 formed on one surface of an electrically insulating base material 44.45. Thus, the receiving portions 29a, 30a are replaced by the feeding portions 29b, 30.
b, and input signal terminals 25b and 26b of the large-scale integrated circuits 25 and 26, and the liquid crystal display element panel 22 is driven for display. Also, the feeding parts 29b, 30b
There are base materials 44 and 45 between the wiring patterns 46 and 47.
are interposed therebetween, and as a result, they are arranged in a so-called three-dimensional intersection, thereby preventing the plurality of leads 29, 30 formed on one surface of the tape carrier 23, 24 from coming into short-circuit contact with each other.
第３図は、本発明のさらに他の実施例の接続方式を用い
た液晶表示装置５１の一部分の分解斜視図である。この
実施例は前述の実施例にＭ似し、対応する部分には同一
の参照符を付す。この実施例では、入力信号配線用リー
ド５２．５３の受は部分５２ａ、５３ａと、送り部分５
２ｂ、５３ｂとは連続して形成され、大災Ｉｓ積回路２
５．２Ｇの入力信号用端子２５ｂ、２（３ｂは、導体層
５４．５５を介して、このリード５２．５３と選択的に
接続される。導体Ｊｒ！Ｊ５４．５５は、リード５２．
５３といわゆる立体交差して配置され、両者間には絶縁
層５６．５７が介在される。したがってテープキャリア
２３．２４上に複数本形成されたリード５２゜５３と導
体Ｗｉ５４，５５とが相互に短ｖｒ接触することが防が
れる。導体ＷＩ５４．５５は、絶縁層５６．５７に形成
された導通孔５８．５９を通してリード５２．５３と接
続される。こうして大規模集積回路２５．２６の入力信
号用端子２５１）、２ Ｇ ｂは、リード５２．５３と
選択的に接続され、液晶表示素子パネル２２が表示駆動
される。FIG. 3 is an exploded perspective view of a portion of a liquid crystal display device 51 using a connection method according to still another embodiment of the present invention. This embodiment is similar to the previously described embodiment, and corresponding parts are provided with the same reference numerals. In this embodiment, the receivers of the input signal wiring leads 52, 53 have portions 52a, 53a and feed portions 5.
2b and 53b are formed continuously, and the catastrophe Is product circuit 2
The 5.2G input signal terminals 25b, 2 (3b) are selectively connected to this lead 52.53 via the conductor layer 54.55.The conductor Jr!J54.55 is connected to the lead 52.55.
53, and insulating layers 56 and 57 are interposed between the two. Therefore, the plurality of leads 52, 53 formed on the tape carrier 23, 24 and the conductors Wi 54, 55 are prevented from coming into short vr contact with each other. Conductor WI54.55 is connected to lead 52.53 through conductive hole 58.59 formed in insulating layer 56.57. In this way, the input signal terminals 251) and 2Gb of the large-scale integrated circuits 25 and 26 are selectively connected to the leads 52 and 53, and the liquid crystal display element panel 22 is driven for display.
第４図は、本発明の他の実施例の接続方式を用いた液晶
表示装Ｆ１６１の一部分の分解斜視図である。この実施
例は、第３図に示された実施例に預臥し、対応する部分
には同一の参照符を付す。注目すべきは、大規模集積回
路２５．２６の入力信号用端子２５１＋、２６ｂは、微
小フレキシブルプリント基板６２．６３によって、入力
信号配線用リード５２．５３と選択的に接続されること
である。FIG. 4 is an exploded perspective view of a portion of a liquid crystal display device F161 using a connection method according to another embodiment of the present invention. This embodiment is a prerequisite to the embodiment shown in FIG. 3, and corresponding parts are given the same reference numerals. What should be noted is that the input signal terminals 251+, 26b of the large-scale integrated circuit 25.26 are selectively connected to the input signal wiring leads 52.53 by the micro flexible printed circuit board 62.63.
この微小７レキシプルプリント基板６２．ｆ３３は、電
気絶縁性の基材６Ｇ、６７の一表面に配線パターン６８
．６９が形成されて成る。したがってテープキャリア２
３．２４上に複数本形成されたリード５２．５３と配線
パターン６８．６９とが相互に短絡接触することが防が
れる。こうして大規模集積回路２５．２６の入力信号用
端子２５ｂ、２６ｂは、リード５２．５３と選択的に接
続され、液晶表示素子パネル２２が表示駆動される。This minute 7 lexiple printed circuit board 62. f33 has a wiring pattern 68 on one surface of the electrically insulating base material 6G, 67.
．． 69 is formed. Therefore tape carrier 2
This prevents the plurality of leads 52, 53 formed on 3.24 and the wiring patterns 68, 69 from coming into short-circuit contact with each other. In this way, the input signal terminals 25b, 26b of the large-scale integrated circuits 25, 26 are selectively connected to the leads 52, 53, and the liquid crystal display element panel 22 is driven to display.
第５図は、本発明のさらに他の実施例の接続方式を用い
た液晶表示装置７１の一部分の分解斜視図である。この
実施例は、第３図に示された実施例にＭＵし、対応する
部分には同一の参照符を付す。この実施例では、入力信
号配線用リード７２゜７３の受は部分７２ａ、７３ａと
送り部分７２ｂ、７３Ｌ＋とは、テープキャリア７４．
７５の裏面に、連続して形成される。テープキャリア？
４，７５の一表面上には、導入部７Ｇ、７７が形成され
、大規模集積回路２５．２６の入力信号用端子２５ｂ。FIG. 5 is an exploded perspective view of a portion of a liquid crystal display device 71 using a connection method according to still another embodiment of the present invention. This embodiment is similar to the embodiment shown in FIG. 3, and corresponding parts are given the same reference numerals. In this embodiment, the receiving portions 72a and 73a of the input signal wiring leads 72 and 73 and the feeding portions 72b and 73L+ are connected to the tape carrier 74.
75 and is continuously formed on the back surface of 75. Tape carrier?
Introducing portions 7G, 77 are formed on one surface of the large-scale integrated circuits 25, 75, and input signal terminals 25b of the large-scale integrated circuits 25, 26.
２６ｂは、この導入部７ｆ３，７７を介して、リード７
２．７３と選択的に接続される。導入部７６．７７は、
リード７２．７３といわゆる立体交差して配置され、両
者はテープキャリア７４．７５に形成された導通孔７８
．７９を通して接続される。26b is connected to the lead 7 through the introducing portions 7f3 and 77.
2.73 is selectively connected. The introduction part 76.77 is
The leads 72 and 73 are arranged in a so-called three-dimensional intersection, and both are connected to the conductive holes 78 formed in the tape carrier 74 and 75.
．． Connected through 79.
したがってテープキャリア７４．７５の裏面に複数本形
成されたリード７２．７３と導入部７６．７７とが相互
に短絡接触することが防がれる。こうして大規模集積回
路２５．２６の入力信号用端子２５ｂ、２６ｂは、リー
ド７２．７３と選択的に接続され、液晶表示素子パネル
２２が表示ｉ動される。Therefore, the plurality of leads 72.73 formed on the back surface of the tape carrier 74.75 and the introduction portion 76.77 are prevented from coming into short-circuit contact with each other. In this way, the input signal terminals 25b, 26b of the large-scale integrated circuits 25, 26 are selectively connected to the leads 72, 73, and the liquid crystal display element panel 22 is displayed.
以上各実施例で示されたように、テーブキャ１゜ア２３
，２４，７４．７５ 上で、大規模集積回路２５．２
Ｇの入力ラインと送り配線ラインとがいゎつる立体交差
して形成されるため、複数本で構成されたラインが相互
に短絡接触することなく配線することができる。As shown in each of the above embodiments, the table carrier 1°a 23
, 24, 74.75 on large-scale integrated circuits 25.2
Since the G input line and the sending wiring line are formed in a vertically intersecting manner, a plurality of lines can be wired without short-circuiting and contacting each other.
上述の各実施例では、液晶表示素子パネル２が用いられ
たが、他の表示素子パネル（たとえばブフＸマ、ＥＬ等
）が用いられでもよい。また表示素子パネルに限らず各
種集積回路素子が実装された印刷配線基板について広〈
実施される。Although the liquid crystal display element panel 2 is used in each of the above-mentioned embodiments, other display element panels (for example, Buchxma, EL, etc.) may be used. In addition to display element panels, we also provide wide-ranging information about printed wiring boards on which various integrated circuit elements are mounted.
Implemented.
効 果
以上のように本発明によれば、各印刷配線基板内には共
通ラインが形成され、各印刷配線基板に実装された電子
回路装置の入力端子はそれらと選択的に接続される。ま
た、共通ラインの端部は、印刷配線基板の周縁部より外
方へ延設されており、隣接する印刷配線基板の共通ライ
ンの端部と重ねられて接続されるようにしたので、共通
ラインを形成するために、別途に基板を設ける必要がな
く、ｖｔ成が簡略化され、薄型化が可能となる。Effects As described above, according to the present invention, common lines are formed in each printed wiring board, and input terminals of electronic circuit devices mounted on each printed wiring board are selectively connected to them. In addition, the end of the common line extends outward from the peripheral edge of the printed wiring board, and is overlapped and connected to the end of the common line of an adjacent printed wiring board, so that the common line There is no need to provide a separate substrate in order to form this, simplifying the Vt formation and making it possible to reduce the thickness.
ｐｔＳ１図は本発明の一実施例の接続方式を用いた液晶
表示装ｒ！１２１の一部分の分解斜視図、第２図は本発
明の他の実施例の接続方式を用いた液晶表示装ｒ！１４
１の一部分の分解斜視図、第３図は本発明のさらに他の
実施例の接続方式を用いた液晶表示装置５１の一部分の
分解斜視図、第４図は本発明の池の実施例の接続方式を
泪いた液晶表示装置６１の一部分の分解斜視図、Ｐｔ５
５図は本発明のさらに他の実施例の接続方式を用いた液
晶表示装置７１の一部分の分解斜視図、第６図は従来技
術の接続方式を用いた液晶表示装置１の一部分の分解斜
視図である。ptS1 diagram shows a liquid crystal display r! using the connection method of one embodiment of the present invention. FIG. 2 is an exploded perspective view of a portion of 121, and FIG. 2 is a liquid crystal display device using a connection method according to another embodiment of the present invention. 14
FIG. 3 is an exploded perspective view of a portion of a liquid crystal display device 51 using a connection method according to still another embodiment of the present invention, and FIG. An exploded perspective view of a portion of the liquid crystal display device 61 showing the method, Pt5
FIG. 5 is an exploded perspective view of a portion of a liquid crystal display device 71 using a connection method according to another embodiment of the present invention, and FIG. 6 is an exploded perspective view of a portion of a liquid crystal display device 1 using a connection method of the prior art. It is.
Claims (1)
信号源に連結されて電子回路装置の入力端子に接続され
た共通ラインが印刷配線され、該共通ラインの端部は周
縁部より外方へ延設された複数の印刷配線基板を含み、 共通ラインの上記外方へ延設された部分が、隣接する印
刷配線基板の共通ラインの端部と重ねられて各共通ライ
ンが互いに接続され、 各印刷配線基板ごとに、電子回路装置の入力端子と共通
ラインとは個別に接続手段で電気的に接続されることを
特徴とする印刷配線基板の接続方式。[Claims] An electronic circuit device having a plurality of input/output terminals is mounted,
A common line connected to the signal source and connected to the input terminal of the electronic circuit device is printed and wired, the ends of the common line including a plurality of printed wiring boards extending outward from the periphery, the common line The outwardly extending portions of the above are overlapped with the ends of the common lines of adjacent printed wiring boards so that the common lines are connected to each other, and the common lines are connected to the input terminals of the electronic circuit device for each printed wiring board. A printed wiring board connection method characterized by electrically connecting lines with individual connection means.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP27239586A JPS63126292A (en) | 1986-11-14 | 1986-11-14 | Interconnection system of printed wiring board |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP27239586A JPS63126292A (en) | 1986-11-14 | 1986-11-14 | Interconnection system of printed wiring board |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| JPS63126292A true JPS63126292A (en) | 1988-05-30 |
| JPH0556877B2 JPH0556877B2 (en) | 1993-08-20 |
Family
ID=17513296
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP27239586A Granted JPS63126292A (en) | 1986-11-14 | 1986-11-14 | Interconnection system of printed wiring board |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPS63126292A (en) |
Cited By (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPH04489A (en) * | 1990-04-17 | 1992-01-06 | Sharp Corp | Display device |
| US5592199A (en) * | 1993-01-27 | 1997-01-07 | Sharp Kabushiki Kaisha | Assembly structure of a flat type device including a panel having electrode terminals disposed on a peripheral portion thereof and method for assembling the same |
| US7327090B2 (en) | 2002-08-30 | 2008-02-05 | Seiko Epson Corporation | Electronic module, methods of manufacturing and driving the same, and electronic instrument |
-
1986
- 1986-11-14 JP JP27239586A patent/JPS63126292A/en active Granted
Cited By (7)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPH04489A (en) * | 1990-04-17 | 1992-01-06 | Sharp Corp | Display device |
| US5592199A (en) * | 1993-01-27 | 1997-01-07 | Sharp Kabushiki Kaisha | Assembly structure of a flat type device including a panel having electrode terminals disposed on a peripheral portion thereof and method for assembling the same |
| US5670994A (en) * | 1993-01-27 | 1997-09-23 | Sharp Kabushiki Kaisha | Assembly structure of a flat type device including a panel having electrode terminals disposed on a peripheral portion |
| EP1221717A3 (en) * | 1993-01-27 | 2004-05-12 | Sharp Kabushiki Kaisha | Assembly structure of a flat type device including a panel having electrode terminals disposed on a peripheral portion thereof and method for assembling the same |
| US7327090B2 (en) | 2002-08-30 | 2008-02-05 | Seiko Epson Corporation | Electronic module, methods of manufacturing and driving the same, and electronic instrument |
| US7924275B2 (en) | 2002-08-30 | 2011-04-12 | Seiko Epson Corporation | Electronic module, methods of manufacturing and driving the same, and electronic instrument |
| US8432382B2 (en) | 2002-08-30 | 2013-04-30 | Seiko Epson Corporation | Electronic module, methods of manufacturing and driving the same, and electronic instrument |
Also Published As
| Publication number | Publication date |
|---|---|
| JPH0556877B2 (en) | 1993-08-20 |
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| Date | Code | Title | Description |
|---|---|---|---|
| EXPY | Cancellation because of completion of term |