JPH04184322A - Liquid crystal display device - Google Patents
Liquid crystal display deviceInfo
- Publication number
- JPH04184322A JPH04184322A JP31332290A JP31332290A JPH04184322A JP H04184322 A JPH04184322 A JP H04184322A JP 31332290 A JP31332290 A JP 31332290A JP 31332290 A JP31332290 A JP 31332290A JP H04184322 A JPH04184322 A JP H04184322A
- Authority
- JP
- Japan
- Prior art keywords
- liquid crystal
- substrate
- crystal display
- printed
- electrodes
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Granted
Links
- 239000004973 liquid crystal related substance Substances 0.000 title claims description 35
- 239000000758 substrate Substances 0.000 claims abstract description 58
- 239000011347 resin Substances 0.000 claims abstract description 19
- 229920005989 resin Polymers 0.000 claims abstract description 19
- 239000003973 paint Substances 0.000 claims description 15
- 210000002858 crystal cell Anatomy 0.000 claims description 4
- 239000010410 layer Substances 0.000 abstract description 16
- 239000012790 adhesive layer Substances 0.000 abstract description 5
- 239000000945 filler Substances 0.000 abstract description 3
- 238000001465 metallisation Methods 0.000 abstract description 2
- 238000004806 packaging method and process Methods 0.000 abstract description 2
- 239000011248 coating agent Substances 0.000 abstract 2
- 238000000576 coating method Methods 0.000 abstract 2
- 238000009413 insulation Methods 0.000 abstract 2
- 239000000463 material Substances 0.000 abstract 2
- 238000000465 moulding Methods 0.000 abstract 1
- 238000000034 method Methods 0.000 description 21
- 239000011521 glass Substances 0.000 description 5
- 238000007639 printing Methods 0.000 description 4
- OKTJSMMVPCPJKN-UHFFFAOYSA-N Carbon Chemical compound [C] OKTJSMMVPCPJKN-UHFFFAOYSA-N 0.000 description 3
- 229910052799 carbon Inorganic materials 0.000 description 3
- 238000007772 electroless plating Methods 0.000 description 2
- 238000005516 engineering process Methods 0.000 description 2
- 239000002184 metal Substances 0.000 description 2
- 239000000203 mixture Substances 0.000 description 2
- 238000000206 photolithography Methods 0.000 description 2
- 239000004417 polycarbonate Substances 0.000 description 2
- 238000007650 screen-printing Methods 0.000 description 2
- 238000005275 alloying Methods 0.000 description 1
- 238000005452 bending Methods 0.000 description 1
- 238000010586 diagram Methods 0.000 description 1
- 230000000694 effects Effects 0.000 description 1
- 230000006355 external stress Effects 0.000 description 1
- 238000004519 manufacturing process Methods 0.000 description 1
- 239000002923 metal particle Substances 0.000 description 1
- 238000007747 plating Methods 0.000 description 1
- 229920000515 polycarbonate Polymers 0.000 description 1
- 229920000728 polyester Polymers 0.000 description 1
- 229920006393 polyether sulfone Polymers 0.000 description 1
- 238000005476 soldering Methods 0.000 description 1
- 229920001187 thermosetting polymer Polymers 0.000 description 1
Classifications
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K1/00—Printed circuits
- H05K1/02—Details
- H05K1/09—Use of materials for the conductive, e.g. metallic pattern
- H05K1/092—Dispersed materials, e.g. conductive pastes or inks
- H05K1/095—Dispersed materials, e.g. conductive pastes or inks for polymer thick films, i.e. having a permanent organic polymeric binder
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/30—Assembling printed circuits with electric components, e.g. with resistor
- H05K3/32—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits
- H05K3/321—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits by conductive adhesives
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/36—Assembling printed circuits with other printed circuits
- H05K3/361—Assembling flexible printed circuits with other printed circuits
Landscapes
- Devices For Indicating Variable Information By Combining Individual Elements (AREA)
- Electric Connection Of Electric Components To Printed Circuits (AREA)
- Liquid Crystal (AREA)
Abstract
Description
【発明の詳細な説明】
〔産業上の利用分野〕
本発明は可撓性フィルム基板からなる液晶表示素子とそ
の駆動用ドライバーからなる液晶表示装置に関する。DETAILED DESCRIPTION OF THE INVENTION [Field of Industrial Application] The present invention relates to a liquid crystal display device comprising a liquid crystal display element made of a flexible film substrate and a driver for driving the liquid crystal display element.
近年、液晶表示装置の小型、薄型、軽量化さらに高表示
容量化に対する要求が急速に高まっている。液晶用の基
板としてガラスのかわりに厚さ100ps程度のポリエ
ステル、ポリカーボネート、ポリエーテルサルフオン等
の可撓性フィルム基板が注目されている。これは液晶表
示素子の薄型軽量化が可能であり、さらに加工の容易性
、低コスト化等のメリットを持つからである。In recent years, there has been a rapid increase in demand for liquid crystal display devices to be smaller, thinner, lighter, and higher in display capacity. Instead of glass, flexible film substrates made of polyester, polycarbonate, polyether sulfon, etc. with a thickness of about 100 ps are attracting attention as substrates for liquid crystals. This is because the liquid crystal display element can be made thinner and lighter, and has advantages such as ease of processing and cost reduction.
一方、小型化、高表示容量化達成のための技術課題とし
て駆動用ドライバーの高密度実装化がある。駆動用LS
Iをペアチップの状態で実装する事によりこの高密度化
は達成可能となった。LSIのペアチップをテープキャ
リア上に直接実装したTAB方式が量産レベルで実用化
されている。最近ではLSIペアチップを直接ガラス液
晶基板上に塔載する方法(COG)が注目されている。On the other hand, a technical challenge for achieving miniaturization and high display capacity is high-density packaging of drivers. Drive LS
This high density can be achieved by mounting I as a pair of chips. The TAB method, in which paired LSI chips are directly mounted on a tape carrier, has been put into practical use at the mass production level. Recently, a method of directly mounting an LSI pair chip on a glass liquid crystal substrate (COG) has been attracting attention.
特にLSIチップの端子部と液晶基板上の電極との接続
に半田、ワイヤーボンディング等の合金化方法によらな
いマイクロバンプ方式を用いた場合、電極ピッチ100
μm以下での面実装が可能となり、高表示容量化のため
の実装技術として最も注目されている(日経マイクロデ
バイス、1989年7月、p41−65)。In particular, when using a microbump method that does not rely on alloying methods such as soldering or wire bonding to connect the terminals of the LSI chip and the electrodes on the liquid crystal substrate, the electrode pitch is 100.
It has become possible to perform surface mounting in micrometers or less, and is attracting the most attention as a mounting technology for increasing display capacity (Nikkei Microdevices, July 1989, p. 41-65).
従来、LSIチップダイレクト実装法においては、例え
ばCOGの場合、第5図の様に表示電極につながりチッ
プ出力端子に接続される出力電極群16、チップ入力端
子に接続される入力用引き込み電極群17、さらに各L
SIチップ15につながるこれら引き込み電極群同士を
結ぶ共通電極(パスライン)18が形成されている。こ
れら引き込み電極群17及び共通電極18はライン抵抗
を下げるために透明電極上に無電解メツキ等の方法でメ
タライズを施した積層構造としている。Conventionally, in the LSI chip direct mounting method, for example, in the case of COG, as shown in FIG. , and each L
A common electrode (pass line) 18 is formed that connects these lead-in electrode groups connected to the SI chip 15. The lead-in electrode group 17 and the common electrode 18 have a laminated structure in which transparent electrodes are metallized by electroless plating or the like in order to reduce line resistance.
チップダイレクト実装法では共通電極を液晶基板上に設
けず、外部回路基板上に形成する方法も考えられている
。第6図はその1例で液晶基板上に形成されLSIチッ
プ15の入力端子に接続された引き込み電極群17をF
PCを介して外部基板上の共通電極18に接続した方法
である。また特開昭62−15586号公報には外部回
路基板上の共通電極と引き込み電極とを導電ペーストを
用いて接続する方法が記載されている。In the chip direct mounting method, a method is being considered in which the common electrode is not provided on the liquid crystal substrate but is formed on an external circuit board. FIG. 6 shows one example of this, in which a lead-in electrode group 17 formed on a liquid crystal substrate and connected to an input terminal of an LSI chip 15 is connected to an F.
This method connects to the common electrode 18 on the external board via a PC. Further, Japanese Patent Application Laid-Open No. 15586/1986 describes a method of connecting a common electrode and a lead-in electrode on an external circuit board using a conductive paste.
しかしながら、前記従来技術には以下に示すような問題
点があった。However, the prior art has the following problems.
第5図に示された様にLSIチップが塔載された液晶基
板上に共通電極部を設けた場合、共通電極部がしめる面
積が大きくなるため液晶基板の使用面積が大きくなって
しまうと言う欠点がある。又、何らかの方法を用いて入
力端子用電極群と共通電極を積層交差配線する必要が出
てくる。ガラス基板の場合はワイヤーボンディングを用
いて交差配線する事が出来るが、液晶基板として可撓性
フィルム基板を使用した場合には基板自体の耐熱性が低
いため他の方法を取らざるを得ない。さらに、第5図の
方法では透明電極表面をメタライズしているために非常
にコスト高となる。特に可撓性フィルム上に形成された
透明電極のメタライズはガラス基板の様に無電解メツキ
法により電極上に選択的に金属を析出しにくいためメタ
ライズの工程がガラスにくらべてさらにコスト高で複雑
になる。If a common electrode section is provided on a liquid crystal substrate on which an LSI chip is mounted as shown in Fig. 5, the area occupied by the common electrode section becomes large, so the area used for the liquid crystal substrate becomes large. There are drawbacks. Further, it becomes necessary to use some method to stack and cross-wire the input terminal electrode group and the common electrode. In the case of a glass substrate, cross wiring can be performed using wire bonding, but when a flexible film substrate is used as a liquid crystal substrate, other methods must be used because the heat resistance of the substrate itself is low. Furthermore, in the method shown in FIG. 5, the surface of the transparent electrode is metallized, resulting in a very high cost. In particular, metallizing transparent electrodes formed on flexible films is difficult to selectively deposit metal on the electrodes using electroless plating, unlike glass substrates, so the metallization process is more costly and complicated than for glass. become.
第6図に示された方法では、入力電極と共通電極との接
続をFPCを介して行なっているため、部品点数の増加
及び接続工程数の増加と言う欠点がある。又、液晶パネ
ル、FPC5共通電極基板と3種の構成よりなるため液
晶表示装置としてユニット化するためにはさらに支持部
材等が必要となる。In the method shown in FIG. 6, since the input electrode and the common electrode are connected via the FPC, there are drawbacks such as an increase in the number of parts and the number of connection steps. Furthermore, since it consists of three types of configurations, including a liquid crystal panel and an FPC5 common electrode substrate, supporting members and the like are additionally required in order to unitize it as a liquid crystal display device.
特開昭62−15586号公報に示された方法では、ス
ルーホールを有する両面配線基板を新たにおこす必要が
ありコスト高となる。The method disclosed in Japanese Unexamined Patent Publication No. 62-15586 requires a new double-sided wiring board having through holes, resulting in high costs.
本発明は、内側に透明電極を有し、配向処理された上下
一対の可撓性フィルム基板により液晶層を挾持させた液
晶セルの上下に各々偏光板を配設した液晶表示素子と該
液晶表示素子を駆動する駆動用ドライバーからなる液晶
表示装置において、駆動用ドライバーに入力するための
引き込み電極群を各々のドライバー間で結線するための
共通電極(パスライン)配線を最小の実装面積でかつメ
タライズする事なく、低コスト、低工程数で実現する事
を目的とする。The present invention relates to a liquid crystal display element comprising a liquid crystal cell having a transparent electrode inside and a liquid crystal layer sandwiched between a pair of upper and lower aligned flexible film substrates, and polarizing plates disposed on each of the upper and lower sides of the liquid crystal cell, and the liquid crystal display. In a liquid crystal display device consisting of a driving driver that drives an element, common electrode (pass line) wiring for connecting a group of lead-in electrodes for inputting to the driving driver between each driver has a minimum mounting area and is metallized. The aim is to achieve this at low cost and with a low number of steps without having to do anything.
上記目的を達成するため、本発明の液晶表示装置は、液
晶表示素子を構成する可撓性フィルム基板上に少なくと
も一層の導電性樹脂塗料で印刷した駆動用ドライバーに
入力するための引き込み電極群が形成され、別個の可撓
性フィルム基板上に少なくとも一層の導電性樹脂塗料で
印刷した共通電極(パスライン)群が形成され、一方の
基板の電極群の上部に絶縁性樹脂塗料を印刷した絶縁接
着層が形成されており、その両基板が導電層を介して熱
圧着されている事を特徴とする特
〔作用〕
本発明では、導電性樹脂塗料で可撓性液晶表示素子フィ
ルム基板上に印刷形成したドライバー人力用引き込み電
極群と、別個の可撓性フィルム基板上に導電性樹脂塗料
で印刷形成した共通電極との導通を、所要の箇所に導電
層を設けると共に一方の電極群の上部に絶縁性樹脂塗料
を印刷し、両基板を熱圧着することにより行っているた
め、可撓性フィルム基板の使用にかかわらず、透明電極
のメタライズしなくてもすみ、また実装面積を最小化で
き、さらに部品点数、工程数が低減できる。In order to achieve the above object, the liquid crystal display device of the present invention includes a group of lead-in electrodes for inputting to a driving driver printed with at least one layer of conductive resin paint on a flexible film substrate constituting the liquid crystal display element. A group of common electrodes (pass lines) printed with at least one layer of conductive resin paint is formed on separate flexible film substrates, and an insulating layer is formed with an insulating resin paint printed on the top of the electrode group of one substrate. Features [Function] Features: An adhesive layer is formed and both substrates are thermocompression bonded via a conductive layer. In the present invention, a conductive resin paint is applied to a flexible liquid crystal display element film substrate. A conductive layer is provided at the required location and the upper part of one electrode group is connected to the print-formed driver manual lead-in electrode group and the common electrode printed and formed with conductive resin paint on a separate flexible film substrate. This is done by printing an insulating resin paint on the board and thermocompressing the two boards, which eliminates the need to metalize the transparent electrodes and minimizes the mounting area, regardless of whether a flexible film board is used. Furthermore, the number of parts and processes can be reduced.
以下本発明を実施例に基づき詳細に説明する。 The present invention will be described in detail below based on examples.
第1図は本発明の本実施例の斜視図であり、図中1は表
示エリア、2はLSIチップ5が塔載された可撓性フィ
ルムよりなる下基板、3は上基板、4は共通電極8の印
刷された可撓性フィルムよりなる基板、6は表示電極に
つながりLSIチップ5の出力端子に接続された出力電
極群、7はLSIチップ5の入力端子に接続された引き
込み電極群である。また第2図は第1図のA−A線断面
図、第3図(a) 、 (b)は下基板2上の引き込み
電極群7の詳細図、第4図(a)。FIG. 1 is a perspective view of this embodiment of the present invention, in which 1 is a display area, 2 is a lower substrate made of a flexible film on which an LSI chip 5 is mounted, 3 is an upper substrate, and 4 is a common A substrate made of a flexible film with electrodes 8 printed on it, 6 a group of output electrodes connected to the display electrodes and connected to the output terminals of the LSI chip 5, and 7 a group of lead-in electrodes connected to the input terminals of the LSI chip 5. be. 2 is a sectional view taken along line A--A in FIG. 1, FIGS. 3(a) and 3(b) are detailed views of the lead-in electrode group 7 on the lower substrate 2, and FIG. 4(a).
(b)、(c)は共通電極8の印刷された基板4の詳細
図である。(b) and (c) are detailed views of the substrate 4 on which the common electrode 8 is printed.
本実施例では、引き込み電極群7を、第3図に示すよう
に、基板3−A上にまず透明電極3−Hのパターンをフ
ォトリソグラフィーにより形成し、形成された透明電極
3−B上にスクリーン印刷法により導電性樹脂塗料3−
Cを印刷することにより構成する。In this embodiment, as shown in FIG. 3, the lead-in electrode group 7 is formed by first forming a pattern of transparent electrodes 3-H on a substrate 3-A by photolithography, and then forming a pattern of transparent electrodes 3-H on the formed transparent electrodes 3-B. Conductive resin paint 3- by screen printing method
Configure by printing C.
本実施例では導電性部材としてAgとカーボン混合を用
いた。共通電極8は、第4図に示すように、フォトリソ
グラフィーにより基板4−Aに形成された透明電極4−
B上にへg/カーボン入りの導電性樹脂塗料4−Cをま
ず印刷し、次にこの共通電極上で第3図の引き込み電極
群7に接続される箇所にスクリーン印刷法により導電層
4−Dを形成することにより構成する。本実施例では導
電層4−DとしてAg/カーボンブレンド金属粒子フィ
ラーを樹脂塗料内に分散したものを用いた。次に共通電
極8上全面に熱硬化性樹脂塗料よりなる絶縁接着層4−
Eを印刷する。この様に共通電極8の形成された基板4
を下基板2上の引き込み電極群7上に重ね位置合わせし
た後、ヒートシーラーにより加熱圧着すると、上下方向
の導通が金属フィラー入り導電層4−Dの形成された箇
所のみでとれるようになる。In this example, a mixture of Ag and carbon was used as the conductive member. As shown in FIG. 4, the common electrode 8 is a transparent electrode 4-A formed on a substrate 4-A by photolithography.
First, a conductive resin paint 4-C containing carbon is printed on B, and then a conductive layer 4-C is printed by screen printing on the common electrode at the location where it will be connected to the lead-in electrode group 7 shown in FIG. Constructed by forming D. In this example, a layer in which Ag/carbon blend metal particle filler was dispersed in a resin paint was used as the conductive layer 4-D. Next, an insulating adhesive layer 4- made of thermosetting resin paint is applied to the entire surface of the common electrode 8.
Print E. The substrate 4 on which the common electrode 8 is formed in this way
After superimposing and positioning on the lead-in electrode group 7 on the lower substrate 2, the electrodes are heated and pressed using a heat sealer, so that vertical conduction can be established only at the location where the metal filler-containing conductive layer 4-D is formed.
本実施例では共通電極の形成された可撓性フィルム基板
を工程上あるいはユニット上別部品として作ったが、例
えば下基板上の余白部に上記の方法で共通電極を形成し
た後、この部分を下基板より切り離して用いる事も可能
である。In this example, the flexible film substrate on which the common electrode was formed was made as a separate part in the process or on the unit. For example, after forming the common electrode in the margin area on the lower substrate by the above method, this part It is also possible to use it by separating it from the lower substrate.
また、本実施例ではLSIチップを下基板上に塔載した
形態をとったが、TABを用いた場合においても引き込
み電極、共通電極の構成、接続法は本実施例の様に適応
する事ももちろん可能である。Also, in this example, the LSI chip is mounted on the lower substrate, but even when TAB is used, the configuration and connection method of the lead-in electrode and common electrode can be adapted as in this example. Of course it is possible.
本発明によれば、液晶表示素子を構成する可撓性フィル
ム基板上に少なくとも一層の導電性樹脂塗料で印刷した
駆動用ドライバー人力用の引き込み電極群を形成し、別
個の可撓性フィルム基板上に少なくとも一層の導電性樹
脂塗料で印刷した共通電極(パスライン)群を形成し、
一方の基板の電極群の上部に絶縁性樹脂塗料を印刷した
絶縁接着層を形成し、その両基板を導電層を介して熱圧
着したので、共通電極配線を最小の実装面積でかつ従来
のメツキ等によるメタライズを施す事なく低コスト、低
工程数で実現出来る。According to the present invention, a pull-in electrode group for human power of a driving driver is formed by printing at least one layer of conductive resin paint on a flexible film substrate constituting a liquid crystal display element, and is formed on a separate flexible film substrate. forming a group of common electrodes (pass lines) printed with at least one layer of conductive resin paint,
An insulating adhesive layer printed with an insulating resin paint is formed on the top of the electrode group on one board, and both boards are bonded together by thermocompression via a conductive layer, allowing the common electrode wiring to be formed with a minimum mounting area and using conventional plating. It can be realized at low cost and with a low number of steps without metalizing.
又、導電性樹脂塗料の印刷により構成された電極である
ため基板の曲げ等の外部応力により断線が低減出来る。Furthermore, since the electrode is constructed by printing conductive resin paint, disconnection due to external stress such as bending of the substrate can be reduced.
第1図は本発明の実施例の斜視図、第2図は第1図のA
−A線断面図、第3図(a)及び(b)はそれぞれ下基
板上の引き込み電極群を詳細に示す平面図及び断面図、
第4図(a)、(b)及び(c)はそれぞれ共通電極の
印刷された基板の詳細を示す平面図、側断面図及び縦断
面図、第5図及び第6図は従来のLSIチップ実装法の
説明図である。
1・・表示エリア
2・下基板
3・・上基板
4・共通電極用基板
5・LSIチップ
6・・・出力電極群
7・・・引き込み電極群
8・・・共通電極
特許出願人 株式会社 リ コ −Figure 1 is a perspective view of an embodiment of the present invention, and Figure 2 is A of Figure 1.
-A sectional view, FIGS. 3(a) and 3(b) are a plan view and a sectional view showing details of the lead-in electrode group on the lower substrate, respectively;
FIGS. 4(a), (b), and (c) are a plan view, a side sectional view, and a vertical sectional view showing details of the substrate on which the common electrode is printed, respectively, and FIGS. 5 and 6 are conventional LSI chips. FIG. 3 is an explanatory diagram of a mounting method. 1.Display area 2.Lower substrate 3..Upper substrate 4.Common electrode substrate 5.LSI chip 6.Output electrode group 7.Leading electrode group 8.Common electrode patent applicant Li Co., Ltd. Co-
Claims (3)
の可撓性フィルム基板により液晶層を挟持させた液晶セ
ルの上下に各々偏光板を配設した液晶表示素子と該液晶
表示素子を駆動する駆動用ドライバーからなる液晶表示
装置において、該可撓性フィルム基板上に少なくとも一
層の導電性樹脂で印刷した駆動用ドライバーに入力する
ための引き込み電極群が形成され、別個の可撓性フィル
ム基板上に少なくとも一層の導電性樹脂で印刷した共通
電極群が形成され、一方の基板の電極群の上部に絶縁性
塗料を印刷した絶縁層が形成されており、その両基板が
導電層を介して熱圧着されていることを特徴とする液晶
表示装置。(1) A liquid crystal display element in which a liquid crystal cell has a transparent electrode inside and a liquid crystal layer is sandwiched between a pair of upper and lower aligned flexible film substrates, and polarizing plates are disposed on each of the upper and lower sides of the liquid crystal cell, and the liquid crystal display element In a liquid crystal display device comprising a driving driver for driving, a group of lead-in electrodes for inputting to the driving driver printed with at least one layer of conductive resin is formed on the flexible film substrate, and a separate flexible film substrate is formed. A common electrode group printed with at least one layer of conductive resin is formed on a film substrate, an insulating layer printed with insulating paint is formed on top of the electrode group of one substrate, and both substrates have a conductive layer. 1. A liquid crystal display device characterized in that the device is bonded by thermocompression through a wire.
実装したテープキャリア(TAB)であることを特徴と
する請求項1項記載の液晶表示装置。(2) The liquid crystal display device according to claim 1, wherein the driving driver is a tape carrier (TAB) on which a driving LSI chip is directly mounted.
電性樹脂により形成された電極に直接実装したものであ
ることを特徴とする請求項1項記載の液晶表示装置。(3) The liquid crystal display device according to claim 1, wherein the driving driver has a driving LSI chip mounted directly on an electrode formed of the conductive resin.
Priority Applications (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP31332290A JP2959641B2 (en) | 1990-11-19 | 1990-11-19 | Liquid crystal display |
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP31332290A JP2959641B2 (en) | 1990-11-19 | 1990-11-19 | Liquid crystal display |
Publications (2)
Publication Number | Publication Date |
---|---|
JPH04184322A true JPH04184322A (en) | 1992-07-01 |
JP2959641B2 JP2959641B2 (en) | 1999-10-06 |
Family
ID=18039838
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
JP31332290A Expired - Fee Related JP2959641B2 (en) | 1990-11-19 | 1990-11-19 | Liquid crystal display |
Country Status (1)
Country | Link |
---|---|
JP (1) | JP2959641B2 (en) |
Cited By (3)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JP2007041606A (en) * | 2005-08-04 | 2007-02-15 | Au Optronics Corp | Connector structure and matrix display panel and matrix display having the same |
JP2014197181A (en) * | 2013-03-07 | 2014-10-16 | 株式会社半導体エネルギー研究所 | Display device |
JP2020197717A (en) * | 2009-05-02 | 2020-12-10 | 株式会社半導体エネルギー研究所 | Display device |
-
1990
- 1990-11-19 JP JP31332290A patent/JP2959641B2/en not_active Expired - Fee Related
Cited By (15)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JP2007041606A (en) * | 2005-08-04 | 2007-02-15 | Au Optronics Corp | Connector structure and matrix display panel and matrix display having the same |
JP2020201495A (en) * | 2009-05-02 | 2020-12-17 | 株式会社半導体エネルギー研究所 | Display device |
US11809030B2 (en) | 2009-05-02 | 2023-11-07 | Semiconductor Energy Laboratory Co., Ltd. | Display device |
US11598982B2 (en) | 2009-05-02 | 2023-03-07 | Semiconductor Energy Laboratory Co., Ltd. | Display device |
JP2022091759A (en) * | 2009-05-02 | 2022-06-21 | 株式会社半導体エネルギー研究所 | Display device |
US11215858B2 (en) | 2009-05-02 | 2022-01-04 | Semiconductor Energy Laboratory Co., Ltd. | Display device |
JP2020197717A (en) * | 2009-05-02 | 2020-12-10 | 株式会社半導体エネルギー研究所 | Display device |
US10096669B2 (en) | 2013-03-07 | 2018-10-09 | Semiconductor Energy Laboratory Co., Ltd. | Display device |
US10680055B2 (en) | 2013-03-07 | 2020-06-09 | Semiconductor Energy Laboratory Co., Ltd. | Display device |
US11271070B2 (en) | 2013-03-07 | 2022-03-08 | Semiconductor Energy Laboratory Co., Ltd. | Display device |
US10263063B2 (en) | 2013-03-07 | 2019-04-16 | Semiconductor Energy Laboratory Co., Ltd. | Display device |
JP2017058694A (en) * | 2013-03-07 | 2017-03-23 | 株式会社半導体エネルギー研究所 | Wrist watch |
US11678538B2 (en) | 2013-03-07 | 2023-06-13 | Semiconductor Energy Laboratory Co., Ltd. | Display device |
JP2014197181A (en) * | 2013-03-07 | 2014-10-16 | 株式会社半導体エネルギー研究所 | Display device |
US11950474B2 (en) | 2013-03-07 | 2024-04-02 | Semiconductor Energy Laboratory Co., Ltd. | Display device |
Also Published As
Publication number | Publication date |
---|---|
JP2959641B2 (en) | 1999-10-06 |
Similar Documents
Publication | Publication Date | Title |
---|---|---|
US5893623A (en) | Structure and method for mounting semiconductor devices, and liquid crystal display | |
US6288343B1 (en) | Printed circuit board | |
US20080055291A1 (en) | Chip film package and display panel assembly having the same | |
US5841414A (en) | Liquid crystal display device | |
JPH08186336A (en) | Circuit board, drive circuit module and liquid crystal device using it as well as their manufacture | |
KR940007578A (en) | Structure of mounting liquid crystal display device and semiconductor element, method of mounting semiconductor element, and electro-optical and electronic factor device | |
KR20040014187A (en) | Wiring substrate, display device, and manufacturing method of wiring substrate | |
JPH04184322A (en) | Liquid crystal display device | |
JPS6329729A (en) | Liquid crystal cell | |
US11445611B2 (en) | Signal transmission apparatus and display apparatus | |
JPH1124097A (en) | Liquid crystal display device | |
JPH0434418A (en) | Liquid crystal panel | |
JP3601455B2 (en) | Liquid crystal display | |
JP2004136673A (en) | Bonded structure, liquid crystal device, and electronic equipment | |
JP2828829B2 (en) | LCD module | |
JPH02127621A (en) | Manufacture of liquid crystal display device | |
JP3797742B2 (en) | Manufacturing method of liquid crystal display panel | |
JPH09232377A (en) | Mounting structure and its manufacture | |
JP3992324B2 (en) | Liquid crystal display device and manufacturing method thereof | |
JPH03271791A (en) | Structure for packaging driving circuit of liquid crystal display device or the like | |
JP3987288B2 (en) | Semiconductor element mounting structure and liquid crystal display device | |
JPH11288002A (en) | Liquid crystal driving circuit module and liquid crystal display device using the same | |
JPS62161187A (en) | Liquid crystal display unit | |
WO2023173472A1 (en) | Circuit board and display module | |
JPH04115228A (en) | Liquid crystal display device |
Legal Events
Date | Code | Title | Description |
---|---|---|---|
FPAY | Renewal fee payment (event date is renewal date of database) |
Free format text: PAYMENT UNTIL: 20070730 Year of fee payment: 8 |
|
FPAY | Renewal fee payment (event date is renewal date of database) |
Free format text: PAYMENT UNTIL: 20080730 Year of fee payment: 9 |
|
FPAY | Renewal fee payment (event date is renewal date of database) |
Free format text: PAYMENT UNTIL: 20090730 Year of fee payment: 10 |
|
LAPS | Cancellation because of no payment of annual fees |