JPS63122196A - Manufacture of through-hole plated wiring board - Google Patents
Manufacture of through-hole plated wiring boardInfo
- Publication number
- JPS63122196A JPS63122196A JP26839286A JP26839286A JPS63122196A JP S63122196 A JPS63122196 A JP S63122196A JP 26839286 A JP26839286 A JP 26839286A JP 26839286 A JP26839286 A JP 26839286A JP S63122196 A JPS63122196 A JP S63122196A
- Authority
- JP
- Japan
- Prior art keywords
- hole
- layer
- resist coating
- coating layer
- wiring board
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
- 238000004519 manufacturing process Methods 0.000 title claims description 19
- 229920005989 resin Polymers 0.000 claims description 47
- 239000011347 resin Substances 0.000 claims description 47
- 239000011247 coating layer Substances 0.000 claims description 39
- 239000010410 layer Substances 0.000 claims description 36
- 238000004070 electrodeposition Methods 0.000 claims description 35
- 239000000758 substrate Substances 0.000 claims description 29
- 239000011248 coating agent Substances 0.000 claims description 25
- 238000000576 coating method Methods 0.000 claims description 25
- 238000000034 method Methods 0.000 claims description 21
- 238000007747 plating Methods 0.000 claims description 19
- 238000005530 etching Methods 0.000 claims description 14
- 229910052751 metal Inorganic materials 0.000 claims description 9
- 239000002184 metal Substances 0.000 claims description 9
- 238000005553 drilling Methods 0.000 claims description 2
- 238000010030 laminating Methods 0.000 claims description 2
- 230000015572 biosynthetic process Effects 0.000 claims 1
- RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical compound [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 description 18
- HEMHJVSKTPXQMS-UHFFFAOYSA-M Sodium hydroxide Chemical compound [OH-].[Na+] HEMHJVSKTPXQMS-UHFFFAOYSA-M 0.000 description 15
- 239000000243 solution Substances 0.000 description 15
- 229910052802 copper Inorganic materials 0.000 description 13
- 239000010949 copper Substances 0.000 description 13
- XLYOFNOQVPJJNP-UHFFFAOYSA-N water Substances O XLYOFNOQVPJJNP-UHFFFAOYSA-N 0.000 description 9
- 239000002253 acid Substances 0.000 description 7
- 239000000126 substance Substances 0.000 description 7
- ZMANZCXQSJIPKH-UHFFFAOYSA-N Triethylamine Chemical compound CCN(CC)CC ZMANZCXQSJIPKH-UHFFFAOYSA-N 0.000 description 6
- 229920000180 alkyd Polymers 0.000 description 6
- 239000007864 aqueous solution Substances 0.000 description 6
- 238000007650 screen-printing Methods 0.000 description 6
- 239000011889 copper foil Substances 0.000 description 5
- 238000007654 immersion Methods 0.000 description 5
- CDBYLPFSWZWCQE-UHFFFAOYSA-L Sodium Carbonate Chemical compound [Na+].[Na+].[O-]C([O-])=O CDBYLPFSWZWCQE-UHFFFAOYSA-L 0.000 description 4
- 238000010586 diagram Methods 0.000 description 4
- MTHSVFCYNBDYFN-UHFFFAOYSA-N diethylene glycol Chemical class OCCOCCO MTHSVFCYNBDYFN-UHFFFAOYSA-N 0.000 description 4
- 239000007789 gas Substances 0.000 description 4
- 239000003973 paint Substances 0.000 description 4
- OYHQOLUKZRVURQ-NTGFUMLPSA-N (9Z,12Z)-9,10,12,13-tetratritiooctadeca-9,12-dienoic acid Chemical compound C(CCCCCCC\C(=C(/C\C(=C(/CCCCC)\[3H])\[3H])\[3H])\[3H])(=O)O OYHQOLUKZRVURQ-NTGFUMLPSA-N 0.000 description 3
- QTBSBXVTEAMEQO-UHFFFAOYSA-N Acetic acid Chemical compound CC(O)=O QTBSBXVTEAMEQO-UHFFFAOYSA-N 0.000 description 3
- 229910021578 Iron(III) chloride Inorganic materials 0.000 description 3
- KFZMGEQAYNKOFK-UHFFFAOYSA-N Isopropanol Chemical compound CC(C)O KFZMGEQAYNKOFK-UHFFFAOYSA-N 0.000 description 3
- 239000005062 Polybutadiene Substances 0.000 description 3
- 125000000129 anionic group Chemical group 0.000 description 3
- 125000003178 carboxy group Chemical group [H]OC(*)=O 0.000 description 3
- 125000002091 cationic group Chemical group 0.000 description 3
- 238000001816 cooling Methods 0.000 description 3
- 239000003822 epoxy resin Substances 0.000 description 3
- RBTARNINKXHZNM-UHFFFAOYSA-K iron trichloride Chemical compound Cl[Fe](Cl)Cl RBTARNINKXHZNM-UHFFFAOYSA-K 0.000 description 3
- 239000000203 mixture Substances 0.000 description 3
- 229920002857 polybutadiene Polymers 0.000 description 3
- 229920000647 polyepoxide Polymers 0.000 description 3
- QGZKDVFQNNGYKY-UHFFFAOYSA-N Ammonia Chemical compound N QGZKDVFQNNGYKY-UHFFFAOYSA-N 0.000 description 2
- VEXZGXHMUGYJMC-UHFFFAOYSA-N Hydrochloric acid Chemical compound Cl VEXZGXHMUGYJMC-UHFFFAOYSA-N 0.000 description 2
- CTQNGGLPUBDAKN-UHFFFAOYSA-N O-Xylene Chemical compound CC1=CC=CC=C1C CTQNGGLPUBDAKN-UHFFFAOYSA-N 0.000 description 2
- QAOWNCQODCNURD-UHFFFAOYSA-N Sulfuric acid Chemical compound OS(O)(=O)=O QAOWNCQODCNURD-UHFFFAOYSA-N 0.000 description 2
- 150000001412 amines Chemical class 0.000 description 2
- 239000002585 base Substances 0.000 description 2
- 238000006243 chemical reaction Methods 0.000 description 2
- 230000000052 comparative effect Effects 0.000 description 2
- 235000014113 dietary fatty acids Nutrition 0.000 description 2
- 125000003700 epoxy group Chemical group 0.000 description 2
- 239000000194 fatty acid Substances 0.000 description 2
- 229930195729 fatty acid Natural products 0.000 description 2
- 150000004665 fatty acids Chemical class 0.000 description 2
- 239000007788 liquid Substances 0.000 description 2
- FPYJFEHAWHCUMM-UHFFFAOYSA-N maleic anhydride Chemical compound O=C1OC(=O)C=C1 FPYJFEHAWHCUMM-UHFFFAOYSA-N 0.000 description 2
- QSHDDOUJBYECFT-UHFFFAOYSA-N mercury Chemical compound [Hg] QSHDDOUJBYECFT-UHFFFAOYSA-N 0.000 description 2
- 229910052753 mercury Inorganic materials 0.000 description 2
- 239000011342 resin composition Substances 0.000 description 2
- 238000007142 ring opening reaction Methods 0.000 description 2
- 229910000029 sodium carbonate Inorganic materials 0.000 description 2
- 239000002904 solvent Substances 0.000 description 2
- 239000008096 xylene Substances 0.000 description 2
- SMZOUWXMTYCWNB-UHFFFAOYSA-N 2-(2-methoxy-5-methylphenyl)ethanamine Chemical compound COC1=CC=C(C)C=C1CCN SMZOUWXMTYCWNB-UHFFFAOYSA-N 0.000 description 1
- NIXOWILDQLNWCW-UHFFFAOYSA-N 2-Propenoic acid Natural products OC(=O)C=C NIXOWILDQLNWCW-UHFFFAOYSA-N 0.000 description 1
- RSWGJHLUYNHPMX-UHFFFAOYSA-N Abietic-Saeure Natural products C12CCC(C(C)C)=CC2=CCC2C1(C)CCCC2(C)C(O)=O RSWGJHLUYNHPMX-UHFFFAOYSA-N 0.000 description 1
- 229920000178 Acrylic resin Polymers 0.000 description 1
- 239000004925 Acrylic resin Substances 0.000 description 1
- 239000004593 Epoxy Substances 0.000 description 1
- LFQSCWFLJHTTHZ-UHFFFAOYSA-N Ethanol Chemical compound CCO LFQSCWFLJHTTHZ-UHFFFAOYSA-N 0.000 description 1
- 239000004640 Melamine resin Substances 0.000 description 1
- 229920000877 Melamine resin Polymers 0.000 description 1
- KHPCPRHQVVSZAH-HUOMCSJISA-N Rosin Natural products O(C/C=C/c1ccccc1)[C@H]1[C@H](O)[C@@H](O)[C@@H](O)[C@@H](CO)O1 KHPCPRHQVVSZAH-HUOMCSJISA-N 0.000 description 1
- GWEVSGVZZGPLCZ-UHFFFAOYSA-N Titan oxide Chemical compound O=[Ti]=O GWEVSGVZZGPLCZ-UHFFFAOYSA-N 0.000 description 1
- 239000003513 alkali Substances 0.000 description 1
- 229910052782 aluminium Inorganic materials 0.000 description 1
- XAGFODPZIPBFFR-UHFFFAOYSA-N aluminium Chemical compound [Al] XAGFODPZIPBFFR-UHFFFAOYSA-N 0.000 description 1
- 229910021529 ammonia Inorganic materials 0.000 description 1
- 239000011230 binding agent Substances 0.000 description 1
- 230000000740 bleeding effect Effects 0.000 description 1
- 150000001732 carboxylic acid derivatives Chemical class 0.000 description 1
- 239000004359 castor oil Substances 0.000 description 1
- 235000019438 castor oil Nutrition 0.000 description 1
- 239000003518 caustics Substances 0.000 description 1
- 239000003795 chemical substances by application Substances 0.000 description 1
- 239000004927 clay Substances 0.000 description 1
- 238000004140 cleaning Methods 0.000 description 1
- 150000001875 compounds Chemical class 0.000 description 1
- 238000007796 conventional method Methods 0.000 description 1
- 229920001577 copolymer Polymers 0.000 description 1
- 230000007547 defect Effects 0.000 description 1
- 230000002950 deficient Effects 0.000 description 1
- 239000006185 dispersion Substances 0.000 description 1
- 238000001035 drying Methods 0.000 description 1
- 230000000694 effects Effects 0.000 description 1
- 150000002148 esters Chemical class 0.000 description 1
- -1 etc.) Polymers 0.000 description 1
- 239000011888 foil Substances 0.000 description 1
- 239000011521 glass Substances 0.000 description 1
- ZEMPKEQAKRGZGQ-XOQCFJPHSA-N glycerol triricinoleate Natural products CCCCCC[C@@H](O)CC=CCCCCCCCC(=O)OC[C@@H](COC(=O)CCCCCCCC=CC[C@@H](O)CCCCCC)OC(=O)CCCCCCCC=CC[C@H](O)CCCCCC ZEMPKEQAKRGZGQ-XOQCFJPHSA-N 0.000 description 1
- LNEPOXFFQSENCJ-UHFFFAOYSA-N haloperidol Chemical compound C1CC(O)(C=2C=CC(Cl)=CC=2)CCN1CCCC(=O)C1=CC=C(F)C=C1 LNEPOXFFQSENCJ-UHFFFAOYSA-N 0.000 description 1
- 238000010438 heat treatment Methods 0.000 description 1
- 238000007731 hot pressing Methods 0.000 description 1
- 239000011810 insulating material Substances 0.000 description 1
- 238000003475 lamination Methods 0.000 description 1
- 239000000463 material Substances 0.000 description 1
- 238000006386 neutralization reaction Methods 0.000 description 1
- 230000003472 neutralizing effect Effects 0.000 description 1
- 239000012299 nitrogen atmosphere Substances 0.000 description 1
- 239000003921 oil Substances 0.000 description 1
- 235000019198 oils Nutrition 0.000 description 1
- 150000007524 organic acids Chemical class 0.000 description 1
- 235000005985 organic acids Nutrition 0.000 description 1
- 239000003960 organic solvent Substances 0.000 description 1
- 238000010422 painting Methods 0.000 description 1
- 239000002245 particle Substances 0.000 description 1
- 210000004417 patella Anatomy 0.000 description 1
- WXZMFSXDPGVJKK-UHFFFAOYSA-N pentaerythritol Chemical compound OCC(CO)(CO)CO WXZMFSXDPGVJKK-UHFFFAOYSA-N 0.000 description 1
- ISWSIDIOOBJBQZ-UHFFFAOYSA-N phenol group Chemical group C1(=CC=CC=C1)O ISWSIDIOOBJBQZ-UHFFFAOYSA-N 0.000 description 1
- 229920001296 polysiloxane Polymers 0.000 description 1
- 150000003141 primary amines Chemical class 0.000 description 1
- 238000007639 printing Methods 0.000 description 1
- WXNYILVTTOXAFR-UHFFFAOYSA-N prop-2-en-1-ol;styrene Chemical compound OCC=C.C=CC1=CC=CC=C1 WXNYILVTTOXAFR-UHFFFAOYSA-N 0.000 description 1
- 238000010526 radical polymerization reaction Methods 0.000 description 1
- 150000003839 salts Chemical class 0.000 description 1
- 150000003335 secondary amines Chemical class 0.000 description 1
- 229920002050 silicone resin Polymers 0.000 description 1
- 239000007787 solid Substances 0.000 description 1
- 239000003549 soybean oil Substances 0.000 description 1
- 235000012424 soybean oil Nutrition 0.000 description 1
- 229910001220 stainless steel Inorganic materials 0.000 description 1
- 239000010935 stainless steel Substances 0.000 description 1
- 239000003784 tall oil Substances 0.000 description 1
- 229920001187 thermosetting polymer Polymers 0.000 description 1
- OGIDPMRJRNCKJF-UHFFFAOYSA-N titanium oxide Inorganic materials [Ti]=O OGIDPMRJRNCKJF-UHFFFAOYSA-N 0.000 description 1
- KHPCPRHQVVSZAH-UHFFFAOYSA-N trans-cinnamyl beta-D-glucopyranoside Natural products OC1C(O)C(O)C(CO)OC1OCC=CC1=CC=CC=C1 KHPCPRHQVVSZAH-UHFFFAOYSA-N 0.000 description 1
- SRPWOOOHEPICQU-UHFFFAOYSA-N trimellitic anhydride Chemical compound OC(=O)C1=CC=C2C(=O)OC(=O)C2=C1 SRPWOOOHEPICQU-UHFFFAOYSA-N 0.000 description 1
- 238000005406 washing Methods 0.000 description 1
- 229920003169 water-soluble polymer Polymers 0.000 description 1
Landscapes
- Printing Elements For Providing Electric Connections Between Printed Circuits (AREA)
Abstract
(57)【要約】本公報は電子出願前の出願データであるた
め要約のデータは記録されません。(57) [Summary] This bulletin contains application data before electronic filing, so abstract data is not recorded.
Description
【発明の詳細な説明】
〔産業上の利用分野〕
本発明は、導電性金属層を存する基板に逆パターンのレ
ジスト被覆層を感光性のドライフィルムを用いて形成し
た後、該レジスト被覆層の形成されていない部分にエツ
チングレジストを電着塗装によって形成する、スルーホ
ールメッキ配線板の製造方法に関するものである。Detailed Description of the Invention [Industrial Application Field] The present invention involves forming a resist coating layer with a reverse pattern on a substrate having a conductive metal layer using a photosensitive dry film, and then applying The present invention relates to a method for manufacturing a through-hole plated wiring board, in which etching resist is formed on the unformed portions by electrodeposition.
〔従来の技術）
スルーホールプリント配線板の製造方法としては、逆パ
ターンのレジスト被覆層を形成した後、該レジスト被覆
層の形成されていない部分にエツチングレジストを電Ｓ
塗装によって形成する方法が提案されている。そして、
この方法において、逆パターンのレジスト被覆層の形成
は、レジストインクをスクリーン印刷する方法（スクリ
ーン印刷法）により行われている。[Prior art] A method for manufacturing a through-hole printed wiring board is to form a resist coating layer with a reverse pattern, and then apply an etching resist to the portions where the resist coating layer is not formed.
A method of forming by painting has been proposed. and,
In this method, a resist coating layer with a reverse pattern is formed by screen printing a resist ink (screen printing method).
上記のスクリーン印刷法は、シルクスクリーンを通して
パターンを形成するため、印刷時にレジストインクの滲
みにより１００μｍ以下の微細パターンの形成が困難で
ある問題があり、また特にランドレスの場合には、スル
ーホール内にインクが流れ込む問題も生じる。The screen printing method described above has the problem that it is difficult to form fine patterns of 100 μm or less due to bleeding of resist ink during printing because the pattern is formed through a silk screen. There is also the problem of ink flowing into the printer.
更に、上記のスクリーン印刷法では、レジスト被覆層の
膜厚を１５μｍとするのが限界（通常１０〜１２μｍ）
であり、このような膜厚の薄いレジスト被覆層の形成さ
れた基板上に電着塗装を施した場合、ピンホール発生の
ない電着塗装樹脂膜とするには、下記の如く、電着塗装
樹脂膜の膜厚を１５μｍ以上（好ましくは２０μｍ以上
）とする必要があるため、特に微細パターン間において
は、第３図に示す如く、電着塗装樹脂膜９がレジスト被
覆層６に覆い被さり、逆パターンのレジスト被覆層を剥
離除去できず、エツチング処理ができない部分が生じ、
回路の短絡した配線板となる問題がある。Furthermore, in the above screen printing method, the thickness of the resist coating layer is limited to 15 μm (usually 10 to 12 μm).
Therefore, when electrocoating is performed on a substrate on which such a thin resist coating layer is formed, in order to obtain an electrocoated resin film that does not generate pinholes, it is necessary to apply electrocoating as follows. Since the thickness of the resin film needs to be 15 μm or more (preferably 20 μm or more), the electrodeposited resin film 9 covers the resist coating layer 6, especially between the fine patterns, as shown in FIG. The reverse pattern of the resist coating layer cannot be peeled off and there are some areas that cannot be etched.
There is a problem of short-circuited wiring boards.
一般に、電着塗装は、印加する電圧で電着塗装樹脂膜の
膜厚が決まり、低電圧で行えば、膜厚１５μｍ以下の電
着塗装樹脂膜を形成することができる。しかし、膜厚が
１５μｍ以下の場合、電着塗装時に発生する気体による
ガス穴及び電着塗装樹脂膜の熱硬化の際に蒸発する溶媒
等（溶媒、水、中和剤）によるガス穴を充分に塞ぐこと
ができず、これらのガス穴がピンホールとなって、エツ
チング処理の際、エツチング液の浸入により銅を腐蝕す
る。また、膜厚が小の場合、電着塗装樹脂膜−銅表面の
密着力が低く、レジスト被ＮＮの剥離時若しくはエツチ
ング処理時に電着塗装樹脂膜が剥離することがある。従
って、電着塗装樹脂膜の膜厚は１５μｍ以上とする必要
がある。Generally, in electrodeposition coating, the thickness of the electrodeposition resin film is determined by the applied voltage, and if performed at a low voltage, an electrodeposition resin film with a thickness of 15 μm or less can be formed. However, if the film thickness is 15 μm or less, there are sufficient gas holes caused by gas generated during electrodeposition coating and gas holes caused by solvents (solvent, water, neutralizing agent) that evaporate during thermosetting of the electrodeposition coating resin film. These gas holes become pinholes, and during etching, the etching solution enters and corrodes the copper. Furthermore, if the film thickness is small, the adhesion between the electrodeposited resin film and the copper surface is low, and the electrodeposited resin film may peel off during peeling of the NN to be resisted or during etching treatment. Therefore, the thickness of the electrodeposited resin film needs to be 15 μm or more.
従って、本発明の目的は、膜厚が充分に大きく且つ微細
パターンのレジスト被覆層を精度良く容易に形成でき、
スルーホールメッキ配ｗＡ板を実質的に製品不良を生じ
ることなく製造し得るスルーホールメッキ配線板の製造
方法を提供することにある。Therefore, an object of the present invention is to easily form a resist coating layer having a sufficiently large thickness and a fine pattern with high precision;
To provide a method for manufacturing a through-hole plating wiring board that can manufacture the through-hole plating wiring board without substantially causing product defects.
本発明は、両面に導電性金属層を有する基板に、孔加工
してスルーホールを形成し、少なくとも該スルーホール
の孔壁部にメッキを施した後、このスルーホールメッキ
された基板の両面に得ようとする回路パターンの逆パタ
ーンのレジスト被覆層を形成し、次いで、上記スルーホ
ールの孔壁部及び上記基板の両面の上記レジスト被覆層
の形成されていない部分に、電着塗装によって電着塗装
樹脂層を形成し、次いで、上記レジスト被覆層のみを除
去した後、このレジスト被覆層の除去によって露出した
メッキ層及び導電性金属層をエツチングにより除去し、
然る後、上記電着塗装樹脂層を除去する、スルーホール
メンキ配線板の製造方法であうで、上記レジスト被覆層
の形成を、感光性のドライフィルムを上記のスルーホー
ルメッキされた基板の両面にラミネートし、次いで、上
記ドライフィルムを逆パターン状に露光した後、現像し
て上記ドライフィルムの未光硬化部分を除去することに
より行うことを特徴とするスルーホールメッキ配線板の
製造方法を提供することにより、前記目的を達成したも
のである。The present invention involves forming through-holes in a substrate having conductive metal layers on both sides, plating at least the hole walls of the through-holes, and then applying plating to both sides of the substrate plated with the through-holes. A resist coating layer with a pattern opposite to the circuit pattern to be obtained is formed, and then electrodeposition is performed on the hole wall portion of the through hole and the portions of both surfaces of the substrate where the resist coating layer is not formed. After forming a coating resin layer and then removing only the resist coating layer, the plated layer and conductive metal layer exposed by the removal of the resist coating layer are removed by etching,
After that, in the method for manufacturing a through-hole plated wiring board, the electrodeposited resin layer is removed, the resist coating layer is formed, and a photosensitive dry film is coated on both sides of the through-hole plated board. Provided is a method for manufacturing a through-hole plated wiring board, which is carried out by laminating the dry film to light, then exposing the dry film to light in a reverse pattern, and developing it to remove the uncured portion of the dry film. By doing so, the above objective has been achieved.
以下、本発明のスルーホールメッキ配線板の製造方法に
ついて詳述する。Hereinafter, the method for manufacturing a through-hole plated wiring board of the present invention will be described in detail.
本発明でレジスト被覆層の形成に用いられる好ましい感
光性のドライフィルムとしては、分子中にカルボキシル
基等の酸基を含有して、希アルカリ （炭酸ナトリウム
等）現像液に溶解し得る、（メタ）アクリル酸及びその
□エステル類を主成分とした共重合体からなるドライフ
ィルムが挙げられ、この感光性のドライフィルムは、光
照射によりラジカル重合し、バインダーに絡んで硬化架
橋して上記希アルカリ現像液に不溶となるが、２〜５％
の濃度の水酸化ナトリウム水溶液等で基板から剥離する
ことができる。Preferred photosensitive dry films used for forming the resist coating layer in the present invention include (meth) containing acid groups such as carboxyl groups in the molecule and being soluble in dilute alkaline (sodium carbonate, etc.) developing solutions. ) This photosensitive dry film is made of a copolymer mainly composed of acrylic acid and its esters, and this photosensitive dry film undergoes radical polymerization by light irradiation, entangles with a binder, cures and crosslinks, and forms the above-mentioned dilute alkali. Insoluble in developer, but 2-5%
It can be peeled off from the substrate using an aqueous sodium hydroxide solution with a concentration of .
上記感光性のドライフィルムとしては、膜厚が２５〜５
０μｍのものを用いることが好ましく、このような膜厚
を有する感光性のドライフィルムとしては、膜厚が２５
μｍのものとして、グイナム コーポレーシテン社製の
ラミナーＴＡ、デュポン社製のリストン３６１０、日立
化成工業■製のフォテンクＰＨＴ−８６２ＡＰ−２５、
日本合成化学工業■製のアルフォー１０２５Ｍ、室町化
学工業■製のミューロンＡ等の市販品があり、膜厚が４
０μｍのものとして、デュポン社製のリストン３６１５
、日立化成工業■製のフォテフクＰＲ？−８６２ＡＰ−
４０、日本合成化学工業■製のアルフォＷ１０３８Ｍ等
の市販品があり、膜厚が５０Ｊ１ｍのものとして、ダイ
ナム コーポレーシッン社製のラミナーＴ＾、デュポン
社製のリストン３６２０、日立化成工業■製のフォテッ
クＰｔ１Ｔ−８６２ＡＰ−５０、日本合成化学工業■製
のアルフォー１０５０Ｍ、室町化学工業側製のミューロ
ンＡ等の市販品がある。The photosensitive dry film has a film thickness of 25 to 5
It is preferable to use a film with a film thickness of 0 μm, and as a photosensitive dry film having such a film thickness, a film with a film thickness of 25 μm is preferable.
As μm ones, Laminar TA manufactured by Guinam Corporation, Liston 3610 manufactured by DuPont, Fotenc PHT-862AP-25 manufactured by Hitachi Chemical ■,
There are commercially available products such as Alfor 1025M manufactured by Nippon Gosei Chemical Industry ■ and Myuron A manufactured by Muromachi Chemical Industry ■, with a film thickness of 4.
Liston 3615 manufactured by DuPont as a 0 μm one
, Fotefuku PR made by Hitachi Chemical ■? -862AP-
40. There are commercially available products such as Alfo W1038M manufactured by Nippon Gosei Kagaku Kogyo ■, with a film thickness of 50 J1 m, Laminar T^ manufactured by Dynam Corporation, Liston 3620 manufactured by DuPont, and products manufactured by Hitachi Chemical ■. There are commercially available products such as Photek Pt1T-862AP-50, Alfor 1050M manufactured by Nippon Gosei Chemical Industry Co., Ltd., and Myuron A manufactured by Muromachi Chemical Industry Co., Ltd.
また、本発明で用いられる両面に導電性金属層を有する
基板としては、有Ｉｌ（樹脂）又は無機の絶縁材からな
る薄板に、その両面に通常の方法により所定の厚さの銅
箔等を張り付けた両面銅張積Ｗｉ板等が用いられる。In addition, the substrate having conductive metal layers on both sides used in the present invention is a thin plate made of aluminum (resin) or an inorganic insulating material, and copper foil or the like of a predetermined thickness is coated on both sides of the plate by a conventional method. A double-sided copper-clad Wi board or the like is used.
また、本発明における電着塗装に使用される樹脂として
は、通常の電着塗装用の樹脂である、被塗装体を陽極と
するアニオン性〔水中で（−）に荷電する〕樹脂、及び
被塗装体を陰極とするカチオン性（水中で（＋）に荷電
する）樹脂が挙げられる。In addition, the resins used in the electrodeposition coating in the present invention include anionic resins (charged to (-) in water) that use the object to be coated as an anode, which are ordinary resins for electrodeposition coating, and resins for the electrodeposition coating in the present invention. Examples include cationic resins (charged to (+) in water) that use the coated body as a cathode.
上記アニオン性樹脂としては、分子中にカルボキシル基
を有し酸価が高く、且つ例えばアンモニア、有機アミン
、苛性アルカリ等の塩基と反応して塩を形成する性能を
有する水溶性の高分子化合物であればよく、例えば、マ
レイン化油（マレイン化ヒマシ油等）１．マレイン化液
状ポリブタジェン、カルボン酸でエポキシ基を開環して
無水マレイン酸を付加したエポキシ樹脂等のマレイン化
樹脂、フェノール樹脂変性マレイン化樹脂、マレイン化
樹脂をアルコールによりハーフェステル化して得た樹脂
、アルキド樹脂、末端にカルボキシル基等を有する液状
ポリブタジェン樹脂、スチレン−アリルアルコール系樹
脂、アクリル樹脂等を挙げることができる。The anionic resin is a water-soluble polymer compound that has a carboxyl group in its molecule, has a high acid value, and has the ability to react with bases such as ammonia, organic amines, and caustic alkalis to form salts. For example, maleated oil (maleated castor oil, etc.) 1. Maleated liquid polybutadiene, maleated resins such as epoxy resins with ring-opened epoxy groups with carboxylic acid and addition of maleic anhydride, phenolic resin-modified maleated resins, resins obtained by halfestering maleated resins with alcohol, alkyds Examples of the resin include liquid polybutadiene resin having a carboxyl group at the end, styrene-allyl alcohol resin, acrylic resin, and the like.
また、上記カチオン性樹脂としては、例えば、エポキシ
樹脂（エポキシ化ポリブタジェン等）のエポキシ基を、
第１又は２級アミンで付加及び開環させ、有機酸で中和
して、水溶性にした樹脂、前記エポキシ樹脂を一部アミ
ンで開環した後、有りａ酸と反応させた樹脂等を挙げる
ことができる。In addition, as the above-mentioned cationic resin, for example, the epoxy group of an epoxy resin (epoxidized polybutadiene, etc.),
Resins made water-soluble by addition and ring-opening with primary or secondary amines and neutralization with organic acids, resins made by partially ring-opening the epoxy resin with amines, and then reacting with acetic acid. can be mentioned.
次に、本発明のスルーホールメッキ配線板の製造方法を
、図面を参照し乍ら詳述する。Next, a method for manufacturing a through-hole plated wiring board according to the present invention will be described in detail with reference to the drawings.
第１図は、本発明のスルーホールメッキ配線板の製造方
法の実施態様を模式的に示す概略図である。FIG. 1 is a schematic diagram schematically showing an embodiment of the method for manufacturing a through-hole plated wiring board of the present invention.
本発明においては、先ず、第１図＋１）に示す如き、有
機（樹脂）又は無機の絶縁材からなる基材３の両面に銅
箔層２を有する両面鋼張基板１のような「両面に導電性
金属層を有する基板ｊに、孔加工して第２図（２）に示
す如き適当な孔径（孔径：好ましくは約１００μｍ以上
、特に好ましくは５００μｍ以上）のスルーホール４を
形成する。In the present invention, first, as shown in FIG. A through hole 4 having an appropriate hole diameter (hole diameter: preferably about 100 μm or more, particularly preferably about 500 μm or more) as shown in FIG. 2 (2) is formed in the substrate j having the conductive metal layer.
次いで、第１図（３）に示す如く、上記スルーホール４
の形成された上記基板ｌにメッキを施して、スルーホー
ル４の孔壁部４ａ及び基板１の両面の銅箔層２上に銅等
の導電性金属のメッキ層５を形成する。Next, as shown in FIG. 1(3), the through hole 4 is
The substrate 1 on which .
次いで、第１図（４）に示す如く、上記基板１の両面の
上記メッキ層５上に、得ようとする回路パターンの逆パ
ターンのレジスト被覆層６を形成する。Next, as shown in FIG. 1(4), a resist coating layer 6 having a pattern opposite to the circuit pattern to be obtained is formed on the plating layer 5 on both sides of the substrate 1.
而して、本発明においては、上記レジスト被覆層６を、
前述した感光性のドライフィルムを用い、次のようにし
て形成する。Therefore, in the present invention, the resist coating layer 6 is
It is formed in the following manner using the photosensitive dry film described above.
先ず、第２図（１）に示す如（、前記の感光性のドライ
フィルム７を、上記のスルーホールメッキされた基板ｌ
の両面にラミネートする。このラミネートは、上記ドラ
イフィルム７を上記基板ｌに８０〜１６０℃でロール熱
圧着することにより行うことができる。First, as shown in FIG. 2(1), the photosensitive dry film 7 is placed on the through-hole plated substrate l.
Laminate on both sides. This lamination can be performed by hot-pressing the dry film 7 onto the substrate l at 80 to 160°C.
次いで、第２図（２）に示す如く、得ようとする回路パ
ターンの逆パターンのネガフィルム８を上記ドライフィ
ルム７上に密着させ、上記ドライフィルム７を露光する
。この露光は、超高圧水銀灯等を用い、１００〜４００
Ｗで１０〜４０秒間光照射すれば良い。Next, as shown in FIG. 2(2), a negative film 8 having a pattern opposite to the circuit pattern to be obtained is brought into close contact with the dry film 7, and the dry film 7 is exposed. This exposure is carried out using an ultra-high pressure mercury lamp, etc., at 100 to 400
Light irradiation with W may be performed for 10 to 40 seconds.
然る後、第２図（３）に示す如く、現像して上記ドライ
フィルム７の未露光部分を除去し、上記基板ｌの両面の
上記メッキ層５上に、上記ドライフィルム７の露光部分
からなるレジスト被覆層６を形成する。上記現像は、０
．５〜１．５％濃度の炭酸ナトリウム水溶液等の希アル
カリ現像液中に浸漬することにより行うことができる。Thereafter, as shown in FIG. 2(3), the unexposed portions of the dry film 7 are removed by development, and a film is applied from the exposed portions of the dry film 7 onto the plating layer 5 on both sides of the substrate l. A resist coating layer 6 is formed. The above development is 0
．． This can be carried out by immersion in a dilute alkaline developer such as a 5 to 1.5% aqueous sodium carbonate solution.
上述の如くしてレジスト被覆層６が形成された基板１に
、第１図（５）に示す如く、前述した電着塗装用の樹脂
を用いて電着塗装を施し、上記スルーホール４の孔壁部
４ａ及び上記基板１の両面の上記レジスト被覆層６の形
成されていない部分に、電着塗装樹脂層９を形成する。As shown in FIG. 1 (5), the substrate 1 on which the resist coating layer 6 has been formed as described above is subjected to electrodeposition coating using the resin for electrodeposition coating described above to form the holes of the through holes 4. An electrodeposition resin layer 9 is formed on the wall portion 4a and the portions of both surfaces of the substrate 1 where the resist coating layer 6 is not formed.
上記の電着塗装は、公知の方法で行うことができ、その
塗装温度が１０〜４０℃、特に２０〜３０℃で、印加電
圧が３０〜１５０Ｖ、特に５０〜１００Ｖの条件下に行
うことが好ましい。The above electrodeposition coating can be performed by a known method, and can be performed at a coating temperature of 10 to 40°C, especially 20 to 30°C, and an applied voltage of 30 to 150V, especially 50 to 100V. preferable.
また、上記電着塗装樹脂層９は、水洗、乾燥後、約６０
〜１５０℃の温度で加熱処理することが好ましい。Further, the electrodeposited resin layer 9 has a coating thickness of approximately 60% after washing with water and drying.
Preferably, the heat treatment is performed at a temperature of ~150°C.
次いで、第１図（６）に示す如く、上記基板１の両面上
のレジスト被覆層６のみを除去する。Next, as shown in FIG. 1(6), only the resist coating layer 6 on both sides of the substrate 1 is removed.
上記レジスト被覆Ｎ６の除去は、２〜５％濃度の水酸化
ナトリウム水溶液等のアルカリ性水溶液を使用して、浸
漬、噴水洗浄等の手段で行うことができる。The resist coating N6 can be removed by immersion, fountain cleaning, or the like using an alkaline aqueous solution such as a 2-5% sodium hydroxide aqueous solution.
次いで、第１図（方に示す如く、レジスト被覆層６の除
去によって露出したメッキ層及びその下の銅箔層をエツ
チングにより除去する。Next, as shown in FIG. 1, the plating layer exposed by removing the resist coating layer 6 and the copper foil layer thereunder are removed by etching.
上記エツチングは、３５〜４８ボーメの塩化第二鉄水溶
液等のエツチング液中に浸漬することにより行うことが
できる。The above-mentioned etching can be carried out by immersion in an etching solution such as a 35 to 48 Baume ferric chloride aqueous solution.
然る後、上記電着塗装樹脂層９を除去し、第１図（８）
に示す如き銅箔層２及びメッキ層５によって電気的に導
通されているスルーホールメッキ配線板を得る。After that, the electrodeposited resin layer 9 was removed, and the electrodeposited resin layer 9 was removed.
A through-hole plated wiring board electrically connected by a copper foil layer 2 and a plating layer 5 as shown in FIG. 1 is obtained.
上記電着塗装樹脂層９の除去は、電着塗装樹脂膜がカチ
オン性樹脂から形成されている場合は５〜２０％濃度の
塩酸又は硫酸等の酸類に浸漬することにより行うことが
でき、また電着塗装樹脂膜がアニオン性樹脂から形成さ
れている場合は４〜ｌＯ％濃度の水酸化ナトリウム水溶
液、ジエチレングリコール類の有機溶媒溶液、及びこれ
らの混合液等に浸漬することにより行うことができる。When the electrodeposition coating resin layer 9 is formed from a cationic resin, the electrodeposition coating resin layer 9 can be removed by immersion in an acid such as hydrochloric acid or sulfuric acid at a concentration of 5 to 20%; When the electrodeposited resin film is formed from an anionic resin, it can be immersed in an aqueous sodium hydroxide solution having a concentration of 4 to 10%, an organic solvent solution of diethylene glycols, or a mixture thereof.
以下に、本発明における電着塗装に用いられる電着塗料
溶液の製造例、及び本発明の実施例を比較例と共に挙げ
、本発明を更に詳しく説明する。EXAMPLES Below, the present invention will be explained in more detail by giving examples of manufacturing the electrodeposition paint solution used in the electrodeposition coating of the present invention and examples of the present invention together with comparative examples.
製造例１
アルキド 芒ゝの１−１
大豆油脂肪酸（酸価１５５）６２０ｇ、ロジン（酸価１
７Ｇ）５００ｇ、 トール油脂肪酸（酸価１７０）６０
０ｇ、リノール酸１４０ｇ、リルン酸１４０ｇ及び無水
マレイン酸３００ｇを２００℃、窒素雰囲気下で３時間
反応させた後、１００℃迄冷却し、この反応液にキシレ
ン１５０ｓ＋１゜ペンタエリスリトール１０００ｇ及び
無水トリメリット酸９００ｇを加え、再び１５０℃迄加
熱し、酸価が１００となった時点で反応を停止して冷却
した。この間キシレンは減圧で除去した０次いで、７０
℃迄冷却したら、イソプロピルアルコール６８０ｇ及び
トリエチルアミン５００ｇを加え溶解させ、固形分約７
０重量％の変性アルキド樹脂溶液を得た。Production Example 1 Alkyd 1-1 Soybean oil fatty acid (acid value 155) 620g, rosin (acid value 1
7G) 500g, tall oil fatty acid (acid value 170) 60
After reacting 0 g of linoleic acid, 140 g of linoleic acid, 140 g of linoleic acid, and 300 g of maleic anhydride at 200°C under a nitrogen atmosphere for 3 hours, it was cooled to 100°C, and to this reaction solution was added 150 s of xylene + 1000 g of 1° pentaerythritol and trimellitic anhydride. 900 g was added and heated to 150° C. again, and when the acid value reached 100, the reaction was stopped and cooled. During this time, xylene was removed under reduced pressure.
After cooling to ℃, 680 g of isopropyl alcohol and 500 g of triethylamine were added and dissolved to reduce the solid content to about 7.
A 0% by weight modified alkyd resin solution was obtained.
の１
上記の変性アルキド樹脂溶液１００ｇに水溶性メラミン
樹脂（三井東圧化学■製、ニーパン１６５（不揮発分７
０％）３６０ｇと水溶性シリコーン樹脂（東しシリコー
ン■製、ＳＨ２９ＰＡ）２ｇを加えよく混合し、更に酸
化チタン２０ｇ及びクレー２０ｇ（何れも平均粒径５０
μｍ）を加えてよく混合し、電着樹脂組成物を得た。1 Add water-soluble melamine resin (manufactured by Mitsui Toatsu Chemical Co., Ltd., Kneepan 165 (non-volatile content: 7) to 100 g of the above modified alkyd resin solution.
0%) and 2 g of water-soluble silicone resin (manufactured by Toshi Silicone ■, SH29PA) were added and mixed well, followed by 20 g of titanium oxide and 20 g of clay (each with an average particle size of 50%).
μm) and mixed well to obtain an electrodeposited resin composition.
１）１粁免建銑
上記の電着樹脂組成物に不揮発分１５％となるように水
を加え、水分散後、ｐｎが８．２となるようにトリエチ
ルアミンを添加し、アルキド樹脂型電着塗料溶液を得た
。1) 1) 1) Water was added to the above electrodeposited resin composition so that the non-volatile content was 15%, and after dispersion in water, triethylamine was added so that the pn was 8.2, and alkyd resin type electrodeposition was performed. A paint solution was obtained.
実施例１
基板（ガラスエポキシ両面銅張積層板：３５ｃｍＸ３５
ｃｍ、厚さ１．６ ａｍ）の所定箇所に５００．ｕｍ孔
径のスルーホール２０００個を開孔し、スルーホールの
孔壁部及び両面銅箔層上に銅メッキを施して、銅メッキ
層を形成した後、このスルーホールメッキされた基板の
両面に感光性のドライフィルム〔ダイナケム コーポレ
ーション社製 ドライフィルムホトポリマー；ラミナー
ＴＡ （厚さ５０μｍ））を１６０℃でロール熱圧着し
た。これを冷却後、回路パターンの逆パターンのネガフ
ィルムをマスクとし、超高圧水銀灯を用い、２５０Ｗで
１０〜２０秒間光照射し、露光後、１．０％の炭酸ナト
リウム水溶液で上記ドライフィルムの未露光部分を溶解
除去して、上記ドライフィルムの露光部分からなる逆パ
ターンのレジスト被覆Ｎ（厚さ５０．ｕｎ）を形成し、
銅メッキ層の回路パターン（最小線幅１００μｍ１パタ
ーン間隔１５０μｍ）部分が露出し且つ銅メッキ層の回
路不要部分が上記レジスト被覆層で被覆された基板を得
た。Example 1 Substrate (glass epoxy double-sided copper clad laminate: 35cm x 35
500.cm, thickness 1.6 am) at a predetermined location. After drilling 2,000 through-holes with a hole diameter of 100 mm and applying copper plating on the hole walls of the through-holes and the copper foil layer on both sides to form a copper plating layer, both sides of the board plated with the through-holes were exposed to light. A dry film (dry film photopolymer manufactured by Dynachem Corporation; Laminar TA (thickness: 50 μm)) was thermocompression bonded with a roll at 160°C. After cooling this, using a negative film with a reverse pattern of the circuit pattern as a mask, it was irradiated with light at 250 W for 10 to 20 seconds using an ultra-high pressure mercury lamp. Dissolving and removing the exposed portion to form a resist coating N (thickness: 50 mm) with a reverse pattern consisting of the exposed portion of the dry film;
A substrate was obtained in which the circuit pattern (minimum line width: 100 μm, pitch per pattern: 150 μm) of the copper plating layer was exposed, and the circuit-free portion of the copper plating layer was covered with the resist coating layer.
このようにして得られた、逆パターンのレジスト被覆層
の形成された基板を、上記製造例１で得られたアルキド
樹脂型電着塗料溶液中に浸漬し、上記基板のｗ４ｎ出部
を陽極とし、上記電着塗料溶液中に浸漬したステンレス
板を陰極として、７０Ｖで１分間直流電流を印加して電
着塗装を行い、上記基板の銅露出部（上記レジスト被覆
層の形成されていない部分）に電着塗装樹脂層を形成し
た。The thus obtained substrate on which the resist coating layer of the reverse pattern was formed was immersed in the alkyd resin type electrodeposition paint solution obtained in Production Example 1 above, and the w4n protruding part of the substrate was used as an anode. Using the stainless steel plate immersed in the electrocoating solution as a cathode, applying a direct current of 70 V for 1 minute to perform electrocoating, and applying the electrodeposition coating to the exposed copper portion of the substrate (the portion where the resist coating layer is not formed). An electrodeposition resin layer was formed on the surface.
この電着塗装樹脂膜の膜厚は２５μｍであった。The thickness of this electrodeposited resin film was 25 μm.
電着塗装後、基板を水洗し、付着した電着塗料を洗い流
した後、電着塗装樹脂膜を、熱風乾燥器を用い１３０℃
で２０分間加熱処理した。これを冷却後、５０℃の２％
水酸化ナトリウム水溶液中に１分間浸漬して上記レジス
ト被覆層を剥離除去し、銅メッキ層の回路不要部分が露
出した基板を得た。After electrodeposition coating, the substrate is washed with water to wash away the adhering electrodeposition paint, and then the electrodeposition coating resin film is heated at 130℃ using a hot air dryer.
The mixture was heat-treated for 20 minutes. After cooling this, 2% of 50℃
The resist coating layer was peeled off by immersion in a sodium hydroxide aqueous solution for 1 minute to obtain a substrate in which the copper plating layer was exposed at an unnecessary portion of the circuit.
次いで、この基板を水洗、乾燥した後、５０℃の４０ボ
ーメ塩化第２鉄水溶液中に浸漬して、エツチング処理を
行い、上記レジスト被覆層の剥離除去によって露出した
銅メッキ層の回路不要部分及びその下のｗ４箔層の回路
不要部分を溶解除去した。Next, this board was washed with water, dried, and then immersed in a 40 Baumé ferric chloride aqueous solution at 50° C. to perform an etching process to remove unnecessary circuit parts of the copper plating layer exposed by peeling and removing the resist coating layer. The unnecessary portion of the W4 foil layer underneath was dissolved and removed.
然る後、上記のエツチング処理を行った基板を水洗、乾
燥した後、４％水酸化ナトリウム水溶液８０重量部とジ
エチレングリコール２０重量部との混合液中に５０℃で
５分間浸漬して電着塗装樹脂膜を剥離除去し、銅スルー
ホールプリント配線板を得た。Thereafter, the etched substrate was washed with water, dried, and then immersed in a mixture of 80 parts by weight of 4% sodium hydroxide solution and 20 parts by weight of diethylene glycol at 50°C for 5 minutes for electrodeposition coating. The resin film was peeled off and a copper through-hole printed wiring board was obtained.
得られた銅スルーホールプリント配線板は、最小線幅１
００μｍの回路パターンが精度良く形成されていた。The resulting copper through-hole printed wiring board has a minimum line width of 1
A circuit pattern of 00 μm was formed with high precision.
比較例１
感光性のドライフィルムの代わりにエツチングレジスト
インク（山栄化学■製 エツチングレジスト５ＥＲ４０
０ＢＬ）を用い、スクリーン印刷により１５μｍ厚のレ
ジスト被覆層を形成した以外は実施例１と同様にして銅
スルーホールプリント配線板を得た。Comparative Example 1 Etching resist ink (manufactured by Sanei Chemical Co., Ltd., Etching Resist 5ER40) instead of photosensitive dry film
A copper through-hole printed wiring board was obtained in the same manner as in Example 1, except that a 15 μm thick resist coating layer was formed using screen printing.
得られたスルーホールプリント配線板は、電着塗装の際
、一部で電着塗装樹脂膜がレジスト被覆層に覆い被さっ
たため、レジスト被覆層が一部剥離除去できず、塩化第
２鉄水溶液による正常なエツチング処理ができないこと
による回路の短絡が認められた。During electrodeposition coating, the resulting through-hole printed wiring board was partially coated with the electrodeposited resin film over the resist coating layer, so the resist coating layer could not be partially peeled off and removed using a ferric chloride aqueous solution. A short circuit was observed due to inability to perform normal etching processing.
本発明のスルーホールメッキ配線板の製造方法によれば
、膜厚が充分に大きく且つ微細パターンのレジスト被覆
層を精度良く容易に形成でき、スルーホールメンキ配線
板を実質的に製品不良を生じることなく製造することが
できる。According to the method for manufacturing a through-hole plating wiring board of the present invention, a resist coating layer having a sufficiently large film thickness and a fine pattern can be easily formed with high precision, and the through-hole plating wiring board can be substantially defective. It can be manufactured without any
第１図は、本発明のスルーホールメッキ配線板の製造方
法の実施態様を模式的に示す概略図、第２図は、本発明
の製造方法におけるレジスト被覆層の形成工程を模式的
ニ、示す概略図、第３図は、レジストインクを用いるス
クリーン印刷法によりレジスト被覆層が形成された基板
に、電着塗装により電着塗装樹脂膜を形成した状態を示
す概略図である。
ｌ・・基板、２・・銅箔層（導電性金属Ｎ）、３・・基
材、４・・スルーホール、４ａ・・孔壁部、５・・メッ
キ層、６・・レジスト被覆層、７・・ドライフィルム、
８・・ネガフィルム、９・・電着塗装樹脂膜
特許出願人 宇部興産株式会社
名幸電子工業株式会社
第２図
第３図
コFIG. 1 is a schematic view schematically showing an embodiment of the method for manufacturing a through-hole plated wiring board of the present invention, and FIG. 2 is a schematic diagram showing a resist coating layer forming step in the manufacturing method of the present invention. The schematic diagram and FIG. 3 are schematic diagrams showing a state in which an electrodeposited resin film is formed by electrodeposition coating on a substrate on which a resist coating layer is formed by a screen printing method using resist ink. l...Substrate, 2...Copper foil layer (conductive metal N), 3...Base material, 4...Through hole, 4a...Hole wall, 5...Plating layer, 6...Resist coating layer, 7.Dry film,
8. Negative film, 9. Electrodeposition resin film Patent applicant Ube Industries, Ltd. Nako Electronics Co., Ltd. Figure 2 Figure 3 Co., Ltd.
Claims (2)
スルーホールを形成し、少なくとも該スルーホールの孔
壁部にメッキを施した後、このスルーホールメッキされ
た基板の両面に得ようとする回路パターンの逆パターン
のレジスト被覆層を形成し、次いで、上記スルーホール
の孔壁部及び上記基板の両面の上記レジスト被覆層の形
成されていない部分に、電着塗装によって電着塗装樹脂
層を形成し、次いで、上記レジスト被覆層のみを除去し
た後、このレジスト被覆層の除去によって露出したメッ
キ層及び導電性金属層をエッチングにより除去し、然る
後、上記電着塗装樹脂層を除去する、スルーホールメッ
キ配線板の製造方法であって、上記レジスト被覆層の形
成を、感光性のドライフィルムを上記のスルーホールメ
ッキされた基板の両面にラミネートし、次いで、上記ド
ライフィルムを逆パターン状に露光した後、現像して上
記ドライフィルムの未光硬化部分を除去することにより
行うことを特徴とするスルーホールメッキ配線板の製造
方法。(1) After drilling a through hole in a substrate having conductive metal layers on both sides and plating at least the hole wall of the through hole, a layer of metal is formed on both sides of the substrate plated with the through hole. A resist coating layer is formed in a pattern opposite to the intended circuit pattern, and then the hole wall portion of the through hole and the portions of both surfaces of the substrate where the resist coating layer is not formed are coated by electrodeposition coating. After forming a resin layer and removing only the resist coating layer, the plating layer and conductive metal layer exposed by the removal of the resist coating layer are removed by etching, and then the electrodeposition coating resin layer is removed. A method for manufacturing a through-hole plated wiring board, which removes the formation of the resist coating layer by laminating a photosensitive dry film on both sides of the through-hole plated board, and then removing the dry film. A method for manufacturing a through-hole plated wiring board, which comprises exposing the dry film to light in a reverse pattern and then developing it to remove the uncured portion of the dry film.
０μｍのものを用いる特許請求の範囲第（１）項記載の
スルーホールメッキ配線板の製造方法。(2) As a photosensitive dry film, the film thickness is 25-5
A method for manufacturing a through-hole plated wiring board according to claim (1) using a plated wiring board having a diameter of 0 μm.
Priority Applications (2)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP26839286A JPS63122196A (en) | 1986-11-11 | 1986-11-11 | Manufacture of through-hole plated wiring board |
| EP87104696A EP0261301A3 (en) | 1986-09-22 | 1987-03-30 | Process for the preparation of circuit-printed board having plated through-hole |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP26839286A JPS63122196A (en) | 1986-11-11 | 1986-11-11 | Manufacture of through-hole plated wiring board |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| JPS63122196A true JPS63122196A (en) | 1988-05-26 |
Family
ID=17457836
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP26839286A Pending JPS63122196A (en) | 1986-09-22 | 1986-11-11 | Manufacture of through-hole plated wiring board |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPS63122196A (en) |
-
1986
- 1986-11-11 JP JP26839286A patent/JPS63122196A/en active Pending
Similar Documents
| Publication | Publication Date | Title |
|---|---|---|
| US4410562A (en) | Method for forming a cured resin coating having a desired pattern on the surface of a substrate | |
| JPS641954B2 (en) | ||
| JPS62293689A (en) | Presensitized circuit material | |
| US6013417A (en) | Process for fabricating circuitry on substrates having plated through-holes | |
| US4690833A (en) | Providing circuit lines on a substrate | |
| KR20000036165A (en) | A method for adding layers to a PWB which yields high levels of copper to dielectric adhesion | |
| JPS63122196A (en) | Manufacture of through-hole plated wiring board | |
| EP0261301A2 (en) | Process for the preparation of circuit-printed board having plated through-hole | |
| JP2004240233A (en) | Solder resist composition, circuit board and method for manufacturing the same | |
| JPH0653631A (en) | Manufacture of printed wiring board | |
| JPH01268093A (en) | Manufacture of wiring substrate having plated through hole | |
| JPS63224393A (en) | Manufacture of wiring board with plated through-hole | |
| JP2015046519A (en) | Method for manufacturing circuit board | |
| JPS6316694A (en) | Manufacture of high density printed wiring board | |
| KR20040061046A (en) | Method for building layer of printed circuit board | |
| JPS6325998A (en) | Manufacture of through-hole plated wiring board | |
| GB2117670A (en) | Method for forming a cured resin coating having a desired pattern on the surface of a substrate | |
| JPH08290478A (en) | Production of resin molded article having fine recess on itssurface | |
| JP2002134909A (en) | Manufacturing method of printed wiring board | |
| JPH11266069A (en) | Transfer member and manufacture thereof | |
| JPS6384192A (en) | Manufacture of through-hole printed wiring board | |
| JPH0836258A (en) | Photosensitive element, its laminating method and resist forming method | |
| JPH1027953A (en) | Manufacturing method of member for transferring and member for transferring | |
| JPS62149193A (en) | Manufacture of through-hole plated wiring board | |
| JPS5867097A (en) | Method of producing printed circuit board |