JPS63110203A - Optical disk substrate - Google Patents
Optical disk substrateInfo
- Publication number
- JPS63110203A JPS63110203A JP61256334A JP25633486A JPS63110203A JP S63110203 A JPS63110203 A JP S63110203A JP 61256334 A JP61256334 A JP 61256334A JP 25633486 A JP25633486 A JP 25633486A JP S63110203 A JPS63110203 A JP S63110203A
- Authority
- JP
- Japan
- Prior art keywords
- resin composition
- acrylate
- disk substrate
- formula
- resin
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
- 239000000758 substrate Substances 0.000 title claims abstract description 29
- 230000003287 optical effect Effects 0.000 title claims abstract description 23
- NIXOWILDQLNWCW-UHFFFAOYSA-M Acrylate Chemical compound [O-]C(=O)C=C NIXOWILDQLNWCW-UHFFFAOYSA-M 0.000 claims abstract description 17
- 239000011342 resin composition Substances 0.000 claims abstract description 12
- 239000011521 glass Substances 0.000 claims abstract description 11
- 239000000178 monomer Substances 0.000 claims abstract description 9
- 125000006850 spacer group Chemical group 0.000 claims abstract description 5
- 230000001678 irradiating effect Effects 0.000 claims abstract description 4
- 125000000391 vinyl group Chemical group [H]C([*])=C([H])[H] 0.000 claims abstract description 4
- 238000000016 photochemical curing Methods 0.000 claims description 4
- 239000000126 substance Substances 0.000 claims 2
- 238000010521 absorption reaction Methods 0.000 abstract description 7
- 150000001875 compounds Chemical class 0.000 abstract description 5
- WHNWPMSKXPGLAX-UHFFFAOYSA-N N-Vinyl-2-pyrrolidone Chemical compound C=CN1CCCC1=O WHNWPMSKXPGLAX-UHFFFAOYSA-N 0.000 abstract description 2
- 239000000203 mixture Substances 0.000 abstract 1
- 239000011347 resin Substances 0.000 description 12
- 229920005989 resin Polymers 0.000 description 12
- 238000000034 method Methods 0.000 description 8
- 239000003795 chemical substances by application Substances 0.000 description 5
- 238000004519 manufacturing process Methods 0.000 description 5
- 239000004925 Acrylic resin Substances 0.000 description 4
- 229920000178 Acrylic resin Polymers 0.000 description 4
- 238000001723 curing Methods 0.000 description 4
- 229920005668 polycarbonate resin Polymers 0.000 description 4
- 239000004431 polycarbonate resin Substances 0.000 description 4
- XLYOFNOQVPJJNP-UHFFFAOYSA-N water Substances O XLYOFNOQVPJJNP-UHFFFAOYSA-N 0.000 description 4
- 238000002347 injection Methods 0.000 description 3
- 239000007924 injection Substances 0.000 description 3
- QSHDDOUJBYECFT-UHFFFAOYSA-N mercury Chemical compound [Hg] QSHDDOUJBYECFT-UHFFFAOYSA-N 0.000 description 3
- 229910052753 mercury Inorganic materials 0.000 description 3
- XMLYCEVDHLAQEL-UHFFFAOYSA-N 2-hydroxy-2-methyl-1-phenylpropan-1-one Chemical compound CC(C)(O)C(=O)C1=CC=CC=C1 XMLYCEVDHLAQEL-UHFFFAOYSA-N 0.000 description 2
- RTZKZFJDLAIYFH-UHFFFAOYSA-N Diethyl ether Chemical compound CCOCC RTZKZFJDLAIYFH-UHFFFAOYSA-N 0.000 description 2
- GUUVPOWQJOLRAS-UHFFFAOYSA-N Diphenyl disulfide Chemical compound C=1C=CC=CC=1SSC1=CC=CC=C1 GUUVPOWQJOLRAS-UHFFFAOYSA-N 0.000 description 2
- PPBRXRYQALVLMV-UHFFFAOYSA-N Styrene Chemical compound C=CC1=CC=CC=C1 PPBRXRYQALVLMV-UHFFFAOYSA-N 0.000 description 2
- 230000007423 decrease Effects 0.000 description 2
- 239000003822 epoxy resin Substances 0.000 description 2
- 229910052751 metal Inorganic materials 0.000 description 2
- 239000002184 metal Substances 0.000 description 2
- 238000000465 moulding Methods 0.000 description 2
- 239000003504 photosensitizing agent Substances 0.000 description 2
- 229920003229 poly(methyl methacrylate) Polymers 0.000 description 2
- 229920000647 polyepoxide Polymers 0.000 description 2
- 239000004926 polymethyl methacrylate Substances 0.000 description 2
- MYWOJODOMFBVCB-UHFFFAOYSA-N 1,2,6-trimethylphenanthrene Chemical compound CC1=CC=C2C3=CC(C)=CC=C3C=CC2=C1C MYWOJODOMFBVCB-UHFFFAOYSA-N 0.000 description 1
- MSAHTMIQULFMRG-UHFFFAOYSA-N 1,2-diphenyl-2-propan-2-yloxyethanone Chemical compound C=1C=CC=CC=1C(OC(C)C)C(=O)C1=CC=CC=C1 MSAHTMIQULFMRG-UHFFFAOYSA-N 0.000 description 1
- DKEGCUDAFWNSSO-UHFFFAOYSA-N 1,8-dibromooctane Chemical compound BrCCCCCCCCBr DKEGCUDAFWNSSO-UHFFFAOYSA-N 0.000 description 1
- 239000012956 1-hydroxycyclohexylphenyl-ketone Substances 0.000 description 1
- ZVAFZTLAMCXAII-UHFFFAOYSA-N 2-(1-ethoxyethyl)-2-(hydroxymethyl)propane-1,3-diol Chemical compound CCOC(C)C(CO)(CO)CO ZVAFZTLAMCXAII-UHFFFAOYSA-N 0.000 description 1
- LCZVSXRMYJUNFX-UHFFFAOYSA-N 2-[2-(2-hydroxypropoxy)propoxy]propan-1-ol Chemical compound CC(O)COC(C)COC(C)CO LCZVSXRMYJUNFX-UHFFFAOYSA-N 0.000 description 1
- KMNCBSZOIQAUFX-UHFFFAOYSA-N 2-ethoxy-1,2-diphenylethanone Chemical compound C=1C=CC=CC=1C(OCC)C(=O)C1=CC=CC=C1 KMNCBSZOIQAUFX-UHFFFAOYSA-N 0.000 description 1
- QPXVRLXJHPTCPW-UHFFFAOYSA-N 2-hydroxy-2-methyl-1-(4-propan-2-ylphenyl)propan-1-one Chemical compound CC(C)C1=CC=C(C(=O)C(C)(C)O)C=C1 QPXVRLXJHPTCPW-UHFFFAOYSA-N 0.000 description 1
- BQZJOQXSCSZQPS-UHFFFAOYSA-N 2-methoxy-1,2-diphenylethanone Chemical compound C=1C=CC=CC=1C(OC)C(=O)C1=CC=CC=C1 BQZJOQXSCSZQPS-UHFFFAOYSA-N 0.000 description 1
- 239000004593 Epoxy Substances 0.000 description 1
- JOYRKODLDBILNP-UHFFFAOYSA-N Ethyl urethane Chemical compound CCOC(N)=O JOYRKODLDBILNP-UHFFFAOYSA-N 0.000 description 1
- ZJCCRDAZUWHFQH-UHFFFAOYSA-N Trimethylolpropane Chemical compound CCC(CO)(CO)CO ZJCCRDAZUWHFQH-UHFFFAOYSA-N 0.000 description 1
- MPIAGWXWVAHQBB-UHFFFAOYSA-N [3-prop-2-enoyloxy-2-[[3-prop-2-enoyloxy-2,2-bis(prop-2-enoyloxymethyl)propoxy]methyl]-2-(prop-2-enoyloxymethyl)propyl] prop-2-enoate Chemical compound C=CC(=O)OCC(COC(=O)C=C)(COC(=O)C=C)COCC(COC(=O)C=C)(COC(=O)C=C)COC(=O)C=C MPIAGWXWVAHQBB-UHFFFAOYSA-N 0.000 description 1
- 239000000654 additive Substances 0.000 description 1
- 238000005452 bending Methods 0.000 description 1
- WURBFLDFSFBTLW-UHFFFAOYSA-N benzil Chemical group C=1C=CC=CC=1C(=O)C(=O)C1=CC=CC=C1 WURBFLDFSFBTLW-UHFFFAOYSA-N 0.000 description 1
- 125000001797 benzyl group Chemical group [H]C1=C([H])C([H])=C(C([H])=C1[H])C([H])([H])* 0.000 description 1
- MQDJYUACMFCOFT-UHFFFAOYSA-N bis[2-(1-hydroxycyclohexyl)phenyl]methanone Chemical compound C=1C=CC=C(C(=O)C=2C(=CC=CC=2)C2(O)CCCCC2)C=1C1(O)CCCCC1 MQDJYUACMFCOFT-UHFFFAOYSA-N 0.000 description 1
- KVNRLNFWIYMESJ-UHFFFAOYSA-N butyronitrile Chemical compound CCCC#N KVNRLNFWIYMESJ-UHFFFAOYSA-N 0.000 description 1
- 230000000694 effects Effects 0.000 description 1
- 125000000524 functional group Chemical group 0.000 description 1
- 230000009477 glass transition Effects 0.000 description 1
- XXMIOPMDWAUFGU-UHFFFAOYSA-N hexane-1,6-diol Chemical compound OCCCCCCO XXMIOPMDWAUFGU-UHFFFAOYSA-N 0.000 description 1
- 230000007774 longterm Effects 0.000 description 1
- SLCVBVWXLSEKPL-UHFFFAOYSA-N neopentyl glycol Chemical compound OCC(C)(C)CO SLCVBVWXLSEKPL-UHFFFAOYSA-N 0.000 description 1
- 229920000515 polycarbonate Polymers 0.000 description 1
- 239000004417 polycarbonate Substances 0.000 description 1
- 229920000728 polyester Polymers 0.000 description 1
- 238000006116 polymerization reaction Methods 0.000 description 1
- 229920001296 polysiloxane Polymers 0.000 description 1
- 230000005855 radiation Effects 0.000 description 1
- YRHRIQCWCFGUEQ-UHFFFAOYSA-N thioxanthen-9-one Chemical compound C1=CC=C2C(=O)C3=CC=CC=C3SC2=C1 YRHRIQCWCFGUEQ-UHFFFAOYSA-N 0.000 description 1
- 238000002834 transmittance Methods 0.000 description 1
- 239000006097 ultraviolet radiation absorber Substances 0.000 description 1
- 238000004383 yellowing Methods 0.000 description 1
Landscapes
- Macromonomer-Based Addition Polymer (AREA)
- Optical Record Carriers And Manufacture Thereof (AREA)
- Moulds For Moulding Plastics Or The Like (AREA)
- Casting Or Compression Moulding Of Plastics Or The Like (AREA)
- Addition Polymer Or Copolymer, Post-Treatments, Or Chemical Modifications (AREA)
Abstract
Description
【発明の詳細な説明】
(産業上の利用分野)
本発明は、光で読みとる方式のディ、スフ基板、特にデ
ジタル・オーディオディスク、ビデオディスク、メモリ
ーディスク等の光ディスク基板に関する。DETAILED DESCRIPTION OF THE INVENTION (Industrial Application Field) The present invention relates to an optically readable disk or screen substrate, particularly to an optical disk substrate such as a digital audio disk, video disk, or memory disk.
(従来の技術)
光ディスクメモリー用のディスク基板の製造法としては
、ポリカーボネート樹脂、アクリル樹脂をインジエクシ
ヲン法で成型する方法、すなわち、片面にスタンパが設
置されている金型の中に重合度の低いプラスチックを高
温高圧で流し込んで成型する方法、又ガラス、アクリル
樹脂、ポリカ−ボネート樹脂、エポキシ樹脂等の平板上
に光硬化性の樹脂を流し込みその上から金属スタンパを
押しあて、基板側から放射線を照射して樹脂を硬化させ
、スタンパを剥離して光ディスク基板を製造する、所謂
2P法が知られている。(Prior art) A method of manufacturing a disk substrate for an optical disk memory is to mold polycarbonate resin or acrylic resin using the indie exion method. Another method is to pour a photocurable resin onto a flat plate of glass, acrylic resin, polycarbonate resin, epoxy resin, etc., press a metal stamper over it, and irradiate radiation from the substrate side. A so-called 2P method is known in which an optical disc substrate is manufactured by curing the resin and peeling off the stamper.
更に特開昭60−112409号公報、特開昭60−2
02557号公報、特開昭61−44689号公報、特
開昭61−98710号公報、特開昭61−11591
3号公報、特開昭61−159411号公報、特開昭6
1−176618号公報にアクリル系樹脂を光硬化させ
て光ディスク基板を製造する方法が提案されている。Furthermore, JP-A-60-112409, JP-A-60-2
02557, JP 61-44689, JP 61-98710, JP 61-11591
Publication No. 3, JP-A-61-159411, JP-A-6
Japanese Patent No. 1-176618 proposes a method of manufacturing an optical disc substrate by photocuring an acrylic resin.
(発明が解決しようとする問題点)
光ディスク基板をインジェクション法で成型する方法は
生産性に優れるが、異物が混入しやす(、C/Nが低い
ばかりでなく、ポリカーボネート樹脂については、成形
時の残留応力のため分子が配向して光学的歪(複屈折)
が太き(なり易く、また表面硬度が低いため製造工程時
に傷がつきやすい欠点を有しており、ポリメチルメタク
リレート樹脂については、吸湿性が大きいためディスク
が反りやすく、かつ、耐熱性が低いため記録膜をつけた
溝の熱安定性が低いという問題点がある。(Problems to be solved by the invention) Although the method of molding optical disk substrates by injection method has excellent productivity, it is easy for foreign matter to get mixed in (not only is the C/N ratio low, but polycarbonate resin is Optical distortion (birefringence) due to orientation of molecules due to residual stress
It has the disadvantage of being thick and easily scratched during the manufacturing process due to its low surface hardness, and polymethyl methacrylate resin has a high hygroscopicity, making the disc easy to warp and having low heat resistance. Therefore, there is a problem that the thermal stability of the groove provided with the recording film is low.
又2P法による場合は、2段階で光ディスク基板を作成
するため作業上からも時間を要し、また基板と光硬化樹
脂との密着性の高信幀性も要求され、更に、遇明な基板
の選定が重要であり、アクリル樹脂では低Tgで吸湿性
による反りの問題、ポリカーボネート樹脂は大きい複屈
折、エポキシ樹脂は成型時の硬化時間が長い等の問題が
ある。In addition, in the case of using the 2P method, the optical disk substrate is created in two steps, which takes time from a work perspective, and also requires high reliability in the adhesion between the substrate and the photocuring resin. Acrylic resin has a problem of warping due to its low Tg and hygroscopicity, polycarbonate resin has a large birefringence, and epoxy resin has problems such as a long curing time during molding.
特開昭60−112409号公報、特開昭60−202
557号公報、特開昭61−44689号公報、特開昭
61−98710号公報、特開昭61−115913号
公報、特開昭61−159411号公報、特開昭61−
176618号公報で提案された方法は、反りの低減、
低吸水、低吸湿、耐熱性等を特徴とするとされているが
いずれもまだ実用化に至っていない。JP-A-60-112409, JP-A-60-202
557, JP 61-44689, JP 61-98710, JP 61-115913, JP 61-159411, JP 61-1987-
The method proposed in Publication No. 176618 reduces warpage,
It is said to have characteristics such as low water absorption, low moisture absorption, and heat resistance, but none of these have yet been put into practical use.
本発明は、光学的歪(複屈折)、吸湿による反りが少な
く、表面硬度、耐熱性、機械的強度に優れ長期信頼性の
高い光ディスク基板を提供するものである。The present invention provides an optical disk substrate that is less warped due to optical distortion (birefringence) and moisture absorption, has excellent surface hardness, heat resistance, and mechanical strength, and has high long-term reliability.
(問題点を解決するための手段) 本発明1よ、Aニ一般式(+) (式中RはHSCH3、X+−XsはH%CI。(Means for solving problems) Invention 1, A general formula (+) (In the formula, R is HSCH3, and X+-Xs is H%CI.
Br%mは0〜3) で示される重合性化合物と、 Bニ一般式(n) (式中RはH,CH:+ 、Y+〜Y4はH,CI。Br%m is 0-3) A polymerizable compound represented by B general formula (n) (In the formula, R is H, CH:+, Y+ to Y4 are H, CI.
Br、 n、 n、は0〜3)
で示される重合性化合物と、
C:光重合可能なアクリレートモノマー、オリゴマー、
ビニル基含有モノマ−1
とより成る樹脂組成物を所定の形状に光硬化させて光デ
ィスク基板とするものである。Br, n, n is 0 to 3) A polymerizable compound represented by: C: a photopolymerizable acrylate monomer, oligomer,
A resin composition comprising a vinyl group-containing monomer 1 is photocured into a predetermined shape to form an optical disc substrate.
光重合可能なアクリレートモノマー、オリゴマー、ビニ
ル基含有モノマーとしては、エポキシ(メタ)アクリレ
ート、ポリエステル(メタ)アクリレート、ウレタン(
メタ)アクリレート、シリコーン(メタ)アクリレート
、1.6ヘキサンジオールジ(メタ)アクリレート、ト
リメチロールプロパントリ (メタ)アクリレート、ペ
ンタエリスリトールテトラアクリレート、ジペンタエリ
スリトールへキサアクリレート、エトオキシトリメチロ
ールプロパントリ (メタ)アクリレート、ネオペンチ
ルグリコールジ(メタ)アクリレート、トリプロピレン
グリコールジ(メタ)アクリレート、イソボニル(メタ
)アクリレート、トリシクロデカニル(メタ)アクリレ
ート、スチレン、N−ビニルピロリドン等が使用される
。オリゴマーの分子量は200〜300が好ましい。Photopolymerizable acrylate monomers, oligomers, and vinyl group-containing monomers include epoxy (meth)acrylate, polyester (meth)acrylate, and urethane (
meth)acrylate, silicone (meth)acrylate, 1.6 hexanediol di(meth)acrylate, trimethylolpropane tri(meth)acrylate, pentaerythritol tetraacrylate, dipentaerythritol hexaacrylate, ethoxytrimethylolpropane tri(meth)acrylate ) acrylate, neopentyl glycol di(meth)acrylate, tripropylene glycol di(meth)acrylate, isobonyl(meth)acrylate, tricyclodecanyl(meth)acrylate, styrene, N-vinylpyrrolidone, etc. are used. The molecular weight of the oligomer is preferably 200 to 300.
A、B成分は共重合可能であり、A、B、C成分は混合
して用いる。それらの混合割合は、それぞれの種類及び
使用量により異なるがA成分が80%(重量%以下同じ
)を越えると吸湿性が増大する傾向にあり、5%未満で
は機械的強度、耐熱性、表面硬度が低下する傾向にあり
好ましくない。Components A and B can be copolymerized, and components A, B, and C are used in combination. The mixing ratio varies depending on the type and amount used, but if the A component exceeds 80% (the same below weight%), the hygroscopicity tends to increase, while if it is less than 5%, the mechanical strength, heat resistance, surface Hardness tends to decrease, which is not preferable.
又B成分が80%を越えるともろくなり耐衝撃性が低下
する傾向にあり、10%未満では吸湿性が大きくなる。Moreover, if the B component exceeds 80%, it tends to become brittle and the impact resistance decreases, while if it is less than 10%, the hygroscopicity increases.
C成分の各々についても、それ自体の構造、官能基数な
どにより異なるため一義的には決められないが50%以
上使用することが好ましい。It is preferable to use 50% or more of each component C, although it cannot be determined unambiguously because it varies depending on its own structure, number of functional groups, etc.
上記樹脂組成物を重合しディスク基板を製造するには、
スペーサーで所定の間隔を保つ透明板と金属又は透明板
のスタンパ−との間、又は2枚の透明板の間に樹脂組成
物を注入し、片面又は全面から紫外線等を照射し光硬化
させる。後者の場合は、その後光硬化させた基板の上に
スタンパの溝を転写した樹脂層を形成する。In order to polymerize the above resin composition and manufacture a disk substrate,
A resin composition is injected between a transparent plate and a metal or transparent plate stamper, which are kept at a predetermined distance by a spacer, or between two transparent plates, and is photocured by irradiating ultraviolet rays or the like from one side or the entire surface. In the latter case, a resin layer having the grooves of the stamper transferred thereto is formed on the photocured substrate.
本発明の樹脂組成物には、一般に知られている光増感剤
、例えばジベンゾイル、ベンゾインメチルエーテル、ベ
ンゾインエチルエーテル、ベンゾインイソプロピルエー
テル、ベンゾインイソブチルエーテル、2−ヒドロキシ
−2−ベンゾイルプロパン、アゾビスイソブチロニトリ
ル、ベンジル、チオキサントン、ジフェニルジスルフィ
ド、1−(4−イソプロピルフェニル)−2−ヒドロキ
シ−2−メチルプロパン−1−オン、2−ヒドロキシ−
2−メチル−1−フェニル−プロパン−1−オン、2.
2−ジメトキシ−2−フェニルアセトフェノン、1−ヒ
ドロキシシクロへキシルフェニルケトン等を使用するこ
とができる。これらの光増感剤は、樹脂組成物に対して
多くとも5%の量で用いられる。The resin composition of the present invention may contain commonly known photosensitizers, such as dibenzoyl, benzoin methyl ether, benzoin ethyl ether, benzoin isopropyl ether, benzoin isobutyl ether, 2-hydroxy-2-benzoylpropane, azobisisobutyl ether, etc. Butyronitrile, benzyl, thioxanthone, diphenyl disulfide, 1-(4-isopropylphenyl)-2-hydroxy-2-methylpropan-1-one, 2-hydroxy-
2-methyl-1-phenyl-propan-1-one, 2.
2-dimethoxy-2-phenylacetophenone, 1-hydroxycyclohexylphenyl ketone, etc. can be used. These photosensitizers are used in amounts of at most 5% based on the resin composition.
本発明の樹脂組成物に、必要に応じて黄変防止剤、レベ
リング剤、紫外線吸収剤等の添加剤を重合硬化を妨げな
い範囲で添加することができる。Additives such as an anti-yellowing agent, a leveling agent, and an ultraviolet absorber can be added to the resin composition of the present invention, if necessary, within a range that does not interfere with polymerization and curing.
実施例1
2枚の板ガラスとスペーサとからなるガラス鋳型を用意
し、この鋳型中に2重部の1− (4−イソプロピルフ
ェニル)−2−ヒドロキシ−2−メチルプロパン−1−
オンを添加、混合した第1表NotmNO4の各種樹脂
組成物を注入し、8〇−/備高圧水銀灯を用いて周囲か
ら紫外線を照射した。60秒間硬化した後、離型し、厚
さ!、2 tm、直径30cmの均一な厚みの基板を得
た。この基板を用いて、以下(I1〜(4)の特性を測
定したところ第1表の結果を得た。Example 1 A glass mold consisting of two glass plates and a spacer was prepared, and a double portion of 1-(4-isopropylphenyl)-2-hydroxy-2-methylpropane-1-
Various resin compositions of NotmNO4 in Table 1, which had been added and mixed with On, were injected and irradiated with ultraviolet rays from the surroundings using an 80-/bi high-pressure mercury lamp. After curing for 60 seconds, release the mold and check the thickness! , 2 tm, and a uniform thickness of 30 cm in diameter was obtained. Using this substrate, the following characteristics (I1 to (4)) were measured and the results shown in Table 1 were obtained.
(I)吸水率:60℃の水中に300時間放置し、JI
S−に6911に準じて測定した。(I) Water absorption rate: left in water at 60°C for 300 hours, JI
S- was measured according to 6911.
(2)耐熱温度: DMA法によりガラス転移温度を測
定した。(2) Heat resistant temperature: Glass transition temperature was measured by DMA method.
(3) 光学特性:厚さ1.2Hの樹脂板に830r
+a+の光をあて、光透過率を分光光度計で求めた。(3) Optical properties: 830r on a resin plate with a thickness of 1.2H
+a+ light was applied, and the light transmittance was determined using a spectrophotometer.
又830nmの光をあてて複屈折率を求めて、リターデ
ーションも測定した。In addition, retardation was also measured by irradiating light of 830 nm to determine birefringence.
(4)表面硬度:鉛筆硬度を求めた。(4) Surface hardness: Pencil hardness was determined.
(5)曲げ強度:JIS−に6911に準じて測定した
。(5) Bending strength: Measured according to JIS-6911.
(以下余白)
第1表かられかるように、本発明の基板はポリメチルメ
タアクリレートの基板に比較し、吸水率が小さく、耐熱
温度が高い、また、ポリカーボネートの基板との比較で
は、リターデーシヨンおよび表面硬度に優れている。(Left below) As can be seen from Table 1, the substrate of the present invention has lower water absorption and higher heat resistance than polymethyl methacrylate substrates, and has lower retardation than polycarbonate substrates. Excellent hardness and surface hardness.
実施例2
溝状パターン付Ni製スタンパに対して、離型剤を塗布
したガラス板を向かい合わせに配置し、両者の間に1.
2mの空間を設けて樹脂注入型を形成した。Example 2 A glass plate coated with a release agent was placed facing a groove-patterned Ni stamper, and 1.
A resin injection mold was formed with a 2 m space.
この型の中に、実施例1で示された第1表N01〜NO
4の各樹脂を注入し、80W/am高圧水銀灯を用いて
、60秒間ガラス板から紫外線を照射し、樹脂を硬化さ
せ、溝状パターン付基板を得た。In this mold, the first table N01 to NO shown in Example 1
Each of the resins No. 4 was injected, and the glass plate was irradiated with ultraviolet rays for 60 seconds using an 80 W/am high-pressure mercury lamp to harden the resins, thereby obtaining a grooved patterned substrate.
溝付の透明基板面にTe系記録膜を約30μm厚さに蒸
着した後、基板全体を100℃1時間の雰囲気にさらし
、記録膜の結晶化を行なって、光ディスク記録媒体を作
成した。得られた光ディスク記録媒体は、情報出力時の
出力レベルは良好であり、かつ基板に反りが生じなかっ
た。After a Te-based recording film was deposited to a thickness of about 30 μm on the surface of a grooved transparent substrate, the entire substrate was exposed to an atmosphere at 100° C. for 1 hour to crystallize the recording film, thereby producing an optical disc recording medium. The obtained optical disc recording medium had a good output level when outputting information, and the substrate did not warp.
実施例3
離型剤を塗布した溝状パターン付ガラス製スタンパに対
して離型剤を塗布したガラス板を用い、実施例2の要領
で樹脂注入型を用意した。さらに、この型の中に、実施
例1で示された第1表N01〜NO4の各樹脂を注入し
た。801f/am高圧水銀灯を用いて、紫外線をガラ
ス板側から30秒間照射し、次にスタンパ側から紫外線
を30秒間照射して、樹脂を硬化せしめた。得られた溝
付パターン付基板に実施例2と同一処理を施し光ディス
ク記録媒体を作製した。Example 3 A resin injection mold was prepared in the same manner as in Example 2 using a glass plate coated with a release agent and a grooved patterned glass stamper coated with a release agent. Furthermore, each resin of Table 1 No. 1 to No. 4 shown in Example 1 was injected into this mold. Using an 801 f/am high pressure mercury lamp, ultraviolet rays were irradiated from the glass plate side for 30 seconds, and then ultraviolet rays were irradiated from the stamper side for 30 seconds to cure the resin. The obtained grooved patterned substrate was subjected to the same treatment as in Example 2 to produce an optical disc recording medium.
得られた光ディスク記録媒体に反りは見られず、又、情
報の書き込み、読み出しを円滑に行うことができた。No warping was observed in the obtained optical disc recording medium, and information could be written and read smoothly.
(発明の効果)
本発明の光ディスク基板は、光学的歪(複屈折)、吸湿
による反りが少なく、表面硬度、機械的強度、耐熱性に
優れると共に、光硬化により短時間で成形出来るのでそ
の製造の生産性が高められる。(Effects of the Invention) The optical disk substrate of the present invention has less optical distortion (birefringence) and warping due to moisture absorption, and has excellent surface hardness, mechanical strength, and heat resistance, and can be molded in a short time by photocuring, so it can be manufactured. productivity is increased.
さらに、スペーサーで所定の間隔を保つガラス板とスタ
ンパとの間に樹脂組成物を注入し紫外線等を照射し光硬
化させ光ディスク基板を製遺し得るのでその製造の生産
性が著しく高められる。Furthermore, the resin composition is injected between the glass plate and the stamper, which are maintained at a predetermined distance by a spacer, and is photocured by irradiation with ultraviolet rays or the like to produce an optical disc substrate, thereby significantly increasing the productivity of its production.
Claims (1)
Br、mは0〜3) で示される重合性化合物と、 B:一般式(II) ▲数式、化学式、表等があります▼(II) (式中RはH、CH_3、Y_1〜Y_4はH、Cl、
Br、n_1n_2は0〜3) で示される重合性化合物と、 C:光重合可能なアクリレートモノマー、オリゴマー、
ビニル基含有モノマー、 とより成る樹脂組成物を所定の形状に光硬化させて成る
光ディスク基板。 2、樹脂組成物を、スペーサーで所定の間隔を保つガラ
ス板とスタンパとの間に注入し紫外線を照射し光硬化さ
せて成る特許請求の範囲第1項記載の光ディスク基板。[Claims] 1.A: General formula (I) ▲There are mathematical formulas, chemical formulas, tables, etc.▼(I) (In the formula, R is H, CH_3, X_1 to X_9 are H, Cl,
Br, m are 0 to 3) B: General formula (II) ▲ There are mathematical formulas, chemical formulas, tables, etc. ▼ (II) (In the formula, R is H, CH_3, Y_1 to Y_4 are H ,Cl,
Br, n_1n_2 is 0 to 3) and C: a photopolymerizable acrylate monomer, oligomer,
An optical disc substrate formed by photocuring a resin composition comprising a vinyl group-containing monomer into a predetermined shape. 2. The optical disc substrate according to claim 1, wherein a resin composition is injected between a glass plate and a stamper, which are maintained at a predetermined distance by a spacer, and is photocured by irradiating ultraviolet rays.
Priority Applications (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP61256334A JPS63110203A (en) | 1986-10-28 | 1986-10-28 | Optical disk substrate |
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP61256334A JPS63110203A (en) | 1986-10-28 | 1986-10-28 | Optical disk substrate |
Publications (1)
Publication Number | Publication Date |
---|---|
JPS63110203A true JPS63110203A (en) | 1988-05-14 |
Family
ID=17291228
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
JP61256334A Pending JPS63110203A (en) | 1986-10-28 | 1986-10-28 | Optical disk substrate |
Country Status (1)
Country | Link |
---|---|
JP (1) | JPS63110203A (en) |
Cited By (1)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
WO2001029138A1 (en) * | 1999-10-22 | 2001-04-26 | Dsm N.V. | Photocurable resin composition and plastic sheet |
-
1986
- 1986-10-28 JP JP61256334A patent/JPS63110203A/en active Pending
Cited By (1)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
WO2001029138A1 (en) * | 1999-10-22 | 2001-04-26 | Dsm N.V. | Photocurable resin composition and plastic sheet |
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