JPH01167801A - Optical disk substrate - Google Patents
Optical disk substrateInfo
- Publication number
- JPH01167801A JPH01167801A JP62327602A JP32760287A JPH01167801A JP H01167801 A JPH01167801 A JP H01167801A JP 62327602 A JP62327602 A JP 62327602A JP 32760287 A JP32760287 A JP 32760287A JP H01167801 A JPH01167801 A JP H01167801A
- Authority
- JP
- Japan
- Prior art keywords
- compd
- denotes
- group
- stamper
- formula
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
- 230000003287 optical effect Effects 0.000 title claims abstract description 23
- 239000000758 substrate Substances 0.000 title claims description 25
- 125000001797 benzyl group Chemical group [H]C1=C([H])C([H])=C(C([H])=C1[H])C([H])([H])* 0.000 claims abstract description 4
- 125000000217 alkyl group Chemical group 0.000 claims abstract description 3
- 125000001997 phenyl group Chemical group [H]C1=C([H])C([H])=C(*)C([H])=C1[H] 0.000 claims abstract description 3
- 125000001037 p-tolyl group Chemical group [H]C1=C([H])C(=C([H])C([H])=C1*)C([H])([H])[H] 0.000 claims abstract 2
- 150000001875 compounds Chemical class 0.000 claims description 14
- 125000006850 spacer group Chemical group 0.000 claims description 4
- 239000000126 substance Substances 0.000 claims 1
- NIXOWILDQLNWCW-UHFFFAOYSA-M Acrylate Chemical compound [O-]C(=O)C=C NIXOWILDQLNWCW-UHFFFAOYSA-M 0.000 abstract description 10
- 239000011347 resin Substances 0.000 abstract description 8
- 229920005989 resin Polymers 0.000 abstract description 8
- 238000010521 absorption reaction Methods 0.000 abstract description 7
- 230000000694 effects Effects 0.000 abstract description 4
- 239000003822 epoxy resin Substances 0.000 abstract description 4
- 229920000647 polyepoxide Polymers 0.000 abstract description 4
- IISBACLAFKSPIT-UHFFFAOYSA-N bisphenol A Chemical compound C=1C=C(O)C=CC=1C(C)(C)C1=CC=C(O)C=C1 IISBACLAFKSPIT-UHFFFAOYSA-N 0.000 abstract description 3
- 239000003504 photosensitizing agent Substances 0.000 abstract description 3
- CERQOIWHTDAKMF-UHFFFAOYSA-N Methacrylic acid Chemical compound CC(=C)C(O)=O CERQOIWHTDAKMF-UHFFFAOYSA-N 0.000 abstract description 2
- 239000000654 additive Substances 0.000 abstract description 2
- 125000000524 functional group Chemical group 0.000 abstract description 2
- 125000002887 hydroxy group Chemical group [H]O* 0.000 abstract description 2
- 239000000178 monomer Substances 0.000 abstract description 2
- NIXOWILDQLNWCW-UHFFFAOYSA-N acrylic acid group Chemical group C(C=C)(=O)O NIXOWILDQLNWCW-UHFFFAOYSA-N 0.000 abstract 2
- 229930185605 Bisphenol Natural products 0.000 abstract 1
- 230000002745 absorbent Effects 0.000 abstract 1
- 239000002250 absorbent Substances 0.000 abstract 1
- 230000032050 esterification Effects 0.000 abstract 1
- 238000005886 esterification reaction Methods 0.000 abstract 1
- XXMIOPMDWAUFGU-UHFFFAOYSA-N hexane-1,6-diol Chemical compound OCCCCCCO XXMIOPMDWAUFGU-UHFFFAOYSA-N 0.000 abstract 1
- 238000009281 ultraviolet germicidal irradiation Methods 0.000 abstract 1
- 239000011521 glass Substances 0.000 description 9
- 238000000034 method Methods 0.000 description 8
- 238000000016 photochemical curing Methods 0.000 description 6
- 239000003795 chemical substances by application Substances 0.000 description 5
- 239000004925 Acrylic resin Substances 0.000 description 4
- 229920000178 Acrylic resin Polymers 0.000 description 4
- -1 acrylic compound Chemical class 0.000 description 4
- 238000002347 injection Methods 0.000 description 4
- 239000007924 injection Substances 0.000 description 4
- 238000004519 manufacturing process Methods 0.000 description 4
- 229920005668 polycarbonate resin Polymers 0.000 description 4
- 239000004431 polycarbonate resin Substances 0.000 description 4
- XLYOFNOQVPJJNP-UHFFFAOYSA-N water Substances O XLYOFNOQVPJJNP-UHFFFAOYSA-N 0.000 description 4
- 230000001678 irradiating effect Effects 0.000 description 3
- QSHDDOUJBYECFT-UHFFFAOYSA-N mercury Chemical compound [Hg] QSHDDOUJBYECFT-UHFFFAOYSA-N 0.000 description 3
- 229910052753 mercury Inorganic materials 0.000 description 3
- 238000000465 moulding Methods 0.000 description 3
- 229920003229 poly(methyl methacrylate) Polymers 0.000 description 3
- 239000004926 polymethyl methacrylate Substances 0.000 description 3
- OZAIFHULBGXAKX-UHFFFAOYSA-N 2-(2-cyanopropan-2-yldiazenyl)-2-methylpropanenitrile Chemical compound N#CC(C)(C)N=NC(C)(C)C#N OZAIFHULBGXAKX-UHFFFAOYSA-N 0.000 description 2
- QPXVRLXJHPTCPW-UHFFFAOYSA-N 2-hydroxy-2-methyl-1-(4-propan-2-ylphenyl)propan-1-one Chemical compound CC(C)C1=CC=C(C(=O)C(C)(C)O)C=C1 QPXVRLXJHPTCPW-UHFFFAOYSA-N 0.000 description 2
- GUUVPOWQJOLRAS-UHFFFAOYSA-N Diphenyl disulfide Chemical compound C=1C=CC=CC=1SSC1=CC=CC=C1 GUUVPOWQJOLRAS-UHFFFAOYSA-N 0.000 description 2
- PPBRXRYQALVLMV-UHFFFAOYSA-N Styrene Chemical compound C=CC1=CC=CC=C1 PPBRXRYQALVLMV-UHFFFAOYSA-N 0.000 description 2
- 238000001723 curing Methods 0.000 description 2
- 229910052751 metal Inorganic materials 0.000 description 2
- 239000002184 metal Substances 0.000 description 2
- 238000006116 polymerization reaction Methods 0.000 description 2
- MSAHTMIQULFMRG-UHFFFAOYSA-N 1,2-diphenyl-2-propan-2-yloxyethanone Chemical compound C=1C=CC=CC=1C(OC(C)C)C(=O)C1=CC=CC=C1 MSAHTMIQULFMRG-UHFFFAOYSA-N 0.000 description 1
- DKEGCUDAFWNSSO-UHFFFAOYSA-N 1,8-dibromooctane Chemical compound BrCCCCCCCCBr DKEGCUDAFWNSSO-UHFFFAOYSA-N 0.000 description 1
- 239000012956 1-hydroxycyclohexylphenyl-ketone Substances 0.000 description 1
- KWVGIHKZDCUPEU-UHFFFAOYSA-N 2,2-dimethoxy-2-phenylacetophenone Chemical compound C=1C=CC=CC=1C(OC)(OC)C(=O)C1=CC=CC=C1 KWVGIHKZDCUPEU-UHFFFAOYSA-N 0.000 description 1
- ZVAFZTLAMCXAII-UHFFFAOYSA-N 2-(1-ethoxyethyl)-2-(hydroxymethyl)propane-1,3-diol Chemical compound CCOC(C)C(CO)(CO)CO ZVAFZTLAMCXAII-UHFFFAOYSA-N 0.000 description 1
- TXBCBTDQIULDIA-UHFFFAOYSA-N 2-[[3-hydroxy-2,2-bis(hydroxymethyl)propoxy]methyl]-2-(hydroxymethyl)propane-1,3-diol Chemical compound OCC(CO)(CO)COCC(CO)(CO)CO TXBCBTDQIULDIA-UHFFFAOYSA-N 0.000 description 1
- KMNCBSZOIQAUFX-UHFFFAOYSA-N 2-ethoxy-1,2-diphenylethanone Chemical compound C=1C=CC=CC=1C(OCC)C(=O)C1=CC=CC=C1 KMNCBSZOIQAUFX-UHFFFAOYSA-N 0.000 description 1
- XMLYCEVDHLAQEL-UHFFFAOYSA-N 2-hydroxy-2-methyl-1-phenylpropan-1-one Chemical compound CC(C)(O)C(=O)C1=CC=CC=C1 XMLYCEVDHLAQEL-UHFFFAOYSA-N 0.000 description 1
- BQZJOQXSCSZQPS-UHFFFAOYSA-N 2-methoxy-1,2-diphenylethanone Chemical compound C=1C=CC=CC=1C(OC)C(=O)C1=CC=CC=C1 BQZJOQXSCSZQPS-UHFFFAOYSA-N 0.000 description 1
- WHNWPMSKXPGLAX-UHFFFAOYSA-N N-Vinyl-2-pyrrolidone Chemical compound C=CN1CCCC1=O WHNWPMSKXPGLAX-UHFFFAOYSA-N 0.000 description 1
- ZJCCRDAZUWHFQH-UHFFFAOYSA-N Trimethylolpropane Chemical compound CCC(CO)(CO)CO ZJCCRDAZUWHFQH-UHFFFAOYSA-N 0.000 description 1
- 239000006096 absorbing agent Substances 0.000 description 1
- 239000003963 antioxidant agent Substances 0.000 description 1
- 239000002216 antistatic agent Substances 0.000 description 1
- 238000005452 bending Methods 0.000 description 1
- MQDJYUACMFCOFT-UHFFFAOYSA-N bis[2-(1-hydroxycyclohexyl)phenyl]methanone Chemical compound C=1C=CC=C(C(=O)C=2C(=CC=CC=2)C2(O)CCCCC2)C=1C1(O)CCCCC1 MQDJYUACMFCOFT-UHFFFAOYSA-N 0.000 description 1
- 230000000052 comparative effect Effects 0.000 description 1
- 230000007547 defect Effects 0.000 description 1
- 238000000151 deposition Methods 0.000 description 1
- 238000005516 engineering process Methods 0.000 description 1
- 230000009477 glass transition Effects 0.000 description 1
- LNEPOXFFQSENCJ-UHFFFAOYSA-N haloperidol Chemical compound C1CC(O)(C=2C=CC(Cl)=CC=2)CCN1CCCC(=O)C1=CC=C(F)C=C1 LNEPOXFFQSENCJ-UHFFFAOYSA-N 0.000 description 1
- 239000003112 inhibitor Substances 0.000 description 1
- 230000007774 longterm Effects 0.000 description 1
- 230000015654 memory Effects 0.000 description 1
- 239000006082 mold release agent Substances 0.000 description 1
- SLCVBVWXLSEKPL-UHFFFAOYSA-N neopentyl glycol Chemical compound OCC(C)(C)CO SLCVBVWXLSEKPL-UHFFFAOYSA-N 0.000 description 1
- WXZMFSXDPGVJKK-UHFFFAOYSA-N pentaerythritol Chemical compound OCC(CO)(CO)CO WXZMFSXDPGVJKK-UHFFFAOYSA-N 0.000 description 1
- 239000004033 plastic Substances 0.000 description 1
- 229920003023 plastic Polymers 0.000 description 1
- 239000004417 polycarbonate Substances 0.000 description 1
- 229920000515 polycarbonate Polymers 0.000 description 1
- 230000000379 polymerizing effect Effects 0.000 description 1
- 230000005855 radiation Effects 0.000 description 1
- YRHRIQCWCFGUEQ-UHFFFAOYSA-N thioxanthen-9-one Chemical compound C1=CC=C2C(=O)C3=CC=CC=C3SC2=C1 YRHRIQCWCFGUEQ-UHFFFAOYSA-N 0.000 description 1
- 238000002834 transmittance Methods 0.000 description 1
- 238000004383 yellowing Methods 0.000 description 1
Classifications
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B29—WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
- B29C—SHAPING OR JOINING OF PLASTICS; SHAPING OF MATERIAL IN A PLASTIC STATE, NOT OTHERWISE PROVIDED FOR; AFTER-TREATMENT OF THE SHAPED PRODUCTS, e.g. REPAIRING
- B29C45/00—Injection moulding, i.e. forcing the required volume of moulding material through a nozzle into a closed mould; Apparatus therefor
- B29C45/14—Injection moulding, i.e. forcing the required volume of moulding material through a nozzle into a closed mould; Apparatus therefor incorporating preformed parts or layers, e.g. injection moulding around inserts or for coating articles
- B29C45/14836—Preventing damage of inserts during injection, e.g. collapse of hollow inserts, breakage
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B29—WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
- B29C—SHAPING OR JOINING OF PLASTICS; SHAPING OF MATERIAL IN A PLASTIC STATE, NOT OTHERWISE PROVIDED FOR; AFTER-TREATMENT OF THE SHAPED PRODUCTS, e.g. REPAIRING
- B29C45/00—Injection moulding, i.e. forcing the required volume of moulding material through a nozzle into a closed mould; Apparatus therefor
- B29C45/14—Injection moulding, i.e. forcing the required volume of moulding material through a nozzle into a closed mould; Apparatus therefor incorporating preformed parts or layers, e.g. injection moulding around inserts or for coating articles
- B29C45/14336—Coating a portion of the article, e.g. the edge of the article
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B29—WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
- B29C—SHAPING OR JOINING OF PLASTICS; SHAPING OF MATERIAL IN A PLASTIC STATE, NOT OTHERWISE PROVIDED FOR; AFTER-TREATMENT OF THE SHAPED PRODUCTS, e.g. REPAIRING
- B29C45/00—Injection moulding, i.e. forcing the required volume of moulding material through a nozzle into a closed mould; Apparatus therefor
- B29C45/14—Injection moulding, i.e. forcing the required volume of moulding material through a nozzle into a closed mould; Apparatus therefor incorporating preformed parts or layers, e.g. injection moulding around inserts or for coating articles
- B29C45/14639—Injection moulding, i.e. forcing the required volume of moulding material through a nozzle into a closed mould; Apparatus therefor incorporating preformed parts or layers, e.g. injection moulding around inserts or for coating articles for obtaining an insulating effect, e.g. for electrical components
- B29C45/14655—Injection moulding, i.e. forcing the required volume of moulding material through a nozzle into a closed mould; Apparatus therefor incorporating preformed parts or layers, e.g. injection moulding around inserts or for coating articles for obtaining an insulating effect, e.g. for electrical components connected to or mounted on a carrier, e.g. lead frame
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B29—WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
- B29L—INDEXING SCHEME ASSOCIATED WITH SUBCLASS B29C, RELATING TO PARTICULAR ARTICLES
- B29L2031/00—Other particular articles
- B29L2031/34—Electrical apparatus, e.g. sparking plugs or parts thereof
- B29L2031/3425—Printed circuits
Landscapes
- Engineering & Computer Science (AREA)
- Manufacturing & Machinery (AREA)
- Mechanical Engineering (AREA)
- Optical Record Carriers And Manufacture Thereof (AREA)
Abstract
Description
【発明の詳細な説明】
（産業上の利用分野）
本発明は、音声、画像、情報などを保存、記録、再生す
る光ディスク基板に関するものである。DETAILED DESCRIPTION OF THE INVENTION (Field of Industrial Application) The present invention relates to an optical disc substrate for storing, recording, and reproducing audio, images, information, and the like.
光ディスクメモリー用のディスク基板の製造法としては
、ポリカーボネート樹脂、アクリル樹脂をインジェクシ
ョン法で成形する方法、すなわち、片面にスタンパが設
置されている金型の中に重合度の低いプラスチックを高
温高圧で流し込んで成形する方法、又ガラス、アクリル
樹脂、ポリカーボネート樹脂、エポキシ樹脂等の平板上
に光硬化性の樹脂を流し込みその上から金属スタンパを
押しあて、基板側から放射線を照射して樹脂を硬化させ
、スタンパを剥離して光ディスク基板を製造する、所謂
２Ｐ法が知られている。The method for manufacturing disk substrates for optical disk memories is to mold polycarbonate resin or acrylic resin using the injection method.In other words, plastic with a low degree of polymerization is poured at high temperature and pressure into a mold with a stamper installed on one side. Alternatively, a photocurable resin is poured onto a flat plate of glass, acrylic resin, polycarbonate resin, epoxy resin, etc., a metal stamper is pressed onto it, and radiation is irradiated from the substrate side to harden the resin. A so-called 2P method is known in which an optical disk substrate is manufactured by peeling off a stamper.
更に特開昭６０−１１２４０９号公報、特開昭６０−２
０２５５７号公報、特開昭６１−４４６８９号公報、特
開昭６１−９８７１０号公報、特開昭６１−１１５９１
３号公報、特開昭６１−１５９４１１号公報、特開昭６
１−１７６６１８号公報にアクリル系樹脂を光硬化させ
て光ディスク基板を製造する方法が提案されている。Furthermore, JP-A-60-112409, JP-A-60-2
02557, JP 61-44689, JP 61-98710, JP 61-11591
Publication No. 3, JP-A-61-159411, JP-A-6
Japanese Patent No. 1-176618 proposes a method of manufacturing an optical disc substrate by photocuring an acrylic resin.
光ディスク基板をインジェクション法で成形する方法は
生産性に優れるが、異物が混入しやす（、Ｃ／Ｎが低い
ばかりでなく、ポリカーボネート樹脂については、成形
時の残留応力のため分子が配向して光学的歪（複屈折）
が大きくなり易く、また表面硬度が低いため製造工程時
に傷がつきやすい欠点を有しており、ポリメチルメタク
リレート樹脂については、吸湿性が大きいためディスク
が反りやすく、かつ、耐熱性が低いため記録膜をつけた
溝の熱安定性が低いという問題点がある。The method of molding optical disk substrates using the injection method has excellent productivity, but it is easy for foreign matter to get mixed in (not only is the C/N ratio low, but the molecules of polycarbonate resin are oriented due to residual stress during molding, resulting in optical problems). distortion (birefringence)
Polymethyl methacrylate resin has the disadvantage of easily becoming large and easily scratched during the manufacturing process due to its low surface hardness.Polymethyl methacrylate resin has high hygroscopicity, which causes the disc to warp easily, and its heat resistance is low, making it difficult to record. There is a problem that the thermal stability of the groove with the film is low.
又２Ｐ法による場合は、２段階で光ディスク基板を作成
するため作業上からも時間を要し、また基板と光硬化樹
脂との密着性の高信頼性も要求され、更に透明な基板の
選定が重要であり、アクリル樹脂では低Ｔｇで吸湿性に
よる反りの問題、ポリカーボネート樹脂は大きい複屈折
、エポキシ樹脂は成形時の硬化時間が長い等の問題があ
る。Furthermore, in the case of using the 2P method, the optical disc substrate is created in two steps, which takes time, and also requires high reliability in adhesion between the substrate and the photocuring resin, and it is also necessary to select a transparent substrate. Acrylic resins have a problem of warping due to their low Tg and hygroscopicity, polycarbonate resins have large birefringence, and epoxy resins have problems such as a long curing time during molding.
特開昭６０−１１２４０９号公報、特開昭６１−２０２
５５７号公報、特開昭６１−４４６８９号公報、特開昭
６１−９８７１０号公報、特開昭６１−１１５９１３号
公報、特開昭６１−１５９４１１号公報、特開昭６１−
１７６６１８号公報で提案された方法は、反りの低減、
低吸水、低吸湿、耐熱、性等を特徴とするとされている
がいずれもまだ実用化に至っていない。JP-A-60-112409, JP-A-61-202
557, JP 61-44689, JP 61-98710, JP 61-115913, JP 61-159411, JP 61-
The method proposed in Publication No. 176618 reduces warpage,
It is said to have characteristics such as low water absorption, low moisture absorption, heat resistance, and durability, but none of these have yet been put into practical use.
本発明は、光学的歪（複屈折）、吸湿による反りが少な
く、表面硬度、耐熱性、機械的強度に優れ長期信頼性の
高い光ディスク基板を提供するものである。The present invention provides an optical disk substrate that is less warped due to optical distortion (birefringence) and moisture absorption, has excellent surface hardness, heat resistance, and mechanical strength, and has high long-term reliability.
本発明は、Ａニ一般式
％式％
〔式中、Ｒ１はＨｌまたはＣＨ３を示し、Ｒ２はＨＳＣ
１〜Ｃｂまでのアルキル基、フェニル基、ベンジル基ま
たはｐ−）リル基を示し、Ｘ、−Ｘ、はＨ、ＣＩ、また
はＢｒを示し、ｎは０〜３の数である。〕で示される化
合物を主成分とする重合性化合物を所定の形状に光硬化
させて成る光ディスク基板を提供するものである。The present invention is based on the general formula % [wherein R1 represents Hl or CH3, and R2 represents HSC]
represents an alkyl group of 1 to Cb, a phenyl group, a benzyl group or a p-)lyl group, X, -X represents H, CI or Br, and n is a number from 0 to 3. The present invention provides an optical disc substrate obtained by photocuring a polymerizable compound containing the compound represented by the following as a main component into a predetermined shape.
前記一般式で表されるアクリル系化合物は、ビスフェノ
ールＡ型エポキシ樹脂を（メタ）アクリル酸で変性し、
分子構造に含まれるＯＨ基を種々官能基で置換しエステ
ル化したものである。The acrylic compound represented by the above general formula is obtained by modifying bisphenol A type epoxy resin with (meth)acrylic acid,
The OH group contained in the molecular structure is substituted with various functional groups and esterified.
また、本発明の重合性化合物は前記一般式で表されるア
クリル系化合物に加えて、公知の光重合可能なモノマー
、例えば、１．６−ヘキサンシオールジ（メタ）アクリ
レート、トリメチロールプロパントリ （メタ）アクリ
レート、ペンタエリスリトールテトラ（メタ）アクリレ
ート、ジペンタエリスリトールヘキサ（メタ）アクリレ
ート、エトオキシトリメチロールプロパントリ（メタ）
アクリレート、ネオペンチルグリコールジ（メタ）アク
リレート、イソボニル（メタ）アクリレート、トリシク
ロデカニル（メタ）アクリレート、スチレン、Ｎ−ビニ
ルピロリドン等を本発明の優れた特性を低下させない範
囲で併用することも可能である。In addition to the acrylic compound represented by the above general formula, the polymerizable compound of the present invention may also include known photopolymerizable monomers, such as 1,6-hexanethiol di(meth)acrylate, trimethylolpropane tri( meth)acrylate, pentaerythritol tetra(meth)acrylate, dipentaerythritol hexa(meth)acrylate, ethoxytrimethylolpropane tri(meth)acrylate
It is also possible to use acrylate, neopentyl glycol di(meth)acrylate, isobonyl(meth)acrylate, tricyclodecanyl(meth)acrylate, styrene, N-vinylpyrrolidone, etc. in combination within a range that does not reduce the excellent properties of the present invention. It is.
上記アクリル系化合物を重合してディスク基板を製造す
るには、スペーサーで所定の間隔を保つ透明板と金属又
は透明板のスタンバ−との間、あるいは２枚の透明板の
間に化合物を注入し、片面又は全面から紫外線等を照射
し光硬化させる。後者の場合は、その後光硬化させた基
板の上にスタンパの溝を転写した樹脂層を形成する。In order to manufacture a disk substrate by polymerizing the above acrylic compound, the compound is injected between a transparent plate and a metal or transparent plate stambar, which are kept at a predetermined distance using a spacer, or between two transparent plates. Alternatively, the entire surface is irradiated with ultraviolet rays and photocured. In the latter case, a resin layer having the grooves of the stamper transferred thereto is formed on the photocured substrate.
光照射の際、光照度ムラの是正、リタデーション低減、
及び透明板、スタンパに存在する可能性がある欠陥（キ
ズ、異物、汚し等）の影響を除去する目的で、光源や透
明板、スタンバを移動あるいは回転して光硬化すること
が望ましい。During light irradiation, correction of light illuminance unevenness, reduction of retardation,
In order to remove the effects of defects (scratches, foreign matter, stains, etc.) that may exist on the transparent plate and stamper, it is desirable to move or rotate the light source, the transparent plate, and the stamper for photocuring.
本発明のアクリル系化合物には、一般に知られている光
増感剤、例えばジベンゾイン、ベンゾインメチルエーテ
ル、ベンゾインエチルエーテル、ベンゾインイソプロピ
ルエーテル、ベンゾインイソブチルエーテル、２−ヒド
ロキシ−２−ベンゾイルプロパン、アゾビスイソブチロ
ニトリル、ベンジル、チオキサントン、ジフェニルジス
ルフィッド、１−（４−イソプロピルフェニル） −２
−ヒドロキシ−２−メチルプロパン−１−オン、２−ヒ
ドロキシ−２−メチル−１−フェニル−プロパン−１−
オン、２．２−ジメトキシ−２−フェニルアセトフェノ
ン、１−ヒドロキシシクロへキシルフェニルケトン等を
使用することができる。The acrylic compound of the present invention may include commonly known photosensitizers such as dibenzoin, benzoin methyl ether, benzoin ethyl ether, benzoin isopropyl ether, benzoin isobutyl ether, 2-hydroxy-2-benzoylpropane, azobis Isobutyronitrile, benzyl, thioxanthone, diphenyl disulfide, 1-(4-isopropylphenyl) -2
-Hydroxy-2-methylpropan-1-one, 2-hydroxy-2-methyl-1-phenyl-propan-1-
1, 2,2-dimethoxy-2-phenylacetophenone, 1-hydroxycyclohexylphenylketone, and the like can be used.
これらの光増感剤は、化合物に対して多くとも５重量％
、好ましくは０．１〜３重量％用いられる。These photosensitizers can be present in amounts of at most 5% by weight based on the compound.
, preferably 0.1 to 3% by weight.
本発明の重合性化合物には、必要に応じて黄変防止剤、
紫外線吸収剤、酸化防止剤、レベリング剤、重合禁止剤
、離型剤、帯電防止剤等のいわゆる添加剤を本発明の効
果を妨げない範囲で添加することができる。The polymerizable compound of the present invention may optionally contain an anti-yellowing agent,
So-called additives such as ultraviolet absorbers, antioxidants, leveling agents, polymerization inhibitors, mold release agents, and antistatic agents can be added to the extent that they do not impede the effects of the present invention.
以下、本発明を実施例に基づいて詳細に説明するが、本
発明はこれに限定されるものではない。Hereinafter, the present invention will be explained in detail based on Examples, but the present invention is not limited thereto.
実施例１〜４、比較例１．２
２枚の板ガラスとスペーサーとからなるガラス鋳型を用
意し、この鋳型中に、２重量部の１−（４−イソプロピ
ルフェニル）−２−ヒドロキシ−２−メチルプロパン−
１−オンを添加、混合した第１表Ｎｏ、 １〜Ｎｏ、
４の各種化合物を注入し、８０Ｗ／ｃｍ高圧水銀灯
を用いて周囲から紫外線を照射した。６０秒間硬化した
後、離型し、厚さ１゜２ｍｍ、直径３０ｃｍの均一な厚
みの基板を得た。この基板を用いて、以下（１）〜（５
）の特性を測定したところ第１表の結果を得た。Examples 1 to 4, Comparative Example 1.2 A glass mold consisting of two glass plates and a spacer was prepared, and 2 parts by weight of 1-(4-isopropylphenyl)-2-hydroxy-2- Methylpropane
1-one added and mixed Table 1 No. 1 to No.
Various compounds of No. 4 were injected, and ultraviolet rays were irradiated from the surrounding area using an 80 W/cm high-pressure mercury lamp. After curing for 60 seconds, the mold was released to obtain a uniform substrate with a thickness of 1.2 mm and a diameter of 30 cm. Using this board, the following (1) to (5)
), the results shown in Table 1 were obtained.
（１）吸水率：６０°Ｃの水中に３００時間放置し、Ｊ
ＩＳ−に６９１１に準じて測定した。(1) Water absorption rate: left in water at 60°C for 300 hours, J
It was measured according to IS-6911.
（２）耐熱温度ｒ ＤＭＡ法によりガラス転移温度を測
定した。(2) Heat resistant temperature r The glass transition temperature was measured by the DMA method.
（３）光学特性：厚さ１．２ ｍｍ ｌ樹脂板に８３０
ｎｍの光をあて、光透過率を分光光度計で求めた。(3) Optical properties: 830 on a resin plate with a thickness of 1.2 mm
nm light was applied, and the light transmittance was determined using a spectrophotometer.
又８３０ ｎｍの光をあてて複屈折率を求めて、リター
デーションも測定した。Retardation was also measured by irradiating light of 830 nm to determine birefringence.
（４）表面硬度：鉛筆硬度を求めた。(4) Surface hardness: Pencil hardness was determined.
（５）曲げ強度： Ｊ Ｉｓ−に６９１１に準じて測定
した。(5) Bending strength: Measured according to JIS-6911.
第１表かられかるように、本発明の基板は、ポリメチル
メタクリレートの基板に比較し、吸水率が小さく、耐熱
温度が高い。又、ポリカーボネートの基板との比較では
、リターデーション及び表面硬度に優れている。As can be seen from Table 1, the substrate of the present invention has a lower water absorption rate and a higher heat resistance than a polymethyl methacrylate substrate. Furthermore, compared to polycarbonate substrates, it has excellent retardation and surface hardness.
実施例５〜８
溝状パターン付Ｎｉ製スタンパに対して、離型剤を塗布
したガラス板を向かい合せに配置し、両者の間に１．２
ｍｍの空間を設けて注入型を形成した。Examples 5 to 8 A glass plate coated with a release agent was placed facing a Ni stamper with a grooved pattern, and 1.2 mm was placed between the two.
An injection mold was formed with a space of mm.
この型の中に、実施例１〜４で示された第１表Ｎｏ、１
”Ｎｏ、 ４の各化合物を注入し、８０Ｗ／ｃｍ高圧
水銀灯を用いて６０秒間ガラス板側から紫外線を照射し
、化合物を硬化させ、溝状パターン付基板を得た。溝付
の透明基板にＴｅ系記録膜を３０μｍ厚さに蒸着した後
、基板全体を１００°Ｃ１１時間の雰囲気にさらし、記
録膜の結晶化を行って光ディスク記録媒体を作成した。In this mold, Table 1 No. 1 shown in Examples 1 to 4
"Each compound No. 4 was injected, and ultraviolet rays were irradiated from the glass plate side for 60 seconds using an 80 W/cm high-pressure mercury lamp to harden the compounds to obtain a grooved patterned substrate. After depositing a Te-based recording film to a thickness of 30 μm, the entire substrate was exposed to an atmosphere at 100° C. for 11 hours to crystallize the recording film to produce an optical disc recording medium.
得られた光ディスク記録媒体は、情報出力時の出力レベ
ルは良好であり、かつ基板に反りが生じなかった。The obtained optical disc recording medium had a good output level when outputting information, and the substrate did not warp.
実施例９〜１０
離型剤を塗布した溝状パターン付ガラス製スタンパに対
して離型剤を塗布したガラス板を用い、実施例５〜８の
要領で注入型を用意した。さらに、この型の中に、実施
例１〜４で示された第１表Ｎｏ。Examples 9 to 10 Injection molds were prepared in the same manner as in Examples 5 to 8 using a glass plate coated with a release agent and a grooved patterned glass stamper coated with a release agent. Furthermore, in this mold, Table 1 No. shown in Examples 1 to 4 was added.
１〜Ｎｏ、 ４の各化合物を注入した。８０Ｗ／ｃｍ
高圧水銀灯を用いて、紫外線をガラス板側から３０秒間
、次にスタンパ側から紫外線を３０秒間照射して、化合
物を硬化せしめた。得られた溝状パターン付基板に実施
例５〜８と同一処理を施し光ディスク記録媒体を作製し
た。Each compound of No. 1 to No. 4 was injected. 80W/cm
Using a high-pressure mercury lamp, the compound was cured by irradiating ultraviolet rays from the glass plate side for 30 seconds and then from the stamper side for 30 seconds. The obtained grooved patterned substrate was subjected to the same treatment as in Examples 5 to 8 to produce an optical disc recording medium.
得られた光ディスク記録媒体に反りは見られず、又、情
報の書き込み、読み出しを円滑に行うことができた。No warping was observed in the obtained optical disc recording medium, and information could be written and read smoothly.
本発明の光ディスク基板は、光学的歪（複屈折）、吸湿
による反りが少なく、表面硬度、耐熱性に優れると共に
、光硬化により短時間で成形できるので生産性に優れて
いる。The optical disc substrate of the present invention has less optical distortion (birefringence) and warping due to moisture absorption, has excellent surface hardness and heat resistance, and can be molded in a short time by photocuring, so it has excellent productivity.
また、スペーサで所定の間隔を保つガラス板とスタンパ
との間に重合性化合物を注入し紫外線等を照射し光硬化
させ光ディスク基板を製造すれば、その生産性はさらに
高められる。Furthermore, productivity can be further improved by injecting a polymerizable compound between the glass plate and the stamper, which are maintained at a predetermined distance by a spacer, and photocuring the compound by irradiating it with ultraviolet rays or the like to produce an optical disk substrate.
Claims (1)
Ｈ、Ｃ＿１〜Ｃ＿６までのアルキル基、フェニル基、ベ
ンジル基またはｐ−トリル基を示し、Ｘ＿１〜Ｘ８はＨ
、Ｃｌ、またはＢｒを示し、ｎは０〜３の数である。〕 ２、重合性化合物をスペーサーで所望の間隔を保つ透明
板とスタンパとの間に注入し紫外線を照射し光硬化させ
て成る特許請求の範囲第１項記載の光ディスク基板。[Claims] 1. A: General formula ▲ Numerical formula, chemical formula, table, etc. ▼ [In the formula, R_1 represents H or CH_3, R_2 represents H, an alkyl group from C_1 to C_6, a phenyl group, Represents a benzyl group or p-tolyl group, and X_1 to X8 are H
, Cl, or Br, and n is a number from 0 to 3. 2. The optical disc substrate according to claim 1, wherein a polymerizable compound is injected between the transparent plate and the stamper, which are maintained at a desired distance by a spacer, and is photocured by irradiation with ultraviolet rays.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP62327602A JPH01167801A (en) | 1987-12-24 | 1987-12-24 | Optical disk substrate |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP62327602A JPH01167801A (en) | 1987-12-24 | 1987-12-24 | Optical disk substrate |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| JPH01167801A true JPH01167801A (en) | 1989-07-03 |
Family
ID=18200889
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP62327602A Pending JPH01167801A (en) | 1987-12-24 | 1987-12-24 | Optical disk substrate |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPH01167801A (en) |
-
1987
- 1987-12-24 JP JP62327602A patent/JPH01167801A/en active Pending
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