JPS63107092A - Manufacture of metal base printed board - Google Patents
Manufacture of metal base printed boardInfo
- Publication number
- JPS63107092A JPS63107092A JP25241586A JP25241586A JPS63107092A JP S63107092 A JPS63107092 A JP S63107092A JP 25241586 A JP25241586 A JP 25241586A JP 25241586 A JP25241586 A JP 25241586A JP S63107092 A JPS63107092 A JP S63107092A
- Authority
- JP
- Japan
- Prior art keywords
- metal
- printed circuit
- conductor
- circuit board
- manufacturing
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
- 239000002184 metal Substances 0.000 title claims description 22
- 229910052751 metal Inorganic materials 0.000 title claims description 22
- 238000004519 manufacturing process Methods 0.000 title claims description 19
- 229920005989 resin Polymers 0.000 claims description 21
- 239000011347 resin Substances 0.000 claims description 21
- 239000004020 conductor Substances 0.000 claims description 19
- 239000012783 reinforcing fiber Substances 0.000 claims description 16
- 239000010953 base metal Substances 0.000 claims description 14
- 229920001187 thermosetting polymer Polymers 0.000 claims description 13
- 238000000034 method Methods 0.000 claims description 8
- 239000011248 coating agent Substances 0.000 claims 1
- 238000000576 coating method Methods 0.000 claims 1
- RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical compound [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 description 3
- 239000011889 copper foil Substances 0.000 description 3
- 230000000694 effects Effects 0.000 description 2
- 239000004744 fabric Substances 0.000 description 2
- 238000000465 moulding Methods 0.000 description 2
- 229920000049 Carbon (fiber) Polymers 0.000 description 1
- 229920006231 aramid fiber Polymers 0.000 description 1
- 239000004917 carbon fiber Substances 0.000 description 1
- 238000005516 engineering process Methods 0.000 description 1
- 239000003822 epoxy resin Substances 0.000 description 1
- 239000000835 fiber Substances 0.000 description 1
- 239000006260 foam Substances 0.000 description 1
- 239000011521 glass Substances 0.000 description 1
- 239000003365 glass fiber Substances 0.000 description 1
- 239000000463 material Substances 0.000 description 1
- VNWKTOKETHGBQD-UHFFFAOYSA-N methane Chemical compound C VNWKTOKETHGBQD-UHFFFAOYSA-N 0.000 description 1
- 229920000647 polyepoxide Polymers 0.000 description 1
- 238000003303 reheating Methods 0.000 description 1
- 239000000758 substrate Substances 0.000 description 1
Classifications
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/44—Manufacturing insulated metal core circuits or other insulated electrically conductive core circuits
Landscapes
- Application Of Or Painting With Fluid Materials (AREA)
- Laminated Bodies (AREA)
- Casting Or Compression Moulding Of Plastics Or The Like (AREA)
- Insulated Metal Substrates For Printed Circuits (AREA)
Abstract
(57)【要約】本公報は電子出願前の出願データであるた
め要約のデータは記録されません。(57) [Abstract] This bulletin contains application data before electronic filing, so abstract data is not recorded.
Description
【発明の詳細な説明】
〔産業上の利用分野〕
この発明は片面プリント配線板用として使用される金属
ベースプリント基板の製造方法に関するものである。DETAILED DESCRIPTION OF THE INVENTION [Field of Industrial Application] The present invention relates to a method of manufacturing a metal-based printed circuit board used for a single-sided printed wiring board.
第２図は金属ベースプリント基板を示す断面図である０
図において、（１，）は金属ベースプリント基板で、ベ
ース金属（２）の片面に絶縁層（３）を介して銅箔等の
導体（４）が固着されて一体化している。Figure 2 is a cross-sectional view of a metal-based printed circuit board.
In the figure, (1,) is a metal base printed circuit board, and a conductor (4) such as copper foil is fixed to one side of a base metal (2) via an insulating layer (3).
絶縁層（３）はガラスクロス等のクロス状の強化繊維（
５）とこれに含浸させた熱硬化樹脂（６）とからなる。The insulating layer (3) is made of cross-shaped reinforcing fibers such as glass cloth (
5) and a thermosetting resin (6) impregnated therewith.
従来の金属ベースプリント基板の製造方法は、予め強化
繊維（５）にディップコータ等により熱硬化樹脂（６）
を含浸させ、半硬化させてプリプレグを形成し、このプ
リプレグをベース金属（２）と導体（４）の間に挟んで
プレス成形を行い、樹脂を硬化させて一体化する。この
ときプリプレグは再加熱により溶融、硬化して絶縁層（
３）を形成し、ベース金属（２）と導体（４）を接着す
る。The conventional manufacturing method for metal-based printed circuit boards is to apply a thermosetting resin (6) onto reinforcing fibers (5) using a dip coater or the like in advance.
The prepreg is impregnated and semi-cured to form a prepreg, this prepreg is sandwiched between the base metal (2) and the conductor (4), press molding is performed, and the resin is cured and integrated. At this time, the prepreg is melted and hardened by reheating, and the insulating layer (
3) and bond the base metal (2) and conductor (4).
しかしながら、このような従来の製造方法においては、
プリプレグを使用するため、予めブリプレグを製造する
必要があり、このため工数がかかってコスト高になると
ともに、半硬化状態からの融着であるため、成形後に気
泡が残留しやすいという問題点があった。However, in such conventional manufacturing methods,
Since prepreg is used, it is necessary to manufacture prepreg in advance, which requires a lot of man-hours and increases costs, and since it is fused from a semi-cured state, there is the problem that air bubbles tend to remain after molding. Ta.
この発明は上記のような従来の問題点を解消するために
なされたもので、プリプレグを用いることなく金属ベー
スプリント基板を製造でき、工数が少なく、低コストで
、気泡が残留しにくい金属ベースプリント基板の製造方
法を得ることを目的としている。This invention was made in order to solve the above-mentioned conventional problems, and it is possible to manufacture metal-based printed circuit boards without using prepreg, and it is possible to manufacture metal-based printed circuit boards with fewer man-hours, at low cost, and with less air bubbles. The purpose is to obtain a method for manufacturing a substrate.
この発明による金属ベースプリント基板の製造方法は、
ベース金属上に熱硬化樹脂を塗布し、その上からクロス
状の強化繊維をのせ、さらにその上から導体を重ねて脱
泡ローラで脱泡し、プレス硬化させる方法である。The method for manufacturing a metal-based printed circuit board according to the present invention includes:
This is a method in which a thermosetting resin is applied onto a base metal, a cross-shaped reinforcing fiber is placed on top of it, a conductor is layered on top of that, the foam is defoamed with a defoaming roller, and the resin is press hardened.
この発明において、導体としては銅箔が使用できる。ベ
ース金属、強化繊維および導体は予め所定寸法に切断し
たものを積層してもよいが、コイル状またはロール状に
連続したものを積層し、一体化後所定寸法に切断しても
よい０強化繊維としてはガラス繊維、炭素繊維、アラミ
ド繊維などのクロスが使用でき、熱硬化樹脂としてはエ
ポキシ樹脂などが使用できる。In this invention, copper foil can be used as the conductor. The base metal, reinforcing fibers, and conductor may be laminated by cutting them into predetermined dimensions in advance, but they may also be laminated in a continuous coil or roll shape and cut into predetermined dimensions after being integrated. As the material, cloth such as glass fiber, carbon fiber, or aramid fiber can be used, and as the thermosetting resin, epoxy resin or the like can be used.
この発明の金属ベースプリント基板の製造方法において
は、ベース金属上に熱硬化樹脂を塗布し、その上からク
ロス状の強化繊維をのせ、さらにその上から導体を重ね
て脱泡ローラで脱泡し、プレス硬化させることにより、
金属ベースプリント基板を製造する。熱硬化樹脂は未硬
化の状態であるため、その上から強化繊維をのせると、
強化繊維は樹脂中に均一に分散する。そしてさらにその
上から導体を重ねて脱泡ローラで脱泡を行うと、気泡は
ほぼ完全に除去され、この状態でプレス硬化を行うと、
気泡の残留しにくい金属ベースプリント基板が得られる
。In the method for manufacturing a metal-based printed circuit board of the present invention, a thermosetting resin is applied onto the base metal, a cross-shaped reinforcing fiber is placed on top of it, a conductor is layered on top of that, and the air is defoamed using a defoaming roller. , by press hardening,
Manufactures metal-based printed circuit boards. Thermosetting resin is in an uncured state, so when reinforcing fiber is placed on top of it,
The reinforcing fibers are uniformly dispersed in the resin. Then, when a conductor is layered on top of the conductor and defoamed with a defoaming roller, the air bubbles are almost completely removed, and when press hardening is performed in this state,
A metal-based printed circuit board in which bubbles are less likely to remain can be obtained.
第１図はこの発明の一実施例による製造方法を示す正面
図であり、図において、（１）〜（６）は第２図と同一
または相当部分を示す６（７）はコンベア。FIG. 1 is a front view showing a manufacturing method according to an embodiment of the present invention. In the figure, (1) to (6) indicate the same or equivalent parts as in FIG. 2, and 6 (7) indicates a conveyor.
（８）は駆動ローラ、（９）はローラ、（１０）は脱泡
ローラである。(8) is a drive roller, (9) is a roller, and (10) is a defoaming roller.
金属ベースプリント基板の製造方法は、駆動ローラ（８
）によりコンベア（７）を駆動し、Ａ工程で所定寸法に
切断されたベース金属（２）をコンベア（７）上にのせ
る。次にＢ工程において未硬化の熱硬化樹脂（６）を塗
布し、Ｃ工程においてロール（１１）から押えローラ（
１２）および供給切断機（１３）を介してクロス状の強
化繊維（５）を供給して熱硬化樹脂（６）の上にのせて
樹脂層中に埋没させ、絶縁層（３）を形成する。強化繊
維（５）はベース金属（２）の寸法に合わせて供給切断
機（１３）により供給および切断する。The method for manufacturing a metal-based printed circuit board includes driving rollers (8
) drives the conveyor (7), and the base metal (2) cut to a predetermined size in step A is placed on the conveyor (7). Next, in step B, an uncured thermosetting resin (6) is applied, and in step C, the pressure roller (
12) and a supply cutter (13) to supply the cross-shaped reinforcing fibers (5), place them on the thermosetting resin (6), and bury them in the resin layer to form an insulating layer (3). . The reinforcing fibers (5) are supplied and cut by a supply cutting machine (13) according to the dimensions of the base metal (2).
そして、Ｄ工程において銅箔等の導体（４）を絶縁層（
３）上に重ね、Ｅ工程において脱泡ローラ（１０）によ
り加圧して脱泡し、積層体（１１）を得る。こうして得
られた積層体（１１）は従来と同様に加熱下にプレス成
形して樹脂（６）を硬化させ、第２図の金属ベースプリ
ント基板（１）を製造する。Then, in step D, a conductor (4) such as copper foil is coated with an insulating layer (
3) Lay them on top of each other, and in step E, pressurize and defoam with a defoaming roller (10) to obtain a laminate (11). The thus obtained laminate (11) is press-molded under heat in the same manner as before to harden the resin (6), thereby manufacturing the metal-based printed circuit board (1) shown in FIG. 2.
上記の方法では、熱硬化樹脂（６）は未硬化の状態であ
るため、その上から強化繊維（５）をのせると、強化繊
維（５）は樹脂（６）中に均一に埋没する。In the above method, since the thermosetting resin (6) is in an uncured state, when the reinforcing fibers (5) are placed on top of it, the reinforcing fibers (5) are uniformly embedded in the resin (6).
そしてさらにその上から導体（４）を重ねて脱泡ローラ
（１０）で脱泡を行うと、気泡はほぼ完全に除去され、
この状態でプレス硬化を行うと、気泡の残留しにくい金
属ベースプリント基板（１）が得られる。Then, when the conductor (4) is further layered on top of the conductor (4) and defoaming is performed with the defoaming roller (10), the air bubbles are almost completely removed.
When press hardening is performed in this state, a metal-based printed circuit board (1) in which bubbles are less likely to remain can be obtained.
なお、上記実施例では、ベース金属（２）および導体（
４）として所定寸法に切断したものをコンベア（７）で
搬送しながら処理を行うようにしたが。In addition, in the above embodiment, the base metal (2) and the conductor (
As for 4), the processing is carried out while cutting the pieces to a predetermined size and conveying them on the conveyor (7).
強化繊維（５）も所定寸法に切断したものでもよく、ま
たコイル状またはロール状に連続したものを連続的に送
出しながら、樹脂（６）の塗布、強化繊維（５）および
導体（４）の積層などを行い、脱泡ロール（１０）によ
り脱泡した積層体（１１）、またはプレス硬化した金属
ベースプリント基板（１）を所定寸法に切断してもよい
。The reinforcing fibers (5) may also be cut to a predetermined size, or the reinforcing fibers (5) and conductor (4) may be coated with the resin (6) while being continuously fed out in a coil or roll shape. The laminated body (11) which has been defoamed using a defoaming roll (10) or the press-hardened metal base printed circuit board (1) may be cut into predetermined dimensions.
以上の通り本発明によれば、ベース金属上に熱硬化樹脂
を塗布し、その上からクロス状の強化繊維をのせ、さら
にその上から導体を重ねて脱泡ローラで脱泡し、プレス
硬化させるようにしたので、プリプレグを用いることな
く金属ベースプリント基板を製造でき、これにより工数
が少なく、低ゴストで、気泡が残留しにくい金属ベース
プリント基板を製造できる効果がある。As described above, according to the present invention, a thermosetting resin is applied onto a base metal, a cross-shaped reinforcing fiber is placed on top of the thermosetting resin, a conductor is layered on top of that, the air is defoamed with a defoaming roller, and the resin is press hardened. As a result, a metal-based printed circuit board can be manufactured without using prepreg, which has the effect of manufacturing a metal-based printed circuit board with fewer man-hours, low cost, and less bubbles.
第１図はこの発明の一実施例による製造方法を示す正面
図、第２図は金属ベースプリント基板の断面図である。
各図中、同一符号は同一または相当部分を示し。
（１）は金属ベースプリント基板、（２）はベース金属
、（３）は絶縁層、（４）は導体、（５）は強化繊維、
（６）は熱硬化樹脂、（７）はコンベア、（１０）は脱
泡ローラである。FIG. 1 is a front view showing a manufacturing method according to an embodiment of the present invention, and FIG. 2 is a sectional view of a metal-based printed circuit board. In each figure, the same reference numerals indicate the same or corresponding parts. (1) is a metal base printed circuit board, (2) is a base metal, (3) is an insulating layer, (4) is a conductor, (5) is a reinforced fiber,
(6) is a thermosetting resin, (7) is a conveyor, and (10) is a defoaming roller.
Claims (3)
クロス状の強化繊維をのせ、さらにその上から導体を重
ねて脱泡ローラで脱泡し、プレス硬化させることを特徴
とする金属ベースプリント基板の製造方法。(1) A metal characterized by coating a thermosetting resin on a base metal, placing cross-shaped reinforcing fibers on top of it, layering a conductor on top of that, defoaming with a defoaming roller, and press hardening. A method of manufacturing a base printed circuit board.
のであることを特徴とする特許請求の範囲第１項記載の
金属ベースプリント基板の製造方法。(2) The method for manufacturing a metal-based printed circuit board according to claim 1, wherein the base metal and the conductor are cut into predetermined dimensions.
であり、一体化後所定寸法に切断するようにしたことを
特徴とする特許請求の範囲第１項記載の金属ベースプリ
ント基板の製造方法。(3) The method for manufacturing a metal-based printed circuit board according to claim 1, wherein the base metal, reinforcing fibers, and conductor are continuous, and are cut into predetermined dimensions after being integrated.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP25241586A JPS63107092A (en) | 1986-10-23 | 1986-10-23 | Manufacture of metal base printed board |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP25241586A JPS63107092A (en) | 1986-10-23 | 1986-10-23 | Manufacture of metal base printed board |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| JPS63107092A true JPS63107092A (en) | 1988-05-12 |
Family
ID=17237032
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP25241586A Pending JPS63107092A (en) | 1986-10-23 | 1986-10-23 | Manufacture of metal base printed board |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPS63107092A (en) |
Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPH01169988A (en) * | 1987-12-24 | 1989-07-05 | Shin Kobe Electric Mach Co Ltd | Metallic-base copper clad plate |
| WO2001019145A1 (en) * | 1999-09-06 | 2001-03-15 | Suzuki Sogyo Co., Ltd. | Substrate of circuit board |
-
1986
- 1986-10-23 JP JP25241586A patent/JPS63107092A/en active Pending
Cited By (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPH01169988A (en) * | 1987-12-24 | 1989-07-05 | Shin Kobe Electric Mach Co Ltd | Metallic-base copper clad plate |
| WO2001019145A1 (en) * | 1999-09-06 | 2001-03-15 | Suzuki Sogyo Co., Ltd. | Substrate of circuit board |
| US6479136B1 (en) | 1999-09-06 | 2002-11-12 | Suzuki Sogyo Co., Ltd. | Substrate of circuit board |
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