JPS63100855U - - Google Patents
Info
- Publication number
- JPS63100855U JPS63100855U JP1987173926U JP17392687U JPS63100855U JP S63100855 U JPS63100855 U JP S63100855U JP 1987173926 U JP1987173926 U JP 1987173926U JP 17392687 U JP17392687 U JP 17392687U JP S63100855 U JPS63100855 U JP S63100855U
- Authority
- JP
- Japan
- Prior art keywords
- optical
- housing
- electro
- electrical
- adhesive
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
- 230000003287 optical effect Effects 0.000 claims abstract description 7
- 239000000853 adhesive Substances 0.000 claims description 3
- 230000001070 adhesive effect Effects 0.000 claims description 3
- 239000013307 optical fiber Substances 0.000 claims description 3
- 239000011810 insulating material Substances 0.000 claims 1
- 239000000463 material Substances 0.000 claims 1
- 239000004020 conductor Substances 0.000 description 1
- 230000008878 coupling Effects 0.000 description 1
- 238000010168 coupling process Methods 0.000 description 1
- 238000005859 coupling reaction Methods 0.000 description 1
- 230000007704 transition Effects 0.000 description 1
Classifications
-
- G—PHYSICS
- G02—OPTICS
- G02B—OPTICAL ELEMENTS, SYSTEMS OR APPARATUS
- G02B6/00—Light guides; Structural details of arrangements comprising light guides and other optical elements, e.g. couplings
- G02B6/24—Coupling light guides
- G02B6/42—Coupling light guides with opto-electronic elements
- G02B6/4201—Packages, e.g. shape, construction, internal or external details
- G02B6/4249—Packages, e.g. shape, construction, internal or external details comprising arrays of active devices and fibres
-
- G—PHYSICS
- G02—OPTICS
- G02B—OPTICAL ELEMENTS, SYSTEMS OR APPARATUS
- G02B6/00—Light guides; Structural details of arrangements comprising light guides and other optical elements, e.g. couplings
- G02B6/24—Coupling light guides
- G02B6/42—Coupling light guides with opto-electronic elements
- G02B6/4201—Packages, e.g. shape, construction, internal or external details
- G02B6/4202—Packages, e.g. shape, construction, internal or external details for coupling an active element with fibres without intermediate optical elements, e.g. fibres with plane ends, fibres with shaped ends, bundles
-
- G—PHYSICS
- G02—OPTICS
- G02B—OPTICAL ELEMENTS, SYSTEMS OR APPARATUS
- G02B6/00—Light guides; Structural details of arrangements comprising light guides and other optical elements, e.g. couplings
- G02B6/24—Coupling light guides
- G02B6/42—Coupling light guides with opto-electronic elements
- G02B6/4201—Packages, e.g. shape, construction, internal or external details
- G02B6/4204—Packages, e.g. shape, construction, internal or external details the coupling comprising intermediate optical elements, e.g. lenses, holograms
- G02B6/4212—Packages, e.g. shape, construction, internal or external details the coupling comprising intermediate optical elements, e.g. lenses, holograms the intermediate optical element being a coupling medium interposed therebetween, e.g. epoxy resin, refractive index matching material, index grease, matching liquid or gel
-
- G—PHYSICS
- G02—OPTICS
- G02B—OPTICAL ELEMENTS, SYSTEMS OR APPARATUS
- G02B6/00—Light guides; Structural details of arrangements comprising light guides and other optical elements, e.g. couplings
- G02B6/24—Coupling light guides
- G02B6/42—Coupling light guides with opto-electronic elements
- G02B6/4201—Packages, e.g. shape, construction, internal or external details
- G02B6/4248—Feed-through connections for the hermetical passage of fibres through a package wall
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L2224/42—Wire connectors; Manufacturing methods related thereto
- H01L2224/44—Structure, shape, material or disposition of the wire connectors prior to the connecting process
- H01L2224/45—Structure, shape, material or disposition of the wire connectors prior to the connecting process of an individual wire connector
- H01L2224/45001—Core members of the connector
- H01L2224/45099—Material
- H01L2224/451—Material with a principal constituent of the material being a metal or a metalloid, e.g. boron (B), silicon (Si), germanium (Ge), arsenic (As), antimony (Sb), tellurium (Te) and polonium (Po), and alloys thereof
- H01L2224/45138—Material with a principal constituent of the material being a metal or a metalloid, e.g. boron (B), silicon (Si), germanium (Ge), arsenic (As), antimony (Sb), tellurium (Te) and polonium (Po), and alloys thereof the principal constituent melting at a temperature of greater than or equal to 950°C and less than 1550°C
- H01L2224/45144—Gold (Au) as principal constituent
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L2224/42—Wire connectors; Manufacturing methods related thereto
- H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
- H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
- H01L2224/4805—Shape
- H01L2224/4809—Loop shape
- H01L2224/48091—Arched
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L24/00—Arrangements for connecting or disconnecting semiconductor or solid-state bodies; Methods or apparatus related thereto
- H01L24/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L24/42—Wire connectors; Manufacturing methods related thereto
- H01L24/44—Structure, shape, material or disposition of the wire connectors prior to the connecting process
- H01L24/45—Structure, shape, material or disposition of the wire connectors prior to the connecting process of an individual wire connector
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/0001—Technical content checked by a classifier
- H01L2924/00011—Not relevant to the scope of the group, the symbol of which is combined with the symbol of this group
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/0001—Technical content checked by a classifier
- H01L2924/00014—Technical content checked by a classifier the subject-matter covered by the group, the symbol of which is combined with the symbol of this group, being disclosed without further technical details
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/01—Chemical elements
- H01L2924/01006—Carbon [C]
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/10—Details of semiconductor or other solid state devices to be connected
- H01L2924/11—Device type
- H01L2924/12—Passive devices, e.g. 2 terminal devices
- H01L2924/1204—Optical Diode
- H01L2924/12041—LED
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/15—Details of package parts other than the semiconductor or other solid state devices to be connected
- H01L2924/181—Encapsulation
Landscapes
- Physics & Mathematics (AREA)
- General Physics & Mathematics (AREA)
- Optics & Photonics (AREA)
- Optical Couplings Of Light Guides (AREA)
- Mechanical Coupling Of Light Guides (AREA)
- Led Device Packages (AREA)
- Light Receiving Elements (AREA)
Description
第1図は本考案電気―光学コネクタの第1の実
施例の拡大断面図、第2図は本考案電気コネクタ
の第2の実施例の発光ダイオードと光フアイバの
ある区域の更に拡大した断面図、第3図は電気部
は取付けられているが光学部が未だ取付けられて
いない状態の本考案電気コネクタの第3の実施例
の一部の断面図、第4図は印刷回路板上に複数個
の電気―光学コネクタを取り付けた状態を示す平
面図、第5図は第4図に示す電気―光学コネクタ
の側面図、第6図は変形ハウジングを有する電気
―光学コネクタを複数個相互に連結した状態を示
す平面図である。 1,1′,1″,1……ハウジング、2,2
′,2″……孔、3……肩部、4,4′,4″…
…チツプ、5,5′……電気導線、6,6′,7
,7′,7″……電極、8,8′,8″……空胴
(凹所)、9……保持歯、10……くし部材、1
1,11′……光フアイバ、12,12′,12
″……接着剤、20,20′……カラー部、21
……スリツト、31……遷移部、32……頚部孔
、33……面、34……ワイヤボンド、35……
中間片、41……印刷回路板、42,43……孔
、60……連結装置。
施例の拡大断面図、第2図は本考案電気コネクタ
の第2の実施例の発光ダイオードと光フアイバの
ある区域の更に拡大した断面図、第3図は電気部
は取付けられているが光学部が未だ取付けられて
いない状態の本考案電気コネクタの第3の実施例
の一部の断面図、第4図は印刷回路板上に複数個
の電気―光学コネクタを取り付けた状態を示す平
面図、第5図は第4図に示す電気―光学コネクタ
の側面図、第6図は変形ハウジングを有する電気
―光学コネクタを複数個相互に連結した状態を示
す平面図である。 1,1′,1″,1……ハウジング、2,2
′,2″……孔、3……肩部、4,4′,4″…
…チツプ、5,5′……電気導線、6,6′,7
,7′,7″……電極、8,8′,8″……空胴
(凹所)、9……保持歯、10……くし部材、1
1,11′……光フアイバ、12,12′,12
″……接着剤、20,20′……カラー部、21
……スリツト、31……遷移部、32……頚部孔
、33……面、34……ワイヤボンド、35……
中間片、41……印刷回路板、42,43……孔
、60……連結装置。
Claims (1)
- 【実用新案登録請求の範囲】 1 電気―光学素子を含み、かつ少なくとも2個
の電気接続体と少なくとも1個の光接続体とを格
納するハウジングを具備し、このハウジング1,
1′,1″を電気的に且つできれば光学的にも絶
縁性の材料で一体形成すると共にこのハウジング
に少なくとも2個の空所2,2′,2″,2b,
2b′,2b″を設け、これら2個の空所に前記
電気接続体と光接続体とを共通軸線上に配置して
格納した電気光学コネクタにおいて、前記空所2
,2′,2″,2b,2b′,2b″に案内手段
3,20,20′,2e,2e′を設け、この案
内手段により挿入の際電気―光学素子4,4′,
4″と光導波素子11,11′とを互いに整列さ
せ、ハウジング1,1′,1″,1の内部に光
学的に活性な空胴2d,2e,35を設け、この
空胴に透明な接着剤12,12′,12″を充填
したことを特徴とする光学コネクタ。 2 ハウジングの材料の屈折率を面相互の接着剤
の屈折率よりも小さくし、光フアイバの端面と受
光又は発光面との間の空胴全体が反射壁を呈する
ように構成したことを特徴とする実用新案登録請
求の範囲第1項記載の電気―光学コネクタ。
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
DE2913262A DE2913262C2 (de) | 1979-04-03 | 1979-04-03 | Elektro-optische Verbindungsvorrichtung |
Publications (1)
Publication Number | Publication Date |
---|---|
JPS63100855U true JPS63100855U (ja) | 1988-06-30 |
Family
ID=6067264
Family Applications (2)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
JP4290680A Pending JPS5612780A (en) | 1979-04-03 | 1980-04-03 | Electroooptical connector |
JP1987173926U Pending JPS63100855U (ja) | 1979-04-03 | 1987-11-16 |
Family Applications Before (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
JP4290680A Pending JPS5612780A (en) | 1979-04-03 | 1980-04-03 | Electroooptical connector |
Country Status (5)
Country | Link |
---|---|
JP (2) | JPS5612780A (ja) |
DE (1) | DE2913262C2 (ja) |
FR (1) | FR2453555A1 (ja) |
GB (1) | GB2046472B (ja) |
SE (1) | SE455243B (ja) |
Cited By (1)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
WO2005122291A1 (ja) * | 2004-06-10 | 2005-12-22 | Olympus Corporation | 発光デバイス、発光デバイスの製造方法、発光デバイスを用いた照明装置、及び、プロジェクタ |
Families Citing this family (15)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
DE3113146C2 (de) * | 1981-04-01 | 1985-03-28 | Siemens AG, 1000 Berlin und 8000 München | Elektro-optischer Modulsteckverbinder |
FR2533710A1 (fr) * | 1982-09-24 | 1984-03-30 | Radiotechnique Compelec | Procede d'assemblage d'un dispositif de transmission par fibre optique |
DE3302373A1 (de) * | 1983-01-25 | 1984-07-26 | WAGO Verwaltungsgesellschaft mbH, 4950 Minden | Schaltanlagen-reihenklemme |
CA1247902A (en) * | 1983-09-30 | 1989-01-03 | Timothy R. Ponn | Fiber optic connector assembly |
DE3513229A1 (de) * | 1985-04-12 | 1986-10-16 | Schott Glaswerke, 6500 Mainz | Lichtzuendbarer thyristor |
JPH0830776B2 (ja) * | 1986-01-31 | 1996-03-27 | 京セラ株式会社 | 光通信用モジュール |
DE3736026A1 (de) * | 1987-10-24 | 1989-05-03 | Standard Elektrik Lorenz Ag | Optoelektrisches bauelement und verfahren zu dessen herstellung |
GB2230349A (en) * | 1989-04-08 | 1990-10-17 | Oxley Dev Co Ltd | "fibre optic/led coupling". |
EP0450560B1 (en) * | 1990-04-03 | 1998-07-22 | Sumitomo Electric Industries, Ltd. | An optical device |
JP2792722B2 (ja) * | 1990-07-16 | 1998-09-03 | 三菱電機株式会社 | 半導体発光装置 |
DE4114156A1 (de) * | 1991-04-30 | 1992-11-05 | Burndy Deutschland | Steckverbinder fuer lichtwellenleiter |
DE19541139C1 (de) | 1995-10-27 | 1997-05-15 | Siemens Ag | Aufnahmeanordnung und Verfahren zum Herstellen einer Aufnahmeanordnung für mindestens einen umhüllten Lichtwellenleiter |
GB9608381D0 (en) * | 1996-04-23 | 1996-06-26 | Baillie Hamilton William J | Combined light emitting and light guide collection and output device |
GB2365990A (en) * | 2000-08-04 | 2002-02-27 | Kymata Ltd | Optical device with strengthening member and guide formations |
DE10257128B3 (de) * | 2002-12-05 | 2004-05-27 | Schott Glas | Vorrichtung zur Einkopplung von Licht in einen Lichtleiter |
Citations (1)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPS5320946B2 (ja) * | 1972-02-03 | 1978-06-29 |
Family Cites Families (11)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
DE2207900B1 (de) * | 1972-02-19 | 1972-10-12 | Messerschmitt-Bölkow-Blohm GmbH, 8000 München | Kupplungselement für Lichtleitfaserkabel |
US3938177A (en) * | 1973-06-25 | 1976-02-10 | Amp Incorporated | Narrow lead contact for automatic face down bonding of electronic chips |
US3840741A (en) * | 1973-09-18 | 1974-10-08 | Bell Telephone Labor Inc | Semiconductor delay line detector for equalization of optical fiber dispersion |
US4076376A (en) * | 1973-10-16 | 1978-02-28 | Bicc Limited | Optical transmission systems |
GB1461693A (en) * | 1974-01-15 | 1977-01-19 | Marconi Co Ltd | Fibre optic couplers |
FR2262407B1 (ja) * | 1974-02-22 | 1977-09-16 | Radiotechnique Compelec | |
GB1557685A (en) * | 1976-02-02 | 1979-12-12 | Fairchild Camera Instr Co | Optically coupled isolator device |
GB1569615A (en) * | 1976-10-19 | 1980-06-18 | Standard Telephones Cables Ltd | Coupling optical fibres |
US4144541A (en) * | 1977-01-27 | 1979-03-13 | Electric Power Research Institute, Inc. | Light-activated semiconductor device package unit |
DE2707190B2 (de) * | 1977-02-18 | 1979-05-17 | Siemens Ag, 1000 Berlin Und 8000 Muenchen | Anordnung zur optoelektronischen Kopplung von eigensicheren und nichteigensicheren Stromkreisen, insbesondere in Schlagwetter- oder explosionsgeschützten Anlagen |
DE2724850A1 (de) * | 1977-06-02 | 1978-12-07 | Bosch Gmbh Robert | Elektrooptische anordnung |
-
1979
- 1979-04-03 DE DE2913262A patent/DE2913262C2/de not_active Expired
-
1980
- 1980-03-31 GB GB8010815A patent/GB2046472B/en not_active Expired
- 1980-03-31 SE SE8002444A patent/SE455243B/sv not_active IP Right Cessation
- 1980-04-02 FR FR8007462A patent/FR2453555A1/fr active Granted
- 1980-04-03 JP JP4290680A patent/JPS5612780A/ja active Pending
-
1987
- 1987-11-16 JP JP1987173926U patent/JPS63100855U/ja active Pending
Patent Citations (1)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPS5320946B2 (ja) * | 1972-02-03 | 1978-06-29 |
Cited By (2)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
WO2005122291A1 (ja) * | 2004-06-10 | 2005-12-22 | Olympus Corporation | 発光デバイス、発光デバイスの製造方法、発光デバイスを用いた照明装置、及び、プロジェクタ |
US7918567B2 (en) | 2004-06-10 | 2011-04-05 | Olympus Corporation | Light emitting device, manufacturing method for light emitting device, illumination device using light emitting device, and projector |
Also Published As
Publication number | Publication date |
---|---|
FR2453555A1 (fr) | 1980-10-31 |
FR2453555B1 (ja) | 1984-12-14 |
JPS5612780A (en) | 1981-02-07 |
GB2046472B (en) | 1983-01-26 |
DE2913262A1 (de) | 1980-10-09 |
DE2913262C2 (de) | 1982-04-29 |
GB2046472A (en) | 1980-11-12 |
SE8002444L (sv) | 1980-10-04 |
SE455243B (sv) | 1988-06-27 |
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