JPS6280345U - - Google Patents
Info
- Publication number
- JPS6280345U JPS6280345U JP1985172124U JP17212485U JPS6280345U JP S6280345 U JPS6280345 U JP S6280345U JP 1985172124 U JP1985172124 U JP 1985172124U JP 17212485 U JP17212485 U JP 17212485U JP S6280345 U JPS6280345 U JP S6280345U
- Authority
- JP
- Japan
- Prior art keywords
- chip
- circuit
- bonding pads
- utility
- registration request
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
- 238000009792 diffusion process Methods 0.000 claims 1
- 238000010586 diagram Methods 0.000 description 2
Classifications
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L24/00—Arrangements for connecting or disconnecting semiconductor or solid-state bodies; Methods or apparatus related thereto
- H01L24/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L24/02—Bonding areas ; Manufacturing methods related thereto
- H01L24/04—Structure, shape, material or disposition of the bonding areas prior to the connecting process
- H01L24/06—Structure, shape, material or disposition of the bonding areas prior to the connecting process of a plurality of bonding areas
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L2224/02—Bonding areas; Manufacturing methods related thereto
- H01L2224/023—Redistribution layers [RDL] for bonding areas
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L2224/02—Bonding areas; Manufacturing methods related thereto
- H01L2224/04—Structure, shape, material or disposition of the bonding areas prior to the connecting process
- H01L2224/05—Structure, shape, material or disposition of the bonding areas prior to the connecting process of an individual bonding area
- H01L2224/0554—External layer
- H01L2224/0555—Shape
- H01L2224/05552—Shape in top view
- H01L2224/05554—Shape in top view being square
Landscapes
- Engineering & Computer Science (AREA)
- Computer Hardware Design (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Power Engineering (AREA)
- Semiconductor Integrated Circuits (AREA)
- Wire Bonding (AREA)
- Design And Manufacture Of Integrated Circuits (AREA)
- Testing Or Measuring Of Semiconductors Or The Like (AREA)
Description
第１図は本考案の一実施例のチツプにおけるボ
ンデイングパツドのレイアウト図、第２図は従来
のチツプにおけるボンデイングパツドのレイアウ
ト図。
FIG. 1 is a layout diagram of bonding pads in a chip according to an embodiment of the present invention, and FIG. 2 is a layout diagram of bonding pads in a conventional chip.
Claims (1)
はフイールド酸化領域を有する集積回路装置にお
いて、前記チツプ上に前記回路に接続されないボ
ンデイングパツドが配置されていることを特徴と
する集積回路装置。 An integrated circuit device having a diffusion region or a field oxide region specific to a circuit formed on a chip, characterized in that bonding pads not connected to the circuit are arranged on the chip.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP1985172124U JPS6280345U (en) | 1985-11-07 | 1985-11-07 |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP1985172124U JPS6280345U (en) | 1985-11-07 | 1985-11-07 |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| JPS6280345U true JPS6280345U (en) | 1987-05-22 |
Family
ID=31108384
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP1985172124U Pending JPS6280345U (en) | 1985-11-07 | 1985-11-07 |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPS6280345U (en) |
-
1985
- 1985-11-07 JP JP1985172124U patent/JPS6280345U/ja active Pending