JPS626653B2 - - Google Patents
Info
- Publication number
- JPS626653B2 JPS626653B2 JP54057252A JP5725279A JPS626653B2 JP S626653 B2 JPS626653 B2 JP S626653B2 JP 54057252 A JP54057252 A JP 54057252A JP 5725279 A JP5725279 A JP 5725279A JP S626653 B2 JPS626653 B2 JP S626653B2
- Authority
- JP
- Japan
- Prior art keywords
- probe
- board
- socket
- electrode
- probe board
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired
Links
- 239000000523 sample Substances 0.000 claims description 76
- 239000004065 semiconductor Substances 0.000 claims description 10
- 239000004020 conductor Substances 0.000 claims description 4
- 239000000758 substrate Substances 0.000 description 8
- 230000002950 deficient Effects 0.000 description 7
- 238000012360 testing method Methods 0.000 description 7
- 238000012790 confirmation Methods 0.000 description 3
- 230000000694 effects Effects 0.000 description 1
- 238000010998 test method Methods 0.000 description 1
Classifications
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L22/00—Testing or measuring during manufacture or treatment; Reliability measurements, i.e. testing of parts without further processing to modify the parts as such; Structural arrangements therefor
Landscapes
- Engineering & Computer Science (AREA)
- Manufacturing & Machinery (AREA)
- Computer Hardware Design (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Power Engineering (AREA)
- Measuring Leads Or Probes (AREA)
- Testing Or Measuring Of Semiconductors Or The Like (AREA)
Description
【発明の詳細な説明】
本発明はプローブ基板に係り、特に半導体素子
の各電極に対応する探針を固定した多探針プロー
ブ基板に関する。DETAILED DESCRIPTION OF THE INVENTION The present invention relates to a probe substrate, and more particularly to a multi-probe probe substrate on which probes corresponding to each electrode of a semiconductor element are fixed.
一般に多探針プローブ基板は集積回路又は、半
導体素子（特にウエハ状態にある）の電気的特性
を試験及び測定する時に使用される。 Generally, multi-point probe substrates are used when testing and measuring the electrical characteristics of integrated circuits or semiconductor devices (particularly in wafer form).
多探針プローブ基板は、電気的に測定機あるい
は試験機と接続されている。集積回路の様に複雑
な回路機能を有する半導体素子を試験する場合、
測定機の状態や被測定素子の試験手順、試験条件
等を定めた試験プログラムの状態、多探針プロー
ブ基板を含む全ての接続配線の状態等を被測定素
子の試験の前に確認することは非常に有効であ
る。この確認に於いてあらかじめ良品と判断され
た素子（以後、良品サンプルと記す）を使用する
ことが有効である。この場合良品サンプルは取り
扱い上ウエハの形でなく容器に納められたいわゆ
る半導体装置が望ましい。 The multi-point probe board is electrically connected to a measuring machine or a testing machine. When testing semiconductor devices with complex circuit functions such as integrated circuits,
Before testing the device under test, it is necessary to check the status of the measuring equipment, the test procedure for the device under test, the status of the test program that defines the test conditions, etc., and the status of all connection wiring including the multi-point probe board. Very effective. In this confirmation, it is effective to use elements that have been previously determined to be non-defective (hereinafter referred to as non-defective samples). In this case, it is preferable for the good sample to be a so-called semiconductor device housed in a container rather than in the form of a wafer for handling purposes.
第１図は従来の多探針のプローブ基板を示す。
プローブ基板１に固定された複数個の探針２とプ
ローブ基板１の電極４は複数個の導体により電気
的に接続されている。探針２は被測定素子の電極
に対応して配置されている。又探針２の付近は探
針２が被測定素子と接触した状態が顕微鏡等で観
察出来る様にプローブ基板１に穴があけてある。 FIG. 1 shows a conventional multi-probe probe board.
The plurality of probes 2 fixed to the probe substrate 1 and the electrodes 4 of the probe substrate 1 are electrically connected by a plurality of conductors. The probe 2 is arranged corresponding to the electrode of the device to be measured. Further, a hole is made in the probe substrate 1 near the probe 2 so that the state in which the probe 2 is in contact with the element to be measured can be observed using a microscope or the like.
このような従来の多探針のプローブ基板に於い
てはリードを有する半導体装置（良品サンプル）
を使用して多探針プローブ基板の確認が出来ない
という欠点がある。 In such a conventional multi-probe probe board, a semiconductor device with leads (good sample)
The disadvantage is that it is not possible to confirm a multi-point probe board using the .
本発明の目的は良品サンプルによる多探針プロ
ーブ基板の確認が出来る多探針のプローブ基板を
提供することである。 An object of the present invention is to provide a multi-probe probe board that allows confirmation of the multi-probe probe board using a non-defective sample.
本発明の特徴は、半導体素子の各電極に対応す
る様に配置、固定された複数個の探針と該探針に
それぞれ電気的に接続された端子及び該端子と導
体を介して接続された電極を備えた第１のプロー
ブ基板と、半導体装置を挿入する為のソケツトを
有し該ソケツトの各電極が該ソケツトを囲む様に
配置された端子と電気的に接続された第２のプロ
ーブ基板とを備え、前記第１のプローブ基板と前
記第２のプローブ基板とを重ねることにより、前
記第１のプローブ基板の端子とそれに対応する前
記第２のプローブカードの端子とが接続され、こ
れにより前記探針と、該探針に対応する前記ソケ
ツトの電極とが電気的に接続される構造であるプ
ローブ基板にある。 The present invention is characterized by a plurality of probes arranged and fixed to correspond to each electrode of a semiconductor element, terminals electrically connected to the probes, and terminals connected to the terminals via conductors. a first probe board having electrodes; and a second probe board having a socket for inserting a semiconductor device, each electrode of the socket being electrically connected to a terminal arranged so as to surround the socket. By overlapping the first probe board and the second probe board, the terminals of the first probe board and the corresponding terminals of the second probe card are connected, thereby The probe substrate has a structure in which the probe and the electrode of the socket corresponding to the probe are electrically connected.
第２図は本発明の一実施例を示す多探針のプロ
ーブ基板である。第１のプローブ基板１には複数
個の探針２が半導体素子の各電極に対応して配置
され、それを囲む様に配置された複数個の端子５
は探針２とそれぞれ電気的に接続され同時に基板
の電極４と電気的に接続されている。第２の基板
６には良品サンプルを挿入する為のソケツト８が
取り付けられており、ソケツト８の各電極はソケ
ツト８を囲む様に配置された複数個の端子７と電
気的にそれぞれ接続されている。プローブ基板１
の端子５とプローブ基板６の端子７は互に接続さ
れる様に配置され互に脱着が可能である。 FIG. 2 shows a multi-probe probe board showing an embodiment of the present invention. A plurality of probes 2 are arranged on the first probe board 1 corresponding to each electrode of the semiconductor element, and a plurality of terminals 5 are arranged to surround the probes 2.
are electrically connected to the probe 2 and at the same time to the electrode 4 of the substrate. A socket 8 for inserting a non-defective sample is attached to the second board 6, and each electrode of the socket 8 is electrically connected to a plurality of terminals 7 arranged so as to surround the socket 8. There is. Probe board 1
The terminals 5 of the probe board 6 and the terminals 7 of the probe board 6 are arranged so as to be connected to each other and are detachable from each other.
従つて良品サンプルを用いて多探針のプローブ
基板の確認を行なう場合には第２のプローブ基板
６の端子７を第１のプローブ基板１の端子５に接
続し良品サンプルをソケツト８に挿入して確認を
行なう。 Therefore, when checking a multi-probe probe board using a non-defective sample, connect the terminal 7 of the second probe board 6 to the terminal 5 of the first probe board 1, and insert the non-defective sample into the socket 8. Check.
多探針プローブ基板の確認が終了した後、被測
定素子の試験を行な場合は第２のプローブ基板を
第１のプローブ基板から取りはずせば良い。 After the confirmation of the multi-probe probe board is completed, if the device to be measured is to be tested, the second probe board may be removed from the first probe board.
以上の様に本発明によれば多探針プローブ基板
の確認が良品サンプルを使用して簡単に出来ると
言う大きな効果がある。 As described above, the present invention has a great effect in that a multi-point probe board can be easily confirmed using a non-defective sample.
第１図は従来の多探針プローブ基板を示す斜視
図、第２図は本発明の実施例で多探針プローブ基
板を示す斜視図である。
尚図において、１，６…プローブ基板、２…探
針、３…導体、４…電極、５，７…端子、８…ソ
ケツト。
FIG. 1 is a perspective view showing a conventional multi-probe probe board, and FIG. 2 is a perspective view showing a multi-probe probe board according to an embodiment of the present invention. In the figure, 1, 6... probe board, 2... probe, 3... conductor, 4... electrode, 5, 7... terminal, 8... socket.
Claims (1)
定された複数個の探針と該探針にそれぞれ電気的
に接続された端子及び該端子と導体を介して接続
された電極を備えた第１のプローブ基板と、半導
体装置を挿入する為のソケツトを有し該ソケツト
の各電極が該ソケツトを囲む様に配置された端子
と電気的に接続された第２のプローブ基板とを備
え、前記第１のプローブ基板と前記第２のプロー
ブ基板とを重ねることにより、前記第１のプロー
ブ基板の端子とそれに対応する前記第２のプロー
ブカードの端子とが接続され、これにより前記探
針と、該探針に対応する前記ソケツトの電極とが
電気的に接続される構造であることを特徴とする
プローブ基板。1. A plurality of probes arranged and fixed to correspond to each electrode of a semiconductor element, a terminal electrically connected to each probe, and an electrode connected to the terminal via a conductor. a second probe board having a socket for inserting a semiconductor device and electrically connected to a terminal in which each electrode of the socket is arranged so as to surround the socket; By overlapping the first probe board and the second probe board, the terminals of the first probe board and the corresponding terminals of the second probe card are connected, thereby connecting the probe to the terminal of the second probe card. A probe board having a structure in which the electrode of the socket corresponding to the probe is electrically connected.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP5725279A JPS55148436A (en) | 1979-05-10 | 1979-05-10 | Probe base plate |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP5725279A JPS55148436A (en) | 1979-05-10 | 1979-05-10 | Probe base plate |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| JPS55148436A JPS55148436A (en) | 1980-11-19 |
| JPS626653B2 true JPS626653B2 (en) | 1987-02-12 |
Family
ID=13050331
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP5725279A Granted JPS55148436A (en) | 1979-05-10 | 1979-05-10 | Probe base plate |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPS55148436A (en) |
Families Citing this family (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US4514022A (en) * | 1983-06-29 | 1985-04-30 | Tektronix, Inc. | Probe cable assemblies |
| US4716500A (en) * | 1985-10-18 | 1987-12-29 | Tektronix, Inc. | Probe cable assembly |
| US4926117A (en) * | 1988-05-02 | 1990-05-15 | Micron Technology, Inc. | Burn-in board having discrete test capability |
| US5923176A (en) * | 1991-08-19 | 1999-07-13 | Ncr Corporation | High speed test fixture |
Family Cites Families (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS593581Y2 (en) * | 1977-01-20 | 1984-01-31 | 日本電気株式会社 | probe card |
-
1979
- 1979-05-10 JP JP5725279A patent/JPS55148436A/en active Granted
Also Published As
| Publication number | Publication date |
|---|---|
| JPS55148436A (en) | 1980-11-19 |
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