JPH07159486A - Integrated circuit testing device - Google Patents
Integrated circuit testing deviceInfo
- Publication number
- JPH07159486A JPH07159486A JP5309374A JP30937493A JPH07159486A JP H07159486 A JPH07159486 A JP H07159486A JP 5309374 A JP5309374 A JP 5309374A JP 30937493 A JP30937493 A JP 30937493A JP H07159486 A JPH07159486 A JP H07159486A
- Authority
- JP
- Japan
- Prior art keywords
- socket
- terminal
- power supply
- conductor
- terminals
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
Landscapes
- Testing Of Individual Semiconductor Devices (AREA)
- Tests Of Electronic Circuits (AREA)
- Connecting Device With Holders (AREA)
Abstract
Description
【０００１】[0001]
【産業上の利用分野】本発明は集積回路試験装置に係
り、特にソケットを有する試験基板を用いて試験を行な
うようにした集積回路試験装置に関する。BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to an integrated circuit test apparatus, and more particularly to an integrated circuit test apparatus for performing a test using a test board having a socket.
【０００２】[0002]
【従来の技術】従来、大規模集積回路（以下ＬＳＩとい
う）の測定を試験装置、例えばＬＳＩ論理テスターを用
いて行なう場合、ＬＳＩ論理テスターの信号をＬＳＩに
伝達する中継に試験基板（テストボード）が広く用いら
れる。図４には従来の試験基板１が示されており、この
試験基板１の上面にＩＣ（集積回路）ソケット２が固定
されていて、このＩＣソケット２に被測定用ＬＳＩ（図
示せず）が搭載されるものである。2. Description of the Related Art Conventionally, when a large-scale integrated circuit (hereinafter referred to as an LSI) is measured by using a test device, for example, an LSI logic tester, a test board (test board) is used as a relay for transmitting a signal of the LSI logic tester to the LSI. Is widely used. FIG. 4 shows a conventional test board 1, an IC (integrated circuit) socket 2 is fixed to the upper surface of the test board 1, and an LSI to be measured (not shown) is attached to the IC socket 2. It is installed.
【０００３】試験基板１にはＬＳＩ論理テスター（図示
せず）から信号が来ている信号端子３と、電源が接続さ
れるＶＤＤ端子４と、接地されるＧＮＤ端子５が設けら
れている。The test board 1 is provided with a signal terminal 3 which receives a signal from an LSI logic tester (not shown), a VDD terminal 4 to which a power source is connected, and a GND terminal 5 which is grounded.
【０００４】一方、ＩＣソケット２の上面には複数のソ
ケット端子６が設けられており、これらの各ソケット端
子６と、信号端子３とＶＤＤ端子４とＧＮＤ端子５とは
予め定められたリード線６，７，８などで結線されてい
る。そして、このＩＣソケット２の上にＬＳＩ（図示せ
ず）を搭載し、このＬＳＩの端子ピンとＩＣソケット２
のソケット端子６とを接触させたうえ、固定具（図示せ
ず）を用いて相互間がずれ動かないように固定されるも
のである。On the other hand, a plurality of socket terminals 6 are provided on the upper surface of the IC socket 2, and each of these socket terminals 6, the signal terminal 3, the VDD terminal 4, and the GND terminal 5 are predetermined lead wires. It is connected with 6, 7, 8 etc. Then, an LSI (not shown) is mounted on the IC socket 2, and the terminal pins of the LSI and the IC socket 2 are mounted.
The socket terminals 6 are brought into contact with each other and fixed by using a fixture (not shown) so as not to move relative to each other.
【０００５】上記のＩＣソケット２では、複数のソケッ
ト端子６のうち、いずれの端子６が試験基板１上の信号
端子３，ＶＤＤ端子４，ＧＮＤ端子５のどれと接続する
かはリード線６，７，８を介して予め定まっている。そ
のためＬＳＩに設けられる電源用の端子ピンと接地用の
端子ピンの配置位置がＬＳＩの品種によって異なる毎に
専用の試験基板１が用意される。In the above-described IC socket 2, which of the plurality of socket terminals 6 is connected to the signal terminal 3, the VDD terminal 4, and the GND terminal 5 on the test board 1 is the lead wire 6. It is determined in advance via 7 and 8. Therefore, a dedicated test board 1 is prepared every time the arrangement positions of the power supply terminal pins and the grounding terminal pins provided in the LSI differ depending on the type of the LSI.
【０００６】[0006]
【発明が解決しようとする課題】従来の集積回路試験装
置では、試験基板の端子と、ＩＣソケットの各ソケット
端子との配線関係が固定しているため、同一パッケージ
であってもＬＳＩの電源用端子および接地用端子の配置
位置が異なる場合、これらの端子と、これに接続すべき
ＩＣソケット上面の各ソケット端子との間で接続位置関
係にずれが生じる。このため、同一の試験基板では、Ｌ
ＳＩの電源用端子および接地用端子を試験基板の電源用
端子と接地用端子に接続することができず、ＬＳＩの品
種ごとに試験基板を用意する必要があり、そのため、試
験基板の数も多くなり、コストがかかってしまうという
問題があった。In the conventional integrated circuit test apparatus, since the wiring relationship between the terminals of the test board and each socket terminal of the IC socket is fixed, even if the same package is used for the power supply of the LSI. If the terminals and the grounding terminals are arranged at different positions, the positional relationship between the terminals and the respective socket terminals on the upper surface of the IC socket to be connected to the terminals deviates. Therefore, in the same test board, L
The SI power supply terminal and the grounding terminal cannot be connected to the power supply terminal and the grounding terminal of the test board, and it is necessary to prepare a test board for each type of LSI. Therefore, the number of test boards is large. However, there was a problem that the cost was high.
【０００７】本発明は上記の問題点を解決した集積回路
試験装置を提供することを目的とする。It is an object of the present invention to provide an integrated circuit testing device that solves the above problems.
【０００８】[0008]
【課題を解決するための手段】上記の目的を達成するた
め、本発明は試験基板の上面にソケットを配設し、この
ソケットに搭載した被試験用の集積回路を上記試験基板
を介して試験基板と電気的に接続するようにした集積回
路試験装置において、上記ソケットは、一端が試験基板
の端子に接続され、他端が集積回路の端子と接続するよ
うに設けられた複数の接続導体と、ソケット本体の側面
に開設され、それぞれが接続導体と電気的に接続されて
いる複数の第１接続孔と、試験基板の電源用端子に接続
されており、ソケット本体の側面部に設けられた電源用
導体と、試験基板の接地用端子に接続されており、ソケ
ット本体の側面部に電源用導体と略平行に設けられた接
地用導体と、それぞれが電源用導体に接続され、第１接
続孔と略平行にソケット本体の側面部に開設された複数
の第２接続孔と、それぞれが接地用導体に接続され、第
２接続孔と略平行にソケット本体の側面部に開設された
複数の第３接続孔とを備えたことを特徴とする。In order to achieve the above object, the present invention provides a socket on the upper surface of a test board and tests an integrated circuit under test mounted in the socket through the test board. In the integrated circuit test device adapted to be electrically connected to the board, the socket has a plurality of connection conductors provided so that one end is connected to a terminal of the test board and the other end is connected to a terminal of the integrated circuit. Provided on a side surface portion of the socket body, which is formed on a side surface of the socket body and is connected to a plurality of first connection holes each of which is electrically connected to a connection conductor and a power supply terminal of the test board. A power supply conductor and a grounding conductor that is connected to the grounding terminal of the test board and is provided on the side surface of the socket body substantially parallel to the powering conductor. Parallel to the hole A plurality of second connection holes formed in the side surface portion of the socket body, and a plurality of third connection holes each formed in the side surface portion of the socket body that are connected to the grounding conductor and are substantially parallel to the second connection hole. It is characterized by having and.
【０００９】上記電源用導体と接地用導体は、それぞれ
の第１接続孔と第２接続孔に挿入できる接続端子を介し
てコンデンサで接続されるように設けるとよい。It is preferable that the power supply conductor and the grounding conductor are connected to each other by a capacitor through connection terminals that can be inserted into the first connection hole and the second connection hole, respectively.
【００１０】[0010]
【作用】本発明の構成によると、ソケットに設けられて
いる所望の第１接続孔および第２接続孔にジャンパ線の
ような連絡導体を挿入し、または第１接続孔と第３接続
孔に上記の連絡導体を挿入すれば、集積回路の電源端子
および接地端子の配置位置が変っても、これらの各端子
と、試験基板上の電源用端子および接地用端子との接続
が可能である。このように、本発明では試験基板が汎用
性を有し、電源端子と接地端子の配置位置が異なる複数
品種の集積回路の測定に際し、１つの試験用基板での対
応が可能となる。According to the structure of the present invention, a connecting conductor such as a jumper wire is inserted into the desired first connection hole and second connection hole provided in the socket, or the connection conductor is inserted into the first connection hole and the third connection hole. By inserting the above-mentioned connecting conductor, even if the arrangement positions of the power supply terminal and the ground terminal of the integrated circuit are changed, these terminals can be connected to the power supply terminal and the ground terminal on the test board. As described above, in the present invention, the test board has versatility, and when measuring a plurality of types of integrated circuits in which the power supply terminal and the ground terminal are arranged at different positions, one test board can be used.
【００１１】また、第２接続孔と第３接続孔を利用して
電源用接続導体と接地用接続導体の間をコンデンサで接
続することにより、これがバイパスコンデンサとして機
能し、安定した電源が確保される。Further, by connecting the power supply connection conductor and the ground connection conductor with a capacitor by utilizing the second connection hole and the third connection hole, this functions as a bypass capacitor, and a stable power supply is secured. It
【００１２】[0012]
【実施例】以下本発明の実施例を図を参照して説明す
る。Embodiments of the present invention will now be described with reference to the drawings.
【００１３】図１は実施例に係るＩＣソケットとＬＳＩ
の斜視図、図２はＩＣソケットにＬＳＩを搭載した断面
図、図３は上記のＩＣソケットを上面に配設した試験基
板の正面図である。FIG. 1 shows an IC socket and an LSI according to an embodiment.
2 is a cross-sectional view in which an LSI is mounted on an IC socket, and FIG. 3 is a front view of a test board on which the above-mentioned IC socket is arranged.
【００１４】図１，図２に示されるように、本実施例に
係るＩＣソケット１２では、ソケット本体１２ａは所定
の厚みを有し、上面からみて四角形のプラスチック等の
絶縁体で形成されていて、このソケット本体１２ａの上
面には、その４つの辺に沿って複数のソケット端子（接
続導体）１３が設けられている。ソケット端子１３の両
端は下方に曲げられていて、一方の折り曲げ部１３ａは
ソケット本体１２ａの挿通孔１４を挿通してその下面に
突出している。この折り曲げ部１３ａはＩＣソケット１
２が配設される試験基板１１の信号端子１５（図３に示
す）とリード線１６を介して接続される。As shown in FIGS. 1 and 2, in the IC socket 12 according to this embodiment, the socket body 12a has a predetermined thickness, and is formed of an insulating material such as a quadrangular plastic when viewed from above. A plurality of socket terminals (connection conductors) 13 are provided on the upper surface of the socket body 12a along the four sides thereof. Both ends of the socket terminal 13 are bent downward, and one bent portion 13a is inserted into the insertion hole 14 of the socket body 12a and protrudes to the lower surface thereof. This bent portion 13a is the IC socket 1
2 is connected via a lead wire 16 to a signal terminal 15 (shown in FIG. 3) of the test board 11 on which it is arranged.
【００１５】ソケット端子１３の他方の折り曲げ部１３
ｂはソケット本体１２ａ内に埋設されていて、この折り
曲げ部１３ｂには後述する手段により電源用のジャンパ
線（連絡導体）１７と接地用のジャンパ線（連絡導体）
１８が接続できるようになっている。The other bent portion 13 of the socket terminal 13
b is embedded in the socket body 12a, and the bent portion 13b is provided with a jumper wire (communication conductor) 17 for power supply and a jumper wire (communication conductor) for grounding by means described later.
18 can be connected.
【００１６】四角形のソケット本体１２ａの４つの側面
には、この側面を取囲むように、例えば細長い帯状の導
電板からなる電源用導体２０と接地用導体２１が上下に
一定の間隔を離し、それにより相互に絶縁して配設され
ている。この電源用導体２０と一体に設けられた接続端
子２０ａおよび、接地用導体２０と一体に設けられた接
続端子２１ａがそれぞれソケット本体１２ａの内部を通
ってその下面に突出している。On the four side surfaces of the quadrangular socket body 12a, a power source conductor 20 and a grounding conductor 21, which are, for example, elongated strip-shaped conductive plates, are vertically spaced apart from each other so as to surround the side surfaces. Are insulated from each other. A connection terminal 20a provided integrally with the power supply conductor 20 and a connection terminal 21a provided integrally with the grounding conductor 20 respectively pass through the inside of the socket body 12a and project to the lower surface thereof.
【００１７】この電源用および接地用の接続導体２０
ａ，２１ａはリード線２２，２３を介して試験基板１１
に設けられたＶＤＤ端子２４とＧＮＤ端子２５にそれぞ
れ接続されている。The connecting conductor 20 for power supply and grounding
a, 21a is the test substrate 11 via the lead wires 22, 23
Are connected to the VDD terminal 24 and the GND terminal 25, respectively.
【００１８】電源用導体２０と接地用導体２１の間に位
置するソケット本体１２ａの側面には複数の第１接続孔
２６が形成されていて、この第１接続孔２６の奥部にソ
ケット端子１３の他方の折り曲げ部１３ｂが位置してい
る。したがって、第１接続孔２６はソケット端子１３の
数と同数設けられている。また、複数の第１接続孔２６
は、ソケット本体１２ａが絶縁体で形成されていること
により、互いに絶縁されている。A plurality of first connection holes 26 are formed on the side surface of the socket body 12a located between the power supply conductor 20 and the grounding conductor 21, and the socket terminals 13 are formed at the inner part of the first connection holes 26. The other bent portion 13b is located. Therefore, the first connection holes 26 are provided in the same number as the socket terminals 13. In addition, the plurality of first connection holes 26
Are insulated from each other by the socket body 12a being formed of an insulator.
【００１９】また、電源用導体２０には第２接続孔２７
が形成され、接地用導体２１には第３接続孔２８が形成
されている。この第２接続孔２７と第３接続孔２８は、
第１接続孔２６と同様、ソケット端子１３に対応してこ
れと同数設けられている。そして、第１接続孔２６と第
２接続孔２７には電源用連絡導体として側面からみて略
コ字形の硬質金属線からなる電源用ジャンパ線１７の両
端の折り曲げ部１７ａ，１７ｂが挿入される。The power supply conductor 20 has a second connection hole 27.
And a third connection hole 28 is formed in the grounding conductor 21. The second connection hole 27 and the third connection hole 28 are
Similar to the first connection holes 26, the same number as the first connection holes 26 is provided corresponding to the socket terminals 13. Then, the bent portions 17a and 17b at both ends of the power supply jumper wire 17, which is a substantially U-shaped hard metal wire when viewed from the side, are inserted into the first connection hole 26 and the second connection hole 27 as power supply connection conductors.
【００２０】このとき、電源用ジャンパ線１７の一方の
折り曲げ部１７ｂの先端は第１接続孔２６の奥部におい
て、ソケット端子１３の一方の折曲げ部１３ｂと接続
し、他方の折り曲げ部１３ａは、第２接続孔２７の内周
縁に接して電源用導体２０と接続する。At this time, the tip of one bent portion 17b of the power jumper wire 17 is connected to one bent portion 13b of the socket terminal 13 at the inner part of the first connection hole 26, and the other bent portion 13a is , Is in contact with the inner peripheral edge of the second connection hole 27 and connected to the power supply conductor 20.
【００２１】電源用ジャンパ線１７の折り曲げ部１７ａ
が挿入された接続孔と別の第１接続孔２６と、第３接続
孔２８には接地用連絡導体２１として形成された、上記
電源用ジャンパ線１７と同一形状の接地用ジャンパ線１
８の両端の折り曲げ部１８ａ，１８ｂが挿入される。こ
のとき、接地用ジャンパ線１８の一方の折り曲げ部１８
ｂの先端は第１接続孔２６の奥部において、ソケット端
子１３の一方の折り曲げ部１３ｂと接続し、他方の折り
曲げ部１８ａは接地用導体２１ａと接続される。Bent portion 17a of power supply jumper wire 17
The first connection hole 26 different from the connection hole into which the is inserted, and the third connection hole 28 are formed as the grounding connection conductors 21 and have the same shape as the power supply jumper wire 17 described above.
The bent portions 18a and 18b at both ends of 8 are inserted. At this time, one bent portion 18 of the grounding jumper wire 18
The tip of b is connected to one bent portion 13b of the socket terminal 13 in the inner part of the first connection hole 26, and the other bent portion 18a is connected to the grounding conductor 21a.
【００２２】図２に示されるように、ＩＣソケット１２
の上部にはＬＳＩ３０が搭載され、このＬＳＩ３０の各
端子ピン３１がＩＣソケット１２の各ソケット端子１３
の上面に載置され、両者は互いに電気的に接続される。
またこのときＬＳＩ３０はずれ動かず、かつ端子ピン３
１とＩＣソケット端子１３との接続が保持されるよう固
定枠３２がＩＣソケット１２に覆せられる。As shown in FIG. 2, the IC socket 12
An LSI 30 is mounted on the upper part of the IC 30, and each terminal pin 31 of this LSI 30 is connected to each socket terminal 13 of the IC socket 12.
Is placed on the upper surface of and both are electrically connected to each other.
At this time, the LSI 30 does not move and the terminal pin 3
The fixing frame 32 covers the IC socket 12 so that the connection between the IC socket terminal 1 and the IC socket terminal 13 is maintained.
【００２３】固定枠３２は例えば蓋形状であって、その
開口部内周縁３２ａをソケット本体１２ａの上部外周縁
に嵌めることにより、当該固定枠３２がＩＣソケット１
２に対して固定される。またこのとき、固定枠３２の内
側下部に形成された押圧面３２ｂがＬＳＩ３０の端子ピ
ン３１を上方から押圧し、それにより端子ピン３１とソ
ケット端子１３とが電気的にしっかりと接続される。The fixed frame 32 has, for example, a lid shape, and by fitting the inner peripheral edge 32a of the opening to the outer peripheral edge of the upper portion of the socket body 12a, the fixed frame 32 becomes the IC socket 1.
Fixed to 2. At this time, the pressing surface 32b formed on the lower inside of the fixed frame 32 presses the terminal pin 31 of the LSI 30 from above, whereby the terminal pin 31 and the socket terminal 13 are electrically and firmly connected.
【００２４】本実施例によると、ＩＣソケット１２にＬ
ＳＩ３０を搭載し、端子ピン３１とソケット端子１３を
接続することにより、このソケット端子１３の一方の折
り曲げ部１３ａと、リード線１６と、試験基板１１の信
号端子１５を介してＬＳＩ３０をＬＳＩ論理テスタ（図
示せず）に接続することができる。According to this embodiment, the IC socket 12 has an L
By mounting the SI 30 and connecting the terminal pin 31 and the socket terminal 13, the LSI 30 is connected to the LSI logic tester via the bent portion 13a of the socket terminal 13, the lead wire 16, and the signal terminal 15 of the test board 11. (Not shown).
【００２５】また、パッケージの品種が変り、ＬＳＩ３
０の複数の端子のうち電源用端子ピン３１ａと接地用端
子ピン３１ｂの配置位置が変った場合も、ＩＣソケット
１２を取換える必要がなく、ソケット端子１３に対する
接続関係も従前と同じでよい。Also, the type of package has changed, and the LSI3
Even when the arrangement positions of the power supply terminal pin 31a and the grounding terminal pin 31b among the plurality of 0 terminals do not need to be replaced, the IC socket 12 does not need to be replaced, and the connection relationship with the socket terminal 13 may be the same as before.
【００２６】そして、この場合はまず第１に電源用ジャ
ンパ線１７をそれまで挿入されていた第１接続孔２６と
第２接続孔２７から一旦引き抜いて、これらの接続孔と
は別の電源用端子ピン３１ａと接触しているソケット端
子１３の折り曲げ部１３ｂに通じる第１接続孔２６と、
電源用導体２０の第２接続孔２７に挿入する。In this case, first, the power supply jumper wire 17 is temporarily pulled out from the first connection hole 26 and the second connection hole 27 which have been inserted until then, and the power supply jumper wire 17 different from these connection holes is used. A first connection hole 26 communicating with the bent portion 13b of the socket terminal 13 in contact with the terminal pin 31a;
The power supply conductor 20 is inserted into the second connection hole 27.
【００２７】それにより、電源用ジャンパ線１７を介し
て電源用端子ピン３１ａと電源用導体２０が接続され、
接続導体２０ａとリード線２３を介してＬＳＩ３０の電
源用端子ピン３１ａを試験基板１１のＶＤＤ端子２４に
接続することができる。As a result, the power supply terminal pin 31a and the power supply conductor 20 are connected via the power supply jumper wire 17,
The power supply terminal pin 31 a of the LSI 30 can be connected to the VDD terminal 24 of the test board 11 via the connection conductor 20 a and the lead wire 23.
【００２８】つぎに、上記と同様な操作で接地用ジャン
パ線１８を第１接続孔２６と第３接続孔２８に挿入す
る。それにより、接地用導体２１が接続され、その接続
導体２１ａとリード線２３を介してＬＳＩ３０の接地用
端子ピン３１ｂを試験基板１１のＧＮＤ端子２５に接続
することができる。Next, the grounding jumper wire 18 is inserted into the first connecting hole 26 and the third connecting hole 28 by the same operation as described above. Thereby, the grounding conductor 21 is connected, and the grounding terminal pin 31b of the LSI 30 can be connected to the GND terminal 25 of the test board 11 via the connection conductor 21a and the lead wire 23.
【００２９】なお、図２において、ＬＳＩ３０の電源用
端子ピン３１ａと接地用端子ピン３１ｂが接触している
ソケット端子１３にリード線１５を介して接続される信
号端子１５については、ＬＳＩ論理テスタの側で開放状
態としておくとよい。In FIG. 2, the signal terminal 15 connected via the lead wire 15 to the socket terminal 13 in which the power supply terminal pin 31a and the ground terminal pin 31b of the LSI 30 are in contact with each other is the LSI logic tester. It is better to leave it open on the side.
【００３０】また、コンデンサ（図示せず）の両方の端
子を電源用導体２０の空いている第２接続孔２７と、接
地用導体２１の空いている第３接続孔２８に挿入し、両
導体間に上記コンデンサをバイパスコンデンサとして挿
入してもよく、それにより安定電源を確保して測定を行
なうことができる。Both terminals of a capacitor (not shown) are inserted into the empty second connecting hole 27 of the power source conductor 20 and the empty third connecting hole 28 of the grounding conductor 21, and both conductors are inserted. The above-mentioned capacitor may be inserted as a bypass capacitor in between, whereby a stable power supply can be secured and measurement can be performed.
【００３１】本発明は実施例に限定されず必要な変更を
行なっても構わない。例えば、電源用ジャンパ線１７を
第１接続孔２６を介してソケット端子１３と接触させる
ための構造は図示例以外でもよい。つまり、複数の第１
接続孔２６同士が絶縁されていて、かつ第１接続孔２６
に電源用ジャンパ線１７の折り曲げ部１７ｂを挿入する
ことにより、この折り曲げ部１７ａとソケット端子１３
の一方の折り曲げ部１３ｂとが電気的に接続する構造で
あれば、図示以外の構造であって構わない。電源用ジャ
ンパ線１７および接地用ジャンパ線１８の形状，大きさ
なども図示例のものに限定されない。さらに、電源用導
体２０と接地用導体２１は、ソケット本体１２ａの側面
部に埋込むようにし、表面に露出しないように形成する
ことも可能である。The present invention is not limited to the embodiments and may be modified as necessary. For example, the structure for contacting the power jumper wire 17 with the socket terminal 13 via the first connection hole 26 may be other than the illustrated example. That is, a plurality of first
The connection holes 26 are insulated from each other, and the first connection holes 26
By inserting the bent portion 17b of the power supply jumper wire 17 into the bent portion 17a and the socket terminal 13,
Any structure other than the illustrated structure may be used as long as it is a structure in which one of the bent portions 13b is electrically connected. The shapes and sizes of the power jumper wire 17 and the ground jumper wire 18 are not limited to those shown in the drawings. Further, the power supply conductor 20 and the grounding conductor 21 can be formed so as to be embedded in the side surface portion of the socket body 12a and not exposed to the surface.
【００３２】[0032]
【発明の効果】以上説明したように本発明によれば、電
源用連絡導体と接地用連絡導体の第１接続孔と第２接続
孔および、第３接続孔への挿入位置を変更することによ
り、ソケットに搭載された集積回路の各端子と、試験基
板の信号端子，ＶＤＤ端子，ＧＮＤ端子との配線関係を
簡単に変えることができるので、同一の試験基板を用い
て電源用端子と接地用端子の配置位置が異なる種々の品
種の集積回路を試験できる。それにより、試験基板の作
成に要する費用と、その保管場所などが少なくてすみ、
装置コストの低減化，試験の容易化が図れる。As described above, according to the present invention, by changing the insertion positions of the power supply connection conductor and the ground connection conductor into the first connection hole, the second connection hole, and the third connection hole. Since the wiring relationship between each terminal of the integrated circuit mounted in the socket and the signal terminal, VDD terminal, and GND terminal of the test board can be easily changed, the same test board can be used for the power supply terminal and the ground terminal. It is possible to test various types of integrated circuits having different terminal arrangement positions. As a result, the cost required to create the test board and its storage space are small,
Equipment costs can be reduced and testing can be facilitated.
【００３３】さらに、本発明によると簡単な接続手段で
安定電源を確保するためのコンデンサをソケット上で電
源端子と接地端子に接続することができる。また集積回
路の電源用端子と接地用端子は、複数の導体を介してそ
れぞれソケット本体の側面に配設されている電源用導体
と接地用端子とに接続されており、これは考えられ得る
最も簡潔な構成であって、その作成上の手間を可及的に
省くことができる。Further, according to the present invention, a capacitor for ensuring a stable power supply can be connected to the power supply terminal and the ground terminal on the socket by a simple connecting means. Further, the power supply terminal and the grounding terminal of the integrated circuit are connected to the power supply conductor and the grounding terminal, which are respectively arranged on the side surface of the socket body, through a plurality of conductors, which is the most conceivable. It has a simple structure, and the time and effort for creating it can be saved as much as possible.
【図１】本発明の実施例に係るＩＣソケットとＬＳＩの
斜視図である。FIG. 1 is a perspective view of an IC socket and an LSI according to an embodiment of the present invention.
【図２】図１のソケットにＬＳＩを搭載し、固定枠で押
さえた状態の断面図である。FIG. 2 is a cross-sectional view showing a state in which an LSI is mounted on the socket of FIG. 1 and is held by a fixing frame.
【図３】図１のソケットを上面に配設した試験基板の正
面図である。FIG. 3 is a front view of a test board having the socket of FIG. 1 arranged on the upper surface.
【図４】従来のソケットを上面に配設した従来の試験基
板の正面図である。FIG. 4 is a front view of a conventional test board having a conventional socket arranged on the upper surface.
１１…試験基板、１２…ＩＣソケット、１２ａ…ソケッ
ト本体、１３…ソケット端子、１３ａ，１３ｂ…折り曲
げ部、１７…電源用ジャンパ線、１８…接地用ジャンパ
線、２０…電源用導体、２０ａ…接続導体、２１…接地
用導体、２１ａ…接続導体、２４…ＶＤＤ端子、２５…
ＧＮＤ端子、２６…第１接続孔、２７…第２接続孔、２
８…第３接続孔、３０…ＬＳＩ、３１…端子ピン。11 ... Test board, 12 ... IC socket, 12a ... Socket body, 13 ... Socket terminal, 13a, 13b ... Bent part, 17 ... Power jumper wire, 18 ... Ground jumper wire, 20 ... Power supply conductor, 20a ... Connection Conductor, 21 ... Grounding conductor, 21a ... Connection conductor, 24 ... VDD terminal, 25 ...
GND terminal, 26 ... First connection hole, 27 ... Second connection hole, 2
8 ... Third connection hole, 30 ... LSI, 31 ... Terminal pin.
Claims (2)
のソケットに搭載した被試験用の集積回路を前記試験基
板を介して試験装置と電気的に接続するようにした集積
回路試験装置において、 前記ソケットは、 一端が前記試験基板の端子に接続され、他端が前記集積
回路の端子と接続するように設けられた複数の接続導体
と、 ソケット本体の側面に開設され、それぞれが前記接続導
体と電気的に接続されている複数の第１接続孔と、 前記試験基板の電源用端子に接続されており、前記ソケ
ット本体の側面部に設けられた電源用導体と、 前記試験基板の接地用端子に接続されており、前記ソケ
ット本体の側面部に前記電源用導体と略平行に設けられ
た接地用導体と、 それぞれが前記電源用導体に接続され、前記第１接続孔
と略平行に前記ソケット本体の側面部に開設された複数
の第２接続孔と、 それぞれが前記接地用導体に接続され、前記第２接続孔
と略平行に前記ソケット本体の側面部に開設された複数
の第３接続孔と、 を備えたことを特徴とする集積回路試験装置。1. An integrated circuit test apparatus in which a socket is provided on an upper surface of a test board, and an integrated circuit under test mounted in the socket is electrically connected to a test apparatus via the test board. The socket has a plurality of connection conductors, one end of which is connected to a terminal of the test board and the other end of which is connected to a terminal of the integrated circuit. A plurality of first connection holes electrically connected to a conductor; a power supply conductor connected to a power supply terminal of the test board and provided on a side surface of the socket body; and a grounding of the test board. A grounding conductor connected to the power supply terminal and provided on the side surface of the socket body substantially parallel to the power supply conductor, and each grounding conductor connected to the power supply conductor and substantially parallel to the first connection hole. The salmon A plurality of second connection holes formed in a side surface portion of the socket body, and a plurality of second connection holes each connected to the grounding conductor and formed in a side surface portion of the socket body substantially parallel to the second connection hole. An integrated circuit testing device comprising: 3 connection holes;
できる接続端子を介して前記電源用導体と前記接地用導
体との間にコンデンサを接続した構成を特徴とする請求
項１記載の集積回路試験装置。2. A configuration in which a capacitor is connected between the power supply conductor and the grounding conductor via a connection terminal that can be inserted into the second connection hole and the third connection hole. Integrated circuit test equipment.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP5309374A JPH07159486A (en) | 1993-12-09 | 1993-12-09 | Integrated circuit testing device |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP5309374A JPH07159486A (en) | 1993-12-09 | 1993-12-09 | Integrated circuit testing device |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| JPH07159486A true JPH07159486A (en) | 1995-06-23 |
Family
ID=17992238
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP5309374A Pending JPH07159486A (en) | 1993-12-09 | 1993-12-09 | Integrated circuit testing device |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPH07159486A (en) |
Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| AU2003203525B2 (en) * | 2002-04-02 | 2007-02-08 | New Macey Pty Limited | A Plug for a Mine Cable |
| JP2010096702A (en) * | 2008-10-20 | 2010-04-30 | Micronics Japan Co Ltd | Electrical connection device |
-
1993
- 1993-12-09 JP JP5309374A patent/JPH07159486A/en active Pending
Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| AU2003203525B2 (en) * | 2002-04-02 | 2007-02-08 | New Macey Pty Limited | A Plug for a Mine Cable |
| JP2010096702A (en) * | 2008-10-20 | 2010-04-30 | Micronics Japan Co Ltd | Electrical connection device |
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