JPS6253528B2 - - Google Patents
Info
- Publication number
- JPS6253528B2 JPS6253528B2 JP58241874A JP24187483A JPS6253528B2 JP S6253528 B2 JPS6253528 B2 JP S6253528B2 JP 58241874 A JP58241874 A JP 58241874A JP 24187483 A JP24187483 A JP 24187483A JP S6253528 B2 JPS6253528 B2 JP S6253528B2
- Authority
- JP
- Japan
- Prior art keywords
- epoxy resin
- biphenol
- type epoxy
- resin
- parts
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired
Links
- 239000003822 epoxy resin Substances 0.000 claims description 37
- 229920000647 polyepoxide Polymers 0.000 claims description 37
- 229920003986 novolac Polymers 0.000 claims description 20
- 239000000203 mixture Substances 0.000 claims description 9
- 125000001997 phenyl group Chemical group [H]C1=C([H])C([H])=C(*)C([H])=C1[H] 0.000 claims description 2
- ISWSIDIOOBJBQZ-UHFFFAOYSA-N Phenol Chemical compound OC1=CC=CC=C1 ISWSIDIOOBJBQZ-UHFFFAOYSA-N 0.000 description 7
- 239000003795 chemical substances by application Substances 0.000 description 6
- LNEPOXFFQSENCJ-UHFFFAOYSA-N haloperidol Chemical compound C1CC(O)(C=2C=CC(Cl)=CC=2)CCN1CCCC(=O)C1=CC=C(F)C=C1 LNEPOXFFQSENCJ-UHFFFAOYSA-N 0.000 description 6
- VYPSYNLAJGMNEJ-UHFFFAOYSA-N Silicium dioxide Chemical group O=[Si]=O VYPSYNLAJGMNEJ-UHFFFAOYSA-N 0.000 description 5
- 239000000945 filler Substances 0.000 description 5
- 229920005989 resin Polymers 0.000 description 5
- 239000011347 resin Substances 0.000 description 5
- 150000001299 aldehydes Chemical class 0.000 description 4
- 239000003054 catalyst Substances 0.000 description 4
- 239000004033 plastic Substances 0.000 description 4
- 229920003023 plastic Polymers 0.000 description 4
- 239000012756 surface treatment agent Substances 0.000 description 4
- WSFSSNUMVMOOMR-UHFFFAOYSA-N Formaldehyde Chemical compound O=C WSFSSNUMVMOOMR-UHFFFAOYSA-N 0.000 description 3
- MUBZPKHOEPUJKR-UHFFFAOYSA-N Oxalic acid Chemical compound OC(=O)C(O)=O MUBZPKHOEPUJKR-UHFFFAOYSA-N 0.000 description 3
- YXFVVABEGXRONW-UHFFFAOYSA-N Toluene Chemical compound CC1=CC=CC=C1 YXFVVABEGXRONW-UHFFFAOYSA-N 0.000 description 3
- 239000000463 material Substances 0.000 description 3
- 239000006082 mold release agent Substances 0.000 description 3
- 150000002989 phenols Chemical class 0.000 description 3
- ZTQSAGDEMFDKMZ-UHFFFAOYSA-N Butyraldehyde Chemical compound CCCC=O ZTQSAGDEMFDKMZ-UHFFFAOYSA-N 0.000 description 2
- VTYYLEPIZMXCLO-UHFFFAOYSA-L Calcium carbonate Chemical compound [Ca+2].[O-]C([O-])=O VTYYLEPIZMXCLO-UHFFFAOYSA-L 0.000 description 2
- 239000004593 Epoxy Substances 0.000 description 2
- FAPWRFPIFSIZLT-UHFFFAOYSA-M Sodium chloride Chemical compound [Na+].[Cl-] FAPWRFPIFSIZLT-UHFFFAOYSA-M 0.000 description 2
- 150000004996 alkyl benzenes Chemical class 0.000 description 2
- MWPLVEDNUUSJAV-UHFFFAOYSA-N anthracene Chemical compound C1=CC=CC2=CC3=CC=CC=C3C=C21 MWPLVEDNUUSJAV-UHFFFAOYSA-N 0.000 description 2
- HUMNYLRZRPPJDN-UHFFFAOYSA-N benzaldehyde Chemical compound O=CC1=CC=CC=C1 HUMNYLRZRPPJDN-UHFFFAOYSA-N 0.000 description 2
- 229920001577 copolymer Polymers 0.000 description 2
- 239000007822 coupling agent Substances 0.000 description 2
- 229930003836 cresol Natural products 0.000 description 2
- 238000004132 cross linking Methods 0.000 description 2
- -1 etc. Chemical class 0.000 description 2
- 239000003063 flame retardant Substances 0.000 description 2
- 125000002887 hydroxy group Chemical group [H]O* 0.000 description 2
- QWVGKYWNOKOFNN-UHFFFAOYSA-N o-cresol Chemical compound CC1=CC=CC=C1O QWVGKYWNOKOFNN-UHFFFAOYSA-N 0.000 description 2
- 239000011342 resin composition Substances 0.000 description 2
- 239000000377 silicon dioxide Substances 0.000 description 2
- 239000000126 substance Substances 0.000 description 2
- 150000005207 1,3-dihydroxybenzenes Chemical class 0.000 description 1
- RNFJDJUURJAICM-UHFFFAOYSA-N 2,2,4,4,6,6-hexaphenoxy-1,3,5-triaza-2$l^{5},4$l^{5},6$l^{5}-triphosphacyclohexa-1,3,5-triene Chemical compound N=1P(OC=2C=CC=CC=2)(OC=2C=CC=CC=2)=NP(OC=2C=CC=CC=2)(OC=2C=CC=CC=2)=NP=1(OC=1C=CC=CC=1)OC1=CC=CC=C1 RNFJDJUURJAICM-UHFFFAOYSA-N 0.000 description 1
- QTWJRLJHJPIABL-UHFFFAOYSA-N 2-methylphenol;3-methylphenol;4-methylphenol Chemical compound CC1=CC=C(O)C=C1.CC1=CC=CC(O)=C1.CC1=CC=CC=C1O QTWJRLJHJPIABL-UHFFFAOYSA-N 0.000 description 1
- CTQNGGLPUBDAKN-UHFFFAOYSA-N O-Xylene Chemical compound CC1=CC=CC=C1C CTQNGGLPUBDAKN-UHFFFAOYSA-N 0.000 description 1
- 229930040373 Paraformaldehyde Natural products 0.000 description 1
- OAICVXFJPJFONN-UHFFFAOYSA-N Phosphorus Chemical compound [P] OAICVXFJPJFONN-UHFFFAOYSA-N 0.000 description 1
- 239000006087 Silane Coupling Agent Substances 0.000 description 1
- RTAQQCXQSZGOHL-UHFFFAOYSA-N Titanium Chemical compound [Ti] RTAQQCXQSZGOHL-UHFFFAOYSA-N 0.000 description 1
- 238000010521 absorption reaction Methods 0.000 description 1
- CWRYPZZKDGJXCA-UHFFFAOYSA-N acenaphthene Chemical compound C1=CC(CC2)=C3C2=CC=CC3=C1 CWRYPZZKDGJXCA-UHFFFAOYSA-N 0.000 description 1
- IKHGUXGNUITLKF-XPULMUKRSA-N acetaldehyde Chemical compound [14CH]([14CH3])=O IKHGUXGNUITLKF-XPULMUKRSA-N 0.000 description 1
- 150000008065 acid anhydrides Chemical class 0.000 description 1
- 125000003172 aldehyde group Chemical group 0.000 description 1
- 229910052782 aluminium Inorganic materials 0.000 description 1
- XAGFODPZIPBFFR-UHFFFAOYSA-N aluminium Chemical compound [Al] XAGFODPZIPBFFR-UHFFFAOYSA-N 0.000 description 1
- PNEYBMLMFCGWSK-UHFFFAOYSA-N aluminium oxide Inorganic materials [O-2].[O-2].[O-2].[Al+3].[Al+3] PNEYBMLMFCGWSK-UHFFFAOYSA-N 0.000 description 1
- 150000001412 amines Chemical class 0.000 description 1
- 229910052787 antimony Inorganic materials 0.000 description 1
- WATWJIUSRGPENY-UHFFFAOYSA-N antimony atom Chemical compound [Sb] WATWJIUSRGPENY-UHFFFAOYSA-N 0.000 description 1
- 239000010425 asbestos Substances 0.000 description 1
- 150000001639 boron compounds Chemical class 0.000 description 1
- 229910000019 calcium carbonate Inorganic materials 0.000 description 1
- 239000000919 ceramic Substances 0.000 description 1
- 238000006243 chemical reaction Methods 0.000 description 1
- 239000004927 clay Substances 0.000 description 1
- 229910052570 clay Inorganic materials 0.000 description 1
- 150000001875 compounds Chemical class 0.000 description 1
- 125000000853 cresyl group Chemical group C1(=CC=C(C=C1)C)* 0.000 description 1
- 238000011161 development Methods 0.000 description 1
- 230000018109 developmental process Effects 0.000 description 1
- 238000005538 encapsulation Methods 0.000 description 1
- 230000007613 environmental effect Effects 0.000 description 1
- 125000003700 epoxy group Chemical group 0.000 description 1
- 239000005350 fused silica glass Substances 0.000 description 1
- 239000011521 glass Substances 0.000 description 1
- 150000004820 halides Chemical class 0.000 description 1
- 150000002460 imidazoles Chemical class 0.000 description 1
- 229910052751 metal Inorganic materials 0.000 description 1
- 239000002184 metal Substances 0.000 description 1
- WSFSSNUMVMOOMR-NJFSPNSNSA-N methanone Chemical compound O=[14CH2] WSFSSNUMVMOOMR-NJFSPNSNSA-N 0.000 description 1
- 238000000034 method Methods 0.000 description 1
- 239000003607 modifier Substances 0.000 description 1
- 239000012778 molding material Substances 0.000 description 1
- 238000000465 moulding Methods 0.000 description 1
- 235000006408 oxalic acid Nutrition 0.000 description 1
- QNGNSVIICDLXHT-UHFFFAOYSA-N para-ethylbenzaldehyde Natural products CCC1=CC=C(C=O)C=C1 QNGNSVIICDLXHT-UHFFFAOYSA-N 0.000 description 1
- 229920002866 paraformaldehyde Polymers 0.000 description 1
- 239000005011 phenolic resin Substances 0.000 description 1
- 239000011574 phosphorus Substances 0.000 description 1
- 229910052698 phosphorus Inorganic materials 0.000 description 1
- 239000000049 pigment Substances 0.000 description 1
- 229920001225 polyester resin Polymers 0.000 description 1
- 239000004645 polyester resin Substances 0.000 description 1
- 229920000642 polymer Polymers 0.000 description 1
- 238000000746 purification Methods 0.000 description 1
- 239000002994 raw material Substances 0.000 description 1
- 230000009467 reduction Effects 0.000 description 1
- 229910052895 riebeckite Inorganic materials 0.000 description 1
- 238000007363 ring formation reaction Methods 0.000 description 1
- 239000011780 sodium chloride Substances 0.000 description 1
- 238000005979 thermal decomposition reaction Methods 0.000 description 1
- 239000010936 titanium Substances 0.000 description 1
- 229910052719 titanium Inorganic materials 0.000 description 1
- HGBOYTHUEUWSSQ-UHFFFAOYSA-N valeric aldehyde Natural products CCCCC=O HGBOYTHUEUWSSQ-UHFFFAOYSA-N 0.000 description 1
- XLYOFNOQVPJJNP-UHFFFAOYSA-N water Substances O XLYOFNOQVPJJNP-UHFFFAOYSA-N 0.000 description 1
- 239000008096 xylene Substances 0.000 description 1
Description
本発明は、硬化性、耐熱性、耐湿性に優れるエ
ポキシ樹脂組成物に係るものであり、その特徴は
剛直なビフエノール構造を骨格中に持つこと及び
ビフエノール構造を骨格中に持つエポキシ樹脂を
用いるところにある。
近年、金属部品やセラミツク部品類のプラスチ
ツク化は驚異的な速さで進行していることは衆知
の事実である。プラスチツクとしてはフエノール
樹脂、ポリエステル樹脂、エポキシ樹脂等が使わ
れており、用途としては家電・自動車分野で多量
に用いられている。これら分野での最近の動きと
してはVIRの小型化、自動車の軽量化といつた動
きや日本の製品が世界中で使用される確率がます
ます高まつてきたことである。このためこれら用
途で使われる部品類は小型・軽量化や環境の変化
に対する強さや低コスト化が強く要求されてい
る。
このため、プラスチツク素材そのものの耐熱
性・耐湿性の向上並びに低コスト化が必要となつ
てきている。
本発明はこれら要求を満足させる耐熱性・耐湿
性さらには速硬化性を兼ねそろえたエポキシ樹脂
組成物を提供するものである。本発明は、下記
〔〕・〔〕・〔〕等で表わされるビフエノール
構造を骨格中に持つエポキシ樹脂を組成の中に含
むことを特徴とするエポキシ樹脂組成物を提供す
る。
〔〕 ビフエノール類とアルデヒド類との重合
物のエポキシ化物
〔〕 ビフエノール類とフエノール類とアルデ
ヒド類との共重合物のエポキシ化物
〔〕 ビフエノール類とアルキルベンゼン類と
アルデヒド類との共重合物のエポキシ化物
ここで、R1＝Ｈ，CH3，C2H5，C3H7，C4H9
R2＝Ｈ，CH3，
The present invention relates to an epoxy resin composition that has excellent curability, heat resistance, and moisture resistance, and is characterized by having a rigid biphenol structure in its skeleton and using an epoxy resin having a biphenol structure in its skeleton. It is in. It is a well-known fact that metal parts and ceramic parts are being replaced with plastic at an astonishing rate in recent years. Phenol resin, polyester resin, epoxy resin, etc. are used as plastics, and they are used in large quantities in the fields of home appliances and automobiles. Recent developments in these fields include the miniaturization of VIRs, the lighter weight of automobiles, and the increasing probability that Japanese products will be used all over the world. For this reason, there is a strong demand for parts used in these applications to be smaller, lighter, more resistant to environmental changes, and lower in cost. For this reason, it has become necessary to improve the heat resistance and moisture resistance of the plastic material itself and to reduce its cost. The present invention provides an epoxy resin composition that satisfies these requirements and has heat resistance, moisture resistance, and fast curing properties. The present invention provides an epoxy resin composition characterized by containing an epoxy resin having a biphenol structure represented by the following [], [], [], etc. in its skeleton. [] Epoxidized product of polymers of biphenols and aldehydes [] Epoxidized products of copolymers of biphenols, phenols, and aldehydes [] Epoxidized product of copolymer of biphenols, alkylbenzenes, and aldehydes Here, R 1 = H, CH 3 , C 2 H 5 , C 3 H 7 , C 4 H 9 R 2 = H, CH 3 ,
【式】CH2＝CH−CH4H9 − R3＝CH3，[Formula] CH 2 = CH - CH 4 H 9 - R 3 = CH 3 ,
【式】
R4＝Ｈ，CH3
ｍ，ｎは０〜２の整数
ここでいうビフエノール類とはビフエノール及
びビフエノール誘導体全てを示し例えばビフエノ
ール，アルキルビフエノール等のことをいう。
又、フエノール類とはビフエノール，アルキルフ
エノール，レゾルシン等のこと、アルキルベンゼ
ン類とはトルエン，キシレン，アセナフテン，ア
ントラセン等のことをいう、アルデヒド類とは、
アルデヒド基を持つもののことを言い、例えばホ
ルムアルデヒド，パラホルムアルデヒド，ベンズ
アルデヒド，アセトアルデヒド，ブチルアルデヒ
ド，アクロイン等が挙げられる。
さらにエポキシ樹脂組成物はビフエノール構造
を骨格中に持つエポキシ樹脂（以後、ビフエノー
ルノボラツク型エポキシ樹脂と称する）を組成に
含むもの全てをいい、一般的にはエポキシ樹脂、
硬化剤、硬化促進剤、充填剤、顔料、離型剤、表
面処理剤、難燃剤等より構成される。
ここでいうエポキシ樹脂とは本発明によるビフ
エノールノボラツク型エポキシ樹脂及びその他ビ
フエノール型エポキシ樹脂，フエノールノボラツ
ク型エポキシ樹脂，ビフエノールノボラツク型エ
ポキシ樹脂，クレゾールノボラツク型エポキシ樹
脂等一般エポキシ樹脂と呼ばれるもの全てを言い
本発明のビフエノールノボラツク型エポキシ樹脂
を必須として他のエポキシ樹脂一種もしくは二種
以上と併用しても良い。又、本発明のビフエノー
ルノボラツク型エポキシ樹脂の比率を多くするほ
ど速硬化性や耐熱性は向上する。
硬化剤とは、フエノールノボラツク類，アミン
類，酸無水物類等エポキシ樹脂と架橋するもの全
てをいう。
さらに、硬化促進剤とはイミダゾール類，第３
級アミン類，ホスフイン化合物，アルミニウム化
合物，チタン化合物等エポキシ樹脂と硬化剤の反
応を促進するもののことをいい充填剤はシリカ，
アルミナ，クレー，アスベスト，炭酸カルシウ
ム，ガラス等のこと、表面処理剤とはシランカツ
プリング剤，チタンカツプリング剤，アルミニウ
ムカツプリング剤等の充填剤改良剤のこと、難燃
剤とはホウ素化合物，リン化合物，アンチモン
類，ハロゲン化物等のことをいう。
特に、電子部品用の組成としてはエポキシ樹脂
の50％以上は本発明のビフエノールノボラツク型
エポキシ樹脂を用い他はクレゾールノボラツク型
エポキシ樹脂、硬化剤はフエノールノボラツク、
充填剤はシリカとするのが望ましい。
本発明はビフエノールを骨格中に入れることに
より樹脂そのものの強度及び架橋後の強度が著し
く向上することを見い出したものである。これは
ビフエノールがベンゼン環とベンゼン環が直接結
合した剛直な構造を持つだけでなくOH当量が小
さく―エポキシ化した場合もエポキシ当量が小さ
く―高強度架橋が達成できるという理由による。
この結果、硬化反応は速くなり速硬化性が得ら
れるだけでなく、硬化物の熱分解温度が高くなる
及び吸水率が小さくなるといつた耐熱性、耐湿性
での長所も得られた。
速硬化性は成形工程やプレス工程のハイサイク
ル合理化を可能にしコストダウンにつながる。又
耐熱性・耐湿性向上はプラスチツク部品の肉薄小
型化時の品質を支えるものである。ビフエノール
ノボラツク型エポキシ樹脂及び樹脂組成物の強度
はビフエノールの比率によつて左右される。
ビフエノールの比率が高いほど強度は向上する
ので目的によつて樹脂中のビフエノール量及び組
成物中のビフエノールノボラツク型エポキシ樹脂
の使用量を決めることが必要である。強度面から
はエポキシ樹脂分の50％以上をビフエノール型エ
ポキシとするのが好ましい。以下、低圧封入成形
材料への適用例で説明する。例で用いる部は全て
重量部であり又、例で用いた原料は次の通りであ
る。
エポキシ樹脂：ビフエノールとホルムアルデヒ
ド（モル比で１：0.8）を蓚酸触媒で反応さ
せたビフエノールノボラツクに水酸基に対し
エピクロルピドリンをモル比１：５で可性ソ
ーダ触媒を用い付加閉環反応させ精製後得た
樹脂
エポキシ樹脂：フエノール変性ビフエノールノ
ボラツク（フエノール／ビフエノール＝1/2
重量比）のエポキシ化樹脂
エポキシ樹脂：ビフエノール変性フエノールノ
ボラツク（フエノール／ビフエノール＝3/1
重量比）のエポキシ化樹脂
オルトクレゾールノボラツク型エポキシ樹脂：
（ECNと略す）チバガイギー ECN―1273
硬化剤：日本化薬 フエノールノボラツク PN
―80
硬化触媒：住友化学工業 スミキユアＤ
充填剤：龍森 溶融シリカ
表面処理剤：日本ユニカー Ａ―186
離型剤：ヘキストワツクス OP
実施例
エポキシ樹脂として，，，ECN，／
ECN＝２／１，／ECN＝１／２なる６水準を
取り、これに硬化剤をエポキシ基／フエノール性
水酸基＝１／１（モル比）の比率で合計が30部に
なるよう仕込む。さらに硬化剤触媒0.2部 充填
剤70部 表面処理剤0.3部 離型剤0.3部を加え混
合後コニーダーを用い混練し材料化を行つた。計
６種の材料の硬化性、耐熱性、耐湿性を比較検討
した結果、本発明による樹脂組成物を用いた場
合、従来のECNを用いる場合に比べいずれも特
性も極めて優れることが判つた。又、ビフエノー
ルノボラツク型エポキシ樹脂を多く用いる程、特
にエポキシ樹脂の半分以上用いると抜群の性質を
示すことが判つた。表―１に結果をまとめた。[Formula] R 4 =H, CH 3 m, n are integers of 0 to 2. The biphenols herein refer to all biphenols and biphenol derivatives, such as biphenols and alkylbiphenols.
In addition, phenols include biphenols, alkylphenols, resorcinols, etc., alkylbenzenes include toluene, xylene, acenaphthene, anthracene, etc., and aldehydes include:
Refers to substances having an aldehyde group, such as formaldehyde, paraformaldehyde, benzaldehyde, acetaldehyde, butyraldehyde, acroin, and the like. Furthermore, epoxy resin compositions refer to all compositions containing epoxy resins having a biphenol structure in their skeleton (hereinafter referred to as biphenol novolak type epoxy resins), and generally include epoxy resins,
Consists of curing agent, curing accelerator, filler, pigment, mold release agent, surface treatment agent, flame retardant, etc. The epoxy resin referred to here includes the biphenol novolak type epoxy resin according to the present invention and other general epoxy resins such as biphenol type epoxy resin, phenol novolak type epoxy resin, biphenol novolak type epoxy resin, and cresol novolak type epoxy resin. In all cases, the biphenol novolak type epoxy resin of the present invention is essential and may be used in combination with one or more other epoxy resins. Further, as the ratio of the biphenol novolac type epoxy resin of the present invention is increased, the faster curing properties and heat resistance improve. The curing agent refers to anything that crosslinks with the epoxy resin, such as phenol novolaks, amines, and acid anhydrides. Furthermore, curing accelerators include imidazoles, tertiary
The filler is silica,
Alumina, clay, asbestos, calcium carbonate, glass, etc.; surface treatment agents include filler modifiers such as silane coupling agents, titanium coupling agents, and aluminum coupling agents; flame retardants include boron compounds, phosphorus, etc. Compounds, antimony, halides, etc. In particular, as for the composition for electronic parts, 50% or more of the epoxy resin is the biphenol novolak type epoxy resin of the present invention, the rest is a cresol novolak type epoxy resin, and the curing agent is phenol novolak type epoxy resin.
Preferably, the filler is silica. The present invention is based on the discovery that the strength of the resin itself and the strength after crosslinking can be significantly improved by incorporating biphenol into the skeleton. This is because biphenol not only has a rigid structure in which benzene rings are directly bonded, but also has a small OH equivalent (and when epoxidized, the epoxy equivalent is also small), making it possible to achieve high strength crosslinking. As a result, not only the curing reaction was accelerated and quick curing properties were obtained, but also advantages in heat resistance and moisture resistance were obtained, such as a higher thermal decomposition temperature and a lower water absorption rate of the cured product. The fast curing properties enable high-cycle rationalization of molding and pressing processes, leading to cost reductions. In addition, improved heat resistance and moisture resistance support the quality of plastic parts when they are made thinner and more compact. The strength of biphenol novolac type epoxy resins and resin compositions depends on the proportion of biphenol. The higher the ratio of biphenol, the higher the strength, so it is necessary to determine the amount of biphenol in the resin and the amount of biphenol novolak type epoxy resin used in the composition depending on the purpose. From the viewpoint of strength, it is preferable that 50% or more of the epoxy resin be biphenol type epoxy. An example of application to a low-pressure encapsulation molding material will be explained below. All parts used in the examples are parts by weight, and the raw materials used in the examples are as follows. Epoxy resin: Biphenol novolac is made by reacting biphenol and formaldehyde (1:0.8 in molar ratio) with an oxalic acid catalyst, and is subjected to an addition ring-closing reaction with epichloropidrine to the hydroxyl group in a molar ratio of 1:5 using a sodium chloride catalyst. Resin obtained after purification Epoxy resin: Phenol-modified biphenol novolak (phenol/biphenol = 1/2
Weight ratio) of epoxidized resin Epoxy resin: Biphenol modified phenol novolak (phenol/biphenol = 3/1
Weight ratio) of epoxidized resin orthocresol novolak type epoxy resin:
(abbreviated as ECN) Ciba Geigy ECN-1273 Hardening agent: Nippon Kayaku Phenol Novolak PN
-80 Curing catalyst: Sumitomo Chemical Sumikiure D Filler: Ryumori Fused silica Surface treatment agent: Nippon Unicar A-186 Mold release agent: Hoechstwax OP Example As an epoxy resin,,,ECN,/
Six levels of ECN=2/1 and /ECN=1/2 are taken, and a curing agent is added thereto in a ratio of epoxy group/phenolic hydroxyl group=1/1 (mole ratio) for a total of 30 parts. Further, 0.2 parts of a hardening agent catalyst, 70 parts of a filler, 0.3 parts of a surface treatment agent, and 0.3 parts of a mold release agent were added and mixed, and then kneaded using a co-kneader to form a material. As a result of comparing and examining the curability, heat resistance, and moisture resistance of a total of six materials, it was found that when the resin composition according to the present invention was used, the characteristics were extremely superior to those when conventional ECN was used. It has also been found that the more biphenol novolac type epoxy resin is used, especially when more than half of the epoxy resin is used, the better the properties are. Table 1 summarizes the results.
【表】【table】
Claims (1)
エノール構造をノボラツク骨格中に持つ下記一般
式〔〕，〔〕，〔〕で表わされるエポキシ樹脂
を組成の中に含むことを特徴とするエポキシ樹脂
組成物。 ここで、R1＝Ｈ，CH3，C2H5，C3H7，C4H9 R2＝Ｈ，CH3，【式】CH2＝CH―， CH4H9― R3＝CH3，【式】【式】 R4＝Ｈ，CH3 ｍ，ｎは０〜２の整数[Scope of Claims] 1. A composition characterized by containing an epoxy resin represented by the following general formulas [], [], [] having a biphenol structure in which benzene rings are linearly bonded in the novolak skeleton. epoxy resin composition. Here, R 1 = H, CH 3 , C 2 H 5 , C 3 H 7 , C 4 H 9 R 2 = H, CH 3 , [Formula] CH 2 = CH-, CH 4 H 9 - R 3 = CH 3 , [Formula] [Formula] R 4 = H, CH 3 m, n are integers from 0 to 2
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP24187483A JPS60135449A (en) | 1983-12-23 | 1983-12-23 | Epoxy resin composition |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP24187483A JPS60135449A (en) | 1983-12-23 | 1983-12-23 | Epoxy resin composition |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| JPS60135449A JPS60135449A (en) | 1985-07-18 |
| JPS6253528B2 true JPS6253528B2 (en) | 1987-11-11 |
Family
ID=17080810
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP24187483A Granted JPS60135449A (en) | 1983-12-23 | 1983-12-23 | Epoxy resin composition |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPS60135449A (en) |
Citations (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS57141419A (en) * | 1981-02-27 | 1982-09-01 | Mitsubishi Petrochem Co Ltd | Production of polyepoxide |
-
1983
- 1983-12-23 JP JP24187483A patent/JPS60135449A/en active Granted
Patent Citations (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS57141419A (en) * | 1981-02-27 | 1982-09-01 | Mitsubishi Petrochem Co Ltd | Production of polyepoxide |
Also Published As
| Publication number | Publication date |
|---|---|
| JPS60135449A (en) | 1985-07-18 |
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