JPS6242281U - - Google Patents
Info
- Publication number
- JPS6242281U JPS6242281U JP13453585U JP13453585U JPS6242281U JP S6242281 U JPS6242281 U JP S6242281U JP 13453585 U JP13453585 U JP 13453585U JP 13453585 U JP13453585 U JP 13453585U JP S6242281 U JPS6242281 U JP S6242281U
- Authority
- JP
- Japan
- Prior art keywords
- electronic component
- component mounting
- detector
- mounting device
- adhesive
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
- 239000000853 adhesive Substances 0.000 claims description 4
- 230000001070 adhesive effect Effects 0.000 claims description 4
- 238000010586 diagram Methods 0.000 description 2
- 238000000034 method Methods 0.000 description 2
- 210000000078 claw Anatomy 0.000 description 1
Landscapes
- Automatic Assembly (AREA)
Description
第1図はこの考案の一実施例である電子部品装
着装置における動作工程を説明するための概略図
、第2図は従来の電子部品装着装置における動作
工程を説明するための概略図である。
図において、1……電子部品、2……爪、3…
…ノズル、4……ヘツド、5……電子部品供給部
、6……小孔、7……接着剤、8……矢印、9…
…プリント基板、10……検出器、11……制御
装置である。なお、各図中、同一符号は同一、又
は相当部分を示す。
FIG. 1 is a schematic diagram for explaining the operating process of an electronic component mounting apparatus which is an embodiment of this invention, and FIG. 2 is a schematic diagram for explaining the operating process of a conventional electronic component mounting apparatus. In the figure, 1...electronic component, 2...claw, 3...
... Nozzle, 4 ... Head, 5 ... Electronic component supply section, 6 ... Small hole, 7 ... Adhesive, 8 ... Arrow, 9 ...
...Printed circuit board, 10...detector, 11...control device. In each figure, the same reference numerals indicate the same or equivalent parts.
Claims (1)
に仮固定する電子部品装着装置において、電子部
品に塗布した接着剤の有無を検出する検出器を備
えたことを特徴とする電子部品装着装置。 (2) 前記検出器は、電子部品に塗布された接着
剤の膜厚を検出することを特徴とする実用新案登
録請求の範囲第1項記載の電子部品装着装置。[Scope of Claim for Utility Model Registration] (1) An electronic component mounting device that temporarily fixes electronic components onto a printed circuit board using adhesive, which is equipped with a detector that detects the presence or absence of adhesive applied to electronic components. An electronic component mounting device featuring: (2) The electronic component mounting apparatus according to claim 1, wherein the detector detects the film thickness of an adhesive applied to the electronic component.
Priority Applications (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP13453585U JPS6242281U (en) | 1985-09-03 | 1985-09-03 |
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP13453585U JPS6242281U (en) | 1985-09-03 | 1985-09-03 |
Publications (1)
Publication Number | Publication Date |
---|---|
JPS6242281U true JPS6242281U (en) | 1987-03-13 |
Family
ID=31035863
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
JP13453585U Pending JPS6242281U (en) | 1985-09-03 | 1985-09-03 |
Country Status (1)
Country | Link |
---|---|
JP (1) | JPS6242281U (en) |
Cited By (3)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPH01150717A (en) * | 1987-12-08 | 1989-06-13 | Rinnai Corp | Combustion device |
JPH0250021A (en) * | 1988-08-11 | 1990-02-20 | Matsushita Electric Ind Co Ltd | Control device for heater |
WO2015019447A1 (en) * | 2013-08-07 | 2015-02-12 | 富士機械製造株式会社 | Electronic component mounting machine and transfer confirmation method |
-
1985
- 1985-09-03 JP JP13453585U patent/JPS6242281U/ja active Pending
Cited By (5)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPH01150717A (en) * | 1987-12-08 | 1989-06-13 | Rinnai Corp | Combustion device |
JPH0250021A (en) * | 1988-08-11 | 1990-02-20 | Matsushita Electric Ind Co Ltd | Control device for heater |
WO2015019447A1 (en) * | 2013-08-07 | 2015-02-12 | 富士機械製造株式会社 | Electronic component mounting machine and transfer confirmation method |
EP3032933A4 (en) * | 2013-08-07 | 2016-09-14 | Fuji Machine Mfg | Electronic component mounting machine and transfer confirmation method |
JPWO2015019447A1 (en) * | 2013-08-07 | 2017-03-02 | 富士機械製造株式会社 | Electronic component mounting machine and transfer confirmation method |
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