JPS5840866U - Mounting structure of circuit components - Google Patents
Mounting structure of circuit componentsInfo
- Publication number
- JPS5840866U JPS5840866U JP13418681U JP13418681U JPS5840866U JP S5840866 U JPS5840866 U JP S5840866U JP 13418681 U JP13418681 U JP 13418681U JP 13418681 U JP13418681 U JP 13418681U JP S5840866 U JPS5840866 U JP S5840866U
- Authority
- JP
- Japan
- Prior art keywords
- mounting structure
- circuit components
- circuit component
- wiring board
- printed wiring
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
Landscapes
- Electric Connection Of Electric Components To Printed Circuits (AREA)
- Structures For Mounting Electric Components On Printed Circuit Boards (AREA)
Abstract
(57)【要約】本公報は電子出願前の出願データであるた
め要約のデータは記録されません。(57) [Summary] This bulletin contains application data before electronic filing, so abstract data is not recorded.
Description
第１図は従来例を示す縦断面図、第２図は第１図に接着
剤を塗布した状態を示す縦断面図、第３図は本考案の１
実施例である接着剤を塗布した状態を示す縦断面図であ
る。
１・・・印刷配線板、２・・・半田付はランド、３・・
・ディスクリート部品、５・・・回路部品、６・・・接
着剤。Fig. 1 is a vertical cross-sectional view showing the conventional example, Fig. 2 is a longitudinal cross-sectional view showing the state in which adhesive is applied to Fig. 1, and Fig. 3 is a vertical cross-sectional view showing the conventional example.
FIG. 3 is a longitudinal cross-sectional view showing a state in which an adhesive according to an example is applied. 1...Printed wiring board, 2...Soldering land, 3...
・Discrete parts, 5...Circuit parts, 6...Adhesive.
Claims (1)
品を装着する回路部品の装着構造において、接着剤が塗
布された前記回路部品を押圧して前記印刷配線板の所定
個所に接着するように構成したことを特徴とする回路部
品の装着構造。In a circuit component mounting structure in which a circuit component is mounted near a soldering land formed on a printed wiring board, the circuit component coated with an adhesive is pressed and adhered to a predetermined location on the printed wiring board. A mounting structure for circuit components characterized by the following structure.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP13418681U JPS5840866U (en) | 1981-09-11 | 1981-09-11 | Mounting structure of circuit components |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP13418681U JPS5840866U (en) | 1981-09-11 | 1981-09-11 | Mounting structure of circuit components |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| JPS5840866U true JPS5840866U (en) | 1983-03-17 |
Family
ID=29927619
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP13418681U Pending JPS5840866U (en) | 1981-09-11 | 1981-09-11 | Mounting structure of circuit components |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPS5840866U (en) |
-
1981
- 1981-09-11 JP JP13418681U patent/JPS5840866U/en active Pending
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