JP3244990B2 - Manufacturing method of printed wiring board - Google Patents
Manufacturing method of printed wiring boardInfo
- Publication number
- JP3244990B2 JP3244990B2 JP3959095A JP3959095A JP3244990B2 JP 3244990 B2 JP3244990 B2 JP 3244990B2 JP 3959095 A JP3959095 A JP 3959095A JP 3959095 A JP3959095 A JP 3959095A JP 3244990 B2 JP3244990 B2 JP 3244990B2
- Authority
- JP
- Japan
- Prior art keywords
- resin
- wiring board
- printed wiring
- manufacturing
- insulating resin
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired - Fee Related
Links
Classifications
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/10—Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern
- H05K3/18—Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern using precipitation techniques to apply the conductive material
- H05K3/181—Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern using precipitation techniques to apply the conductive material by electroless plating
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/38—Improvement of the adhesion between the insulating substrate and the metal
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/46—Manufacturing multilayer circuits
- H05K3/4644—Manufacturing multilayer circuits by building the multilayer layer by layer, i.e. build-up multilayer circuits
Landscapes
- Manufacturing Of Printed Wiring (AREA)
- Production Of Multi-Layered Print Wiring Board (AREA)
Description
【０００１】[0001]
【産業上の利用分野】本発明は、プリント配線板の製造
方法に係り、特に、プリント配線板における絶縁層に用
いる樹脂と、配線に用いる金属との密着力の向上を図る
プリント配線板の製造方法に関するものである。BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to a method for manufacturing a printed wiring board, and more particularly to a method for manufacturing a printed wiring board for improving the adhesion between a resin used for an insulating layer in a printed wiring board and a metal used for wiring. It is about the method.
【０００２】[0002]
【従来の技術】従来、信号配線層と絶縁樹脂層を順次積
み上げるビルドアップ工程によるプリント配線板におい
ては、絶縁樹脂を基板上に塗布し加熱により硬化させ
る。この後、絶縁樹脂表面を過マンガン酸処理液で粗化
し、その凹凸により無電解めっきとのアンカー効果が現
れ、絶縁樹脂と金属配線（信号配線）との密着強度を得
るようにしていた。2. Description of the Related Art Conventionally, in a printed wiring board by a build-up process in which a signal wiring layer and an insulating resin layer are sequentially stacked, an insulating resin is applied on a substrate and cured by heating. Thereafter, the surface of the insulating resin is roughened with a permanganic acid treatment solution, and the irregularities have an anchor effect with the electroless plating, so that the adhesive strength between the insulating resin and the metal wiring (signal wiring) is obtained.
【０００３】[0003]
【発明が解決しようとする課題】しかしながら、以上述
べた従来のプリント配線板の製造方法では、絶縁樹脂を
塗布・硬化させた後に、絶縁樹脂表面を処理液で粗化す
る方式であるため、硬化後強固な膜となる他の熱可塑性
樹脂や熱硬化性樹脂で、微細な凹凸面を得ることのでき
る処理液がない場合、めっきやスパッタなどによる金属
膜との十分な密着力が得られず、従って種々の特性に優
れた樹脂をビルドアップ工法によるプリント配線板に適
用することが困難であるという問題点があった。However, in the above-described conventional method for manufacturing a printed wiring board, since the insulating resin is applied and cured, the surface of the insulating resin is roughened with a treatment liquid. If there is no processing liquid that can obtain a fine uneven surface with other thermoplastic resin or thermosetting resin that becomes a strong film afterwards, sufficient adhesion to the metal film by plating or sputtering cannot be obtained Therefore, there is a problem that it is difficult to apply a resin having various characteristics to a printed wiring board by a build-up method.
【０００４】本発明は、上記問題点を解決するために、
絶縁樹脂と金属配線との密着強度を向上し得るプリント
配線板の製造方法を提供することを目的とする。The present invention has been made to solve the above problems.
An object of the present invention is to provide a method of manufacturing a printed wiring board that can improve the adhesion strength between an insulating resin and metal wiring.
【０００５】[0005]
【課題を解決するための手段】本発明は、上記目的を達
成するために、 （１）金属配線層と絶縁樹脂層を順次積み上げるビルド
アップ工法によるプリント配線板の製造方法において、
絶縁樹脂を塗布し、半硬化状態とした後、樹脂表面を粗
化する工程と、前記絶縁樹脂表面に金属膜としてカレン
トフィルムを形成する工程と、前記絶縁樹脂を硬化が進
んだ状態にする工程と、前記カレントフィルム上に金属
配線層を形成する工程と、前記絶縁樹脂を完全硬化させ
る工程とを順次施すことを特徴とする。According to the present invention, there is provided a method of manufacturing a printed wiring board by a build-up method in which a metal wiring layer and an insulating resin layer are sequentially stacked.
A step of applying an insulating resin to a semi-cured state and thereafter roughening the resin surface, a step of forming a current film as a metal film on the surface of the insulating resin, and a step of curing the insulating resin And a step of forming a metal wiring layer on the current film and a step of completely curing the insulating resin.
【０００６】（２）上記（１）記載のプリント配線板の
製造方法において、前記絶縁樹脂が熱可塑性もしくは熱
硬化性樹脂であること特徴とする。[0006] (2) In the manufacturing method of the above (1) Symbol placement of the printed wiring board, wherein said insulating resin is a thermoplastic or thermosetting resin.
【０００７】（３）上記（１）記載のプリント配線板の
製造方法において、前記絶縁樹脂がビスマレイミド成分
もしくはトリアジン成分のいずれかを含む熱硬化性樹脂
であることを特徴とする。[0007] (3) In the manufacturing method of the above (1) Symbol placement of the printed wiring board, wherein said insulating resin is a thermosetting resin containing any of bismaleimide component or triazine component.
【０００８】（４）上記（１）記載のプリント配線板の
製造方法において、前記粗化処理が、過マンガン酸系処
理液によって行われることを特徴とする。[0008] (4) In the manufacturing method of the above (1) Symbol placement of the printed wiring board, wherein the roughening treatment, characterized by being performed by permanganate acid treatment solution.
【０００９】（５）上記（１）記載のプリント配線板の
製造方法において、前記粗化処理が、バフ研磨処理後に
過マンガン酸系処理液によって行われることを特徴とす
るプリント配線板の製造方法。[0009] (5) In the manufacturing method of the above (1) Symbol placement of the printed wiring board, wherein the roughening treatment, a printed wiring board which comprises carrying out the permanganate-based treatment solution after buffing treatment preparation Method.
【００１０】[0010]
【作用】請求項１記載のプリント配線板の製造方法によ
れば、半硬化状態とした樹脂（第１段階）上にカレント
フィルムを形成した時点で、樹脂の硬化を半分程度進め
る（第２段階）ようにし、かつ配線パターンを形成し終
えた後に、樹脂の完全硬化を行う（第３段階）ようにし
たので、形成しようとする配線パターンが微細で、また
層間接続部を有する基板である場合などは、樹脂硬化時
に起こる樹脂のゲル化から硬化迄の樹脂流れの影響を受
けることがなくなる。また、樹脂の硬化を３段階に進め
るようにしたので、硬化に伴って、残留溶剤分の揮発が
起こる樹脂においては、有効なガス出し方法の一つにな
るので、樹脂と金属膜との界面剥離を防ぐことができ
る。According to the production process of the action printed wiring board according to claim 1, wherein, when the above resin was semi-cured state (stage 1) to form a current film advances about the curing of the resin half (second stage ) , And after completing the formation of the wiring pattern, the resin is completely cured (third stage), so that the wiring pattern to be formed is a fine substrate having an interlayer connection portion. Is not affected by the resin flow from the gelling of the resin to the curing which occurs during the curing of the resin. Further, since the <br/> so that advances the curing of the resin in three stages, with the curing, in the resin evaporation of residual solvent content occurs, since the one of the effective degassing method, the resin Separation between the metal and the metal film can be prevented.
【００１１】[0011]
【実施例】以下、本発明の実施例について図を参照しな
がら詳細に説明する。DESCRIPTION OF THE PREFERRED EMBODIMENTS Embodiments of the present invention will be described below in detail with reference to the drawings.
【００１２】図１は本発明の第１実施例を示すプリント
配線板の製造工程断面図である。FIG. 1 is a cross-sectional view showing a manufacturing process of a printed wiring board according to a first embodiment of the present invention.
【００１３】（１）まず、図１（ａ）に示すように、ベ
ースとなる基板１１（ガラスクロス含浸ビスマレイミド
トリアジン基板、厚さ０．９ｍｍ）上に、銅箔１２を接
着する。(1) First, as shown in FIG. 1A, a copper foil 12 is bonded on a substrate 11 (bismaleimide triazine substrate impregnated with glass cloth, thickness 0.9 mm) as a base.
【００１４】（２）次いで、図１（ｂ）に示すように、
その銅箔１２上に、スピンコーティングにより、有機金
属触媒０．７容積（ｖｏｌ）％を添加したビスマレイミ
ドトリアジン樹脂（以下、ＢＴ樹脂）（三菱ガス化学社
製、Ｔｇ＝２４０℃）１３を塗布し、８０℃で３０分
間、続いて１６０℃で１５分間乾燥させ、ＢＴ樹脂１３
を半硬化状態とした。(2) Next, as shown in FIG.
Bismaleimide triazine resin (BT resin) (Mitsubishi Gas Chemical Co., Ltd., Tg = 240 ° C.) 13 containing 0.7 volume% of organometallic catalyst is applied on the copper foil 12 by spin coating. And dried at 80 ° C. for 30 minutes and then at 160 ° C. for 15 minutes.
In a semi-cured state.
【００１５】（３）次いで、図１（ｃ）に示すように、
ＢＴ樹脂１３表面をバフ研磨により極薄く研磨した後、
過マンガン酸系処理液でＢＴ樹脂１３表面を粗化する。(3) Next, as shown in FIG.
After polishing the surface of the BT resin 13 very thinly by buffing,
The surface of the BT resin 13 is roughened with a permanganate treatment liquid.
【００１６】（４）次いで、図１（ｄ）に示すように、
この基板に対して無電解銅めっきプロセス（シプレイ社
製）により、厚さ１μｍ以下のカレントフィルム１４を
形成する。(4) Next, as shown in FIG.
A current film 14 having a thickness of 1 μm or less is formed on the substrate by an electroless copper plating process (manufactured by Shipley).
【００１７】（５）次に、図１（ｅ）に示すように、窒
素雰囲気下１２０℃で３０分間乾燥し、電解銅めっきに
より基板全面に対して厚さ１８μｍの銅厚付けを行い、
配線１５に相当する部分とする。(5) Next, as shown in FIG. 1 (e), the substrate is dried at 120 ° C. for 30 minutes in a nitrogen atmosphere, and a 18 μm-thick copper film is formed on the entire surface of the substrate by electrolytic copper plating.
This is a portion corresponding to the wiring 15.
【００１８】（６）この後、図１（ｆ）に示すように、
８０℃で３０分間、続いて１２０℃で１時間、続いて２
１０℃で２時間のポストキュアを行い、半硬化状態であ
ったＢＴ樹脂１３を完全硬化させた。(6) Thereafter, as shown in FIG.
30 minutes at 80 ° C., then 1 hour at 120 ° C., followed by 2 hours
Post-curing was performed at 10 ° C. for 2 hours to completely cure the semi-cured BT resin 13.
【００１９】作製したプリント配線板のＢＴ樹脂とめっ
き膜との密着性を確認するため、厚付けしためっき膜
を、エッチングにより長方形（幅１０ｍｍ、長さ５０ｍ
ｍ) のパターンとして、パターン端部から垂直方向に速
度５０ｍｍ／分で引き剥がす方法で、銅箔引き剥がし強
度を測定した。In order to confirm the adhesion between the BT resin and the plating film of the produced printed wiring board, the thick plating film was etched into a rectangular (width 10 mm, length 50 m) by etching.
As the pattern m), the copper foil peeling strength was measured by a method of peeling off from the end of the pattern in the vertical direction at a speed of 50 mm / min.
【００２０】その結果を表１に示す。The results are shown in Table 1.
【００２１】[0021]
【表１】 この表１に示すように、実施例Ｎｏ．１、つまり、半硬
化後、樹脂粗化処理有りの場合は、銅引き剥がし強度
は、５６０（ｇ／ｃｍ）、実施例Ｎｏ．２、つまり、半
硬化後、樹脂粗化処理なしの場合は、銅引き剥がし強度
は、３６０（ｇ／ｃｍ）、従来例では銅引き剥がし強度
は、４０（ｇ／ｃｍ）である。[Table 1] As shown in Table 1, Example No. 1, that is, in the case where the resin was roughened after semi-curing, the copper peeling strength was 560 (g / cm). 2, in other words, after semi-curing, without the resin roughening treatment, the copper peel strength is 360 (g / cm), and in the conventional example, the copper peel strength is 40 (g / cm).
【００２２】このように、樹脂を半硬化状態にすること
により、銅箔との密着力を大幅に向上させることができ
る。As described above, by bringing the resin into a semi-cured state, the adhesion to the copper foil can be greatly improved.
【００２３】第１実施例では、絶縁樹脂としてＢＴ樹脂
を用いたものについて述べたものであるが、これに限定
されるものではなく、半硬化状態を保つことのできる全
ての樹脂を適用することが可能である。また、配線とす
る金属はめっき法だけでなくスパッタなどによる方法を
含め、すべての膜の形成方法が適用可能である。更に、
硬化のために触媒を必要とする樹脂では、触媒添加量を
減らすことにより、樹脂のゲルタイムが長くなり、結果
としてより高い密着力を得ることができる。In the first embodiment, the case where the BT resin is used as the insulating resin has been described. However, the present invention is not limited to this, and all resins capable of maintaining a semi-cured state can be applied. Is possible. In addition, not only a plating method but also a method of forming a film can be applied to a metal used as a wiring, including a method by sputtering or the like. Furthermore,
For a resin that requires a catalyst for curing, reducing the amount of catalyst added increases the gel time of the resin, resulting in higher adhesion.
【００２４】次に、本発明の第２実施例について説明す
る。Next, a second embodiment of the present invention will be described.
【００２５】図２は本発明の第２実施例を示すプリント
配線板の製造工程断面図である。FIG. 2 is a sectional view showing a manufacturing process of a printed wiring board according to a second embodiment of the present invention.
【００２６】（１）まず、図２（ａ）に示すように、基
板２１上に銅箔２２を接着し、その上にＢＴ樹脂２３を
塗布・半硬化させ、バフ研磨処理、過マンガン酸系処理
液での樹脂表面粗化後、無電解銅めっきでカレントフィ
ルム２４を形成する。ここまでは、第１実施例と同様で
ある。(1) First, as shown in FIG. 2A, a copper foil 22 is adhered on a substrate 21, a BT resin 23 is applied and semi-cured thereon, a buffing treatment, a permanganate-based After the resin surface is roughened with the treatment liquid, the current film 24 is formed by electroless copper plating. Up to this point, the operation is the same as in the first embodiment.
【００２７】（２）次に、図２（ｂ）に示すように、窒
素雰囲気下１２０℃で３０分間乾燥し、続いて１８０℃
で１時間の熱処理を行い、ＢＴ樹脂２３を半硬化状態か
ら樹脂硬化が半分程度進んだ状態にする。(2) Next, as shown in FIG. 2B, drying is performed at 120 ° C. for 30 minutes in a nitrogen atmosphere, and then at 180 ° C.
Heat treatment for one hour to bring the BT resin 23 into a state in which the resin curing has advanced about half from the semi-cured state.
【００２８】（３）次に、図２（ｃ）に示すように、感
光性レジストのホトリソ工程を行い、配線の必要な部位
以外のカレントフィルム２４上をめっきレジスト２５で
覆った後、パターニングする。(3) Next, as shown in FIG. 2C, a photosensitive resist photolithography process is performed to cover the current film 24 other than the area where wiring is required with the plating resist 25 and then patterning. .
【００２９】（４）次いで、図２（ｄ）に示すように、
例えば、電解銅めっきによって配線パターン２６を形成
する。(4) Next, as shown in FIG.
For example, the wiring pattern 26 is formed by electrolytic copper plating.
【００３０】（５）次に、図２（ｅ）に示すように、め
っきレジスト２５を剥離する。(5) Next, as shown in FIG. 2E, the plating resist 25 is peeled off.
【００３１】（６）次いで、図２（ｆ）に示すように、
完全硬化していないＢＴ樹脂２３を２１０℃で２時間の
ポストキュアで完全硬化させた。(6) Next, as shown in FIG.
The BT resin 23 that was not completely cured was completely cured by a post cure at 210 ° C. for 2 hours.
【００３２】（７）次に、図２（ｇ）に示すように、配
線パターン２６が接している以外のカレントフィルム２
４をエッチングにより除去し、ＢＴ樹脂２３上に密着の
良い配線パターン２６を持つプリント配線板を得た。(7) Next, as shown in FIG. 2 (g), the current film 2 except the wiring pattern 26 is in contact therewith.
4 was removed by etching to obtain a printed wiring board having a wiring pattern 26 with good adhesion on the BT resin 23.
【００３３】第１及び第２実施例ではカレントフィルム
形成のために、無電解銅めっきを用いた例を示したが、
本発明はこれに限定させるものではない。即ち、ドライ
系のスパッタリングなどの成膜装置によりカレントフィ
ルムを形成することも可能であり、かつ必ずしも銅であ
る必要はない。In the first and second embodiments, an example is shown in which electroless copper plating is used for forming a current film.
The present invention is not limited to this. That is, the current film can be formed by a film forming apparatus such as dry sputtering, and it is not always necessary to use copper.
【００３４】また、樹脂の半硬化状態化は、樹脂硬化が
進んでいる必要は必ずしもなく、単に樹脂を溶かし込ん
でいる溶剤を揮発させることによっても目的は達成でき
る。The semi-cured state of the resin does not necessarily have to be advanced, but the purpose can be achieved simply by volatilizing the solvent in which the resin is dissolved.
【００３５】なお、本発明は上記実施例に限定されるも
のではなく、本発明の趣旨に基づき種々の変形が可能で
あり、それらを本発明の範囲から排除するものではな
い。It should be noted that the present invention is not limited to the above embodiment, and various modifications are possible based on the spirit of the present invention, and these are not excluded from the scope of the present invention.
【００３６】[0036]
【発明の効果】以上、詳細に説明したように、本発明に
よれば、以下のような効果を奏することができる。As described above, according to the present invention, the following effects can be obtained.
【００３７】（１）請求項１記載の発明によれば、半硬
化状態（第１段階）とした樹脂上にカレントフィルムを
形成した時点で、樹脂の硬化を半分程度進める（第２段
階）ようにし、かつ配線パターンを形成し終えた後に、
樹脂の完全硬化を行う（第３段階）ようにしたので、形
成しようとする配線パターンが微細で、また層間接続部
を有する基板である場合などは、樹脂硬化時に起こる樹
脂のゲル化から硬化迄の樹脂流れの影響を受けることが
なくなる。また、樹脂の硬化を３段階に進めるようにし
たので、硬化に伴って、残留溶剤分の揮発が起こる樹脂
においては、有効なガス出し方法の一つになるので、樹
脂と金属膜との界面剥離を防ぐことができる。 (1) According to the first aspect of the invention, when the current film is formed on the resin in the semi-cured state (first stage) , the curing of the resin is advanced by about half (second stage)
Floor) , and after finishing the wiring pattern,
Since the resin is completely cured (third stage), in the case where the wiring pattern to be formed is fine and the substrate has an interlayer connection part, from gelling to curing of the resin which occurs during resin curing. No longer affected by the resin flow. Further, since the advance the curing of the resin in three stages, with the curing, in the resin evaporation of residual solvent content occurs, since the one of the effective degassing method, the resin and the metal film Interfacial peeling can be prevented.
【図面の簡単な説明】[Brief description of the drawings]
【図１】本発明の第１実施例を示すプリント配線板の製
造工程断面図である。FIG. 1 is a cross-sectional view illustrating a process of manufacturing a printed wiring board according to a first embodiment of the present invention.
【図２】本発明の第２実施例を示すプリント配線板の製
造工程断面図である。FIG. 2 is a sectional view showing a manufacturing process of a printed wiring board according to a second embodiment of the present invention.
１１，２１ 基板 １２，２２ 銅箔 １３，２３ ビスマレイミドトリアジン樹脂（ＢＴ樹
脂） １４，２４ カレントフィルム １５ 配線（金属配線層） ２５ めっきレジスト ２６ 配線パターン11, 21 Substrate 12, 22 Copper foil 13, 23 Bismaleimide triazine resin (BT resin) 14, 24 Current film 15 Wiring (metal wiring layer) 25 Plating resist 26 Wiring pattern
───────────────────────────────────────────────────── フロントページの続き (72)発明者 烏野 ゆたか 東京都港区虎ノ門１丁目７番12号 沖電 気工業株式会社内 (72)発明者 板谷 哲 新潟県上越市福田町１番地 沖プリンテ ッドサーキット株式会社内 (56)参考文献 特開 平７−170070（ＪＰ，Ａ) 特開 平６−260763（ＪＰ，Ａ) 特開 平３−171794（ＪＰ，Ａ) (58)調査した分野(Int.Cl.7，ＤＢ名) H05K 3/46 H05K 3/38 ──────────────────────────────────────────────────続 き Continued on the front page (72) Inventor Yutaka Karasuno 1-7-12 Toranomon, Minato-ku, Tokyo Oki Electric Industry Co., Ltd. (56) References JP-A-7-170070 (JP, A) JP-A-6-260763 (JP, A) JP-A-3-171794 (JP, A) (58) Fields investigated (Int) .Cl. 7 , DB name) H05K 3/46 H05K 3/38
Claims (5)
るビルドアップ工法によるプリント配線板の製造方法に
おいて、 （ａ）絶縁樹脂を塗布し、半硬化状態とした後、樹脂表
面を粗化する工程と、 （ｂ）前記絶縁樹脂表面に金属膜としてカレントフィル
ムを形成する工程と、 （ｃ）前記絶縁樹脂を硬化が進んだ状態にする工程と、 （ｄ）前記カレントフィルム上に金属配線層を形成する
工程と、 （ｅ）前記絶縁樹脂を完全硬化させる工程とを順次施す
ことを特徴とするプリント配線板の製造方法。1. A method of manufacturing a printed wiring board by a build-up method in which a metal wiring layer and an insulating resin layer are sequentially stacked. (A) a step of applying an insulating resin to a semi-cured state and then roughening the resin surface; (B) a step of forming a current film as a metal film on the surface of the insulating resin; (c) a step of hardening the insulating resin; and (d) forming a metal wiring layer on the current film. Forming a printed wiring board; and (e) completely curing the insulating resin.
法において、前記絶縁樹脂が熱可塑性もしくは熱硬化性
樹脂であること特徴とするプリント配線板の製造方法。2. A process according to claim 1 Symbol mounting of the printed wiring board, method of manufacturing the printed wiring board, wherein said insulating resin is a thermoplastic or thermosetting resin.
法において、前記絶縁樹脂がビスマレイミド成分もしく
はトリアジン成分のいずれかを含む熱硬化性樹脂である
ことを特徴とするプリント配線板の製造方法。3. The method for manufacturing a printed wiring board according to claim 1 , wherein the insulating resin is a thermosetting resin containing either a bismaleimide component or a triazine component. .
法において、前記粗化処理が、過マンガン酸系処理液に
よって行われることを特徴とするプリント配線板の製造
方法。4. The method for manufacturing a printed wiring board according to claim 1, wherein the roughening treatment is performed using a permanganate-based treatment liquid.
法において、前記粗化処理が、バフ研磨処理後に過マン
ガン酸系処理液によって行われることを特徴とするプリ
ント配線板の製造方法。5. A process according to claim 1 Symbol mounting of the printed wiring board, wherein the roughening treatment, a method for manufacturing a printed wiring board, characterized in that it is performed after buffing treatment by permanganate-based treatment solution.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP3959095A JP3244990B2 (en) | 1995-02-28 | 1995-02-28 | Manufacturing method of printed wiring board |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP3959095A JP3244990B2 (en) | 1995-02-28 | 1995-02-28 | Manufacturing method of printed wiring board |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| JPH08236933A JPH08236933A (en) | 1996-09-13 |
| JP3244990B2 true JP3244990B2 (en) | 2002-01-07 |
Family
ID=12557325
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP3959095A Expired - Fee Related JP3244990B2 (en) | 1995-02-28 | 1995-02-28 | Manufacturing method of printed wiring board |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JP3244990B2 (en) |
-
1995
- 1995-02-28 JP JP3959095A patent/JP3244990B2/en not_active Expired - Fee Related
Also Published As
| Publication number | Publication date |
|---|---|
| JPH08236933A (en) | 1996-09-13 |
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