JPS623939A - Composite metallic plate - Google Patents
Composite metallic plateInfo
- Publication number
- JPS623939A JPS623939A JP14341085A JP14341085A JPS623939A JP S623939 A JPS623939 A JP S623939A JP 14341085 A JP14341085 A JP 14341085A JP 14341085 A JP14341085 A JP 14341085A JP S623939 A JPS623939 A JP S623939A
- Authority
- JP
- Japan
- Prior art keywords
- copper
- metal plate
- composite metal
- plating layer
- layer
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
Landscapes
- Cooling Or The Like Of Electrical Apparatus (AREA)
- Cooling Or The Like Of Semiconductors Or Solid State Devices (AREA)
- Laminated Bodies (AREA)
Abstract
(57)【要約】本公報は電子出願前の出願データであるた
め要約のデータは記録されません。(57) [Summary] This bulletin contains application data before electronic filing, so abstract data is not recorded.
Description
【発明の詳細な説明】
〔産業上の利用分野〕
本発明は、セラミック製のプリント板に接着して熱放散
を有効になし得るヒートシンク等に利用し得る複合金属
板に関する。DETAILED DESCRIPTION OF THE INVENTION [Field of Industrial Application] The present invention relates to a composite metal plate that can be used as a heat sink or the like that can be bonded to a ceramic printed board to effectively dissipate heat.
種々の電子機器においてはヒートシンクとして機能する
金属板に種々の半導体装置或いはプリント板をハンダ付
けすることとして、良好な放、熱性と、実装時又は保守
時の便宜性を高めている上記金属板としては銅板が用い
られてきたが、軽量化及び低廉化を目的として銅板に替
えてアルミニウムを基板とし、その表層に銅被膜を形成
した複合金属板を用いることが行われている。 □こ
の複合金属板は例えば特開昭４８−８１７３９号に係る
方法にて製造されるものであり、アルミニウム板の表面
に塩化銅を散布付着し、これを塩化アルミニウムの昇華
現象が起こる温度以上に加熱した後、冷却してアルミニ
ウム表面に銅を拡散浸透させて製造される。斯かる複合
金属板（以下従来品という）によってヒートシンク金属
板の軽量化、低廉化の目的は一応は達成できる。In various electronic devices, various semiconductor devices or printed circuit boards are soldered to a metal plate that functions as a heat sink, and the above-mentioned metal plate improves good radiation, heat properties, and convenience during mounting and maintenance. Copper plates have been used in the past, but in order to reduce weight and cost, a composite metal plate with an aluminum substrate and a copper coating formed on the surface layer has been used instead of the copper plate. □This composite metal plate is manufactured by, for example, the method disclosed in JP-A No. 48-81739, in which copper chloride is sprayed onto the surface of an aluminum plate and heated to a temperature higher than the temperature at which the sublimation phenomenon of aluminum chloride occurs. It is manufactured by heating and then cooling to diffuse and infiltrate copper into the aluminum surface. With such a composite metal plate (hereinafter referred to as a conventional product), the objectives of reducing the weight and cost of a heat sink metal plate can be achieved to a certain extent.
ところで上記方法により複合金属板を製造した場合は、
その基板たるアルミニウムが、銅の被膜形成の際の加熱
（４５０〜４８０℃）及びそれに続く冷却によって焼な
ましされたものとなっている。By the way, when a composite metal plate is manufactured by the above method,
The aluminum substrate is annealed by heating (450 to 480° C.) and subsequent cooling during the formation of the copper film.
このため該複合金属板のヒートシンクに例えば各種の半
導体装置、部品を実装する際、又はこのヒートシンクを
ケーシング等に固定する際等において、ヒートシンクが
容易に撓むという不具合があリ、このためこれに例えば
セラミック製の剛性の高いプリン１−板を実装した場合
にはプリント板がその撓みに追随し得す、テリント板が
割れるとい・ □う事故が発生していた。For this reason, when mounting various semiconductor devices and components on the heat sink of the composite metal plate, or when fixing this heat sink to a casing, etc., there is a problem that the heat sink easily bends. For example, when a highly rigid printing board made of ceramic is mounted, the printed board may follow the deflection, causing accidents such as cracking of the printed board.
本発明は斯かる事情に鑑みてなされたものであり、高強
度アルミチウムを基板として用い、この表面に電気メッ
キして銅メンキ屓、ニッケルメッキ層を順次形成せしめ
た構成とすることにより、撓みによる不都合を生しるこ
とのない複合金属板を提供することを目的とする。The present invention has been made in view of the above circumstances, and has a structure in which high-strength aluminum is used as a substrate, and a copper coating layer and a nickel plating layer are successively formed on the surface of the substrate by electroplating. The purpose is to provide a composite metal plate that does not cause any inconvenience.
本発明に係る複合金属板は、高強度アルミニウムの基板
の表面に電気メッキによる銅メッキ層及びニッケルメッ
キ層が基板側からこの順に形成せしめられていることを
特徴とする。The composite metal plate according to the present invention is characterized in that a copper plating layer and a nickel plating layer are formed in this order from the substrate side by electroplating on the surface of a high-strength aluminum substrate.
〔実施例〕
以下本発明をヒートシンクに適用した場合の実施例を示
す図面に基づいて詳述する。[Example] Hereinafter, an example in which the present invention is applied to a heat sink will be described in detail based on the drawings.
図面において１０は複合金属板であって、厚さ１〜５ｆ
ｌ程度の高強度アルミニウムからなる基板１１の一面に
３〜２０μｍ厚の銅メッキ層］２及び２〜６μｍ厚のニ
ッケルメッキ層１３を積層形成してなるものである。In the drawing, 10 is a composite metal plate with a thickness of 1 to 5 f.
A copper plating layer 12 with a thickness of 3 to 20 .mu.m and a nickel plating layer 13 with a thickness of 2 to 6 .mu.m are laminated on one surface of a substrate 11 made of high-strength aluminum.
高強度アルミニウムの基板１１としては、引張強度 ２
０ ｋｇ ／ ＋ｎ ２以上（又は程度）耐力 １
５ｋｇ／＊＊２以上（又は程度）伸び ２０％
以下（又は程度）の如き仕様のものを用いる。そして
この複合金属板は素材のアルミニウムのストリップを銅
及びニッケルのメッキ槽へ順次送給し、そこで電気メッ
キする連続法にて製造されたものを通人に切断して製造
される。実施例に示すものは片面に銅、ニッケルのメッ
キ［１２，１３を形成しているが、両面に形成してもよ
い。なおニッケルメッキ層１３は銅メッキＭ１２の酸化
を防止して美観を維持するために、またハンダ付けを容
易にするために形成せしめている。The high-strength aluminum substrate 11 has a tensile strength of 2
0 kg / +n 2 or more (or degree) proof stress 1
5kg/**2 or more (or degree) growth 20%
Use the following specifications (or degrees). This composite metal plate is produced by sequentially feeding aluminum strips into a copper and nickel plating bath, and then electroplating them there, followed by manual cutting. In the example shown, copper and nickel plating [12, 13 are formed on one side, but they may be plated on both sides. The nickel plating layer 13 is formed to prevent oxidation of the copper plating M12 to maintain its aesthetic appearance and to facilitate soldering.
２０はセラミック製のプリント板であり、セラミック板
本体２１の下面ばハンダ付けのためにメタライジング被
ＩＩ！２２が施されており、セラミック板本体２］の上
面には、全面に亘って被着されていた銅層を所定バクー
ンに食刻してなる銅配線層２３が形成されている。この
ようなプリント板２０はヒートシンク１０のニッケルメ
ッキ層１３とメクライジング被膜２２とをハンダ付け３
１する方法で接着されている。 ゛
プリント板２０の銅配線層２３上には抵抗、コンデンサ
等の回路構成部品３５がハンダ付け３６され、また集積
回路チップ等の半導体装置３４がハンダ付け３６されて
いる。また他の回路部分への配線のためのボンディング
バンド４０がハンダ付け３６されている。このボンディ
ングバンド４０はアルミニウムの基板の片面に銅、ハン
ダのメッキ層を形成したものである。20 is a ceramic printed board, and the lower surface of the ceramic board body 21 is metallized for soldering. A copper wiring layer 23 is formed on the upper surface of the ceramic plate main body 2 by etching a copper layer deposited over the entire surface into a predetermined shape. Such a printed circuit board 20 is manufactured by soldering 3 the nickel plating layer 13 and meclizing coating 22 of the heat sink 10.
It is attached using the method described in 1. Circuit components 35 such as resistors and capacitors are soldered 36 onto the copper wiring layer 23 of the printed board 20, and semiconductor devices 34 such as integrated circuit chips are also soldered 36. Further, a bonding band 40 for wiring to other circuit parts is soldered 36. This bonding band 40 is formed by forming a copper and solder plating layer on one side of an aluminum substrate.
その他５１は半導体装置であり、ヒートシンク１０上に
ハンダ付け３１されたヒートスプレッダ５０上にハンダ
付け３６されている。このヒートスプレッダ５０ば、ヒ
ートシンク１０と同様にアルミニウムの基板上に銅、ハ
ンダのメッキ層を形成したものである。（但し、両面形
成しである。）
〔効果〕
叙上の如き本発明の複合金属板においては、旧来の銅板
のみにて形成されたものに比して軽量化。Others 51 are semiconductor devices, which are soldered 36 on the heat spreader 50 that is soldered 31 on the heat sink 10 . This heat spreader 50, like the heat sink 10, is made by forming a plating layer of copper and solder on an aluminum substrate. (However, it is formed on both sides.) [Effects] The composite metal plate of the present invention as described above is lighter in weight than the conventional one formed only of copper plates.
低廉化の利点を享受でき、また表面がニッケルであるの
で空気等による酸化が抑制され、長期にわたって美感を
保ち得、又ハンダ付けが容易である。It has the advantage of being inexpensive, and since the surface is made of nickel, oxidation due to air etc. is suppressed, it maintains its aesthetic appearance over a long period of time, and it is easy to solder.
更に従来品と比して以下の利点がある。Furthermore, it has the following advantages compared to conventional products.
即ち、本発明のものは高強度アルミニウムを用いてこれ
に銅メッキ層及びニッケルメッキ層を順次電気メッキし
て形成させたものであるので、メッキ処理の前後で高強
度アルミニウムの強度が変化せず撓みにくい。従って従
来品のように焼ならされて軟質化した複合金属板と比べ
て、本発明に係る複合金属板をヒートシンクとして用い
る場合は例えばセラミック製のプリント板２０の割れ発
生を著しく低減でき、これにより高信頼度の電子回路装
置の製造を実現できる。また撓みにくいので構”漬物用
として使用も可能である。That is, since the product of the present invention uses high-strength aluminum and sequentially electroplats a copper plating layer and a nickel plating layer, the strength of the high-strength aluminum does not change before and after the plating process. Not easy to bend. Therefore, when the composite metal plate according to the present invention is used as a heat sink, the occurrence of cracks in the printed board 20 made of ceramic, for example, can be significantly reduced compared to conventional composite metal plates that have been softened by normalizing. It is possible to manufacture highly reliable electronic circuit devices. Also, since it does not easily bend, it can also be used for pickles.
そして、また銅メッキＮ１２．ニッケルメッキ層１３夫
々の厚さはメッキ厚み制御によって全面に亘って均一に
形成され得るのに対し、従来品における銅の層厚又は銅
−アルミニウムの界面に形成した金属間化合物の厚さ及
び組成が界面上の位置で区々に異なる。このために後者
による熱放散は場所によって劣る処がみられるが、本発
明のものは全面に亘って均一な熱放散特性を確保できる
。また本発明のものは金属間化合物が形成されていない
ので熱伝導率が従来品に比して優れ、また撓みにくいの
で例えばアンプのように使用により熱を生ずる装置の外
枠等への用途に適する等、本発明は優れた効果を奏する
。And also copper plated N12. The thickness of each nickel plating layer 13 can be formed uniformly over the entire surface by controlling the plating thickness, whereas in conventional products, the thickness and composition of the copper layer or the intermetallic compound formed at the copper-aluminum interface differs depending on the position on the interface. For this reason, the heat dissipation by the latter is inferior depending on the location, but the one of the present invention can ensure uniform heat dissipation characteristics over the entire surface. Furthermore, since the products of the present invention do not contain intermetallic compounds, they have superior thermal conductivity compared to conventional products, and are less susceptible to bending, making them suitable for use in the outer frames of devices that generate heat when used, such as amplifiers. The present invention has excellent effects.
図面は本発明の１実施例を示す断面構造図である。 The drawings are cross-sectional structural diagrams showing one embodiment of the present invention.
Claims (1)
いて、 高強度アルミニウムの基板の表面に電気メ ッキによる銅メッキ層及びニッケルメッキ層が基板側か
らこの順に形成せしめられていることを特徴とする複合
金属板。[Claims] 1. In a laminated composite metal plate including an aluminum layer and a copper layer, a copper plating layer and a nickel plating layer are formed by electroplating on the surface of a high-strength aluminum substrate in this order from the substrate side. A composite metal plate characterized by:
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP14341085A JPS623939A (en) | 1985-06-28 | 1985-06-28 | Composite metallic plate |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP14341085A JPS623939A (en) | 1985-06-28 | 1985-06-28 | Composite metallic plate |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| JPS623939A true JPS623939A (en) | 1987-01-09 |
Family
ID=15338121
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP14341085A Pending JPS623939A (en) | 1985-06-28 | 1985-06-28 | Composite metallic plate |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPS623939A (en) |
Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPH01117240A (en) * | 1987-10-30 | 1989-05-10 | Masao Iwanaga | Discharge element and its applied device |
| WO2015151686A1 (en) * | 2014-04-04 | 2015-10-08 | シャープ株式会社 | Substrate for light emitting devices, and light emitting device |
Citations (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS5897851A (en) * | 1981-12-07 | 1983-06-10 | Nec Home Electronics Ltd | Manufacture of metallic part |
| JPS6092486A (en) * | 1983-10-27 | 1985-05-24 | Nec Kansai Ltd | Silver brazing method of copper parts |
-
1985
- 1985-06-28 JP JP14341085A patent/JPS623939A/en active Pending
Patent Citations (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS5897851A (en) * | 1981-12-07 | 1983-06-10 | Nec Home Electronics Ltd | Manufacture of metallic part |
| JPS6092486A (en) * | 1983-10-27 | 1985-05-24 | Nec Kansai Ltd | Silver brazing method of copper parts |
Cited By (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPH01117240A (en) * | 1987-10-30 | 1989-05-10 | Masao Iwanaga | Discharge element and its applied device |
| WO2015151686A1 (en) * | 2014-04-04 | 2015-10-08 | シャープ株式会社 | Substrate for light emitting devices, and light emitting device |
| JPWO2015151686A1 (en) * | 2014-04-04 | 2017-04-13 | シャープ株式会社 | Method for manufacturing substrate for light emitting device, method for manufacturing light emitting device, and method for manufacturing lighting device |
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