JPS6233493A - Manufacture of transfer sheet - Google Patents
Manufacture of transfer sheetInfo
- Publication number
- JPS6233493A JPS6233493A JP17240585A JP17240585A JPS6233493A JP S6233493 A JPS6233493 A JP S6233493A JP 17240585 A JP17240585 A JP 17240585A JP 17240585 A JP17240585 A JP 17240585A JP S6233493 A JPS6233493 A JP S6233493A
- Authority
- JP
- Japan
- Prior art keywords
- transfer sheet
- circuit pattern
- metal foil
- manufacturing
- sheet
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
Abstract
(57)【要約】本公報は電子出願前の出願データであるた
め要約のデータは記録されません。(57) [Summary] This bulletin contains application data before electronic filing, so abstract data is not recorded.
Description
【発明の詳細な説明】
〔産業上の利用分野〕
本発明は合成樹脂製の絶縁基板の成形と同時にその表面
に電気回路パターンを形成する方法に用いる転写シート
の製造方法に関する。DETAILED DESCRIPTION OF THE INVENTION [Industrial Application Field] The present invention relates to a method for manufacturing a transfer sheet used in a method for molding an insulating substrate made of synthetic resin and simultaneously forming an electric circuit pattern on the surface thereof.
（従来の技術）
従来、樹脂等の成形品の表面に電気回路パターンを形成
する方法としては、成形品に銅箔等工してパターンニン
グするサブトラクティブ法や、と着強度促進用の下地処
理を成形品表面に施し、そこへ触媒を付加してメッキ核
を形成した後に無電解メッキを行うフルアディティブ法
や、無電解メッキと電解メッキを併用するセミアディテ
ィブ法等が一般的に用いられてきた。(Prior art) Conventionally, methods for forming electrical circuit patterns on the surface of molded products such as resins include subtractive methods in which the molded products are patterned with copper foil, etc., and surface treatment to promote adhesion strength. Generally used are the fully additive method, in which electroless plating is performed after applying plating to the surface of a molded product, adding a catalyst thereto to form a plating nucleus, and the semi-additive method, in which electroless plating and electrolytic plating are combined. Ta.
また、成形品に導電塗料を印刷する方法、或いは導電塗
料の印刷されたシートを成形品に装着し、その塗料を熱
転写する方法も開発が進められてきた。Further, a method of printing a conductive paint on a molded product, or a method of attaching a sheet printed with a conductive paint to a molded product and thermally transferring the paint has also been developed.
しかし、いずれの方法も成形品を成形後、その表面に電
気回路パターンを形成する工程を必要とした。However, both methods require a step of forming an electric circuit pattern on the surface of the molded product after molding.
そこで、結縛基板上に回路パターンを萄する電気回路基
板を製造する方法として、シート状基材の上に回路パタ
ーンが形成された転写シートを、樹脂製絶縁基板の成形
用金型内に装着し、この金型内に樹脂を充填することに
よって、絶縁基板の成形と同ｖＦ＋こ、この裏面十に転
写シートの回路バターンを転写して電気回路基板を製造
する方法が考えられる。Therefore, as a method for manufacturing an electric circuit board with a circuit pattern on a bound board, a transfer sheet with a circuit pattern formed on a sheet-like base material is mounted in a mold for molding a resin insulating board. However, it is conceivable to manufacture an electric circuit board by filling the mold with resin and transferring the circuit pattern of the transfer sheet to the back surface of the insulating board in the same manner as the molding of the insulating board.
この電気回路基板の製造法は、絶縁基板の成形と回路パ
ターンの形成とを同一の工程で実施でき効率の良い方法
ではある
しかし、この方法に用いる従来の転写シートはシート状
基材上に銀、銅、ニッケル等の金属フィラーを含む導電
性塗料によって回路パターンを印刷しで形成されでいる
かこの金属フィラーを含む導電性塗料は電気抵抗が高い
ことから、この転写シートを使用して製造するのに適し
た電気回路には制限があり、例えば、大電流を印加する
必要のある電気回路基板や幅の狭い回路パターンの形成
が要求される電気回路基板に対しては発熱あるいは電流
損失から不向きであった。This electric circuit board manufacturing method is an efficient method as it can mold the insulating substrate and form the circuit pattern in the same process. However, the conventional transfer sheet used in this method is The circuit pattern is formed by printing a conductive paint containing metal fillers such as copper or nickel.Since conductive paints containing metal fillers have high electrical resistance, it is difficult to manufacture them using this transfer sheet. There are limitations to the electrical circuits that are suitable for this, for example, it is not suitable for electrical circuit boards that require the application of large currents or that require the formation of narrow circuit patterns due to heat generation or current loss. there were.
本発明は、上述の問題点を除去するためになされたもの
であり、その目的は、より多くのｆｉ頚の電気回路基板
を製造するのに適した転写シートの製造方法を提供する
ことにある。The present invention has been made in order to eliminate the above-mentioned problems, and its purpose is to provide a method for manufacturing a transfer sheet suitable for manufacturing more FI neck electric circuit boards. .
〔問題点を解決するための手段〕
上記目的を達成する本発明は、樹脂製の絶縁基板の成形
と同時にその表面に回路パターンを形成する電気回路基
板の製造に使用する転写シートの製造方法に於いて、シ
ート状基材と金属箔とを接着剤で貼り合わせた後に、該
金属′Ａをエツチング除去し、その未除去部分からなる
回路パターンを形成する工程を有することを特徴とする
。[Means for Solving the Problems] The present invention, which achieves the above object, provides a method for manufacturing a transfer sheet used for manufacturing an electric circuit board, in which a circuit pattern is formed on the surface of a resin insulating board at the same time as the molding of the resin insulating board. The present invention is characterized by the step of bonding the sheet-like base material and the metal foil together with an adhesive, then removing the metal 'A by etching, and forming a circuit pattern consisting of the unremoved portion.
第１図及び第２図は本発明の転写シートの製造方法の実
施例を示す工程図である。この実施例では、まず、シー
ト状基材］の上に接着剤２により金属箔３を貼り合わせ
る（第１図）。この貼り合わせには、加熱されたラミネ
ーターの圧着力を利用するとよい。FIGS. 1 and 2 are process diagrams showing an embodiment of the method for manufacturing a transfer sheet of the present invention. In this example, first, a metal foil 3 is pasted onto a sheet-like base material using an adhesive 2 (FIG. 1). For this bonding, it is preferable to use the pressure bonding force of a heated laminator.
シート状基材１の材質は強度、耐熱性に優れたものであ
ればよく、例えばポリエチレンテレフタレートが利用で
きる。The material of the sheet-like base material 1 may be any material as long as it has excellent strength and heat resistance; for example, polyethylene terephthalate can be used.
金属箔３としでは銅箔が好適である。銅箔の厚ざは印加
電流値に応して適切な抵抗値を示すことができるように
適宜選定すればよいが、通常２０〜１００−の範囲内の
厚さが適当である。As the metal foil 3, copper foil is suitable. The thickness of the copper foil may be appropriately selected so as to exhibit an appropriate resistance value depending on the applied current value, but a thickness within the range of 20 to 100 mm is usually appropriate.
接着剤２としでは、耐熱性に優れたものであって、転写
シートの使用時（使用方法は後述する）に金属箔３がシ
ート基材１よつ剥離できる程度の接着力をもてばよく、
エポキシ系接着剤が好適なものヒして使用できる。The adhesive 2 only needs to have excellent heat resistance and have enough adhesive strength to allow the metal foil 3 to be peeled off from the sheet base material 1 when the transfer sheet is used (how to use it will be described later). ,
Epoxy adhesives are suitable and can be used.
次に、シート状基材１上の金属箔３の不要部分をエツチ
ング除去することにより、その未除去部分からなる回路
パターン３ａを形成する（第２図）、このエツチング工
程には、種々の方法が適用できるが、例えば金属箔３の
上にスクリーン印刷等によりレジストインク４を印刷し
た後、露出している金属箔３を食刻可能な工・ンチング
液に浸すことにより実施できる。この操作によって、印
刷されたレジストインキ４部分に覆われた金属箔だけが
残り回路パターン３ａが形成できる。なあ、レジストイ
ンキ４はその後除去する。またこのエツチング工程には
フォトリングラフイー技術を利用してもよい。Next, unnecessary parts of the metal foil 3 on the sheet-like base material 1 are removed by etching to form a circuit pattern 3a consisting of the unremoved parts (Fig. 2). Various methods can be used for this etching process. However, it can be carried out by, for example, printing the resist ink 4 on the metal foil 3 by screen printing or the like, and then immersing the exposed metal foil 3 in an etching liquid. By this operation, only the metal foil covered with the printed resist ink 4 remains, forming the circuit pattern 3a. By the way, the resist ink 4 will be removed afterwards. Further, photophosphorography technology may be used in this etching step.
このようにして本発明の方法により製造された転写シー
トの使用方法につき、以下第３図〜第５図１８参照しで
説明する。The method of using the transfer sheet thus produced by the method of the present invention will be described below with reference to FIGS. 3 to 5.
転写シートは、その回路パターン形成面が成形金型のゲ
ート側に向くように、成形金型内に装着した後、この金
型を閉じて樹脂を金型内に流し込み固化させる（第３図
）。The transfer sheet is installed in the mold so that the circuit pattern forming surface faces the gate side of the mold, then the mold is closed and the resin is poured into the mold and solidified (Figure 3). .
型開きをすると成形された樹脂製の絶縁基板５上に、金
属箔からなる回路パターン３ａが転写されて、電気回路
基板が製造できる（第４図）。When the mold is opened, the circuit pattern 3a made of metal foil is transferred onto the molded insulating substrate 5 made of resin, and an electric circuit board can be manufactured (FIG. 4).
この型開きの際、１！着剤２も回路パターンと一緒に電
気回路基板に転写されることが少なくないが、転写され
た接着剤２は回路パターン３ａの酸化防止に役立つので
除去せずその走まにしておくことが好ましい、ただし、
第５図に示すように、回路パターン３ａのコネクタ一部
分上にある接着剤２は除去し、必要であればメッキを施
す。When opening this mold, 1! The adhesive 2 is often transferred to the electric circuit board along with the circuit pattern, but since the transferred adhesive 2 helps prevent oxidation of the circuit pattern 3a, it is preferable to leave it as it is without removing it. ,however,
As shown in FIG. 5, the adhesive 2 on a portion of the connector of the circuit pattern 3a is removed and, if necessary, plated.
接着剤２を積極的に基板上に転写させるためには、射出
時の樹脂温度や接着剤の種類等を適切に選定すればよい
。In order to positively transfer the adhesive 2 onto the substrate, the resin temperature at the time of injection, the type of adhesive, etc. may be appropriately selected.
（発明の効果）
以上説明したように本発明の方法によつ導電パターンと
して金属箔、特に銅箔を使用した電気回路基板製造用の
転写シートが提供される。(Effects of the Invention) As described above, the method of the present invention provides a transfer sheet for manufacturing an electric circuit board using metal foil, particularly copper foil, as a conductive pattern.
金属箔は導電性接着剤に比較して抵抗が小ざいので大電
流を印加する必要のある電気回路基板や幅の狭い回路パ
ターンの形成が要求される電気回路基板等を製造する場
合にも、本発明の方法によつ製造された転写シートは使
用可能となる。即ち従来の転写シートと比べて使用上の
制約（電気回路の種類）が緩和されるという効果がある
。Metal foil has a lower resistance than conductive adhesives, so it can be used when manufacturing electrical circuit boards that require the application of large currents or that require the formation of narrow circuit patterns. The transfer sheet produced by the method of the invention can be used. That is, compared to conventional transfer sheets, there is an effect that restrictions on use (type of electric circuit) are relaxed.
更に、金属フィラーを宮む導電性接着剤よりも金属箔の
方が電気的性質の均一性が高いことから信頼性の高い電
気回路基板の製造が可能になる。Furthermore, since the metal foil has higher uniformity of electrical properties than the conductive adhesive used to enclose the metal filler, it is possible to manufacture a highly reliable electric circuit board.
第１図、第２図は本発明の転写シートの製造方法の一実
施例を示す工程図。第３図〜第５図は本発明の方法によ
り製造された転写シートの使用例を示す断面図である。
１・・・基材シート ２・・・Ｗｔ＠剤３・・・金
属箔 ４・・・レジストインキ５・・・絶縁基
板FIGS. 1 and 2 are process diagrams showing one embodiment of the method for manufacturing a transfer sheet of the present invention. 3 to 5 are cross-sectional views showing examples of use of the transfer sheet manufactured by the method of the present invention. 1...Base material sheet 2...Wt@ agent 3...Metal foil 4...Resist ink 5...Insulating substrate
Claims (1)
ターンを形成する電気回路基板の製造に使用する転写シ
ートの製造方法に於いて、シート状基材と金属箔とを接
着剤で貼り合わせた後に、該金属箔をエッチング除去し
、その未除去部分からなる回路パターンを形成する工程
を有することを特徴とする転写シートの製造方法。1) In the method of manufacturing a transfer sheet used in the manufacture of electric circuit boards, in which a circuit pattern is formed on the surface of a resin insulating board at the same time as molding, a sheet-like base material and metal foil are bonded together with an adhesive. A method for manufacturing a transfer sheet, comprising the step of etching away the metal foil and forming a circuit pattern consisting of the unremoved portions.
Priority Applications (2)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP17240585A JPS6233493A (en) | 1985-08-07 | 1985-08-07 | Manufacture of transfer sheet |
| US06/892,086 US4980016A (en) | 1985-08-07 | 1986-08-01 | Process for producing electric circuit board |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP17240585A JPS6233493A (en) | 1985-08-07 | 1985-08-07 | Manufacture of transfer sheet |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| JPS6233493A true JPS6233493A (en) | 1987-02-13 |
Family
ID=15941339
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP17240585A Pending JPS6233493A (en) | 1985-08-07 | 1985-08-07 | Manufacture of transfer sheet |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPS6233493A (en) |
Cited By (6)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS6464392A (en) * | 1987-09-04 | 1989-03-10 | Shinko Electric Ind Co | Transcription sheet for circuit formation use and manufacture of circuit board using transcription sheet |
| JPH02216892A (en) * | 1989-02-17 | 1990-08-29 | Nippon Koudoshi Kogyo Kk | Laminate for printed circuit board |
| US4969257A (en) * | 1987-09-04 | 1990-11-13 | Shinko Electric Industries, Co., Ltd. | Transfer sheet and process for making a circuit substrate |
| JPH0325996A (en) * | 1989-06-23 | 1991-02-04 | Nitto Boseki Co Ltd | Transfer sheet for injection molding printed circuit board and manufacture thereof |
| JPH03142994A (en) * | 1989-10-30 | 1991-06-18 | Nitto Boseki Co Ltd | Manufacture of transfer sheet for injection molded printed wiring board |
| JPH08330709A (en) * | 1996-05-07 | 1996-12-13 | Shinko Electric Ind Co Ltd | Manufacture of transfer sheet for circuit formation and circuit substrate using the same |
-
1985
- 1985-08-07 JP JP17240585A patent/JPS6233493A/en active Pending
Cited By (6)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS6464392A (en) * | 1987-09-04 | 1989-03-10 | Shinko Electric Ind Co | Transcription sheet for circuit formation use and manufacture of circuit board using transcription sheet |
| US4969257A (en) * | 1987-09-04 | 1990-11-13 | Shinko Electric Industries, Co., Ltd. | Transfer sheet and process for making a circuit substrate |
| JPH02216892A (en) * | 1989-02-17 | 1990-08-29 | Nippon Koudoshi Kogyo Kk | Laminate for printed circuit board |
| JPH0325996A (en) * | 1989-06-23 | 1991-02-04 | Nitto Boseki Co Ltd | Transfer sheet for injection molding printed circuit board and manufacture thereof |
| JPH03142994A (en) * | 1989-10-30 | 1991-06-18 | Nitto Boseki Co Ltd | Manufacture of transfer sheet for injection molded printed wiring board |
| JPH08330709A (en) * | 1996-05-07 | 1996-12-13 | Shinko Electric Ind Co Ltd | Manufacture of transfer sheet for circuit formation and circuit substrate using the same |
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