JPS62292366A - Manufacture of diamond abrasive-grain buried tool - Google Patents
Manufacture of diamond abrasive-grain buried toolInfo
- Publication number
- JPS62292366A JPS62292366A JP62054297A JP5429787A JPS62292366A JP S62292366 A JPS62292366 A JP S62292366A JP 62054297 A JP62054297 A JP 62054297A JP 5429787 A JP5429787 A JP 5429787A JP S62292366 A JPS62292366 A JP S62292366A
- Authority
- JP
- Japan
- Prior art keywords
- abrasive
- diamond abrasive
- base material
- diamond
- embedded
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
- 239000010432 diamond Substances 0.000 title claims description 56
- 229910003460 diamond Inorganic materials 0.000 title claims description 54
- 239000006061 abrasive grain Substances 0.000 title claims description 38
- 238000004519 manufacturing process Methods 0.000 title claims description 19
- 239000000463 material Substances 0.000 claims description 33
- 238000000034 method Methods 0.000 claims description 24
- 239000000843 powder Substances 0.000 claims description 21
- 239000002184 metal Substances 0.000 claims description 12
- 229910052751 metal Inorganic materials 0.000 claims description 12
- 239000010410 layer Substances 0.000 claims description 11
- 238000002844 melting Methods 0.000 claims description 9
- 230000008018 melting Effects 0.000 claims description 9
- 239000000203 mixture Substances 0.000 claims description 8
- 239000011247 coating layer Substances 0.000 claims description 2
- 238000005520 cutting process Methods 0.000 description 22
- 239000000758 substrate Substances 0.000 description 22
- RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical compound [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 description 4
- 229910000831 Steel Inorganic materials 0.000 description 4
- ATJFFYVFTNAWJD-UHFFFAOYSA-N Tin Chemical compound [Sn] ATJFFYVFTNAWJD-UHFFFAOYSA-N 0.000 description 4
- 229910052802 copper Inorganic materials 0.000 description 4
- 239000010949 copper Substances 0.000 description 4
- 239000002245 particle Substances 0.000 description 4
- 239000010959 steel Substances 0.000 description 4
- 239000013078 crystal Substances 0.000 description 3
- 239000011248 coating agent Substances 0.000 description 2
- 238000000576 coating method Methods 0.000 description 2
- 230000000694 effects Effects 0.000 description 2
- 238000003754 machining Methods 0.000 description 2
- 229920002635 polyurethane Polymers 0.000 description 2
- 239000004814 polyurethane Substances 0.000 description 2
- 238000003825 pressing Methods 0.000 description 2
- 230000000717 retained effect Effects 0.000 description 2
- 230000035939 shock Effects 0.000 description 2
- 230000003068 static effect Effects 0.000 description 2
- 229910000906 Bronze Inorganic materials 0.000 description 1
- 229910001018 Cast iron Inorganic materials 0.000 description 1
- 229910009043 WC-Co Inorganic materials 0.000 description 1
- 239000011230 binding agent Substances 0.000 description 1
- 239000010974 bronze Substances 0.000 description 1
- 239000000919 ceramic Substances 0.000 description 1
- 238000005253 cladding Methods 0.000 description 1
- 239000002131 composite material Substances 0.000 description 1
- 238000010276 construction Methods 0.000 description 1
- KUNSUQLRTQLHQQ-UHFFFAOYSA-N copper tin Chemical compound [Cu].[Sn] KUNSUQLRTQLHQQ-UHFFFAOYSA-N 0.000 description 1
- 238000009826 distribution Methods 0.000 description 1
- 238000005516 engineering process Methods 0.000 description 1
- 239000011521 glass Substances 0.000 description 1
- 239000003292 glue Substances 0.000 description 1
- 238000007373 indentation Methods 0.000 description 1
- 230000014759 maintenance of location Effects 0.000 description 1
- 239000000155 melt Substances 0.000 description 1
- 238000002156 mixing Methods 0.000 description 1
- 230000003287 optical effect Effects 0.000 description 1
- 239000004033 plastic Substances 0.000 description 1
- 229920003023 plastic Polymers 0.000 description 1
- 239000011120 plywood Substances 0.000 description 1
- 238000012216 screening Methods 0.000 description 1
- 238000007493 shaping process Methods 0.000 description 1
- 238000005507 spraying Methods 0.000 description 1
- UONOETXJSWQNOL-UHFFFAOYSA-N tungsten carbide Chemical compound [W+]#[C-] UONOETXJSWQNOL-UHFFFAOYSA-N 0.000 description 1
Classifications
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B24—GRINDING; POLISHING
- B24D—TOOLS FOR GRINDING, BUFFING OR SHARPENING
- B24D18/00—Manufacture of grinding tools or other grinding devices, e.g. wheels, not otherwise provided for
- B24D18/0054—Manufacture of grinding tools or other grinding devices, e.g. wheels, not otherwise provided for by impressing abrasive powder in a matrix
Landscapes
- Engineering & Computer Science (AREA)
- Manufacturing & Machinery (AREA)
- Mechanical Engineering (AREA)
- Polishing Bodies And Polishing Tools (AREA)
Abstract
(57)【要約】本公報は電子出願前の出願データであるた
め要約のデータは記録されません。(57) [Summary] This bulletin contains application data before electronic filing, so abstract data is not recorded.
Description
【発明の詳細な説明】
３、発明の詳細な説明
〔産業上の利用分野〕
本発明は、一般的には生産工学の分野に関係し、更に詳
しくはダイアモンド砥粒押込工具の製造方法に関する。DETAILED DESCRIPTION OF THE INVENTION 3. DETAILED DESCRIPTION OF THE INVENTION [Field of Industrial Application] The present invention relates generally to the field of production engineering, and more particularly to a method of manufacturing a diamond abrasive indentation tool.
本発明の方法によって製造された工具は、ダイアモンド
、ガラス、セラミックス等の硬質材料の機械加工に用い
られるものであり、宝石加工、光機械、建設等の工業分
野で適用される。The tool manufactured by the method of the present invention is used for machining hard materials such as diamond, glass, and ceramics, and is applied in industrial fields such as jewelry processing, optical machinery, and construction.
当業界において公知のダイアモンド埋込切削円板（ｄｉ
ａｍｏｎｄ−ｉｍｐｒｅｇｎａｔｅｄ ｃｕｔｔｉｎｇ
ｄｉｓｋ）の製茫方法の一つにおいては、油−粉末−
ダイアモンドの混合物を金属製円板の表面の上に塗布し
た後、鋳鉄ランプ（ｌａｐ）のような超硬合金部材を使
って該混合物を該円板に押しつける。埋込工程を行なう
には、超硬合金部材を静的に荷重し、周波数２〜４０
Ｓ−’で回転させる。（参照文献：テキストブック「粗
ダイアモンドからカット・ダイアモンドへのプロセスＪ
、Ｖ、Ｔ、Ｅｐｉｆａｎｏｖ他著、１９８２、Ｖｙｓ
ｓｈａｙａ ５ｈｋｏｌａ出版社、モスクワ、２３３ペ
ージ、ロシア語版）。Diamond-embedded cutting discs (di
amond-impregnated cutting
In one of the methods of making smoked oil (disk), oil-powder-
After the diamond mixture is applied onto the surface of the metal disc, a cemented carbide member, such as a cast iron lap, is used to press the mixture onto the disc. To carry out the embedding process, the cemented carbide member is statically loaded and the frequency of 2 to 40 is applied.
Rotate with S-'. (Reference: Textbook “Process from rough diamond to cut diamond J
, V.T., Epifanov et al., 1982, Vys.
Shaya 5hkola Publishing House, Moscow, 233 pages, Russian version).
しかし上記の方法は押しつけ工程に２０〜３０分を要す
るため生産効率が低い。その上、この方法は金属円板中
のダイアモンド砥粒の濃度を高くすることができず、ま
た、機械加工での使用中の砥粒の保持を適切に確保でき
ない。そのため、切削円板の性能特性は低く、高価な粗
ダイアモンド（ｒｏｕｇｈ ｄ’ｉａｍｏｎｄ）の消費
量が多い。However, the above method requires 20 to 30 minutes for the pressing process, resulting in low production efficiency. Moreover, this method does not allow high concentration of diamond abrasive grains in the metal disk, nor does it adequately ensure retention of the abrasive grains during use in machining. Therefore, the performance characteristics of the cutting disc are poor and the consumption of expensive rough diamonds is high.
上記の方法では、円板が変形するため、厚さがダイアモ
ンド砥粒の寸法並の薄い砥粒円板を製造することは現実
的でない。In the above method, since the disk is deformed, it is not realistic to manufacture an abrasive disk having a thickness as thin as that of diamond abrasive grains.
もう一つのダイアモンド砥粒埋込工具の製造方法におい
ては、ダイアモンド砥粒を含有する砥粒粉末の層を基材
に塗布した後、超硬合金パンチによって基材の表面全体
に加圧する。パンチは４００〜５００ＭＰａの範囲の圧
力で静的荷重を負荷する。In another method for manufacturing a tool embedded with diamond abrasive grains, a layer of abrasive powder containing diamond abrasive grains is applied to a base material, and then pressure is applied to the entire surface of the base material with a cemented carbide punch. The punch carries a static load at a pressure in the range of 400-500 MPa.
しかし、この方法も埋込が不十分なためダイアモンド砥
粒と基材との固着結合を十分に行なえない。However, this method also fails to sufficiently securely bond the diamond abrasive grains to the base material due to insufficient embedding.
ダイアモンド砥粒の埋込動作が静的荷重の負荷と同一方
向に行なわれる限り、ダイアモンド砥粒を４０ｖｏｌ％
を超える濃度で基材に埋め込むことは現実的に不可能で
ある。この要因は工具の性能特性にとって極めて逆効果
となる。As long as the embedding operation of the diamond abrasive grains is performed in the same direction as the static load, the diamond abrasive grains should be added at 40 vol%.
It is practically impossible to embed it in a base material at a concentration exceeding . This factor is extremely counterproductive to the performance characteristics of the tool.
その上この方法はエネルギー消費の多い加圧加工設備を
使用する。Moreover, this method uses energy-intensive pressure processing equipment.
本発明の目的は、基材にダイアモンド砥粒を押しつける
段階の工程要因を選択することによって、良好な性能特
性を具備する砥粒工具の高効率生産を確保できるダイア
モンド砥粒埋込工具の製造方法を提供することである。The object of the present invention is to provide a method for manufacturing a diamond abrasive embedded tool that can ensure highly efficient production of an abrasive tool with good performance characteristics by selecting process factors in the step of pressing diamond abrasive grains onto a base material. The goal is to provide the following.
上記の目的は、ダイアモンド砥粒を含有する砥粒粉末の
層を基材に塗布した後、超硬合金部材が行なう衝撃動作
を該層の上に加えて該砥粒粉末を該基材に埋め込むダイ
アモンド砥粒埋込工具の製造方法において、該超硬合金
部材を周波数９００〜２５００ Ｓ伺で回転させ、２０
０〜８００にＮ、Ｓの範囲の衝撃パルスを該超硬合金部
材に加えることによって該砥粒粉末を埋め込むことを特
徴とする本発明のダイアモンド砥粒埋込工具の製造方法
によって達成される。The above purpose is to apply a layer of abrasive powder containing diamond abrasive grains to a substrate and then apply an impact action performed by a cemented carbide member onto the layer to embed the abrasive powder into the substrate. In the method for manufacturing a diamond abrasive embedded tool, the cemented carbide member is rotated at a frequency of 900 to 2500 S,
This is achieved by the method for manufacturing a diamond abrasive embedded tool of the present invention, which is characterized in that the abrasive powder is embedded by applying an impact pulse in the range of 0 to 800 N, S to the cemented carbide member.
このように基材の上で複合動作を行なうことによって、
ダイアモンド砥粒が最適状態で基材に埋め込まれ且つそ
の状態で保持されるための好適な条件が提供される。こ
れによって肉薄工具、たとえば０．０５ｍｍの薄さの切
断工具を、ダイアモンド砥粒の濃度６０〜６５ｖｏ ｌ
％で、製造できる。更に、工具寿命が４０〜４５％伸
長し、実切取速度（ｓｔｏｃｋｒｅｍｏｖａｌ ｒａｔ
ｅ）の高速化、たとえばダイアモンドの切削において５
０〜５５％の高速化が達成され、且つ工具生産効率が３
〜４倍に増加する。By performing composite operations on the base material in this way,
Suitable conditions are provided for the diamond abrasive grains to be optimally embedded and retained in the substrate. This allows thin-walled tools, for example, cutting tools with a thickness of 0.05 mm, to be cut with a diamond abrasive grain concentration of 60 to 65 vol.
%, it can be manufactured. Additionally, tool life is increased by 40-45%, and stock removal rate is increased by 40-45%.
e) speeding up, for example, 5 in diamond cutting.
A speed increase of 0 to 55% was achieved, and the tool production efficiency was 3.
~4 times increase.
円板状の基材に砥粒粉末を押しつけながら同時に該基材
を初回半径の３〜１０倍の半径を有する球面セグメント
に成形することが望ましい。It is desirable to press the abrasive powder onto a disc-shaped base material and simultaneously shape the base material into a spherical segment having a radius 3 to 10 times the initial radius.
砥粒粉末の塗布と基材の成形を組み合わせることによっ
て、基材全体にわたってダイアモンドを最適分布させる
ことができるので、工具寿命の伸長を確保できる。The combination of abrasive powder application and substrate shaping provides an optimal distribution of diamonds throughout the substrate, thereby ensuring extended tool life.
砥粒粉末の組成が、ダイアモンド砥粒：２０〜６゜ｖｏ
ｌ％、および低融点金属：残部がら成ることが望ましく
、更に、ダイアモンド砥粒を含有する砥粒粉末の層を、
低融点金属の基材被覆層に塗布することも望ましい。The composition of the abrasive grain powder is diamond abrasive grain: 20~6°vo
1%, and the balance is a low melting point metal, further comprising a layer of abrasive grain powder containing diamond abrasive grains,
It is also desirable to coat a base coating layer of a low melting point metal.
混合物の中に低融点金属を混入するか、またばあらかし
め低融点金属で被覆（クラッド）した基材を用いること
によって、粒寸法が２００〜２５０μｒｎの範囲にある
ダイアモンド砥粒の含有量を最大阪の濃度にまで高める
ことができる。The content of diamond abrasive grains in the grain size range of 200 to 250 μrn can be maximized by incorporating a low melting point metal into the mixture or by using a substrate that is clad with a low melting point metal. It is possible to increase the concentration to that of Osaka.
本発明の方法は下記のように行なわれる。 The method of the invention is carried out as follows.
ダイアモンド砥粒を含有する砥粒粉末の層を基材に被覆
する。超硬合金部材、たとえばタングステン・カーバイ
ド板を砥粒粉末層の直上に配置し、周波数９００〜２５
０ＯＳ −’で回転させる。基材の反対側の表面全体に
２００〜８００ＫＮ 、ｓの範囲の衝撃を加えることに
よって、基材を超硬合金部材に向かって非常に高速で変
位させて衝突させる。A layer of abrasive powder containing diamond abrasive grains is coated onto a substrate. A cemented carbide member, such as a tungsten carbide plate, is placed directly above the abrasive powder layer, and a frequency of 900 to 25
Rotate at 0OS-'. The substrate is displaced and impacted at very high speeds towards the cemented carbide member by applying an impact in the range of 200-800 KN, s across the opposite surface of the substrate.
基材が、上記の強さの衝撃動作によって、回転している
超硬合金部材に押しつけられると、ダイアモンド砥粒は
基材内部に入り組んだ径路で入り込んで確実に保持され
るのに十分な深さまで達する。これによって、工具中の
ダイアモンド砥粒含有量を高めることができ、使用中の
砥粒の破砕が防止され、それによって工具性能が向上す
る。When the substrate is pressed against the rotating cemented carbide member by an impact action of the above strength, the diamond abrasive grains enter the substrate with intricate paths deep enough to be securely retained. reach. This allows the diamond abrasive content in the tool to be increased and prevents the abrasive from fracturing during use, thereby improving tool performance.
更に、短時間の衝撃によってダイアモンド砥粒を信頼性
良く埋め込むので、生産効率が高まる。Furthermore, diamond abrasive grains are reliably embedded by short-term impact, increasing production efficiency.
基材表面への砥粒粉末の塗布は、フリー・フォーミング
（ｆｒｅｅ ｆｏｒｍｉｎｇ） 、吹きつけ（ｓｐｒａ
ｙｉｎｇ）、またはふるいかけ（ｓｃｒｅｅｎｉｎｇ）
によって行なうことができる。Application of abrasive powder to the surface of the base material can be done by free forming, spraying, etc.
ying), or screening
This can be done by
円板状の基材に砥粒粉末を押しつけながら同時に該基材
を初期半径の３〜１０倍の半径を有する球面セグメント
に成形することが望ましい。これによって、埋込過程中
に金属が塑性変形するので、ダイアモンド砥粒を基材の
中に強固に保持することができる。It is desirable to press the abrasive powder onto a disc-shaped base material and simultaneously shape the base material into a spherical segment having a radius 3 to 10 times the initial radius. This allows the diamond abrasive grains to be firmly held within the base material as the metal undergoes plastic deformation during the embedding process.
セグメントの半径が前記の上限を超えると工具の性能特
性は実質的に全く向上せず、下限未満であると基材をバ
ックリングなしに所要形状に成形できなくなる。If the radius of the segment exceeds the upper limit mentioned above, there will be virtually no improvement in the performance characteristics of the tool, and if it is below the lower limit, the substrate will not be able to be formed into the desired shape without buckling.
本発明の方法において用いる砥粒（５）末の粒寸ｌＪ±
は、工具の使用目的に応じて広い範囲で変えることがで
きる。Particle size lJ± of abrasive grain (5) powder used in the method of the present invention
can vary within a wide range depending on the intended use of the tool.
砥粒粉末の組成が、ダイアモンド砥粒：２０〜６０ｖｏ
ｌ％、および低融点金属：残部から成ることが望ましい
。The composition of the abrasive powder is diamond abrasive: 20 to 60vo
1%, and the balance is a low melting point metal.
工具材料の構造が形成されたときに、低融点金属は結合
剤として働き、２００〜２５０μｍの寸法のダイアモン
ド低粒を適切に固着させる。When the structure of the tool material is formed, the low melting point metal acts as a binder and properly anchors the diamond grains with dimensions of 200-250 μm.
同様の効果は、あらかじめ基材の表面に低融点金属を被
覆（クラッド）しても得られる。この場合には、被覆厚
さを最小ダイアモンド砥粒寸法の半分未満にするように
注意すべきである。そうしないとダイアモンド砥粒が基
材の中に十分に埋め込まれない。A similar effect can be obtained by coating (cladding) the surface of the base material with a low melting point metal in advance. In this case care should be taken to keep the coating thickness less than half the minimum diamond grain size. Otherwise, the diamond abrasive grains will not be fully embedded into the substrate.
以下に本発明の方法を詳しい実施例によって説明する。 The method of the invention will be explained below by means of detailed examples.
実施例１
ダイアモンド結晶を切削するための切断用砥粒円１＆
（ａｂｒａｓｉｖｅ ｃｕｔｏｆｆ ｄｉｓｋｓ）を製
造した。直径８０ｍｍ、厚さ０．０８＋ｕの鋼製円板を
基材として用い１こ。Example 1 Cutting abrasive circle 1 & for cutting diamond crystal
(abrasive cutoff disks) were manufactured. A steel disc with a diameter of 80 mm and a thickness of 0.08+U was used as the base material.
粒寸法２０／１６μｍの砥粒を基材の表面上ににかわを
使って均一に分布させた。銅板の上に弾性ポリウレタン
部材を設置しその表面上に基材を配置した。該弾性部材
および原板はいずれも軸方向に自由に変位できる。磁気
パルス装置の平型誘電子を銅板の直く隣りにぴったり合
わせて配置した。Abrasive grains with a grain size of 20/16 μm were uniformly distributed on the surface of the substrate using glue. An elastic polyurethane member was placed on the copper plate, and a base material was placed on the surface of the elastic polyurethane member. Both the elastic member and the original plate can be freely displaced in the axial direction. The flat inductor of the magnetic pulse device was placed closely adjacent to the copper plate.
ＷＣ−Ｃｏ超硬合金製の板を基材表面の上方に配置して
周波数９００〜２５０ＯＳ −’で回転させた。［は気
パルス装置の容量的電荷蓄積器（ｃａｐａｃｉｔａｔｉ
ｖｅｃｈａ（ｇｅ ｉｎｔｅｇｒａｔｅｒ）から誘電子
に放電を行なわせ、それによって弾性部材と銅板に基材
にり、１して衝撃動作を行なわせた。衝撃の強さは２０
０〜８００ＫＮ、Ｓであった。A plate made of WC-Co cemented carbide was placed above the surface of the substrate and rotated at a frequency of 900 to 250 OS −'. [is the capacitive charge accumulator of the air pulse device
A dielectric discharge was caused to occur from a vecha (ge integrator), and thereby the elastic member and the copper plate were connected to the base material, and an impact action was performed. The strength of the impact is 20
It was 0-800KN, S.
基材と餡硬合合板の１）ｉ突が起きた結果、ダイアモン
ド砥粒が基材の中に埋め込まれ固着された。1) As a result of the collision between the base material and the hard plywood, the diamond abrasive grains were embedded and fixed in the base material.
第１表に、得られた切断用砥粒円板の性能特性を製造要
因と関係づけて示す。Table 1 shows the performance characteristics of the obtained cutting abrasive disks in relation to manufacturing factors.
以下余白
第 １ 表
実施例２
ダイアモン［・結晶を切削するための切断用砥粒円板を
製造した。直径５０ｍｍ、厚さ０．０５ｍｍの青銅製円
板を基材として用いた。Table 1 Example 2 A cutting abrasive disk for cutting diamond crystals was manufactured. A bronze disc with a diameter of 50 mm and a thickness of 0.05 mm was used as the base material.
砥粒をフリー・フォーミング法（ｆｒｅｅ ｆｏｒｍｉ
ｎｇｍｅ ｔｈｏｄ）によって基材の表面上に均一に散
布した。The abrasive grains are free-formed.
ngmethod) on the surface of the substrate.
表面が半径１５０〜５００ｍｍの凹球面の超硬板を用意
した。次に、銅板に６Ｘ１０”Ａ／ｍの強度のパルス磁
界をかけた。その結果、基材は球面状のセグメントに成
形され、それと共に部分的にダイアモンド砥粒が埋め込
まれた。A carbide plate having a concave spherical surface with a radius of 150 to 500 mm was prepared. The copper plate was then subjected to a pulsed magnetic field with an intensity of 6×10” A/m. As a result, the substrate was formed into spherical segments with diamond abrasive grains partially embedded therein.
更に、球面の超硬板を平面の超硬板と取り換えて、周波
数１００３−’で回転させてから、再び１ｌｆｆｌｌ板
にパルス磁界を作用させた。基材に印加された衝撃パル
スの強さは４５０ＫＮ、Ｓであった。Further, the spherical carbide plate was replaced with a flat carbide plate, rotated at a frequency of 1003-', and then a pulsed magnetic field was applied to the 1lffll plate again. The strength of the impact pulse applied to the substrate was 450 KN, S.
第２表は、得られた切断用砥粒円板の性能特性を基材曲
面セグメントの半径と関係づけて示す。Table 2 shows the performance characteristics of the resulting cutting abrasive discs in relation to the radius of the substrate curved segments.
第２表
実施例３
厚さ４０１ｍまでのチクストライド・シート（ｔｅｘｔ
ｏｌｉｔｅ ５ｈｅｅｔｓ）を切削するための切断用砥
粒円板を製造した。Table 2 Example 3 Thixtride sheet up to 401 m thick (text
A cutting abrasive disk for cutting olite 5sheets) was manufactured.
直径２００龍、厚さ１．０ ａｓの鋼製円板を基材とし
て用いた。A steel disc with a diameter of 200mm and a thickness of 1.0as was used as the base material.
寸法３１５〜２５０μｍのダイアモンド砥粒と粒子寸法
３００〜３２０μｍの錫粉末との混合物を基材表側に、
水圧ハンマー装置で発生させた６５０ＫＮ −Ｓの衝撃
パルスをかけた。A mixture of diamond abrasive grains with a size of 315 to 250 μm and tin powder with a particle size of 300 to 320 μm is placed on the front side of the base material,
A shock pulse of 650 KN-S was applied using a hydraulic hammer device.
基材と超硬合金とが衝突した結果、ダイアモンド砥粒が
基材の中に埋め込まれた。錫が溶融してろう材として作
用するため、ダイアモンド砥粒はそのろう材の中に埋め
込まれて保持される。As a result of the collision between the base material and the cemented carbide, diamond abrasive grains were embedded within the base material. As the tin melts and acts as a braze, the diamond abrasive grains are held embedded within the braze.
第３表は、得られた砥粒円板の切削速度６０ｍ／ｓ、送
り速度０．６ ａｍ ／ ｒｅνでの性能特性をダイア
モンド砥粒／錫の比に関して示す。Table 3 shows the performance characteristics of the abrasive discs obtained at a cutting speed of 60 m/s and a feed rate of 0.6 am/rev in terms of the diamond abrasive/tin ratio.
以下示白
第 ３ 表
実施例４
厚さ５０關までのチクストライド・シートを切削するた
めの切断用砥粒円板を製造した。Table 3 Example 4 A cutting abrasive disk for cutting thickened sheets up to 50 mm thick was manufactured.
直径２００龍、厚さ１． Ｏｗｎの鋼製円板を基材とし
て用いた。最初に、基材の表面を厚さ１８μｒｎの錫の
層で被覆した。粒寸法４００／２５０μｍおよび６３／
４０μｍのダイアモンド砥粒と錫粉末の混合物（混合比
＝３０ ： ３０ ： ４０）を基材の表面に塗布した
。Diameter 200 dragons, thickness 1. A proprietary steel disc was used as the base material. First, the surface of the substrate was coated with a layer of tin with a thickness of 18 μrn. Particle size 400/250μm and 63/
A mixture of 40 μm diamond abrasive grains and tin powder (mixing ratio = 30:30:40) was applied to the surface of the base material.
その後は実施例３と同様の工程を行なった。Thereafter, the same steps as in Example 3 were performed.
得られた円板の耐摩耗性は０．８３ ｔｔｅ ／ ｒｒ
？、切削面積は９２９０ ｍであった。The wear resistance of the obtained disc is 0.83 tte/rr
? , the cutting area was 9290 m.
以下余白
実施例５
ダイアモンド結晶を切削するための砥粒円板を製造した
。粒寸法５０／４０μｍのダイアモンド粉末を鋼製基材
に塗布した。塗布した基材の直ぐ隣りに超硬会合板（Ｗ
Ｃ−Ｃｏ）を配置して周波数２２０Ｏ３−１で回転させ
た。基材の反対側に、水圧衝撃装置で発生させた７５０
ＫＮ−５の衝撃パルスをかけた。Example 5 An abrasive disk for cutting a diamond crystal was manufactured. Diamond powder with particle size 50/40 μm was applied to a steel substrate. A cemented carbide meeting board (W
C-Co) was placed and rotated at a frequency of 220O3-1. On the opposite side of the substrate, 750
A KN-5 shock pulse was applied.
回転している超硬会合板の衝突によって、基材の表面下
の層にはダイアモンド砥粒が５Ｑｖｏｌ％にまで達する
濃度で埋め込まれた。Due to the collision of the rotating cemented carbide meeting plate, diamond abrasive grains were embedded in the layer below the surface of the base material at a concentration of up to 5Qvol%.
得られた工具は切削過程において１．９〜２．０ ｍｇ
／ｍｉｎの実切取速度（ｓｔｏｃｋ ｒｅｍｏｖａｌ
ｒａｔｅ）を発揮した。The obtained tool lost 1.9-2.0 mg during the cutting process.
/min actual cutting speed (stock removal
demonstrated a high rate).
〔発明の効果］
本発明の方法は、ダイアモンド切削において工具寿命を
４０〜４５パーセント増加させ且つ実切取速度を、たと
えば５０〜５５パーセント高めることができる。[Effects of the Invention] The method of the present invention can increase tool life by 40 to 45 percent and increase actual cutting speed by, for example, 50 to 55 percent in diamond cutting.
以下ぶ白White below
Claims (1)
塗布した後、超硬合金部材が行なう衝撃動作を該層の上
に加えて該砥粒粉末を該基材に埋め込むダイアモンド砥
粒埋込工具の製造方法において、該超硬合金部材を周波
数９００〜２５００Ｓ＾−＾１で回転させ、２００〜８
００ＫＮ・Ｓの範囲の衝撃パルスを該超硬合金部材に加
えることによって該砥粒粉末を埋め込むことを特徴とす
るダイアモンド砥粒埋込工具の製造方法。 ２、円板状の基材に砥粒粉末を押しつけながら同時に該
基材を初期半径の３〜１０倍の半径を有する球面セグメ
ントに成形することを特徴とする特許請求の範囲第１項
記載のダイアモンド砥粒埋込工具の製造方法。 ３、前記砥粒粉末の組成が、ダイアモンド砥粒：２０〜
６０ｖｏｌ％、および低融点金属：残部から成ることを
特徴とする特許請求の範囲第１項または第２項に記載の
ダイアモンド砥粒埋込工具の製造方法。 ４、ダイアモンド砥粒を含有する砥粒粉末の層を、低融
点金属の基材被覆層に塗布することを特徴とする特許請
求の範囲第１項または第２項に記載のダイアモンド砥粒
埋込工具の製造方法。[Claims] 1. After applying a layer of abrasive powder containing diamond abrasive grains to a base material, an impact action performed by a cemented carbide member is applied onto the layer to transfer the abrasive powder to the base material. In a method for manufacturing a diamond abrasive embedded tool embedded in a material, the cemented carbide member is rotated at a frequency of 900 to 2500 S^-^1,
A method for manufacturing a diamond abrasive embedded tool, characterized in that the abrasive powder is embedded by applying an impact pulse in the range of 00 KN·S to the cemented carbide member. 2. The method according to claim 1, characterized in that the abrasive powder is pressed onto a disc-shaped base material and at the same time the base material is formed into a spherical segment having a radius of 3 to 10 times the initial radius. A method of manufacturing a diamond abrasive embedded tool. 3. The composition of the abrasive grain powder is diamond abrasive grain: 20~
60 vol%, and a low melting point metal: the balance, the method for manufacturing a diamond abrasive embedded tool according to claim 1 or 2. 4. Diamond abrasive embedding according to claim 1 or 2, characterized in that a layer of abrasive grain powder containing diamond abrasive grains is applied to a base coating layer of a low melting point metal. Method of manufacturing tools.
Applications Claiming Priority (2)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| SU4070496 | 1986-06-09 | ||
| SU864070496A SU1556885A1 (en) | 1986-06-09 | 1986-06-09 | Method of producing abrasive cut-off wheels |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| JPS62292366A true JPS62292366A (en) | 1987-12-19 |
Family
ID=21238806
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP62054297A Pending JPS62292366A (en) | 1986-06-09 | 1987-03-11 | Manufacture of diamond abrasive-grain buried tool |
Country Status (9)
| Country | Link |
|---|---|
| JP (1) | JPS62292366A (en) |
| BG (1) | BG48504A1 (en) |
| CH (1) | CH673424A5 (en) |
| CS (1) | CS263700B1 (en) |
| DD (1) | DD273223A1 (en) |
| DE (1) | DE3716751A1 (en) |
| GB (1) | GB2191499B (en) |
| IT (1) | IT1218568B (en) |
| SU (1) | SU1556885A1 (en) |
Family Cites Families (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| DE481726C (en) * | 1927-06-06 | 1929-08-29 | Arthur Vonnez | Metallic guide body for loose, grainy abrasives as a tool for processing (sawing, cutting, drilling, etc.) of rock |
| DE735944C (en) * | 1938-02-09 | 1943-06-02 | Albert Strasmann Praez S Werkz | Procedure for restoring the profile of grinding wheels |
-
1986
- 1986-06-09 SU SU864070496A patent/SU1556885A1/en active
-
1987
- 1987-03-03 GB GB8704952A patent/GB2191499B/en not_active Expired - Fee Related
- 1987-03-06 CS CS871519A patent/CS263700B1/en unknown
- 1987-03-11 JP JP62054297A patent/JPS62292366A/en active Pending
- 1987-04-07 BG BG79219A patent/BG48504A1/en unknown
- 1987-04-14 IT IT41582/87A patent/IT1218568B/en active
- 1987-05-19 DE DE19873716751 patent/DE3716751A1/en not_active Withdrawn
- 1987-06-01 DD DD87303396A patent/DD273223A1/en not_active IP Right Cessation
- 1987-06-04 CH CH2112/87A patent/CH673424A5/de not_active IP Right Cessation
Also Published As
| Publication number | Publication date |
|---|---|
| IT1218568B (en) | 1990-04-19 |
| GB8704952D0 (en) | 1987-04-08 |
| GB2191499A (en) | 1987-12-16 |
| IT8741582A0 (en) | 1987-04-14 |
| CS263700B1 (en) | 1989-04-14 |
| DD273223A1 (en) | 1989-11-08 |
| CS151987A1 (en) | 1988-09-16 |
| CH673424A5 (en) | 1990-03-15 |
| SU1556885A1 (en) | 1990-04-15 |
| BG48504A1 (en) | 1991-03-15 |
| DE3716751A1 (en) | 1987-12-10 |
| GB2191499B (en) | 1990-04-04 |
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