JPS62287081A - Electroless plating solution - Google Patents
Electroless plating solutionInfo
- Publication number
- JPS62287081A JPS62287081A JP12896286A JP12896286A JPS62287081A JP S62287081 A JPS62287081 A JP S62287081A JP 12896286 A JP12896286 A JP 12896286A JP 12896286 A JP12896286 A JP 12896286A JP S62287081 A JPS62287081 A JP S62287081A
- Authority
- JP
- Japan
- Prior art keywords
- electroless plating
- plating solution
- magnetic film
- malate
- malonate
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
- 238000007772 electroless plating Methods 0.000 title claims abstract description 8
- DHMQDGOQFOQNFH-UHFFFAOYSA-N Glycine Chemical compound NCC(O)=O DHMQDGOQFOQNFH-UHFFFAOYSA-N 0.000 claims abstract description 12
- 239000004471 Glycine Substances 0.000 claims abstract description 6
- BFNBIHQBYMNNAN-UHFFFAOYSA-N ammonium sulfate Chemical compound N.N.OS(O)(=O)=O BFNBIHQBYMNNAN-UHFFFAOYSA-N 0.000 claims abstract description 5
- 229910052921 ammonium sulfate Inorganic materials 0.000 claims abstract description 5
- 235000011130 ammonium sulphate Nutrition 0.000 claims abstract description 5
- 150000001868 cobalt Chemical class 0.000 claims abstract description 4
- 239000008139 complexing agent Substances 0.000 claims abstract description 4
- 229940049920 malate Drugs 0.000 claims abstract description 4
- BJEPYKJPYRNKOW-UHFFFAOYSA-N malic acid Chemical compound OC(=O)C(O)CC(O)=O BJEPYKJPYRNKOW-UHFFFAOYSA-N 0.000 claims abstract description 4
- ACVYVLVWPXVTIT-UHFFFAOYSA-M phosphinate Chemical compound [O-][PH2]=O ACVYVLVWPXVTIT-UHFFFAOYSA-M 0.000 claims abstract description 3
- OFOBLEOULBTSOW-UHFFFAOYSA-L Malonate Chemical compound [O-]C(=O)CC([O-])=O OFOBLEOULBTSOW-UHFFFAOYSA-L 0.000 claims abstract 3
- 150000002815 nickel Chemical class 0.000 claims abstract 3
- 229910052751 metal Inorganic materials 0.000 claims description 2
- 239000002184 metal Substances 0.000 claims description 2
- 238000007747 plating Methods 0.000 abstract description 26
- 150000003839 salts Chemical class 0.000 abstract description 4
- KWSLGOVYXMQPPX-UHFFFAOYSA-N 5-[3-(trifluoromethyl)phenyl]-2h-tetrazole Chemical compound FC(F)(F)C1=CC=CC(C2=NNN=N2)=C1 KWSLGOVYXMQPPX-UHFFFAOYSA-N 0.000 abstract description 3
- 229910000361 cobalt sulfate Inorganic materials 0.000 abstract description 3
- 229940044175 cobalt sulfate Drugs 0.000 abstract description 3
- KTVIXTQDYHMGHF-UHFFFAOYSA-L cobalt(2+) sulfate Chemical compound [Co+2].[O-]S([O-])(=O)=O KTVIXTQDYHMGHF-UHFFFAOYSA-L 0.000 abstract description 3
- WPUMTJGUQUYPIV-JIZZDEOASA-L disodium (S)-malate Chemical compound [Na+].[Na+].[O-]C(=O)[C@@H](O)CC([O-])=O WPUMTJGUQUYPIV-JIZZDEOASA-L 0.000 abstract description 3
- 235000019265 sodium DL-malate Nutrition 0.000 abstract description 3
- 229910001379 sodium hypophosphite Inorganic materials 0.000 abstract description 3
- 239000001394 sodium malate Substances 0.000 abstract description 3
- PRWXGRGLHYDWPS-UHFFFAOYSA-L sodium malonate Chemical compound [Na+].[Na+].[O-]C(=O)CC([O-])=O PRWXGRGLHYDWPS-UHFFFAOYSA-L 0.000 abstract description 3
- LGQLOGILCSXPEA-UHFFFAOYSA-L nickel sulfate Chemical compound [Ni+2].[O-]S([O-])(=O)=O LGQLOGILCSXPEA-UHFFFAOYSA-L 0.000 abstract description 2
- 229910000363 nickel(II) sulfate Inorganic materials 0.000 abstract description 2
- -1 cobalt sulfate Chemical class 0.000 abstract 3
- 239000006174 pH buffer Substances 0.000 abstract 1
- 239000000243 solution Substances 0.000 description 20
- 230000000052 comparative effect Effects 0.000 description 9
- 239000000758 substrate Substances 0.000 description 6
- OKTJSMMVPCPJKN-UHFFFAOYSA-N Carbon Chemical compound [C] OKTJSMMVPCPJKN-UHFFFAOYSA-N 0.000 description 4
- VYZAMTAEIAYCRO-UHFFFAOYSA-N Chromium Chemical compound [Cr] VYZAMTAEIAYCRO-UHFFFAOYSA-N 0.000 description 4
- 229910052799 carbon Inorganic materials 0.000 description 4
- 230000001681 protective effect Effects 0.000 description 4
- VHUUQVKOLVNVRT-UHFFFAOYSA-N Ammonium hydroxide Chemical compound [NH4+].[OH-] VHUUQVKOLVNVRT-UHFFFAOYSA-N 0.000 description 3
- HEMHJVSKTPXQMS-UHFFFAOYSA-M Sodium hydroxide Chemical compound [OH-].[Na+] HEMHJVSKTPXQMS-UHFFFAOYSA-M 0.000 description 3
- 239000007864 aqueous solution Substances 0.000 description 3
- 229910052804 chromium Inorganic materials 0.000 description 3
- 239000011651 chromium Substances 0.000 description 3
- 238000010586 diagram Methods 0.000 description 3
- 230000001050 lubricating effect Effects 0.000 description 3
- 238000000034 method Methods 0.000 description 3
- 241000951471 Citrus junos Species 0.000 description 1
- QAOWNCQODCNURD-UHFFFAOYSA-L Sulfate Chemical compound [O-]S([O-])(=O)=O QAOWNCQODCNURD-UHFFFAOYSA-L 0.000 description 1
- 229910052782 aluminium Inorganic materials 0.000 description 1
- XAGFODPZIPBFFR-UHFFFAOYSA-N aluminium Chemical compound [Al] XAGFODPZIPBFFR-UHFFFAOYSA-N 0.000 description 1
- 239000011248 coating agent Substances 0.000 description 1
- 238000000576 coating method Methods 0.000 description 1
- 230000007423 decrease Effects 0.000 description 1
- 238000005137 deposition process Methods 0.000 description 1
- 230000000694 effects Effects 0.000 description 1
- 238000005516 engineering process Methods 0.000 description 1
- JYTUFVYWTIKZGR-UHFFFAOYSA-N holmium oxide Inorganic materials [O][Ho]O[Ho][O] JYTUFVYWTIKZGR-UHFFFAOYSA-N 0.000 description 1
- 239000000314 lubricant Substances 0.000 description 1
- 238000005259 measurement Methods 0.000 description 1
- 238000005498 polishing Methods 0.000 description 1
- 238000001556 precipitation Methods 0.000 description 1
- 235000011121 sodium hydroxide Nutrition 0.000 description 1
- 238000005478 sputtering type Methods 0.000 description 1
Classifications
-
- C—CHEMISTRY; METALLURGY
- C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
- C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
- C23C18/00—Chemical coating by decomposition of either liquid compounds or solutions of the coating forming compounds, without leaving reaction products of surface material in the coating; Contact plating
- C23C18/16—Chemical coating by decomposition of either liquid compounds or solutions of the coating forming compounds, without leaving reaction products of surface material in the coating; Contact plating by reduction or substitution, e.g. electroless plating
- C23C18/31—Coating with metals
- C23C18/32—Coating with nickel, cobalt or mixtures thereof with phosphorus or boron
- C23C18/34—Coating with nickel, cobalt or mixtures thereof with phosphorus or boron using reducing agents
- C23C18/36—Coating with nickel, cobalt or mixtures thereof with phosphorus or boron using reducing agents using hypophosphites
Abstract
Description
【発明の詳細な説明】
３発明の詳細な説明
〔産業上の利用分野〕
本発明は、磁気ディスク、磁気ドラム等の磁気記録媒体
を作製するために使われる無電解メッキ液に関するもの
である。Detailed Description of the Invention 3. Detailed Description of the Invention [Field of Industrial Application] The present invention relates to an electroless plating solution used for producing magnetic recording media such as magnetic disks and magnetic drums.
磁気ディスク等の磁気記録媒体の製造方法昏こは塗布タ
イプ、メッキタイプ、スパッタタイプがあるが、高記録
密度の可能性、大量生産性の２点からメッキタイプの磁
気ディスクが注目されているこの記録密度の改良のため
に、柚々のメッキ浴が開発され実用化されている。There are coating types, plating types, and sputtering types of magnetic recording media such as magnetic disks, but plating type magnetic disks are attracting attention because of the possibility of high recording density and mass productivity. In order to improve recording density, a plating bath for Yuzu has been developed and put into practical use.
磁気記録媒体の記録密度を向上させるには、媒体ノイズ
を小さクシ、記録密度を高くした時に出力を大きくする
必要がある。In order to improve the recording density of a magnetic recording medium, it is necessary to reduce the medium noise and increase the output when the recording density is increased.
しかし、メッキ可能な限られた元素の組み合わせで、媒
体ノイズの小さい磁性膜をつくることはむつかしく、ノ
イズ特性を大きく改良できないのが現状であった。However, it is difficult to create a magnetic film with low media noise using a limited combination of elements that can be plated, and the current situation is that the noise characteristics cannot be significantly improved.
本発明の目的は、このメッキ磁性膜の媒体ノイズが小さ
い磁性膜を提供することにある。An object of the present invention is to provide a plated magnetic film with low medium noise.
本発明は、コバルト塩０．０５〜ＣＬ １０ ｍｏｆｌ
Ｉ、 。The present invention provides cobalt salt 0.05 to CL 10 mofl
I.
二ｙケル塩０．０１〜０．０５ ｍｏｌｔ／Ｉｔ 、次
亜リン酸塩（ＬＯ３〜α３０ ｍｏｉ、／ｉ、、 ｌ：
’ Ｈ緩衝剤として硫酸アンモニウム０．０１〜０．３
ｍｏｊｌ／Ｉｔ 、前記金属塩の錯化剤としてマレン
酸塩１１〜（Ｌ ６ ｍａｎ／１２． ｔリンゴ酸塩Ｑ
、１〜α６ ｍｏｌ／１１ 、グリシンα２〜０．６
ｍｏｌ！／Ｉｔ を含むことを特徴としている。Dikel salt 0.01-0.05 mol/It, hypophosphite (LO3-α30 moi, /i,, l:
' Ammonium sulfate 0.01-0.3 as H buffer
mojl/It, malate Q as complexing agent for the metal salt.
, 1~α6 mol/11, glycine α2~0.6
Mol! It is characterized by containing /It.
本発明者は、メッキ磁性膜の媒体ノイズは、磁性膜の初
期析出過程に依存していることを見い出した。The inventors have found that the medium noise of a plated magnetic film depends on the initial deposition process of the magnetic film.
本発明のメッキ液の特徴は第１図に示すように磁性膜の
厚みが大きくなるに従い保磁力Ｈｅが大きくなることに
ある。従来のメッキ液は第２図に示すように、磁性膜の
厚みが大きくなるに従い保磁力Ｈｃが小さくなっている
。A feature of the plating solution of the present invention is that, as shown in FIG. 1, the coercive force He increases as the thickness of the magnetic film increases. As shown in FIG. 2, in the conventional plating solution, the coercive force Hc decreases as the thickness of the magnetic film increases.
従来のメッキ液による磁性膜は、析出初期において、高
Ｈｃとなり、この高Ｈｅ部が磁性膜が厚く成長しても膜
内に残り、ノイズの原因となる。A magnetic film formed using a conventional plating solution has a high Hc level at the initial stage of precipitation, and even if the magnetic film grows thick, this high He portion remains within the film and causes noise.
本発明のメッキ液による磁性膜の場合は、磁性膜が成長
しても膜内に高Ｈｅ部が存在しないため媒体ノイズが小
さくなっていると推測される。In the case of a magnetic film formed using the plating solution of the present invention, it is presumed that even if the magnetic film grows, there is no high He part in the film, so that the medium noise is reduced.
以下、本発明について実施例に基づき詳細に説明する。Hereinafter, the present invention will be described in detail based on examples.
〔比較例１〕
アルミの五５インチ円型基板に、無電解ＮＬＰメッキに
よってＮＬＰを３０μｍ形成し、研摩機によりて鏡面研
摩した。この上に
のメッキ液をつくり、苛性ソーダでＰＨを９４に調整し
た。このメッキ液を７５℃で加温し、上記鏡面基板に
ＨＣ６５００ｅ のメッキ磁性膜を７００裏の厚さで形
成した。第６図α）はこのメッキ液での、各磁性膜の厚
さとＨｅの関係である。この後、保護、潤滑膜としてク
ロム（１００Ｘ）カーボン（４００ｉ）を形成した。[Comparative Example 1] NLP was formed to a thickness of 30 μm on a 55-inch circular aluminum substrate by electroless NLP plating, and mirror-polished using a polishing machine. A plating solution was prepared on top of this, and the pH was adjusted to 94 with caustic soda. This plating solution was heated to 75°C and applied to the mirror substrate.
A plated magnetic film of HC6500e was formed to a thickness of 700mm. Figure 6 α) shows the relationship between the thickness of each magnetic film and He using this plating solution. Thereafter, chromium (100X) carbon (400i) was formed as a protective and lubricating film.
この基板に、ミニモノリシックヘッドを用いて２５ＭＩ
（Ｚの信号を書き込み、０〜６ＭＨ２の周波数領域で２
．５ＭＨｚと５ＭＨｚを除いた実効電圧を測定し、この
ノイズレベルから測迦系のシステムノイズを引いたもの
を媒体ノイズとした。この結果ＳＮ比は一２８ｄＢであ
った。This board uses a mini monolithic head to produce 25 MI
(Write the Z signal and write 2 in the frequency range of 0 to 6MH2.
．． The effective voltage at 5 MHz and excluding 5 MHz was measured, and the medium noise was obtained by subtracting the system noise of the measurement system from this noise level. As a result, the SN ratio was -28 dB.
〔実施例１〕 比較例１と同様の方法で鏡面基板を得た。[Example 1] A mirror substrate was obtained in the same manner as in Comparative Example 1.
この上に
のメッキ液をつくり、アンモニア水溶液でＰＨを９０に
調整した。このメッキ液を７５℃に加温し、上記鏡面基
板に Ｈｃ６４０．のメッキ磁性膜を７００１の厚さで
形成し、比較例１と同じくり四ムカーボンの保護潤滑膜
を形成後同様の手段で媒体ノイズを測定した。媒体ノイ
ズは一３４０ｄＢであった。A plating solution was prepared on top of this, and the pH was adjusted to 90 with an ammonia aqueous solution. This plating solution was heated to 75°C, and Hc640. A plated magnetic film with a thickness of 7001 mm was formed, and a protective lubricant film of 4M carbon was formed in the same manner as in Comparative Example 1, and the medium noise was measured using the same method. Media noise was -340 dB.
第３図ｂ）はこのメッキ液での、磁性膜の厚さとＨｃの
関係である。Figure 3b) shows the relationship between the thickness of the magnetic film and Hc using this plating solution.
〔実施例２〕 比較例１と同様の方法で鏡面基板を得た。[Example 2] A mirror substrate was obtained in the same manner as in Comparative Example 1.
この上に、
硫酸コバルト ０．０８ ｍａｉｌ／ｆＬ硫酸
ニッケル ０．０２ ｍｏｆｉ／ｊ２マロン酸
ナトリウム ０．２０ ｍｏｌ／１１リンゴ酸ナトリ
ウム ０．４０ ｍａｌｔ７！グリシン
０．３０ ｍｏｆｌ、／ＩＩ。On top of this, Cobalt sulfate 0.08 mail/fL Nickel sulfate 0.02 mofi/j2 Sodium malonate 0.20 mol/11 Sodium malate 0.40 malt7! glycine
0.30 mofl, /II.
硫酸アンモニウム ０．１０ ｍｏｌ／Ａ次亜リン
酸ナトリウム ０．３０ ｍｏｆ）、７Ｑｌのメッキ液
をつくり、アンモニア水溶液でＰＨａ８に調整した。こ
のメッキ液を７５℃に加温し、上記鏡面基板に、Ｈｏ７
Ｏ０のメッキ磁性膜を７００又の厚さで形成し、比較例
１と同じくクロム・カーボンの保護・潤滑膜を形成後、
同様の手段で媒体ノイズ測定した。媒体ノイズは一３五
５ ｄＢ であった。A plating solution containing 7Ql of ammonium sulfate (0.10 mol/A sodium hypophosphite 0.30 mof) was prepared, and the PHa was adjusted to 8 with an ammonia aqueous solution. This plating solution was heated to 75°C, and Ho7
After forming a plating magnetic film of O0 with a thickness of 700 mm and forming a protective and lubricating film of chromium and carbon as in Comparative Example 1,
Media noise was measured using the same method. Media noise was -355 dB.
〔実施例３〕
比較例１と同様の方法で鏡面基板を得た。この上に
硫酸コバルト ０．０８ ｍｏぷ／２硫酸ニッ
ケル ０．０２ ｍｏＪ２μマロン酸ナトリウ
ム ０．３０ ｍａｉｌ／Ｉｔリンゴ酸ナトリウム
０．３０ ｍｏｌ／Ｉｔグリシン０．２５ ｍｏｆｌ
、／ｆｔ
硫酸アンモニウム ０．２ ｍｏｌ／Ａ次亜リン
酸ナトリウム ｌ ２ ｍａｉｌ／ｆｌ。[Example 3] A mirror substrate was obtained in the same manner as in Comparative Example 1. On top of this, cobalt sulfate 0.08 mop/2nickel sulfate 0.02 moJ2μ sodium malonate 0.30 mail/It sodium malate
0.30 mol/It glycine 0.25 mofl
,/ft ammonium sulfate 0.2 mol/A sodium hypophosphite l 2 mail/fl.
のメッキ液をつくり、アンモニア水溶液でＰＨ９２に調
整した。このメッキ液を７５℃に加温し、上記鏡面基板
に、Ｈｏ２Ｏ３のメッキ磁性膜を７００′にの厚さで形
成し、比較例１と同じくクロム・カーボンの保護・潤滑
膜を形成後、同様の手段で媒体ノイズを測定した。媒体
ノイズは一３５ｄＢ であった。A plating solution was prepared and the pH was adjusted to 92 with an ammonia aqueous solution. This plating solution was heated to 75°C, and a plating magnetic film of Ho2O3 was formed on the mirror substrate to a thickness of 700'. After forming a protective and lubricating film of chromium and carbon in the same manner as in Comparative Example 1, Media noise was measured using the following method. Media noise was -35 dB.
以上、実施例と比較例かられかるように、本発―のメッ
キ液から得られる磁性膜は、媒体ノイズが小さく、高記
録密度に適したものである。As can be seen from the Examples and Comparative Examples above, the magnetic film obtained from the plating solution of the present invention has low medium noise and is suitable for high recording density.
第１図は、本発明のメッキ液を用いた場合の磁性膜厚さ
とＨｃの関係の図。
第２図は、従来のメッキ液を用いた場合の磁性膜厚さと
Ｈｃの関係の図。
第６図は、磁性膜厚さとＨｅの関係の図。
α）比較例のメッキ液の場合
ｈ）実施例１のメッキ液の場合
（Ｊ） ’Ｈら？ｐ？
（、ン １１ ｃｚ＠。
（τＱ）つ１−Ｉｆより′FIG. 1 is a diagram showing the relationship between magnetic film thickness and Hc when the plating solution of the present invention is used. FIG. 2 is a diagram showing the relationship between magnetic film thickness and Hc when a conventional plating solution is used. FIG. 6 is a diagram showing the relationship between magnetic film thickness and He. α) In the case of the plating solution of comparative example h) In the case of the plating solution of Example 1 (J) 'H et al? p?
(, n 11 cz@. (τQ) from 1-If'
Claims (1)
０．０１〜０．０５ｍｏｌ／ｌ、次亜リン酸塩０．０３
〜０．３０ｍｏｌ／ｌ、硫酸アンモニウム０．０１〜０
．３ｍｏｌ／ｌ、前記金属の錯化剤としてマロン酸塩０
．１〜０．６ｍｏｌ／ｌ、リンゴ酸塩０．１〜０．６ｍ
ｏｌ／ｌ、グリシン０．２〜０．６ｍｏｌ／ｌを含むこ
とを特徴とする無電解メッキ液。Cobalt salt 0.05-0.10 mol/l, nickel salt 0.01-0.05 mol/l, hypophosphite 0.03
~0.30mol/l, ammonium sulfate 0.01~0
．． 3 mol/l, 0 malonate as a complexing agent for the metal.
．． 1-0.6 mol/l, malate 0.1-0.6 m
An electroless plating solution characterized by containing 0.2 to 0.6 mol/l of glycine.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP12896286A JPS62287081A (en) | 1986-06-03 | 1986-06-03 | Electroless plating solution |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP12896286A JPS62287081A (en) | 1986-06-03 | 1986-06-03 | Electroless plating solution |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| JPS62287081A true JPS62287081A (en) | 1987-12-12 |
Family
ID=14997719
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP12896286A Pending JPS62287081A (en) | 1986-06-03 | 1986-06-03 | Electroless plating solution |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPS62287081A (en) |
Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| EP1022770A2 (en) * | 1999-01-22 | 2000-07-26 | Sony Corporation | Method and apparatus for plating and plating structure |
| US7223695B2 (en) | 2004-09-30 | 2007-05-29 | Intel Corporation | Methods to deposit metal alloy barrier layers |
-
1986
- 1986-06-03 JP JP12896286A patent/JPS62287081A/en active Pending
Cited By (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| EP1022770A2 (en) * | 1999-01-22 | 2000-07-26 | Sony Corporation | Method and apparatus for plating and plating structure |
| EP1022770A3 (en) * | 1999-01-22 | 2000-12-06 | Sony Corporation | Method and apparatus for plating and plating structure |
| US6555158B1 (en) | 1999-01-22 | 2003-04-29 | Sony Corporation | Method and apparatus for plating, and plating structure |
| US7223695B2 (en) | 2004-09-30 | 2007-05-29 | Intel Corporation | Methods to deposit metal alloy barrier layers |
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