JPS62251608A - Inspecting method for packaging state of printed circuit board parts - Google Patents
Inspecting method for packaging state of printed circuit board partsInfo
- Publication number
- JPS62251608A JPS62251608A JP61096450A JP9645086A JPS62251608A JP S62251608 A JPS62251608 A JP S62251608A JP 61096450 A JP61096450 A JP 61096450A JP 9645086 A JP9645086 A JP 9645086A JP S62251608 A JPS62251608 A JP S62251608A
- Authority
- JP
- Japan
- Prior art keywords
- printed circuit
- circuit board
- mark
- parts
- image
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
- 238000000034 method Methods 0.000 title claims description 15
- 238000004806 packaging method and process Methods 0.000 title abstract 3
- 238000005286 illumination Methods 0.000 claims abstract description 5
- 238000001454 recorded image Methods 0.000 claims description 2
- 238000007689 inspection Methods 0.000 abstract description 10
- 238000010586 diagram Methods 0.000 description 11
- 238000005516 engineering process Methods 0.000 description 2
- 239000003086 colorant Substances 0.000 description 1
- 230000003247 decreasing effect Effects 0.000 description 1
- 230000000694 effects Effects 0.000 description 1
- 230000010354 integration Effects 0.000 description 1
- 238000002844 melting Methods 0.000 description 1
- 230000008018 melting Effects 0.000 description 1
- 239000000203 mixture Substances 0.000 description 1
- 230000001629 suppression Effects 0.000 description 1
Landscapes
- Length Measuring Devices By Optical Means (AREA)
- Supply And Installment Of Electrical Components (AREA)
Abstract
Description
【発明の詳細な説明】
〔概要〕
プリント基板の部品実装面に、部品の平面的な輪郭より
も若干小さくかつプリント基板に対しコントラストの良
好な色のマークを印刷して、このマーク部分にそれぞれ
部品を実装した状態で、テレビカメラ等で実装状態を検
査することによって、実装部品の有無、取付位置違いを
簡易に検査することができる。[Detailed Description of the Invention] [Summary] A mark is printed on the component mounting surface of the printed circuit board, which is slightly smaller than the planar outline of the component and has a color that contrasts well with the printed circuit board. By inspecting the mounting state with a television camera or the like while the components are mounted, it is possible to easily inspect the presence or absence of the mounted components and the incorrect mounting position.
本発明は、プリント基板部品実装状態の検査方法に藺す
る。The present invention is directed to a method of inspecting a printed circuit board component mounting state.
近年、電子装置のユニットを構成するプリント基板は、
実装される電子部品の高密度集積化技術の驚異的な進展
に伴ない小形化され、益々高密度実装されつつあること
は周知である。したがってこれら高密度実装されたプリ
ント基板の部品実装状態を検査する方法の出現が強（要
望されている。In recent years, the printed circuit boards that make up the units of electronic devices are
It is well known that electronic components to be mounted are being miniaturized and increasingly densely packaged with the amazing progress in high-density integration technology. Therefore, there is a strong demand for a method for inspecting the state of component mounting on printed circuit boards that are mounted at high density.
従来のプリント基板における実装部品の自動検査方法は
、プリント基板に実装された部品の輪郭をテレビカメラ
等で収録し、これを画像処理して実装部品の有無１位置
違いを判定する方法が行なわれている。The conventional automatic inspection method for components mounted on printed circuit boards records the contours of components mounted on printed circuit boards using a television camera, etc., and processes this image to determine whether there are components mounted or not. ing.
上記従来の検査方法にあっては、プリント基板面に実装
する部品には明るい色、暗い色が種々混在して実装され
るので、暗い色の部品に帯してはプリント基板とのコン
トラストが悪いために、検査の信頼性が低下するといっ
た問題点があった。In the conventional inspection method described above, components mounted on the printed circuit board surface are a mixture of bright and dark colors, so dark colored components have poor contrast with the printed circuit board. Therefore, there was a problem that the reliability of the test decreased.
本発明は、上記の問題点を解決して部品実装状態の検査
を確実に行えるようにしたプリント基板部品実装状態の
検査方法を提供するものである。The present invention solves the above-mentioned problems and provides a method for inspecting a printed circuit board component mounting state that can reliably inspect a component mounting state.
すなわち、プリント基板の実装面に、該実装面に実装さ
れるべき部品の輪郭よりも若干小さい外形のマークを印
刷し、このマークを印刷した部分にそれぞれの部品を実
装した前記プリント基板に、照明光を投光して、部品の
実装状態をテレビカメラで収録し、この収録した画像を
２値化して画像記憶装置に格納し、この画像記憶装置の
画像情報により部品の実装状態を検出することによって
解決される。That is, a mark with an outline slightly smaller than the contour of the component to be mounted on the mounting surface of the printed circuit board is printed on the mounting surface of the printed circuit board, and the illumination is applied to the printed circuit board on which each component is mounted on the part where this mark is printed. Projecting light and recording the mounting state of the component with a television camera, converting the recorded image into a binary value and storing it in an image storage device, and detecting the mounting state of the component using the image information in this image storage device. solved by.
〔作用〕
上記プリント基板部品実装状態の検査方法は、プリント
基板の部品実装面に部品の輪郭よりも若干小さいマーク
を印刷して、このマーク部に部品を実装するので、マー
クの画像が見えなければ所定の部品が実装しであること
が分り、マークの一部分が見えれば実装部品が位置ずれ
していることになり、検査が確実に行なえる。[Operation] The above method for inspecting the printed circuit board component mounting state prints a mark that is slightly smaller than the outline of the component on the component mounting surface of the printed circuit board, and mounts the component on this mark, so the image of the mark must be visible. If a part of the mark is visible, it means that the mounted component has been displaced, and inspection can be performed reliably.
第１図は、本発明の一実施例を説明するプリント基板の
要部斜視図である。FIG. 1 is a perspective view of essential parts of a printed circuit board illustrating an embodiment of the present invention.
図において、部品３を実装するプリント基板１に、その
個所に実装されるべき部品３の輪郭よりも若干小さく、
かつプリント基板１に対しコントラストの良好な色たと
えば白色（プリント基板ｌが暗い色である場合）のマー
ク２を印刷したものである。In the figure, the printed circuit board 1 on which the component 3 is mounted is slightly smaller than the outline of the component 3 to be mounted at that location.
Further, a mark 2 is printed on the printed circuit board 1 in a color with good contrast, for example, white (when the printed circuit board 1 is a dark color).
第２図は、本発明の部品実装状態の検査方法を通用した
構成図で、第１図と同等の部分については同一符号を付
している。FIG. 2 is a block diagram showing a configuration in which the component mounting state inspection method of the present invention is applied, and parts equivalent to those in FIG. 1 are given the same reference numerals.
図において、部品３の実装されたプリント基板ｌを、コ
ントローラ１０により駆動制御されるステージ４に載置
する。そうしてプリント基板１に照明光５を投光した状
態で、テレビカメラ６でプリント基板１の画像を収録し
、この画像を２値化回路７で２値化（マーク２の有無を
０，１で表示）した画像情報を画像記憶装置８に格納し
て、この格納された画像情報をプロセッサ９で処理する
と、部品３の実装状態は後述の第２図で示すように検出
される。処理が終わるとプリント基板ｌを載置したステ
ージ４はコントローラｌＯでＸ、Ｙ軸に制御され順次移
動して検査される。In the figure, a printed circuit board 1 on which a component 3 is mounted is placed on a stage 4 whose drive is controlled by a controller 10 . Then, with the illumination light 5 projected onto the printed circuit board 1, an image of the printed circuit board 1 is recorded by a television camera 6, and this image is binarized by a binarization circuit 7 (the presence or absence of mark 2 is set to 0, When the image information displayed at 1) is stored in the image storage device 8 and the stored image information is processed by the processor 9, the mounting state of the component 3 is detected as shown in FIG. 2, which will be described later. When the processing is completed, the stage 4 on which the printed circuit board 1 is placed is controlled in the X and Y axes by the controller 10, and is sequentially moved and inspected.
第３図は、本発明方法を適用して検出した処理情報を説
明する図で、同図（ａ）は部品を実装したプリント基板
の要部斜視図、（ｂ）は正常実装状態の図。FIG. 3 is a diagram illustrating processing information detected by applying the method of the present invention, in which (a) is a perspective view of a main part of a printed circuit board on which components are mounted, and (b) is a diagram of a normally mounted state.
（Ｃ１は部品の実装されていない（欠品）状態の図。(C1 is a diagram of a state in which parts are not mounted (missing items).
（ｄ）は取付位置の違った状態の図で、第１図と同等の
部分については同一符号を付している。(d) is a diagram showing a different mounting position, and parts equivalent to those in FIG. 1 are given the same reference numerals.
図において、プリント基板１にマーク２を印刷した部分
に、部品３を実装した状態で第１図で説明した実装部品
検査システムの画像処理エリアを限定するために、２ケ
所にマーク２に対応するウィンドウ１１．１２を設けて
画像を処理すると、正常に部品３が実装されている場合
は第２図０１１）の如くマーク２は部品３に隠れて見え
ないが、部品３が実装されていない（欠品）場合は、第
２図（Ｃ）の如くマーク２が見える。In the figure, in order to limit the image processing area of the mounted component inspection system explained in FIG. 1 with a component 3 mounted on the printed circuit board 1 where mark 2 is printed, there are two locations corresponding to mark 2. When the image is processed using windows 11 and 12, if part 3 is mounted normally, mark 2 is hidden behind part 3 and cannot be seen as shown in Fig. 2 (011), but if part 3 is not mounted ( If the item is out of stock, mark 2 will be visible as shown in Figure 2 (C).
ところが、部品３は実装されているが第２図（ｄ）の如
くマーク２の一部が見えている場合は、部品３は実装さ
れているが、部品３の実装位置違いでマーク２の一部が
部品３がらはみ出して見えている。However, if part 3 is mounted but part of mark 2 is visible as shown in Figure 2(d), part 3 is mounted, but part 2 of mark 2 is not aligned with the mounting position of part 3. Part 3 is seen sticking out.
なお、本実施例では実装部品検査システムをテレビカメ
ラで収録した画像を２値化回路で２値化（マーク２の有
無を０．１に変換）して画像を処理する説明をしたが、
２値化回路によらず、テレビカメラの画像を表示管に接
続してを直接画面に表示する検査方法であっても構わな
い。In addition, in this embodiment, the mounted component inspection system has been described in which an image recorded by a television camera is binarized by a binarization circuit (the presence or absence of mark 2 is converted to 0.1) and the image is processed.
Instead of using a binarization circuit, an inspection method may be used in which images from a television camera are connected to a display tube and displayed directly on a screen.
以上の説明から明らかなように、本発明によればプリン
ト基板の部品の実装状態が確実に行なわれるので、信頼
性が向上し、プリント基板の自動検査等に通用して極め
て有効である。As is clear from the above description, according to the present invention, components on a printed circuit board can be reliably mounted, improving reliability and being extremely effective in automatic inspection of printed circuit boards.
第１図は、本発明の一実施例を説明するプリント基板の
要部斜視図、
第２図は、本発明の部品実装状態の検査方法を適用した
構成図、
第３図は、本発明方法を適用して検出した処理情報を説
明する図で、同図（ａｌは部品を実装したプリント基板
の要部斜視図、（ｂ）は正常実装状態の図。
ｆｃ）は部品の実装されていない（欠品）状態の図。
ｆｄ）は取付位置の違った状態の図である。
図において、■はプリント基板、２はマーク、３は部品
、４はステージ、５は照明光、６はテレビカメラ、７は
２値化回路、８は画像記憶装置、９はプロセッサ、１０
はコントローラ、１１．１２はウィンドウ、をそれぞれ
示す。
アリ〉し蓼看し＝＝ｆ？溶噂−→晃国
第１図
ｊＩＰ岳欠装欣′東／）澹棄オ小譚へ図第２図
奮Ｔ品６突芯しｈ粛り糾伐■
（Ｑ）FIG. 1 is a perspective view of the main parts of a printed circuit board illustrating an embodiment of the present invention, FIG. 2 is a configuration diagram to which the component mounting state inspection method of the present invention is applied, and FIG. 3 is a method of the present invention. This is a diagram explaining the processing information detected by applying the method. (al is a perspective view of the main part of the printed circuit board with components mounted, (b) is a diagram of the normal mounting state. fc) is a diagram of the printed circuit board with no components mounted. (Out of stock) condition diagram. fd) is a diagram showing a different mounting position. In the figure, ■ is a printed circuit board, 2 is a mark, 3 is a component, 4 is a stage, 5 is an illumination light, 6 is a television camera, 7 is a binarization circuit, 8 is an image storage device, 9 is a processor, 10
indicates a controller, and 11.12 indicates a window. Ali〉 and look at the table == f? Melting rumors - → Akikoku 1st figure jIP Gakechisou kin' East/) To the deserted o story 2nd figure Struggle T product 6 thrust and h suppression ■ (Q)
Claims (1)
るべき部品（３）の輪郭よりも小さい外形のマーク（２
）を印刷し、該マーク（２）の部分にそれぞれ部品（３
）を実装した前記プリント基板（１）に照明光（５）を
投光して、テレビカメラ（６）で収録し、該収録した画
像を画像記憶装置（８）に格納し、該画像記憶装置（８
）の画像情報により部品（３）の実装状態を検出するこ
とを特徴とするプリント基板実装部品状態の検査方法。A mark (2) with an outline smaller than the outline of the component (3) to be mounted on the mounting surface of the printed circuit board (1) is placed on the mounting surface of the printed circuit board (1).
), and place each part (3) on the mark (2).
) is mounted on the printed circuit board (1), the illumination light (5) is recorded by the television camera (6), the recorded image is stored in the image storage device (8), and the image storage device (8
1. A method for inspecting the state of a printed circuit board mounted component, characterized in that the state of the component (3) is detected based on image information of (3).
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP61096450A JPS62251608A (en) | 1986-04-24 | 1986-04-24 | Inspecting method for packaging state of printed circuit board parts |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP61096450A JPS62251608A (en) | 1986-04-24 | 1986-04-24 | Inspecting method for packaging state of printed circuit board parts |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| JPS62251608A true JPS62251608A (en) | 1987-11-02 |
Family
ID=14165355
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP61096450A Pending JPS62251608A (en) | 1986-04-24 | 1986-04-24 | Inspecting method for packaging state of printed circuit board parts |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPS62251608A (en) |
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| GB2387433A (en) * | 2002-04-08 | 2003-10-15 | Edward Pryor And Son Ltd | Integrated marking system with optical verification camera |
-
1986
- 1986-04-24 JP JP61096450A patent/JPS62251608A/en active Pending
Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| GB2387433A (en) * | 2002-04-08 | 2003-10-15 | Edward Pryor And Son Ltd | Integrated marking system with optical verification camera |
| GB2387433B (en) * | 2002-04-08 | 2005-11-09 | Edward Pryor And Son Ltd | Improved marking system |
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