JPS62239591A - Manufacture of printed wiring board - Google Patents
Manufacture of printed wiring boardInfo
- Publication number
- JPS62239591A JPS62239591A JP8229286A JP8229286A JPS62239591A JP S62239591 A JPS62239591 A JP S62239591A JP 8229286 A JP8229286 A JP 8229286A JP 8229286 A JP8229286 A JP 8229286A JP S62239591 A JPS62239591 A JP S62239591A
- Authority
- JP
- Japan
- Prior art keywords
- hole
- printed wiring
- wiring board
- substrate
- plating
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
- 238000004519 manufacturing process Methods 0.000 title claims description 9
- 238000000034 method Methods 0.000 claims description 33
- 239000000758 substrate Substances 0.000 claims description 32
- 239000004020 conductor Substances 0.000 claims description 17
- 238000007772 electroless plating Methods 0.000 claims description 13
- 239000003054 catalyst Substances 0.000 claims description 12
- 229910052751 metal Inorganic materials 0.000 claims description 8
- 239000002184 metal Substances 0.000 claims description 8
- 239000003638 chemical reducing agent Substances 0.000 claims description 5
- 239000010410 layer Substances 0.000 description 19
- 238000007747 plating Methods 0.000 description 15
- 238000000576 coating method Methods 0.000 description 8
- 239000003795 chemical substances by application Substances 0.000 description 7
- RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical compound [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 description 6
- 239000011248 coating agent Substances 0.000 description 6
- 229910052802 copper Inorganic materials 0.000 description 6
- 239000010949 copper Substances 0.000 description 6
- 229920001971 elastomer Polymers 0.000 description 6
- 239000011521 glass Substances 0.000 description 6
- 239000005060 rubber Substances 0.000 description 6
- 239000012790 adhesive layer Substances 0.000 description 5
- 230000015572 biosynthetic process Effects 0.000 description 5
- CURLTUGMZLYLDI-UHFFFAOYSA-N Carbon dioxide Chemical compound O=C=O CURLTUGMZLYLDI-UHFFFAOYSA-N 0.000 description 4
- XEEYBQQBJWHFJM-UHFFFAOYSA-N Iron Chemical compound [Fe] XEEYBQQBJWHFJM-UHFFFAOYSA-N 0.000 description 4
- PXHVJJICTQNCMI-UHFFFAOYSA-N Nickel Chemical compound [Ni] PXHVJJICTQNCMI-UHFFFAOYSA-N 0.000 description 4
- 238000005553 drilling Methods 0.000 description 4
- 239000002923 metal particle Substances 0.000 description 4
- 239000000203 mixture Substances 0.000 description 4
- -1 polyethylene Polymers 0.000 description 4
- XLYOFNOQVPJJNP-UHFFFAOYSA-N water Substances O XLYOFNOQVPJJNP-UHFFFAOYSA-N 0.000 description 4
- FBPFZTCFMRRESA-FSIIMWSLSA-N D-Glucitol Chemical group OC[C@H](O)[C@H](O)[C@@H](O)[C@H](O)CO FBPFZTCFMRRESA-FSIIMWSLSA-N 0.000 description 3
- 239000004593 Epoxy Substances 0.000 description 3
- 239000000654 additive Substances 0.000 description 3
- 230000000996 additive effect Effects 0.000 description 3
- KRKNYBCHXYNGOX-UHFFFAOYSA-N citric acid Chemical compound OC(=O)CC(O)(C(O)=O)CC(O)=O KRKNYBCHXYNGOX-UHFFFAOYSA-N 0.000 description 3
- KPVWDKBJLIDKEP-UHFFFAOYSA-L dihydroxy(dioxo)chromium;sulfuric acid Chemical compound OS(O)(=O)=O.O[Cr](O)(=O)=O KPVWDKBJLIDKEP-UHFFFAOYSA-L 0.000 description 3
- 238000005530 etching Methods 0.000 description 3
- 239000007788 liquid Substances 0.000 description 3
- ISWSIDIOOBJBQZ-UHFFFAOYSA-N phenol group Chemical group C1(=CC=CC=C1)O ISWSIDIOOBJBQZ-UHFFFAOYSA-N 0.000 description 3
- 150000003839 salts Chemical class 0.000 description 3
- 239000000600 sorbitol Chemical group 0.000 description 3
- NLHHRLWOUZZQLW-UHFFFAOYSA-N Acrylonitrile Chemical compound C=CC#N NLHHRLWOUZZQLW-UHFFFAOYSA-N 0.000 description 2
- 241000219122 Cucurbita Species 0.000 description 2
- 235000009852 Cucurbita pepo Nutrition 0.000 description 2
- VEXZGXHMUGYJMC-UHFFFAOYSA-N Hydrochloric acid Chemical compound Cl VEXZGXHMUGYJMC-UHFFFAOYSA-N 0.000 description 2
- NBIIXXVUZAFLBC-UHFFFAOYSA-N Phosphoric acid Chemical compound OP(O)(O)=O NBIIXXVUZAFLBC-UHFFFAOYSA-N 0.000 description 2
- WGLPBDUCMAPZCE-UHFFFAOYSA-N Trioxochromium Chemical compound O=[Cr](=O)=O WGLPBDUCMAPZCE-UHFFFAOYSA-N 0.000 description 2
- 239000000853 adhesive Substances 0.000 description 2
- 230000001070 adhesive effect Effects 0.000 description 2
- 150000004056 anthraquinones Chemical class 0.000 description 2
- 239000001569 carbon dioxide Substances 0.000 description 2
- 229910002092 carbon dioxide Inorganic materials 0.000 description 2
- 238000007796 conventional method Methods 0.000 description 2
- ORTQZVOHEJQUHG-UHFFFAOYSA-L copper(II) chloride Chemical compound Cl[Cu]Cl ORTQZVOHEJQUHG-UHFFFAOYSA-L 0.000 description 2
- 238000007766 curtain coating Methods 0.000 description 2
- 238000007598 dipping method Methods 0.000 description 2
- 239000003822 epoxy resin Substances 0.000 description 2
- PCHJSUWPFVWCPO-UHFFFAOYSA-N gold Chemical compound [Au] PCHJSUWPFVWCPO-UHFFFAOYSA-N 0.000 description 2
- 229910052737 gold Inorganic materials 0.000 description 2
- 239000010931 gold Substances 0.000 description 2
- 229910052742 iron Inorganic materials 0.000 description 2
- 159000000014 iron salts Chemical class 0.000 description 2
- 239000000463 material Substances 0.000 description 2
- 229910052759 nickel Inorganic materials 0.000 description 2
- 230000010355 oscillation Effects 0.000 description 2
- 230000003647 oxidation Effects 0.000 description 2
- 238000007254 oxidation reaction Methods 0.000 description 2
- PIBWKRNGBLPSSY-UHFFFAOYSA-L palladium(II) chloride Chemical compound Cl[Pd]Cl PIBWKRNGBLPSSY-UHFFFAOYSA-L 0.000 description 2
- 239000005011 phenolic resin Substances 0.000 description 2
- BASFCYQUMIYNBI-UHFFFAOYSA-N platinum Chemical compound [Pt] BASFCYQUMIYNBI-UHFFFAOYSA-N 0.000 description 2
- 229920000647 polyepoxide Polymers 0.000 description 2
- 239000011347 resin Substances 0.000 description 2
- 229920005989 resin Polymers 0.000 description 2
- SQGYOTSLMSWVJD-UHFFFAOYSA-N silver(1+) nitrate Chemical compound [Ag+].[O-]N(=O)=O SQGYOTSLMSWVJD-UHFFFAOYSA-N 0.000 description 2
- 238000005406 washing Methods 0.000 description 2
- TXUICONDJPYNPY-UHFFFAOYSA-N (1,10,13-trimethyl-3-oxo-4,5,6,7,8,9,11,12,14,15,16,17-dodecahydrocyclopenta[a]phenanthren-17-yl) heptanoate Chemical compound C1CC2CC(=O)C=C(C)C2(C)C2C1C1CCC(OC(=O)CCCCCC)C1(C)CC2 TXUICONDJPYNPY-UHFFFAOYSA-N 0.000 description 1
- QTBSBXVTEAMEQO-UHFFFAOYSA-M Acetate Chemical compound CC([O-])=O QTBSBXVTEAMEQO-UHFFFAOYSA-M 0.000 description 1
- 239000004925 Acrylic resin Substances 0.000 description 1
- 229920000178 Acrylic resin Polymers 0.000 description 1
- VEXZGXHMUGYJMC-UHFFFAOYSA-M Chloride anion Chemical compound [Cl-] VEXZGXHMUGYJMC-UHFFFAOYSA-M 0.000 description 1
- 239000004859 Copal Substances 0.000 description 1
- OCUCCJIRFHNWBP-IYEMJOQQSA-L Copper gluconate Chemical compound [Cu+2].OC[C@@H](O)[C@@H](O)[C@H](O)[C@@H](O)C([O-])=O.OC[C@@H](O)[C@@H](O)[C@H](O)[C@@H](O)C([O-])=O OCUCCJIRFHNWBP-IYEMJOQQSA-L 0.000 description 1
- 229910021592 Copper(II) chloride Inorganic materials 0.000 description 1
- FBPFZTCFMRRESA-JGWLITMVSA-N D-glucitol Chemical group OC[C@H](O)[C@@H](O)[C@H](O)[C@H](O)CO FBPFZTCFMRRESA-JGWLITMVSA-N 0.000 description 1
- 241000782205 Guibourtia conjugata Species 0.000 description 1
- 239000004640 Melamine resin Substances 0.000 description 1
- 229920000877 Melamine resin Polymers 0.000 description 1
- 229910021586 Nickel(II) chloride Inorganic materials 0.000 description 1
- 239000004698 Polyethylene Substances 0.000 description 1
- 239000004642 Polyimide Substances 0.000 description 1
- BQCADISMDOOEFD-UHFFFAOYSA-N Silver Chemical compound [Ag] BQCADISMDOOEFD-UHFFFAOYSA-N 0.000 description 1
- 229910000831 Steel Inorganic materials 0.000 description 1
- 239000004809 Teflon Substances 0.000 description 1
- 229920006362 Teflon® Polymers 0.000 description 1
- 229910021626 Tin(II) chloride Inorganic materials 0.000 description 1
- 239000002253 acid Substances 0.000 description 1
- 229910000147 aluminium phosphate Inorganic materials 0.000 description 1
- PYKYMHQGRFAEBM-UHFFFAOYSA-N anthraquinone Natural products CCC(=O)c1c(O)c2C(=O)C3C(C=CC=C3O)C(=O)c2cc1CC(=O)OC PYKYMHQGRFAEBM-UHFFFAOYSA-N 0.000 description 1
- MSSUFHMGCXOVBZ-UHFFFAOYSA-N anthraquinone-2,6-disulfonic acid Chemical compound OS(=O)(=O)C1=CC=C2C(=O)C3=CC(S(=O)(=O)O)=CC=C3C(=O)C2=C1 MSSUFHMGCXOVBZ-UHFFFAOYSA-N 0.000 description 1
- 238000003763 carbonization Methods 0.000 description 1
- 230000003197 catalytic effect Effects 0.000 description 1
- 150000001805 chlorine compounds Chemical group 0.000 description 1
- ZCDOYSPFYFSLEW-UHFFFAOYSA-N chromate(2-) Chemical compound [O-][Cr]([O-])(=O)=O ZCDOYSPFYFSLEW-UHFFFAOYSA-N 0.000 description 1
- KRVSOGSZCMJSLX-UHFFFAOYSA-L chromic acid Substances O[Cr](O)(=O)=O KRVSOGSZCMJSLX-UHFFFAOYSA-L 0.000 description 1
- 229910017052 cobalt Inorganic materials 0.000 description 1
- 239000010941 cobalt Substances 0.000 description 1
- GUTLYIVDDKVIGB-UHFFFAOYSA-N cobalt atom Chemical compound [Co] GUTLYIVDDKVIGB-UHFFFAOYSA-N 0.000 description 1
- 230000000052 comparative effect Effects 0.000 description 1
- 150000001875 compounds Chemical class 0.000 description 1
- 239000000470 constituent Substances 0.000 description 1
- 238000010276 construction Methods 0.000 description 1
- 229940108925 copper gluconate Drugs 0.000 description 1
- OPQARKPSCNTWTJ-UHFFFAOYSA-L copper(ii) acetate Chemical compound [Cu+2].CC([O-])=O.CC([O-])=O OPQARKPSCNTWTJ-UHFFFAOYSA-L 0.000 description 1
- HFDWIMBEIXDNQS-UHFFFAOYSA-L copper;diformate Chemical compound [Cu+2].[O-]C=O.[O-]C=O HFDWIMBEIXDNQS-UHFFFAOYSA-L 0.000 description 1
- 230000006378 damage Effects 0.000 description 1
- 238000010586 diagram Methods 0.000 description 1
- JICJOAMNCDEKAO-UHFFFAOYSA-L dipotassium;9,10-dioxoanthracene-2,6-disulfonate Chemical compound [K+].[K+].[O-]S(=O)(=O)C1=CC=C2C(=O)C3=CC(S(=O)(=O)[O-])=CC=C3C(=O)C2=C1 JICJOAMNCDEKAO-UHFFFAOYSA-L 0.000 description 1
- PKOVWEHDVFYKHL-UHFFFAOYSA-L disodium;9,10-dioxoanthracene-2,6-disulfonate Chemical compound [Na+].[Na+].[O-]S(=O)(=O)C1=CC=C2C(=O)C3=CC(S(=O)(=O)[O-])=CC=C3C(=O)C2=C1 PKOVWEHDVFYKHL-UHFFFAOYSA-L 0.000 description 1
- CSCLXYAAXMCWLG-UHFFFAOYSA-L disodium;9,10-dioxoanthracene-2,7-disulfonate Chemical compound [Na+].[Na+].C1=C(S([O-])(=O)=O)C=C2C(=O)C3=CC(S(=O)(=O)[O-])=CC=C3C(=O)C2=C1 CSCLXYAAXMCWLG-UHFFFAOYSA-L 0.000 description 1
- 238000009826 distribution Methods 0.000 description 1
- 230000000694 effects Effects 0.000 description 1
- 238000005516 engineering process Methods 0.000 description 1
- AWJWCTOOIBYHON-UHFFFAOYSA-N furo[3,4-b]pyrazine-5,7-dione Chemical compound C1=CN=C2C(=O)OC(=O)C2=N1 AWJWCTOOIBYHON-UHFFFAOYSA-N 0.000 description 1
- 238000009413 insulation Methods 0.000 description 1
- 230000000968 intestinal effect Effects 0.000 description 1
- 150000002500 ions Chemical class 0.000 description 1
- 229910000358 iron sulfate Inorganic materials 0.000 description 1
- BAUYGSIQEAFULO-UHFFFAOYSA-L iron(2+) sulfate (anhydrous) Chemical compound [Fe+2].[O-]S([O-])(=O)=O BAUYGSIQEAFULO-UHFFFAOYSA-L 0.000 description 1
- 150000002739 metals Chemical class 0.000 description 1
- QMMRZOWCJAIUJA-UHFFFAOYSA-L nickel dichloride Chemical compound Cl[Ni]Cl QMMRZOWCJAIUJA-UHFFFAOYSA-L 0.000 description 1
- 229920000620 organic polymer Polymers 0.000 description 1
- 239000007800 oxidant agent Substances 0.000 description 1
- WXZMFSXDPGVJKK-UHFFFAOYSA-N pentaerythritol Chemical compound OCC(CO)(CO)CO WXZMFSXDPGVJKK-UHFFFAOYSA-N 0.000 description 1
- 238000006552 photochemical reaction Methods 0.000 description 1
- 229910052697 platinum Inorganic materials 0.000 description 1
- 229920006122 polyamide resin Polymers 0.000 description 1
- 229920000728 polyester Polymers 0.000 description 1
- 229920000573 polyethylene Polymers 0.000 description 1
- 229920001721 polyimide Polymers 0.000 description 1
- 229920001296 polysiloxane Polymers 0.000 description 1
- 239000002244 precipitate Substances 0.000 description 1
- 238000001556 precipitation Methods 0.000 description 1
- 229910052705 radium Inorganic materials 0.000 description 1
- HCWPIIXVSYCSAN-UHFFFAOYSA-N radium atom Chemical compound [Ra] HCWPIIXVSYCSAN-UHFFFAOYSA-N 0.000 description 1
- 238000007788 roughening Methods 0.000 description 1
- 229910052709 silver Inorganic materials 0.000 description 1
- 239000004332 silver Substances 0.000 description 1
- UPYATISLEPWPOB-UHFFFAOYSA-N sodium;9,10-dioxoanthracene-2,6-disulfonic acid Chemical compound [Na+].OS(=O)(=O)C1=CC=C2C(=O)C3=CC(S(=O)(=O)O)=CC=C3C(=O)C2=C1 UPYATISLEPWPOB-UHFFFAOYSA-N 0.000 description 1
- 239000002904 solvent Chemical group 0.000 description 1
- 239000001119 stannous chloride Substances 0.000 description 1
- 235000011150 stannous chloride Nutrition 0.000 description 1
- 239000007858 starting material Substances 0.000 description 1
- 239000010959 steel Substances 0.000 description 1
- 229920003048 styrene butadiene rubber Polymers 0.000 description 1
- 239000000126 substance Substances 0.000 description 1
- QAOWNCQODCNURD-UHFFFAOYSA-N sulfuric acid Substances OS(O)(=O)=O QAOWNCQODCNURD-UHFFFAOYSA-N 0.000 description 1
- 239000004094 surface-active agent Chemical group 0.000 description 1
Landscapes
- Printing Elements For Providing Electric Connections Between Printed Circuits (AREA)
- Manufacturing Of Printed Wiring (AREA)
Abstract
(57)【要約】本公報は電子出願前の出願データであるた
め要約のデータは記録されません。(57) [Summary] This bulletin contains application data before electronic filing, so abstract data is not recorded.
Description
【発明の詳細な説明】 〔発明の利用分野〕 本発明はプリント配線板の製造方法に関する。[Detailed description of the invention] [Field of application of the invention] The present invention relates to a method for manufacturing a printed wiring board.
近年、フルアディティブ法の有利性全最大限に活かした
プリント配線板の製造方法として、フォト・フオーム法
と呼ばれる方法が開発されている。In recent years, a method called the photoform method has been developed as a method for manufacturing printed wiring boards that takes full advantage of the advantages of the fully additive method.
このフォト・フオーム法は、例えばスルーホール用孔を
穿った絶縁性基体の全表面に無電解めりきの触媒核たり
得る金属を還元可能な酢化状態で含み、かつ光、熱等の
エネルギーを吸収して還元剤を生成する感光性物質（感
光性還元剤）を含む感光剤層を形成し、次に導体回路と
なる部分を選択的に露光して金属粒子ｔ−還元・析出さ
せ５次に無電解めっきにより金属粒子が析出した部分の
みに導体回路を形成するものである（例えば、特公昭５
４−３６２９０号公報参照）。This photoform method involves, for example, containing a metal in a reducible acetylated state that can serve as a catalyst nucleus for electroless plating on the entire surface of an insulating substrate with through-holes, and applying energy such as light or heat. A photosensitive agent layer containing a photosensitive substance (photosensitive reducing agent) that absorbs and generates a reducing agent is formed, and then the portion that will become the conductive circuit is selectively exposed to reduce and precipitate metal particles. A conductor circuit is formed only in the part where metal particles are deposited by electroless plating (for example, the
4-36290).
ところが、フォト・フオーム法によれば、基体平面部の
回路形成には問題彦いが、特に平行光線による露光の場
合スルーホール用孔壁が露光不足となり、このため無電
解めっきによりめっきされない微小部分（めっきゼイド
）が生じ、スルーホールの接続信頼性に欠けるプリント
配線板が製造されるという問題点があった。However, according to the photoform method, there is a problem in forming circuits on the flat surface of the substrate, especially when exposed to parallel light, the holes for through-holes are insufficiently exposed, and as a result, minute parts that are not plated by electroless plating are exposed. There is a problem in that (plating zeid) occurs and a printed wiring board is manufactured that lacks through-hole connection reliability.
本発明は、従来のフォト・フオーム法によるプリント配
線板の製造方法に付随する前述の問題点を解決し、スル
ーホール部分の回路形成全良好に行なうことができ、ス
ルーホール接続信頼性に優れたプリント配線板ｆ：製造
し得る方法を提供すべくなされたものである。The present invention solves the above-mentioned problems associated with the conventional method of manufacturing printed wiring boards using the photoform method, enables complete circuit formation in through-hole portions, and provides excellent through-hole connection reliability. Printed wiring board f: This was created to provide a manufacturing method.
即ち、本発明によって提供されるプリント配線板の製造
方法は、プリント配線板用基体にテーパ状のスルーホー
ル用孔を形成する工程（以下、スルーホール用孔形成工
程という）、前記スルーホール用孔壁を含む基体表面の
所定部分に、無電解めっきの触媒核とカリ得る金属を還
元可能彦酸化状態で含み且つ前記金属を還元するための
感光性還元剤を含む層（以下、感光剤層という）を形成
しこれ全露光して触媒核を形成する工程（以下、触媒核
形成工程という）、及び前記触媒核が形成された部分に
無電解めっきを施して導体層を形成する工程（以下、導
体層形成工程という）、を含むことを特徴とするもので
ある。That is, the method for manufacturing a printed wiring board provided by the present invention includes a step of forming a tapered through hole in a printed wiring board substrate (hereinafter referred to as a through hole forming step), A layer (hereinafter referred to as a photosensitive agent layer) containing a catalyst nucleus for electroless plating and a metal in a reducible Hiko oxidation state and a photosensitive reducing agent for reducing the metal is formed on a predetermined portion of the substrate surface including the wall. ) and fully exposing it to light to form a catalyst nucleus (hereinafter referred to as catalyst nucleus formation step), and a step of applying electroless plating to the portion where the catalyst nucleus is formed to form a conductor layer (hereinafter referred to as “catalyst nucleus formation step”). The method is characterized in that it includes a conductor layer forming step).
本発明方法を実施すれば、プリント配腸板用基体のスル
ーホール用孔壁を含む基体表面の所望する部分に導体層
を形成することができる。従って、本発明方法によシ、
導体回路を形成するための導体と々る部分を予め具有し
ていない基体として、例えば絶縁性基体全使用して、ス
ルーホール用孔壁を含む所定部分に導体ノ（至）全形成
して基体表面に形成すべき導体回路の一部乃至全部を構
成することができる。また、例えば導体回路全構成する
ための導体となる部分を予め具有する基体（例えば、紙
基材フェノール鋼張積層板、ガラス基材エポキシ銅張積
層板）を使用して、６’ｌｌえはスルーホール用孔壁乃
至はその周囲のみに導体層を形成して導体回路の一部を
構成し、その他の導体となる部分を、例えばエツチング
彦どの手段を用いて所望の導体層を形成して導体回路全
構成することができる。By carrying out the method of the present invention, a conductive layer can be formed on a desired portion of the surface of the substrate for a printed intestinal plate, including the hole walls for through holes. Therefore, according to the method of the present invention,
As a base that does not have a conductor contact part in advance to form a conductor circuit, for example, the entire insulating base is used, and the conductor is completely formed on a predetermined part including the hole wall for a through hole. Part or all of the conductive circuit to be formed on the surface can be formed. In addition, for example, by using a substrate that already has a part that will become a conductor for configuring the entire conductor circuit (for example, a paper-based phenolic steel-clad laminate, a glass-based epoxy copper-clad laminate), A conductor layer is formed only on the hole wall for the through hole or its surroundings to form a part of the conductor circuit, and a desired conductor layer is formed on the other portions that will become the conductor using a method such as etching. The entire conductor circuit can be configured.
本発明方法の特徴の１つは、スルーホール用として基体
に形成する孔のうち少なくとも１つ金チーツヤー状の孔
とすることにより、従来のフォト・フオーム法における
スルーホール用孔壁に対する露光不足を解消した点にあ
る。テーノ４−状の孔は、し１」えはレーザー穿孔によ
シスルーホール用孔を形成することにより得られる。レ
ーザー穿孔によりチー・ぐ−状の孔が形成されるのは、
レーデ−のビーム出力が公知の様にガラス分布状となる
為であると推察される。One of the features of the method of the present invention is that at least one of the holes formed in the substrate for the through-hole is a gold-like hole, thereby preventing insufficient exposure of the hole wall for the through-hole in the conventional photoform method. It is at the point where it has been resolved. The 4-shaped holes are obtained by first forming holes for through-holes by laser drilling. The chi-shaped hole is formed by laser drilling.
It is presumed that this is because the beam output of the radar has a glass distribution as is well known.
以下、添付した図面に即して、本発明方法の実施例につ
いて説明する。Embodiments of the method of the present invention will be described below with reference to the attached drawings.
第１図Ｋ、本発明方法の１実施例における工程フローチ
ャート全部した。この実施例は、従来のフルアディティ
ブ法を応用して絶縁性基体に導体層全形成する例を示し
たものである。FIG. 1K is a complete process flowchart for one embodiment of the method of the present invention. This example shows an example in which a conventional fully additive method is applied to completely form a conductor layer on an insulating substrate.
この実施列で使用する絶縁性基体としては、通常例えば
、紙基材フェノール基板、紙基材エポキシ基板、ガラス
基材エポキシ基板、ガラス基材ポリエステル基板、ガラ
ス基材テフロン基板、シリコーン基板、ポリイミド基板
、ポリエチレン基板力との有機高分子を構成成分とする
板状の絶縁性基体が使用される。The insulating substrates used in this embodiment are usually, for example, paper-based phenol substrates, paper-based epoxy substrates, glass-based epoxy substrates, glass-based polyester substrates, glass-based Teflon substrates, silicone substrates, and polyimide substrates. A plate-shaped insulating substrate whose constituent components are a polyethylene substrate and an organic polymer is used.
絶縁性基体の両生面上には、第４図に示した様に、基体
１と導電層との密着性を向上させるために接着層２が形
成される。接着層は、通常、ゴムとしては、アクリロニ
トリルブタノエンゴム、クロログレンゴム、イソグレン
ゴム、スチレンブタジェンゴム、樹脂としては、フェノ
ール樹脂、エポキシ樹脂、アクリル樹脂、ポリアミド樹
脂、メラミン樹脂等により構成される。これらのうち、
特に好ましいのは、ゴムとしてはアクリロニトリルブタ
ノエンゴム、樹脂としてはフェノール樹脂、エポキシ樹
脂等である。As shown in FIG. 4, an adhesive layer 2 is formed on both sides of the insulating substrate in order to improve the adhesion between the substrate 1 and the conductive layer. The adhesive layer is usually composed of acrylonitrile butanoene rubber, chloroglene rubber, isogrene rubber, styrene butadiene rubber as the rubber, and phenol resin, epoxy resin, acrylic resin, polyamide resin, melamine resin, etc. as the resin. . Of these,
Particularly preferred are acrylonitrile butanoene rubber as the rubber, and phenol resin, epoxy resin, etc. as the resin.
接着層は、例えばロールコート法、カーテンコート法、
スピンナー塗布法、浸漬法、ボイラー塗布法などの方法
を用いて設層される。The adhesive layer can be formed by, for example, a roll coating method, a curtain coating method,
The layer is applied using methods such as spinner coating, dipping, and boiler coating.
かくして、接着層２が形成された絶縁性基体１の所望す
る位置に所望数のスルーホール用孔３がレーザー穿孔特
有のチー・ぐ−状に形成される。レーデ−穿孔は、例え
ば炭酸ガスレーザー、ＹＡＧレーデーカどのレーザーを
使用して、レーザーの出力、照射時間、デフォーカス等
を調節して行なわれる。レーザー発振は、スルーホール
周辺部の破壊、及び基材の炭化を防止するためなどの理
由によりｌ？ルス発振が好ましい。In this way, a desired number of through-hole holes 3 are formed at desired positions on the insulating substrate 1 on which the adhesive layer 2 is formed, in a chi-shaped pattern unique to laser drilling. Radical drilling is carried out using a laser such as a carbon dioxide laser or a YAG laser, and adjusting the laser output, irradiation time, defocus, etc. Laser oscillation is used for reasons such as preventing destruction of the area around the through hole and carbonization of the base material. Lux oscillation is preferred.
かくしてスルーホール用孔の穿たれた絶縁性基体１０表
面には、メッキ膜と基材との密着性の向上を計るためエ
ツチング粗化が行なわれる。エツチング粗化はクロム酸
、クロム酸塩、過マンガン酸塩、クロム酸−硫酸、クロ
ム醗−硫酸、燐酸などの酸化剤によって行なわれる。特
にクロム酸−硫酸系は形成される導体層との密着性に浸
れ望ましい。The surface of the insulating substrate 10 with the through-holes thus formed is roughened by etching in order to improve the adhesion between the plating film and the substrate. Etching roughening is carried out using an oxidizing agent such as chromic acid, chromate, permanganate, chromic acid-sulfuric acid, chromic acid-sulfuric acid, or phosphoric acid. In particular, a chromic acid-sulfuric acid type is desirable because of its good adhesion with the conductor layer to be formed.
エツチング粗化された基体上に形成される感光剤層に含
まれる還元可能な酸化状態にあり、無電解めっきに対し
触媒と力る金属としては金、銀、白金、／Ｊ？ラジウム
、銅、ニッケル、コバルト、鉄の塩が使用できる。具体
的な塩としては、金属が多原子価であれば、還元可能な
塩は全ての酸化状態で存在でき、たとえば銅（１１およ
び銅（Ｉ［）、鉄（Ｉｌｌおよび鉄（Ｉ［Ｄイオンの両
方が使用できる。還元可能な金属塩組成物としては、た
とえば蟻酸銅（ＩＩ）、グルコン酸銅（■）、酢酸鋼（
■）、塩化銅（ＩＩ）、塩化ニッケル（Ｉ［ｌ、塩化コ
パル） （Ｉｌｌ、硫酸鉄（Ｉｆ）、硝酸銀（Ｉ）、塩
化パラジウム佃）等が挙げられる。Examples of metals that are in a reducible oxidized state and act as catalysts for electroless plating include gold, silver, platinum, and /J? Radium, copper, nickel, cobalt, and iron salts can be used. As specific salts, if the metal is polyvalent, reducible salts can exist in all oxidation states, such as copper (11 and copper (I[), iron (Ill and iron (I[D ion) Both can be used. Examples of reducible metal salt compositions include copper formate (II), copper gluconate (■), and steel acetate (
(2), copper(II) chloride, nickel chloride (I[l, copal chloride) (Ill, iron sulfate (If), silver(I) nitrate, palladium chloride), and the like.
感光性還元剤としては、芳香族ジアゾ化合物、鉄塩類、
アントラキノン誘導体、アット化合物等が使用可能であ
る。特に好適なものとしては、アントラキノンおよびそ
の誘導体である。、りとえばアントラキノン２，６−ジ
スルホン酸二ナトリウム、アントラキノン２，７−ジス
ルホン酸二ナトリウム、アントラキノン２，６−ジスル
ホン酸二カリウム、アントラキノン２，７−ジスルホン
酸二カリウム等が挙けられる。As photosensitive reducing agents, aromatic diazo compounds, iron salts,
Anthraquinone derivatives, at compounds, etc. can be used. Particularly preferred are anthraquinones and derivatives thereof. Examples include disodium anthraquinone 2,6-disulfonate, disodium anthraquinone 2,7-disulfonate, dipotassium anthraquinone 2,6-disulfonate, dipotassium anthraquinone 2,7-disulfonate, and the like.
さらに４ンタエリスリトール、ソルビトール等の還元促
進剤、界面活性剤、溶剤等を適宜配合して、例えば浸漬
法、カーテンコート法、スピンナー塗布法、ホイラー塗
布法、フローコート法等の設層方法により使用する。Furthermore, reduction accelerators such as tertiary chloride and sorbitol, surfactants, solvents, etc. are blended as appropriate and used by coating methods such as dipping, curtain coating, spinner coating, wheeler coating, and flow coating. do.
例えば、上記感光性溶液にエツチング処理された基板を
浸漬し乾燥して全面に感光剤層を形成する。For example, an etched substrate is immersed in the photosensitive solution and dried to form a photosensitive agent layer on the entire surface.
次いで、この基板に、例えばネガフィルム、ガラスマス
クを用いて選択的に紫外線等を照射して露光全行ない、
めっき触媒性金属粒子（触媒核）を所望回路状に形成す
る。光源は拡散光源、平行光源のいずれも使用可能であ
るが、微細パターンを形成するには平行光源が望ましい
。又、マスクを用いずに露光する場合には、紫外線フォ
ト・プロッタ等を使用することができる。尚、感光剤層
の構成設層方法、露光方法等について、特公昭５４−３
６２９０号明細書等に記載された方法等を参照して本発
明を実施することができる。Next, this substrate is selectively irradiated with ultraviolet rays using, for example, a negative film or a glass mask, and exposed to light.
Plating catalytic metal particles (catalyst nuclei) are formed into a desired circuit shape. Although either a diffused light source or a parallel light source can be used as the light source, a parallel light source is preferable in order to form a fine pattern. Furthermore, when exposing without using a mask, an ultraviolet photo plotter or the like can be used. Regarding the construction method of the photosensitive agent layer, the exposure method, etc.,
The present invention can be carried out with reference to the method described in the specification of No. 6290 and the like.
次に、必要に応じて、未露光部の感光性物質が無電解め
っき液を汚染しないため水洗工程を施した後、選択的に
露光された部分に無電解めっきにより導電層を析出形成
させる。無電解めっきとしでは、無電解銅めっき、無電
解ニッケルめっき、無電解金めっき等が使用できるが、
中でも無電解銅めっきが最も適している。Next, if necessary, a water washing step is performed to prevent the photosensitive material in the unexposed areas from contaminating the electroless plating solution, and then a conductive layer is deposited and formed on the selectively exposed areas by electroless plating. For electroless plating, electroless copper plating, electroless nickel plating, electroless gold plating, etc. can be used.
Among them, electroless copper plating is the most suitable.
回路形成に３いては、第２図に示し友ようにスルーホー
ル部を含む基板表面に所望の回路全無電解めっきにより
薄付けした後、眠気めっきにより所望回路部全厚付は補
力する事も可能である。この方法を用いると回路形成の
時間短縮が可能となる。又、第３図に示したように銅張
積層板全出発材料として用い、スルーホール全形成する
工程においても本方法を用いる事が可能である。In circuit formation 3, as shown in Figure 2, after the desired circuit is thinly deposited on the entire board surface including the through-hole portion by electroless plating, the desired circuit portion is reinforced by drowsy plating. is also possible. Using this method, it is possible to shorten the circuit formation time. Furthermore, as shown in FIG. 3, this method can also be used in the step of forming all through holes using a copper clad laminate as the starting material.
以下、具体的実施例を示して、本発明全史に詳しく説明
する。Hereinafter, the entire history of the present invention will be explained in detail by showing specific examples.
実施例１
第１図に示した工程フローチャートに従ってプリント配
線板全作製した。Example 1 A printed wiring board was entirely manufactured according to the process flowchart shown in FIG.
１．６瓢の紙フエノール絶縁板（日立化成（株）製ＬＰ
−４６１Ｆ）上にアディティブ用接着剤（ＡＣＩジャパ
ン（株）製工ヴアーグリップ７５４）ｔ−乾燥膜厚が約
３０μｍになる様塗布し、硬化せしめた後、炭酸ガスレ
ーザー（ｐｈｏｔｏｎ ５ｏｒｃｅｓ Ｉｎｃ−Ｍｏｄ
ｅｌ ５００ ）で照射面で直径１．０瓢のスルーホー
ルを所望の場所に設けた。スルーホール用透孔は大略第
１図のような形状で、照射面の逆側では直径０．５ ｒ
ａｎであった。1.6 gourd paper phenol insulation board (LP made by Hitachi Chemical Co., Ltd.)
-461F), an additive adhesive (Vourgrip 754 manufactured by ACI Japan Co., Ltd.) was applied to a dry film thickness of approximately 30 μm, and after curing, a carbon dioxide laser (photon 5orces Inc-Mod)
A through hole with a diameter of 1.0 gourd was formed at a desired location on the irradiated surface using a 1.0 mm diameter (el 500). The through hole for the through hole has a shape roughly as shown in Figure 1, and has a diameter of 0.5 r on the opposite side of the irradiation surface.
It was an.
上記接着剤性き基板を４５℃に加温された無水クロム酸
６５ ｇ／ｌ −濃硫酸２３０ノめ旬の混酸溶液で粗化
し、中和してから下記組成よりなる感光液に浸漬後乾燥
して感光剤層を形成した。The above adhesive substrate was roughened with a mixed acid solution of 65 g/l of chromic anhydride and 230 g/l of concentrated sulfuric acid heated to 45°C, neutralized, immersed in a photosensitive solution having the following composition, and then dried. A photosensitive agent layer was formed.
酢酸銅 １６１／１アントラキノン
２，６−ジスルホン酸ジナトリウム塩１６ｇ／ｌ
ソルビトール ３０９／１ペンタエリスリ
トール ２５ｇ／ｌくえん酸 ４
０ｇ／ｌ塩化第一スズ ０．３ ｆｌ／１
水 残部
上記感光剤層を形成した基板上にネガフィルムを密着さ
せ紫外線１００ｍＪ〜４００ｍＪ照射した１、流水洗を
１０〜３０秒行力つ九後、公知の無電解めっき液に浸漬
し、膜厚３０μｍの導体回路層を有するプリント配線板
を得た。スルーホール部を観察し念ところ、スルーホー
ル内壁および端縁部分にはめっきボイドが全くみられず
、めっき状態は良好であった。Copper acetate 161/1 Anthraquinone 2,6-disulfonic acid disodium salt 16 g/l Sorbitol 309/1 Pentaerythritol 25 g/l Citric acid 4
0g/l stannous chloride 0.3 fl/1
Water Remainder A negative film was closely attached to the substrate on which the photosensitive agent layer was formed and irradiated with 100 mJ to 400 mJ of ultraviolet rays. After washing with running water for 10 to 30 seconds, it was immersed in a known electroless plating solution, and the film thickness was A printed wiring board having a 30 μm conductor circuit layer was obtained. When observing the through-hole portion, it was found that no plating voids were observed on the inner wall and edge portion of the through-hole, and the plating condition was good.
実施例２
絶縁板として、値線化学工業（株）製ＲＵ−１６００を
用いた以外は、実施例１の場合と同様にしてプリント配
線板’ｒｆｆ造したところ、スルーホール内壁および端
縁部分にはめっきボイドがみられずスルホール接続信頼
性に優れたものであった。Example 2 A printed wiring board 'rff was fabricated in the same manner as in Example 1 except that RU-1600 manufactured by Value Line Kagaku Kogyo Co., Ltd. was used as the insulating board. No plating voids were observed and the through-hole connection reliability was excellent.
実施例３
下記感光液を使用した以外は、実施例１の場合と同様に
してプリント配線を製造したところ、スルーホール内壁
、および端縁部分にはめっきボイドがみられず、スルー
ホール接続信頼性に優れたものであった。Example 3 Printed wiring was manufactured in the same manner as in Example 1 except that the following photosensitive liquid was used. No plating voids were observed on the inner wall or edge of the through hole, and the through hole connection reliability was improved. It was excellent.
塩化パラジウム １．９
塩酸（３５％） ５ ｃｍ３ソルビトー
ル １０．９
アントラキノン２，６−ジスルホン酸ツナトリウム２．
５ｙ
水 １１比較
例Ｉ
Ｍ 径１． Ｏｒｉｎのスルーホール全ドリルによシ基
板の所望の場所に設けた以外は、実施例１と同様にして
プリント配線板を製造したところ、スルーホール内部お
よび端縁でめつきボイドが多数発生した。Palladium chloride 1.9 Hydrochloric acid (35%) 5 cm3 Sorbitol 10.9 Anthraquinone 2,6-disulfonate 2.
5y Water 11 Comparative Example I M Diameter 1. When a printed wiring board was manufactured in the same manner as in Example 1 except that all Orin through holes were drilled at desired locations on the board, many plating voids were generated inside the through holes and at the edges.
以上説明したように、本発明によれば、フォト・フオー
ム法によりプリント配線板を製造するに際して、レーザ
ーを用いて穿孔を行ない、テーノ卆−状のスルーホール
用孔を形成した基体を使用することにより、感光剤層の
均一塗布が可能とカリ、スルーホール用孔壁へのめつき
つきまわり性が向上した。又本発明による壁形状のスル
ーホール用孔ならば光の到達量が多いため、光化学反応
が十分進行する。したがってめっき触媒である金属粒子
の析出が十分となり、めっきボイドの発生″ｆ、［くす
ことが可能である。As explained above, according to the present invention, when manufacturing a printed wiring board by the photoform method, a substrate is used in which a hole is formed using a laser to form a hole for a through hole in the shape of a tenon. This enables uniform coating of the photosensitive agent layer and improves the ability to cover the walls of through-holes. In addition, since the wall-shaped through-hole according to the present invention allows a large amount of light to reach the hole, the photochemical reaction proceeds sufficiently. Therefore, the precipitation of metal particles serving as a plating catalyst becomes sufficient, and it is possible to eliminate the occurrence of plating voids.
したがって本発明により、フォト・フオーム法によるス
ルーホール接続信頼性に優れた高信頼性のプリント配線
板の製造方法が提供できる。Therefore, the present invention can provide a method for manufacturing a highly reliable printed wiring board with excellent through-hole connection reliability using the photoform method.
第１図乃至第３図は、本発明方法の実施１１ＦＩＪにお
ける工程フローチャートを示した図である。
第４図は、本発明方法によりスルーホール用孔を形成し
たプリント配線板用基体の模式部分断面図である。
第５図は、従来法によりスルーホール用孔を形成したプ
リント配線板用基体の模式部分断面図である。
１・・・絶縁性基体、２・・・接着層、３・・・スルー
ホール用孔。FIGS. 1 to 3 are diagrams showing process flowcharts in the 11th FIJ of the method of the present invention. FIG. 4 is a schematic partial cross-sectional view of a substrate for a printed wiring board in which through holes are formed by the method of the present invention. FIG. 5 is a schematic partial cross-sectional view of a printed wiring board substrate in which through-hole holes are formed by a conventional method. DESCRIPTION OF SYMBOLS 1... Insulating base, 2... Adhesive layer, 3... Hole for through-hole.
Claims (1)
を形成する工程、前記スルーホール用孔壁を含む基体表
面の所定部分に、無電解めっきの触媒核となり得る金属
を還元可能な酸化状態で含み且つ前記金属を還元するた
めの感光性還元剤を含む層を形成しこれを露光して触媒
核を形成する工程、及び前記触媒核が形成された部分に
無電解めっきを施して導体層を形成する工程、を含むこ
とを特徴とするプリント配線板の製造方法。A step of forming a tapered through-hole hole in a substrate for a printed wiring board, a predetermined portion of the surface of the substrate including the wall of the through-hole hole contains a metal that can become a catalyst nucleus for electroless plating in a reducible oxidized state. and a step of forming a layer containing a photosensitive reducing agent for reducing the metal and exposing the layer to light to form catalyst nuclei, and forming a conductor layer by performing electroless plating on the portion where the catalyst nuclei are formed. A method for manufacturing a printed wiring board, comprising the step of:
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP8229286A JPS62239591A (en) | 1986-04-11 | 1986-04-11 | Manufacture of printed wiring board |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP8229286A JPS62239591A (en) | 1986-04-11 | 1986-04-11 | Manufacture of printed wiring board |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| JPS62239591A true JPS62239591A (en) | 1987-10-20 |
Family
ID=13770464
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP8229286A Pending JPS62239591A (en) | 1986-04-11 | 1986-04-11 | Manufacture of printed wiring board |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPS62239591A (en) |
Cited By (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP2006351770A (en) * | 2005-06-15 | 2006-12-28 | Fujikura Ltd | Wiring substrate and its manufacturing method |
| JP2008113022A (en) * | 2007-12-17 | 2008-05-15 | Ibiden Co Ltd | Substrate with through-hole formed and multilayer printed wiring board |
| US7832098B2 (en) | 1998-09-03 | 2010-11-16 | Ibiden Co., Ltd. | Method of manufacturing a multilayered printed circuit board |
-
1986
- 1986-04-11 JP JP8229286A patent/JPS62239591A/en active Pending
Cited By (5)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US7832098B2 (en) | 1998-09-03 | 2010-11-16 | Ibiden Co., Ltd. | Method of manufacturing a multilayered printed circuit board |
| US8148643B2 (en) | 1998-09-03 | 2012-04-03 | Ibiden Co., Ltd. | Multilayered printed circuit board and manufacturing method thereof |
| JP2006351770A (en) * | 2005-06-15 | 2006-12-28 | Fujikura Ltd | Wiring substrate and its manufacturing method |
| JP2008113022A (en) * | 2007-12-17 | 2008-05-15 | Ibiden Co Ltd | Substrate with through-hole formed and multilayer printed wiring board |
| JP4722904B2 (en) * | 2007-12-17 | 2011-07-13 | イビデン株式会社 | Multilayer printed circuit board manufacturing method |
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