JPS62211989A - Electronic parts inserter - Google Patents
Electronic parts inserterInfo
- Publication number
- JPS62211989A JPS62211989A JP61053554A JP5355486A JPS62211989A JP S62211989 A JPS62211989 A JP S62211989A JP 61053554 A JP61053554 A JP 61053554A JP 5355486 A JP5355486 A JP 5355486A JP S62211989 A JPS62211989 A JP S62211989A
- Authority
- JP
- Japan
- Prior art keywords
- electronic component
- gripping
- gripping claw
- spring
- board
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
- 210000000078 claw Anatomy 0.000 claims description 55
- 238000003780 insertion Methods 0.000 claims description 16
- 230000037431 insertion Effects 0.000 claims description 16
- 229910000639 Spring steel Inorganic materials 0.000 claims description 2
- 230000000694 effects Effects 0.000 description 3
- 238000010586 diagram Methods 0.000 description 2
- 238000003860 storage Methods 0.000 description 2
- 239000000758 substrate Substances 0.000 description 2
- 210000003371 toe Anatomy 0.000 description 2
- 239000003795 chemical substances by application Substances 0.000 description 1
- 239000000470 constituent Substances 0.000 description 1
- 238000004519 manufacturing process Methods 0.000 description 1
- 238000000034 method Methods 0.000 description 1
- 238000004806 packaging method and process Methods 0.000 description 1
- 238000003825 pressing Methods 0.000 description 1
Landscapes
- Manipulator (AREA)
- Supply And Installment Of Electrical Components (AREA)
Abstract
(57)【要約】本公報は電子出願前の出願データであるた
め要約のデータは記録されません。(57) [Summary] This bulletin contains application data before electronic filing, so abstract data is not recorded.
Description
【発明の詳細な説明】
［産業上の利用分野〕
この発明は、たとえばプリント配線基板（以下これを基
板と呼ぶ）のスルーホールに電子部品のリードを自動的
に挿入する電子部品挿入装置に関するもので、特にこの
発明は電子部品の収納ケース内に収容された電子部品を
把持するハンド装置の把持爪に関するものである。[Detailed Description of the Invention] [Industrial Application Field] The present invention relates to an electronic component insertion device that automatically inserts electronic component leads into through holes of, for example, a printed wiring board (hereinafter referred to as a board). In particular, the present invention relates to a gripping claw of a hand device that grips an electronic component housed in an electronic component storage case.
第１図は一般的な種電子部品挿入装置を示す斜視図で、
（１）は電子部品挿入装置の本体、（２）は乙の本体（
１）上のガイドレール（３）に沿ってＸ方向に往復移動
し得るように取付けられ、上面に電子部品のリードを挿
入するスルーホール（図示せず）を有する基板（４）を
着脱自在に取付けた移動テーブル、（５）は本体（１）
上に取付けられた支柱（６）の梁材にＹ方向に往復移動
し得るように取付けられた移動ベース（７）に、Ｚ方向
に昇降し得るように取付けられたヘッドで、乙のヘッド
（５）には比較的厚さ寸法の大きい一対の把持爪（８ａ
） 、 （８ｂｌを有するハンド装置（９）が取付けら
れている。（１０）は本体（１）上の所定位置に取付け
られ、内部に基板（４）に取付けるための電子部品（１
１）を収納した電子部品の収納ケースで、この収納ケー
ス（１０）の電子部品供給口（１０ａ）に滑り落ちた電
子部品（１１）をハンド装置（９）の一対の把持爪（８
ａ） （８ｂ）によ？て把持し、このハンド装置（９）
と、ヘッド（５）と、ベース（７）と、移動テーブル（
４）の所定方向への移動によって、電子部品（１１）の
リードを基板（４）の所定のスルーホールに挿入するよ
うになされている。FIG. 1 is a perspective view showing a general type electronic component insertion device.
(1) is the main body of the electronic component insertion device, (2) is the main body of Party B (
1) A board (4) is attached so that it can reciprocate in the X direction along the upper guide rail (3), and has a through hole (not shown) on the top surface for inserting the lead of an electronic component. The attached moving table (5) is the main body (1)
The head (B) is attached to a movable base (7) that is attached to the beam of the support column (6) attached above so that it can move back and forth in the Y direction, and is attached so that it can move up and down in the Z direction. 5) has a pair of gripping claws (8a) with a relatively large thickness.
), (A hand device (9) having 8 bl is attached. (10) is attached to a predetermined position on the main body (1), and therein is an electronic component (1) for attaching to the board (4).
1), the electronic component (11) that has slipped into the electronic component supply opening (10a) of the storage case (10) is held by the pair of gripping claws (8) of the hand device (9).
a) According to (8b)? and grasp this hand device (9).
, head (5), base (7), and moving table (
4) in a predetermined direction, the lead of the electronic component (11) is inserted into a predetermined through hole of the board (4).
第２図（Ａ）（Ｂ）は基板（４）のスルーホールに挿入
される電子部品（１１）の−例とそのリード（１１ａｌ
を示す正面図と側面図である。Figure 2 (A) and (B) show an example of an electronic component (11) inserted into a through hole of a board (4) and its lead (11al).
FIG. 2 is a front view and a side view showing
次に、゛第９図および第１０図はハンド装置（９）を示
す正断面図と側断面図で、（８ａ） 、 （８ｂ）はハ
ンド装置（９）フｌノーム（９ａ）に所定間隔をあけて
支持ビン（１２λ）、 （１２ｂ）により揺動自在に支
承されたほぼＬ字形の一対の把持爪で、この両把持爪（
８ａ） 、 （８ｂ）（よ、フレーム（９ａ）との間に
張架された引張りばね（１３ａ） 、 （１３ｂ）によ
りその爪先部が常時開放ずろように付勢されている。（
１４，ａ） 、 （１４ｂ）はフレーム（９ａ）内に
おいて所定間隔をあけて取付けられ、進退するピストン
ロッド（１５ａ） 、 （］、５ｂ）下垂端部を両把持
爪（８ａ） 、 （８ｂ）の内側自由端部の受台（１６
ａ）。Next, ``Figures 9 and 10 are a front sectional view and a side sectional view showing the hand device (9), and (8a) and (8b) show the hand device (9) at a predetermined interval between the full knob (9a). A pair of approximately L-shaped gripping claws are swingably supported by support bins (12λ) and (12b).
8a), (8b) (Yo, the toes are always urged to open by tension springs (13a) and (13b) stretched between them and the frame (9a).
14,a), (14b) are installed at a predetermined interval in the frame (9a), and the piston rods (15a), (], 5b) move back and forth, and the hanging end portions are held by both gripping claws (8a), (8b). cradle (16) on the inner free end of the
a).
（１６ｂ）に係合させた一対の把持用エアシリンダで、
この両把持用アエシリンダ（１４ａ） 、 （１４ｂｌ
は両把持爪（８ａ） 、 （８ｂ）の爪先部を引張りば
ね（１３ａ） 、 （１３ｂ）に抗して閉合させ、電子
部品’（１１）を把持するために設けられたものである
。（１７）は再把持用シリンダ（１４ａ） 、 （１４
ｂ）のほぼ中間部に設けられ、そのビス１〜ンロツド（
１８）を両把持爪（８ａ） 、 （８ｂ）で把持した電
子部品（１］）に対応させた挿入用エアシリンダで、こ
の挿入用シリンダ（１７）のピストンロッド（１８）は
、電子部品（１］）のリード（Ｉｌａ）を基板（４）の
スルーホールに挿入するために設けられたものである。A pair of gripping air cylinders engaged with (16b),
These both gripping air cylinders (14a), (14bl
are provided to grip the electronic component (11) by closing the toe portions of the gripping claws (8a) and (8b) against the tension springs (13a) and (13b). (17) is a re-gripping cylinder (14a), (14
b) is provided approximately in the middle of the screws 1 to 1 (
The piston rod (18) of this insertion cylinder (17) is adapted to hold the electronic component (1]) held by both gripping claws (8a) and (8b). 1]) is provided for inserting the lead (Ila) into the through hole of the substrate (4).
従来の電子部品挿入装置におけるＪ’（ンド装置（９）
の把持爪（８ａ） 、 （８ｂ）は第１１図に示すよう
に、両把持爪（８ａ） 、 （８ｂ）間の間隔（ｂ）は
、この両把持爪によって把持される電子部品（１１）の
厚さ寸法よりも必然的に大きく、シかもこの両把持爪（
８ａ）。J' (end device (9) in the conventional electronic component insertion device)
The gripping claws (8a) and (8b) are as shown in FIG. The thickness of both gripping claws (
8a).
（８ｂ）の厚さ寸法（ｅ）は強度的に比較的厚く作られ
ているため、先に基板（４）のスルーホールに挿入した
電子部品（１１）との間隔寸法（ａ）が大きくなり、電
子部品の実装密度が粗密になる欠点がある。また、従来
のハンド装置（９）の把持爪（８ａ） 、 （８ｂ）の
場合、第１２図に示すように、基板（４）のスルーホー
ルに電子部品（１１）のリード（ｌｌａ）を挿入したあ
と、両把持爪（８ａ） 、 （８ｂ）を上昇させる場合
、両把持爪（８ａ） 、 （８ｂ）の開き幅寸法（ｅ）
は、電子部品（１１）の厚さ寸法よりも大きくしなけれ
ばならないので、これまた先に基板（４）のスルーホー
ルに挿入した電子部品（１１）との間隔寸法（ａ）が大
きくなる欠点がある。Since the thickness dimension (e) of (8b) is made relatively thick in terms of strength, the distance dimension (a) from the electronic component (11) inserted into the through hole of the board (4) becomes large. , there is a drawback that the packaging density of electronic components becomes dense. In addition, in the case of the gripping claws (8a) and (8b) of the conventional hand device (9), the lead (lla) of the electronic component (11) is inserted into the through hole of the board (4) as shown in FIG. After that, when raising both gripping claws (8a) and (8b), the opening width dimension (e) of both gripping claws (8a) and (8b)
must be larger than the thickness of the electronic component (11), which also has the disadvantage of increasing the distance (a) from the electronic component (11) inserted into the through hole of the board (4). There is.
乙の発明は、かλ）る点に着目してなされたもので、基
板のスルーホールに挿入する電子部品間の間隔寸法を小
さくして電子部品を高密度に実装し得るようにした電子
部品挿入装置を提供しようとするものである。The invention of Party B was made with a focus on the following point, and is an electronic component that enables high-density mounting of electronic components by reducing the distance between electronic components inserted into through holes of a board. The present invention seeks to provide an insertion device.
この発明にかかる電子部品挿入装置は、基板のスルーホ
ールにリードを挿入する電子部品を把持する一方の把持
爪を、比較的厚さの薄いばね把持爪によって形成し、こ
の一方のばね把持爪により電子部品を他方の剛体把持爪
に押し付けて把持するようにしたものである。In the electronic component insertion device according to the present invention, one of the gripping claws for gripping an electronic component whose lead is to be inserted into a through hole of a board is formed by a relatively thin spring gripping claw. The electronic component is held by being pressed against the other rigid gripping claw.
この発明においては、電子部品を把持する一方の把持爪
を比較的厚さの薄いばね把持爪によって形成するように
したので、先に基板のスルーホールに挿入した電子部品
との間隔寸法および一方の剛体把持爪の先端部と、基板
のスルーホールの中心との間隔が小さくなる。In this invention, one of the gripping claws that grips the electronic component is formed by a relatively thin spring gripping claw, so that the distance between the electronic component and the electronic component that is inserted into the through hole of the board first, and the one of the gripping claws that grip the electronic component are The distance between the tip of the rigid gripping claw and the center of the through hole of the board becomes smaller.
第３図〜第６図は何れも乙の発明の一実施例を示すもの
であるが、上述した従来のものく第９図〜第１２図）と
同一符号は同一構成部材につきその説明を省略する。Figures 3 to 6 all show an embodiment of B's invention, but the same reference numerals as in the above-mentioned prior art (Figures 9 to 12) refer to the same constituent members, so their explanations will be omitted. do.
まず、第３図と第４図の正面断面図と側面断面図におい
て、（１９ａ）、 （１９ｂ）はハンド装置（９）のフ
レーム（９ａ）に、所定間隔をあけて支持ピン（１２ａ
）。First, in the front sectional view and side sectional view of FIGS. 3 and 4, (19a) and (19b) are attached to the frame (9a) of the hand device (9) with support pins (12a) at predetermined intervals.
).
（１２ｂ）により揺動自在に支承されたほぼＬ字形の剛
体把持爪と把持腕て、一方の把持腕（１９ｂ）の自由端
部には、比較的厚さが薄く、所定の弾性力を有するばね
鋼板からなるばね把持爪（２０）の一端が複数の取付ポ
ルＩ−（２１）により取付けられており、乙のばね把持
爪（２０）と、比較的厚さ寸法の大きい剛体把持爪（１
９ａ）とによって、第５図に示すように電子部品（１１
）を多少傾斜させながら挟持するようになされており、
一方のばね把持爪（２０）の厚さが薄いため、先に基板
（４）のスルーホールに挿入した電子部品（１１）のリ
ード（１１ａ）との間隔寸法（ａ）を著しく小さくする
ことができ、基板（４）への高密度の実装が可能となる
。The roughly L-shaped rigid gripping claw and gripping arm are swingably supported by (12b), and the free end of one gripping arm (19b) has a relatively thin thickness and has a predetermined elastic force. One end of the spring gripping claw (20) made of a spring steel plate is attached by a plurality of mounting holes I-(21), and the spring gripping claw (20) of B and the rigid gripping claw (1) having a relatively large thickness dimension are attached.
9a), the electronic component (11
) is held at a slight angle.
Since the thickness of one spring gripping claw (20) is thin, it is possible to significantly reduce the distance dimension (a) between the lead (11a) of the electronic component (11) inserted into the through hole of the board (4) first. This enables high-density mounting on the substrate (4).
また、第６図に示すように剛体把持爪（１９ａ）と、ば
ね把持爪（２０）がわずかに開いた状態からハンド装置
（９）が上昇しても、ばね把持爪（２０）の厚さが薄い
ため、剛体把持爪（１９ａ）の先端部が電子部品（１１
）に係合してこの電子部品を剛体把持爪（１９ａ）の反
対側に偏位させても、ばね把持爪（２０）が同一方向に
逃げるため、剛体把持爪（１９ａ）の先端部と基板（４
）のスルーホールの中心との間隔（ｆ）を小さくする乙
とが可能であり、これまた電子部品の基板への高密度の
実装に貢献するものである。Furthermore, even if the hand device (9) is raised from the state where the rigid body gripping claw (19a) and the spring gripping claw (20) are slightly opened as shown in FIG. is thin, so the tip of the rigid gripping claw (19a) is attached to the electronic component (11).
) to deflect this electronic component to the opposite side of the rigid gripping claw (19a), the spring gripping claw (20) escapes in the same direction, so that the tip of the rigid gripping claw (19a) and the board (4
) and the center of the through-hole can be reduced, which also contributes to high-density mounting of electronic components on the board.
なお、第７図（Ａ）、（Ｂ）、（Ｃ）はこの発明の電子
部品挿入装置による電子部品の挿入工程を示す図面で、
第７図（Ａ）は剛体把持爪（１９ａ）とばね把持爪（２
０）とによって把持した電子部品（１１）を、基板（４
）の所定のスルーホールに近接させた状態を示し、また
第７図（Ｂ）は挿入用エアシリンダのピストンロッド（
１８）が下降して電子部品（１１）のリード（ｌｌａ）
を基板（４）のスルーホールに挿入した状態を示してい
るが、乙のとき下降するピストンロッド（１８）がばね
把持爪（２０）に係合しないように、乙のばね把持爪に
切欠き（図示せず）が設けられている。次に、第７図（
ｅ）は剛体把持爪（１９ａ）とばね把持爪（２０）が開
いて上昇する寸前を示している。Note that FIGS. 7(A), (B), and (C) are drawings showing the electronic component insertion process by the electronic component insertion device of the present invention,
FIG. 7(A) shows the rigid gripping claw (19a) and the spring gripping claw (2).
0) and the electronic component (11) held by the board (4).
), and FIG. 7(B) shows the piston rod of the insertion air cylinder (
18) descends and the lead (lla) of the electronic component (11)
is shown inserted into the through hole of the board (4), but a notch is provided in the spring gripping claw (20) to prevent the piston rod (18) that descends at the time of (B) from engaging with the spring gripping claw (20). (not shown) is provided. Next, see Figure 7 (
e) shows the rigid gripping claw (19a) and the spring gripping claw (20) about to open and rise.
次に、第８図（Ａ）、（Ｂ）、（Ｃ）は、一方の剛体把
持爪（１９ａ）に電子部品（１１）を押し付けて把持す
るばね把持爪（２０）の抑圧状態の変形を示すもので、
第８図（Ａ）は、ばね把持爪（２０）の先端を電子部品
（１１）のボディの下縁部に押し当てた場合を示し、ま
た第８図（Ｂ）ばばね把持爪（２０）の先端を電子部品
（１１）のリード（１１ａ）に押し当てた場合を示し、
さらに第８図（Ｃ）ばばね把持爪（２０）の先端を電子
部品（１１）のボディの下縁部と、リード（Ｉｌａ）の
２ケ所に押し当てた場合を示しているが、何れの場合も
電子部品（１１）のリード（ｌｌａ）の先端の位置決め
は、一方の剛体把持爪（１９ａ）の爪先に当接すること
によって決定される。Next, FIGS. 8(A), (B), and (C) show the deformation of the suppressed state of the spring gripping claw (20) that presses and grips the electronic component (11) against one of the rigid gripping claws (19a). It shows,
FIG. 8(A) shows the case where the tip of the spring gripping claw (20) is pressed against the lower edge of the body of the electronic component (11), and FIG. 8(B) shows the case where the spring gripping claw (20) is pressed against the lower edge of the body of the electronic component (11). The case where the tip of is pressed against the lead (11a) of the electronic component (11) is shown,
Further, FIG. 8(C) shows a case where the tip of the spring gripping claw (20) is pressed against two places: the lower edge of the body of the electronic component (11) and the lead (Ila). In this case, the positioning of the tip of the lead (lla) of the electronic component (11) is determined by contacting the tip of one of the rigid gripping claws (19a).
以上述べたように、この発明によれば、基板のスルーホ
ールにリードを挿入する電子部品を、把持する一対の把
持爪を剛体把持爪と、比較的厚さの薄いばね把持爪とに
よって形成し、この一方のばね把持爪により電子部品を
他方の剛体把持爪に押し付けて把持するようにしたので
、先に基板のスルーホールに挿入した電子部品との間隔
寸法および一方の剛体把持爪の先端部と、基板のスルー
ホールの中心との間隔が小さくなり、基板への電子部品
の高密度の実装が可能となる優れた効果を有するもので
ある。As described above, according to the present invention, a pair of gripping claws for gripping an electronic component whose lead is inserted into a through hole of a board is formed by a rigid gripping claw and a relatively thin spring gripping claw. Since one spring gripper grips the electronic component by pressing it against the other rigid gripper, the distance between the electronic component and the electronic component inserted into the through-hole of the board first and the tip of the one rigid gripper can be adjusted. This has the excellent effect that the distance between the center of the through hole of the board and the center of the board becomes small, and that it is possible to mount electronic components on the board with high density.
第１図は一般的な電子部品挿入装置を示す斜視図、第２
図（Ａ）は電子部品を示す正面図、第２図（Ｂ）はその
側面図、第３図〜第６図は何れもこの発明の一実施例を
示すもので、第３図は正面断面図、第４図は側面断面図
、第５図〜第８図は何れも動作説明図、第９図、第１０
図は従来のハンド装置を示す正断面図及び側断面図、第
１１図。
第１２図は従来装置の所用説明図である。
図において、（４）は基板、（９）はハンド装置、（１
１）は電子部品、（ｌｌａ）はリード、（１４ａ） （
１４ｂ）はｘ７シリンダ、（１９ａ）は剛体把持爪、（
２０）ばばね把持爪である。
なお、図中同一符号は同一または相当部分を示す。
代理人 弁理士 佐 藤 正 年
第ｉｍｌ
第 ２ 図
第３図 第４図
４：基嫉
９：ハン）：製置−
１１：電３ｒ部品
１１ａ、リード
１４ａ、１４ｂ： 工７シ’Ｊ ン７−１９ａ：［１４
本１已持丘し
２０： １τ わ オ巴壊ヤ屹
第５図
ｒし！
第６図
〕ｂ
第７図
（Ａ）
第８図
（Ａ）
第１１図
ぅ、１５ｂ。
１８ 第１２図Figure 1 is a perspective view showing a general electronic component insertion device, Figure 2 is a perspective view showing a general electronic component insertion device;
Figure (A) is a front view showing an electronic component, Figure 2 (B) is a side view thereof, Figures 3 to 6 all show one embodiment of the present invention, and Figure 3 is a front cross section. Figures 4 and 4 are side sectional views, Figures 5 to 8 are operation explanatory diagrams, Figures 9 and 10.
FIG. 11 is a front sectional view and a side sectional view showing a conventional hand device. FIG. 12 is an explanatory diagram of the requirements of the conventional device. In the figure, (4) is the board, (9) is the hand device, (1
1) is an electronic component, (lla) is a lead, (14a) (
14b) is an x7 cylinder, (19a) is a rigid gripping claw, (
20) It is a spring gripping claw. Note that the same reference numerals in the figures indicate the same or corresponding parts. Agent Patent Attorney Tadashi Sato Year 2 IML Figure 2 Figure 3 Figure 4 Figure 4: Base 9: Manufacturing - 11: Electrical 3R parts 11a, Leads 14a, 14b: Engineering 7 Scene 7 -19a: [14
Book 1: 20: 1τ Wow! Figure 6] b Figure 7 (A) Figure 8 (A) Figure 11, 15b. 18 Figure 12
Claims (4)
品を把持するハンド装置の一対の把持爪を、剛体把持爪
と比較的厚さの薄いばね把持爪とによって形成したこと
を特徴とする電子部品挿入装置。(1) An electronic device characterized in that a pair of gripping claws of a hand device for gripping an electronic component whose leads are inserted into a through-hole or the like of a board are formed by a rigid gripping claw and a relatively thin spring grasping claw. Parts insertion device.
よつて作られている乙とを特徴とする特許請求の範囲第
１項記載の電子部品挿入装置。(2) The electronic component insertion device according to claim 1, wherein the spring gripping claw is made of a spring steel plate having a predetermined elastic force.
、電子部品のボディまたはリードあるいはボディとリー
ドとに押し当てることを特徴とする特許請求の範囲第１
項記載の電子部品挿入装置。(3) The spring gripping claw that presses the electronic component against the rigid gripping claw is pressed against the body or lead of the electronic component, or the body and the lead.
Electronic component insertion device described in Section 1.
ンダによつて操作されることを特徴とする特許請求の範
囲第１項記載の部品挿入装置。(4) The component insertion device according to claim 1, wherein the rigid body gripping claw and the spring gripping claw are each operated by an air cylinder.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP61053554A JPS62211989A (en) | 1986-03-13 | 1986-03-13 | Electronic parts inserter |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP61053554A JPS62211989A (en) | 1986-03-13 | 1986-03-13 | Electronic parts inserter |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| JPS62211989A true JPS62211989A (en) | 1987-09-17 |
Family
ID=12946018
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP61053554A Pending JPS62211989A (en) | 1986-03-13 | 1986-03-13 | Electronic parts inserter |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPS62211989A (en) |
Citations (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS5436575A (en) * | 1977-08-27 | 1979-03-17 | Fuji Machine Mfg | Claw mechanism for electronic parts insertion device |
| JPS598790B2 (en) * | 1976-12-23 | 1984-02-27 | トヨタ自動車株式会社 | Battery condensation monitor |
-
1986
- 1986-03-13 JP JP61053554A patent/JPS62211989A/en active Pending
Patent Citations (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS598790B2 (en) * | 1976-12-23 | 1984-02-27 | トヨタ自動車株式会社 | Battery condensation monitor |
| JPS5436575A (en) * | 1977-08-27 | 1979-03-17 | Fuji Machine Mfg | Claw mechanism for electronic parts insertion device |
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