JPS5881981U - PCB soldering equipment - Google Patents
PCB soldering equipmentInfo
- Publication number
- JPS5881981U JPS5881981U JP17578681U JP17578681U JPS5881981U JP S5881981 U JPS5881981 U JP S5881981U JP 17578681 U JP17578681 U JP 17578681U JP 17578681 U JP17578681 U JP 17578681U JP S5881981 U JPS5881981 U JP S5881981U
- Authority
- JP
- Japan
- Prior art keywords
- support frame
- substrate support
- circuit board
- rolling element
- printed circuit
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
Landscapes
- Molten Solder (AREA)
- Electric Connection Of Electric Components To Printed Circuits (AREA)
Abstract
(57)【要約】本公報は電子出願前の出願データであるた
め要約のデータは記録されません。(57) [Summary] This bulletin contains application data before electronic filing, so abstract data is not recorded.
Description
第１図は本考案の一実施例を示す平面図、第２図は一部
切欠きした基板支持枠がガイドに至る直前の状態を示す
正面図、第３図は第２図の一方の挾持部材の近傍部を示
す拡大図である。
図中、１・・・基板支持枠、２・・・ハンダ溶解槽、３
゜３′・・・ガイドレール、８． ８’・・・チェーン
、１３・・・基板取出し口、１４．１４’・・・ガイド
、１５・・・プリント基板、１６．１６’・・・挾持部
材、１８゜１．８′・・・転動体、１９．１９’・・・
腕。Fig. 1 is a plan view showing an embodiment of the present invention, Fig. 2 is a front view showing the partially cut-out board support frame just before it reaches the guide, and Fig. 3 is a plan view showing one of the clamps in Fig. 2. FIG. 3 is an enlarged view showing the vicinity of the member. In the figure, 1... Board support frame, 2... Solder melting tank, 3
゜3'...Guide rail, 8. 8'... Chain, 13... Board outlet, 14.14'... Guide, 15... Printed circuit board, 16.16'... Holding member, 18° 1.8'... Rolling element, 19.19'...
arm.
Claims (1)
を解放する一対の挟持部材を有し、かつ、遊端部に転動
体を回動自在に支持する腕の基部をそれぞれの挟持部材
の外側部に取り付けた基板支持枠を移動可能に備え、該
基板支持枠が基板取出し口上を移動するときに、該基支
持枠の一対の挾持部材を互いに離反させる方向に転動体
を案内するガイドを備えたことを特徴とする基板用ハン
ダ付は装置。It has a pair of clamping members that clamp the printed circuit board when approaching and releases the printed circuit board when separating, and the base of the arm that rotatably supports the rolling element at the free end is attached to the outside of each clamping member. The attached substrate support frame is movable, and the substrate support frame is provided with a guide that guides the rolling element in a direction that moves the pair of clamping members of the base support frame away from each other when the substrate support frame moves over the substrate ejection port. A soldering device for circuit boards featuring:
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP17578681U JPS5881981U (en) | 1981-11-26 | 1981-11-26 | PCB soldering equipment |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP17578681U JPS5881981U (en) | 1981-11-26 | 1981-11-26 | PCB soldering equipment |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| JPS5881981U true JPS5881981U (en) | 1983-06-03 |
Family
ID=29968318
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP17578681U Pending JPS5881981U (en) | 1981-11-26 | 1981-11-26 | PCB soldering equipment |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPS5881981U (en) |
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS6310067A (en) * | 1986-06-30 | 1988-01-16 | Ideya:Kk | Solder dip treating equipment for electronic parts |
-
1981
- 1981-11-26 JP JP17578681U patent/JPS5881981U/en active Pending
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS6310067A (en) * | 1986-06-30 | 1988-01-16 | Ideya:Kk | Solder dip treating equipment for electronic parts |
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