JPS62208935A - Manufacture of laminated material - Google Patents
Manufacture of laminated materialInfo
- Publication number
- JPS62208935A JPS62208935A JP61052015A JP5201586A JPS62208935A JP S62208935 A JPS62208935 A JP S62208935A JP 61052015 A JP61052015 A JP 61052015A JP 5201586 A JP5201586 A JP 5201586A JP S62208935 A JPS62208935 A JP S62208935A
- Authority
- JP
- Japan
- Prior art keywords
- laminate
- molding
- laminated material
- laminated
- elimination
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
- 238000004519 manufacturing process Methods 0.000 title claims description 6
- 239000002648 laminated material Substances 0.000 title abstract 6
- 239000000463 material Substances 0.000 claims abstract description 22
- 238000000465 moulding Methods 0.000 claims abstract description 12
- 239000011888 foil Substances 0.000 claims abstract description 8
- 238000000034 method Methods 0.000 claims abstract description 7
- 229910052751 metal Inorganic materials 0.000 claims description 7
- 239000002184 metal Substances 0.000 claims description 7
- 238000010438 heat treatment Methods 0.000 claims description 4
- 238000010030 laminating Methods 0.000 claims description 2
- 230000005855 radiation Effects 0.000 abstract description 4
- 229920001971 elastomer Polymers 0.000 abstract description 3
- 239000005060 rubber Substances 0.000 abstract description 3
- 239000004033 plastic Substances 0.000 abstract description 2
- 229920003023 plastic Polymers 0.000 abstract description 2
- 239000013013 elastic material Substances 0.000 abstract 3
- 230000008030 elimination Effects 0.000 abstract 3
- 238000003379 elimination reaction Methods 0.000 abstract 3
- 238000006722 reduction reaction Methods 0.000 abstract 2
- 238000010276 construction Methods 0.000 abstract 1
- 239000010410 layer Substances 0.000 description 12
- 229920002379 silicone rubber Polymers 0.000 description 5
- 239000004945 silicone rubber Substances 0.000 description 5
- 229920005989 resin Polymers 0.000 description 4
- 239000011347 resin Substances 0.000 description 4
- CSCPPACGZOOCGX-UHFFFAOYSA-N Acetone Chemical compound CC(C)=O CSCPPACGZOOCGX-UHFFFAOYSA-N 0.000 description 3
- OKKJLVBELUTLKV-UHFFFAOYSA-N Methanol Chemical compound OC OKKJLVBELUTLKV-UHFFFAOYSA-N 0.000 description 3
- RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical compound [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 description 2
- 239000004593 Epoxy Substances 0.000 description 2
- 239000004952 Polyamide Substances 0.000 description 2
- PPBRXRYQALVLMV-UHFFFAOYSA-N Styrene Chemical compound C=CC1=CC=CC=C1 PPBRXRYQALVLMV-UHFFFAOYSA-N 0.000 description 2
- 230000001070 adhesive effect Effects 0.000 description 2
- 239000011889 copper foil Substances 0.000 description 2
- JHIVVAPYMSGYDF-UHFFFAOYSA-N cyclohexanone Chemical compound O=C1CCCCC1 JHIVVAPYMSGYDF-UHFFFAOYSA-N 0.000 description 2
- 230000003111 delayed effect Effects 0.000 description 2
- 239000003822 epoxy resin Substances 0.000 description 2
- 235000012438 extruded product Nutrition 0.000 description 2
- 239000011521 glass Substances 0.000 description 2
- 239000005011 phenolic resin Substances 0.000 description 2
- 229920002647 polyamide Polymers 0.000 description 2
- 229920000647 polyepoxide Polymers 0.000 description 2
- 229920000728 polyester Polymers 0.000 description 2
- KXGFMDJXCMQABM-UHFFFAOYSA-N 2-methoxy-6-methylphenol Chemical compound [CH]OC1=CC=CC([CH])=C1O KXGFMDJXCMQABM-UHFFFAOYSA-N 0.000 description 1
- QTWJRLJHJPIABL-UHFFFAOYSA-N 2-methylphenol;3-methylphenol;4-methylphenol Chemical compound CC1=CC=C(O)C=C1.CC1=CC=CC(O)=C1.CC1=CC=CC=C1O QTWJRLJHJPIABL-UHFFFAOYSA-N 0.000 description 1
- 229910001369 Brass Inorganic materials 0.000 description 1
- 229920000742 Cotton Polymers 0.000 description 1
- YCKRFDGAMUMZLT-UHFFFAOYSA-N Fluorine atom Chemical compound [F] YCKRFDGAMUMZLT-UHFFFAOYSA-N 0.000 description 1
- 239000004640 Melamine resin Substances 0.000 description 1
- 229920000877 Melamine resin Polymers 0.000 description 1
- 239000004677 Nylon Substances 0.000 description 1
- 239000004696 Poly ether ether ketone Substances 0.000 description 1
- 229930182556 Polyacetal Natural products 0.000 description 1
- 239000004962 Polyamide-imide Substances 0.000 description 1
- 239000005062 Polybutadiene Substances 0.000 description 1
- 239000004642 Polyimide Substances 0.000 description 1
- 239000004372 Polyvinyl alcohol Substances 0.000 description 1
- 229910000831 Steel Inorganic materials 0.000 description 1
- 229920006311 Urethane elastomer Polymers 0.000 description 1
- NIXOWILDQLNWCW-UHFFFAOYSA-N acrylic acid group Chemical group C(C=C)(=O)O NIXOWILDQLNWCW-UHFFFAOYSA-N 0.000 description 1
- 239000000853 adhesive Substances 0.000 description 1
- 229910052782 aluminium Inorganic materials 0.000 description 1
- XAGFODPZIPBFFR-UHFFFAOYSA-N aluminium Chemical compound [Al] XAGFODPZIPBFFR-UHFFFAOYSA-N 0.000 description 1
- 239000010425 asbestos Substances 0.000 description 1
- 238000005452 bending Methods 0.000 description 1
- 230000015572 biosynthetic process Effects 0.000 description 1
- 239000010951 brass Substances 0.000 description 1
- 238000004891 communication Methods 0.000 description 1
- 229930003836 cresol Natural products 0.000 description 1
- 230000000694 effects Effects 0.000 description 1
- 238000005265 energy consumption Methods 0.000 description 1
- 238000005516 engineering process Methods 0.000 description 1
- 238000001125 extrusion Methods 0.000 description 1
- 239000004744 fabric Substances 0.000 description 1
- 239000000835 fiber Substances 0.000 description 1
- 229910052731 fluorine Inorganic materials 0.000 description 1
- 239000011737 fluorine Substances 0.000 description 1
- 239000006260 foam Substances 0.000 description 1
- 230000005484 gravity Effects 0.000 description 1
- 230000017525 heat dissipation Effects 0.000 description 1
- 239000012784 inorganic fiber Substances 0.000 description 1
- 238000003475 lamination Methods 0.000 description 1
- 239000000203 mixture Substances 0.000 description 1
- 239000004745 nonwoven fabric Substances 0.000 description 1
- 229920001778 nylon Polymers 0.000 description 1
- 229920001568 phenolic resin Polymers 0.000 description 1
- 229920002492 poly(sulfone) Polymers 0.000 description 1
- 229920002312 polyamide-imide Polymers 0.000 description 1
- 229920002857 polybutadiene Polymers 0.000 description 1
- -1 polybutylene terephthalate Polymers 0.000 description 1
- 229920001707 polybutylene terephthalate Polymers 0.000 description 1
- 229920001225 polyester resin Polymers 0.000 description 1
- 239000004645 polyester resin Substances 0.000 description 1
- 229920002530 polyetherether ketone Polymers 0.000 description 1
- 229920001721 polyimide Polymers 0.000 description 1
- 229920006324 polyoxymethylene Polymers 0.000 description 1
- 229920002635 polyurethane Polymers 0.000 description 1
- 239000004814 polyurethane Substances 0.000 description 1
- 229920002451 polyvinyl alcohol Polymers 0.000 description 1
- 238000003825 pressing Methods 0.000 description 1
- 229910052895 riebeckite Inorganic materials 0.000 description 1
- 229920002050 silicone resin Polymers 0.000 description 1
- 239000002356 single layer Substances 0.000 description 1
- 239000002904 solvent Substances 0.000 description 1
- 239000010959 steel Substances 0.000 description 1
- 239000012209 synthetic fiber Substances 0.000 description 1
- 229920002994 synthetic fiber Polymers 0.000 description 1
- 229920001169 thermoplastic Polymers 0.000 description 1
- 239000004416 thermosoftening plastic Substances 0.000 description 1
- 229920006337 unsaturated polyester resin Polymers 0.000 description 1
- XLYOFNOQVPJJNP-UHFFFAOYSA-N water Substances O XLYOFNOQVPJJNP-UHFFFAOYSA-N 0.000 description 1
- 239000002023 wood Substances 0.000 description 1
- 239000002759 woven fabric Substances 0.000 description 1
Classifications
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/02—Apparatus or processes for manufacturing printed circuits in which the conductive material is applied to the surface of the insulating support and is thereafter removed from such areas of the surface which are not intended for current conducting or shielding
- H05K3/022—Processes for manufacturing precursors of printed circuits, i.e. copper-clad substrates
Landscapes
- Laminated Bodies (AREA)
Abstract
Description
【発明の詳細な説明】
〔技術分野〕
本発明は電気機器、電子機器、計算Ｍ器、通信ｍ器等に
用すられる積層板や多層プリント配線板等の製造方法に
関するものである。DETAILED DESCRIPTION OF THE INVENTION [Technical Field] The present invention relates to a method for manufacturing laminated boards, multilayer printed wiring boards, etc. used in electrical equipment, electronic equipment, computing equipment, communication equipment, and the like.
従来の濱＠板や多層プリント配線板等の成形はキャリア
板上にり噌ジョン材、成形用プレート、外層材、樹脂含
浸基材、更に必要に応じて内層材を挿入した積層体を熱
盤間に挿入し積層成形してｈるが放熱のため積層体外周
部は熱不足と−２り硬化が遅れ熔融樹脂流出の停とが遅
れるので墳）一体外周部の厚み不足を招来し且つ成形プ
レスの熱損失も大きいものであ＾た。更に積層成形後の
積層板や多層プリント配線板中に気泡を内政しやすく回
路の信頼性、耐湿性の低下を惹起する原因となって込た
。Conventional molding of boards and multilayer printed wiring boards involves placing the laminate on a carrier plate, inserting the paste John material, the molding plate, the outer layer material, the resin-impregnated base material, and, if necessary, the inner layer material, on a hot plate. However, due to heat dissipation, the outer periphery of the laminate is insufficiently heated and curing is delayed, and the outflow of molten resin is delayed. The heat loss of the press was also large. Furthermore, air bubbles tend to form in the laminated board or multilayer printed wiring board after lamination molding, causing a decrease in circuit reliability and moisture resistance.
本発明の目的とするところは積層体成形時の放熱を防止
し省エネルギー化と積層体のふみ精度を向上させ且つ内
蔵気泡の撲滅を計ることにある。The purpose of the present invention is to prevent heat radiation during the formation of a laminate, save energy, improve the filling accuracy of the laminate, and eliminate built-in air bubbles.
本発明は外ｊ−材、樹脂含浸基材、更に必要に応じて内
層材を挿入した積層体を積層成形する。ｆｌ１層体の！
ｉｌ造方法において、檀１一体を成形プレートに挾み、
その周囲を上部が凹凸状の弾性体で囲み積層体を減圧下
、Ｐａ層加熱加圧することを特徴とする積層体の５１造
方法のため、放熱防止による省工ネルギー化と積層体の
厚み精度を向上させ且っ内置気泡を撲滅することができ
たもので、以下本発明の詳細な説明する。In the present invention, a laminate including an outer material, a resin-impregnated base material, and, if necessary, an inner layer material is laminated and molded. fl1 layer body!
In the IL method, one piece of wood is sandwiched between molding plates,
The 51 manufacturing method of the laminate is characterized by surrounding it with an elastic body with an uneven upper part and heating and pressurizing the Pa layer under reduced pressure.This method saves labor energy by preventing heat radiation, and the thickness accuracy of the laminate. The present invention will be described in detail below.
本発明に用する外層材は銅箔、アルミニウム箔、眞鍮箔
等の金属箔や片面金属箔張積層板であるが、好ましくは
金属箔であることが望ましく更に金属箔には必要に応じ
て接着剤を予じめ塗布しておき接着性等を向上させるこ
ともできる。樹脂含浸基材は樹脂としてフェノール樹脂
、クレゾール樹脂ｄ１ エポキシ樹脂、不飽和ポリエス
テル樹脂。The outer layer material used in the present invention is a metal foil such as copper foil, aluminum foil, or brass foil, or a single-sided metal foil-clad laminate. Preferably, it is a metal foil. Adhesive properties can also be improved by applying an adhesive in advance. The resin-impregnated base material includes phenol resin, cresol resin d1, epoxy resin, and unsaturated polyester resin.
メラミン樹脂、ポリイミド、ポリブタジェン１ポリアミ
ド、ポリアミドイミド、ポリスルフォン、ポリブチＶン
テレフタＶ−ト、ポリエーテルエーテルケトン、弗化樹
脂等の瓜独、変性物、混合物等が用すられ必要に応じて
粘度調整に水、メチルアルコール、アセトン、シクロヘ
キサノン、スチレン等の溶媒を添加したもので、基材と
しては、ガラス、アスベスト等の無機繊維やポリエステ
ル、ポリアミド、ポリビニルアルコール、アクリル等の
有機合成繊維や木綿等の天然繊維からなる織布、不織布
、マット或は紙又はこれらの組合せ基材等である。内層
材としては片面金部箔張積層板や両面金属箔張積層板の
金属箔面に回路形成したもので必要に応じて内層材の枚
数を増加させ多層化することができるものである。上部
が凹凸状の弾性体としてはりリコンゴム、ウレタンゴム
、フッ化ゴム等のゴムやポリウレタン、シリコン樹脂、
フッ素櫂詣、熱可ｍ件ポリエステル、ポリアセタール、
ナイロン、フェノール樹脂、エポキシ樹脂、ポリエステ
ル樹脂、ポリブタジェン等のプラスチックの成形品、押
出品、注形品等を用することかでをる。弾性体上部の凹
凸形状は特に限定するものではなく凸部断面が角柱状、
三角状、半円状等各れでもよく、更に凸部は１つに眼ら
ず複数であってもよく特に限定するものではなり０上部
を凹凸状にすることにより減圧時の気密性を更に向上さ
せることができる。減圧、加熱、加圧程度九っｂては積
層体の樹脂、基材、内層材、積層体凧み等により異なる
ので特に限定するものではなＡ０以下本発明を実施例に
もとづいて詳細に説明する。Melamine resin, polyimide, polybutadiene-1 polyamide, polyamideimide, polysulfone, polybutylene terephthalate, polyetheretherketone, fluorinated resin, etc., modified products, mixtures, etc. are used, and the viscosity is adjusted as necessary. It is made by adding solvents such as water, methyl alcohol, acetone, cyclohexanone, styrene, etc., and the base materials include inorganic fibers such as glass and asbestos, organic synthetic fibers such as polyester, polyamide, polyvinyl alcohol, and acrylic, and cotton. These include woven fabrics, nonwoven fabrics, mats, paper, or combinations of these materials made of natural fibers. The inner layer material is one in which a circuit is formed on the metal foil surface of a single-sided metal foil-clad laminate or a double-sided metal foil-clad laminate, and the number of inner layer materials can be increased to form a multilayer structure as required. As an elastic body with an uneven upper part, rubber such as silicone rubber, urethane rubber, fluorinated rubber, polyurethane, silicone resin, etc.
Fluorine foam, thermoplastic polyester, polyacetal,
This can be achieved by using molded, extruded, cast, etc. plastic products such as nylon, phenolic resin, epoxy resin, polyester resin, and polybutadiene. The shape of the unevenness on the upper part of the elastic body is not particularly limited;
It may be triangular, semicircular, etc., and there may be more than one convex part, and there is no particular limitation.By making the upper part uneven, airtightness during depressurization can be further improved. can be improved. The degree of depressurization, heating, and pressurization varies depending on the resin of the laminate, the base material, the inner layer material, the laminate kite, etc., and is not particularly limited. Below A0 The present invention will be described in detail based on examples. do.
実施例１
回路形成した内層材の上、下面に厚さ０．１ｆｌのエポ
キシ樹脂含浸ガラス布を夫々２枚づつ重ね、更にその外
側に厚さ０．０３５１ｎＩの銅箔を夫々配設した積ノ一
体を成形プレートに挾んだもの５組の周囲に断面形状が
タテ１５ｊＥＩＩ、ヨコ３０１！ＩＩで且つ上部が凹凸
状で凸部を３筋臀するシリコンゴム角柱状押出品を配設
し１ＯＴｏｒｒ 以下に減圧し、成形圧力５０ＫＱ／
ｄ 、１６５℃で６０分間積層加熱加圧して厚さ１，６
闘の多層プリント配線板を得た。Example 1 A multilayer structure in which two sheets of epoxy resin-impregnated glass cloth with a thickness of 0.1 fl were stacked on the upper and lower surfaces of the inner layer material on which the circuit was formed, and copper foil with a thickness of 0.0351 nI was placed on the outside of each layer. The cross-sectional shape of the 5 pairs of pieces sandwiched between molded plates is vertically 15JEII and horizontally 301! A silicone rubber prismatic extruded product with an uneven upper part and three ribs on the convex part was installed, and the pressure was reduced to 1 O Torr or less, and the molding pressure was 50 KQ/
d, laminated and heated and pressed at 165℃ for 60 minutes to a thickness of 1.6
Obtained a multi-layer printed wiring board.
実施例２
厚み０．２Ｈのエポキシ樹脂含浸基材８枚を重ね更にそ
の上、下面に厚み０．０３５１０１の鋼箔を載置した積
層体を成形プレートに挾んだものｗ組の周囲に実施１５
１１と同じシリコンゴム角柱状押出品を配設し１０ Ｔ
ｏｒｒ 以下に減圧し、成形圧力５０’ｑｖ’ｄ ＊
１６５℃で１２０分間積層加熱加圧して厚さ１．６鰭の
一層板を得た。Example 2 A laminate in which 8 sheets of 0.2H thick epoxy resin-impregnated base materials were stacked and a steel foil with a thickness of 0.035101 was placed on the bottom surface was sandwiched between molded plates, and was carried out around group w. 15
10T with the same silicone rubber prismatic extrusion as 11.
Reduce the pressure to below orr and molding pressure 50'qv'd *
A single-layer plate with a thickness of 1.6 fins was obtained by laminating, heating and pressing at 165° C. for 120 minutes.
従来−Ｐ４１
実施列１のシリコンゴム角柱状押出品を除去し、減圧処
理をしない以外は実施例１と同様に処理して多層プリン
ト配線板を得た。Conventional-P41 A multilayer printed wiring board was obtained in the same manner as in Example 1 except that the silicone rubber prismatic extruded product of Example Row 1 was removed and the reduced pressure treatment was not performed.
従来例２
実施列２のシリコンゴム角柱状押出品を除去し、減圧処
理をしなり以外は実施列２と同様に処理して積層板を得
た。Conventional Example 2 The silicone rubber prismatic extrudates of Example 2 were removed, and a laminate was obtained by performing the same process as Example 2 except for the reduced pressure treatment for bending.
実施例１と２及び従来Ａ１と２の積層体のエネルギー消
費と厚み精度及び気泡含有本は第１表で明白なように本
発明の積層体の性能はよく本発明の積層体の製造方法の
優れていることを確認した。As is clear from Table 1, the energy consumption, thickness accuracy, and bubble content of the laminates of Examples 1 and 2 and conventional A1 and 2 are as follows. Confirmed that it is excellent.
注
※１ 従来品を１００とした場合の比重である※２ 枚
数は５枚である。Note *1 Specific gravity when the conventional product is set as 100 *2 Number of sheets is 5.
Claims (2)
を挿入した積層体を積層成形する積層体の製造方法にお
いて、積層体を成形プレートに挾み、その周囲を上部が
凹凸状の弾性体で囲み積層体を減圧下、積層加熱加圧す
ることを特徴とする積層体の製造方法。(1) In a method for producing a laminate in which a laminate is formed by laminating and molding an outer layer material, a resin-impregnated base material, and an inner layer material inserted as necessary, the laminate is sandwiched between molding plates, and the periphery of the laminate is formed into an uneven upper part. A method for producing a laminate, the method comprising: heating and pressurizing the laminate while surrounding it with an elastic body under reduced pressure.
の範囲第１項記載の積層体の製造方法。(2) The method for manufacturing a laminate according to claim 1, wherein the outer layer material is a metal foil.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP61052015A JPS62208935A (en) | 1986-03-10 | 1986-03-10 | Manufacture of laminated material |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP61052015A JPS62208935A (en) | 1986-03-10 | 1986-03-10 | Manufacture of laminated material |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| JPS62208935A true JPS62208935A (en) | 1987-09-14 |
Family
ID=12902986
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP61052015A Pending JPS62208935A (en) | 1986-03-10 | 1986-03-10 | Manufacture of laminated material |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPS62208935A (en) |
-
1986
- 1986-03-10 JP JP61052015A patent/JPS62208935A/en active Pending
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