JPS59101356A - Copper foil and laminated board for electricity using said foil - Google Patents
Copper foil and laminated board for electricity using said foilInfo
- Publication number
- JPS59101356A JPS59101356A JP21183382A JP21183382A JPS59101356A JP S59101356 A JPS59101356 A JP S59101356A JP 21183382 A JP21183382 A JP 21183382A JP 21183382 A JP21183382 A JP 21183382A JP S59101356 A JPS59101356 A JP S59101356A
- Authority
- JP
- Japan
- Prior art keywords
- foil
- copper foil
- resin
- laminate
- electricity
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
Classifications
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/38—Improvement of the adhesion between the insulating substrate and the metal
- H05K3/382—Improvement of the adhesion between the insulating substrate and the metal by special treatment of the metal
Abstract
(57)【要約】本公報は電子出願前の出願データであるた
め要約のデータは記録されません。(57) [Summary] This bulletin contains application data before electronic filing, so abstract data is not recorded.
Description
【発明の詳細な説明】
本発明は電気機器、電子機器、針算機、コンピューター
等に用いられる印刷配線板に用いる電気用積層板および
それに用いられる銅箔に関するもので、その目的とする
ところは印刷配線板としての加工時にうける加熱に対し
安定した銀箔接着力を与えることにある。DETAILED DESCRIPTION OF THE INVENTION The present invention relates to an electrical laminate used in printed wiring boards used in electrical equipment, electronic equipment, pointers, computers, etc., and a copper foil used therein. The purpose is to provide stable silver foil adhesive strength against heating during processing as a printed wiring board.
従来、電気用積層板に用いられる銅箔には銀箔接着力を
向上させるため２０ミクロン程度の粗面を設けた銅箔が
あったが接着力は向上するが銅箔と積層板間に気泡を介
在させたり粗面間に樹脂を流入させる必要のため高圧成
形となり板厚精度が低下する欠点がありこの気泡が印刷
配線板加工時の半田処理時にフクレとなり板厚精度と共
に不良品を惹起する原因になっていた。Conventionally, the copper foil used for electrical laminates had a rough surface of about 20 microns to improve the adhesion of the silver foil, but although this improved the adhesion, air bubbles formed between the copper foil and the laminate. Because it is necessary to interpose resin or flow resin between rough surfaces, high-pressure molding results in a decrease in board thickness accuracy.These air bubbles cause blisters during soldering during printed wiring board processing, which increases board thickness accuracy and causes defective products. It had become.
本発明は上記欠点を解決するもので、片面に１〜１０ミ
クロンの粗面を設けた銅箔を用いることにより銅箔と積
層板間Ｉこ気泡を介在させずに銀箔接着力を安定、向上
させることができ且つ高圧成形不要のため板厚精度を向
上させることができたものである。The present invention solves the above-mentioned drawbacks by using a copper foil with a rough surface of 1 to 10 microns on one side, thereby stabilizing and improving the adhesion of the silver foil without the presence of air bubbles between the copper foil and the laminate. In addition, since high-pressure molding is not required, the accuracy of the plate thickness can be improved.
以下本発明の詳細な説明する。本発明に用いる銅箔は片
面に１〜１０ミクロンの粗面を設けたものであることが
必要である。即ち１ミクロン末７両では接着力を安定、
向上させることができず、１０ミクロンをこえると銅箔
と積層板間に気泡が介在し又、高圧成形が必要になるか
らである。粗面の形状は凸状、凹状を間わず又円形状、
鋭角状を問うものではないが好ましくは凸状、鋭角状粗
面がより接着力が安定、同上する傾向にあるので好まし
いことである。又粗面にする方法は特に限定するもので
なく、化学的方法、物理的方法、電気的方法等問うもの
ではない。積層板用樹脂としてはフェノール樹脂、クレ
ゾール樹脂、エポキシ樹脂、不飽和ポリエステル樹脂、
メラミン樹脂、ポリイミド、ポリブタジエン、ポリアミ
ド、ポリアミドイド、ポリスルフォン、ポリブチレンテ
レフタレート、ポリエーテルエーテルケトン、弗化樹脂
等の単独、変性物、混合物等が用いられ必要に応じて粘
度門整に水、メチルアルコール、アセトン、シクロ・ベ
キサノン、スチレン等の溶媒を添加したもので、積層板
用基材としては、ガラス、アスベスト等の無機繊維やポ
リエステル、ポリアミド、ポリビニルアルコール、アク
リル等の有機合成繊維や木綿等の天然繊維からなる織布
、不織布、マット或は紙又はこれらの組合せ基材等であ
り上記積層板用樹脂を上記積層板用基材に含浸、乾燥し
た樹脂含浸基材の所要枚数を重ねた片面又は両面に本発
明の銅箔を載置した積層体を積層成形して電気用ｆｆｔ
ｌｌｉｌ板を得るものである。この際鋼箔の粗面愉に必
要に応じて接着剤を塗布してお（こともできるものであ
る。The present invention will be explained in detail below. The copper foil used in the present invention must have a rough surface of 1 to 10 microns on one side. In other words, the adhesive strength is stable for 7 cars with 1 micron diameter.
If the thickness exceeds 10 microns, air bubbles will be present between the copper foil and the laminate, and high-pressure molding will be required. The shape of the rough surface is convex, concave, circular,
Although the shape does not necessarily have to be acute, it is preferable to use a convex or acute-angled rough surface because the adhesive force tends to be more stable and the same as above. Further, the method for roughening the surface is not particularly limited, and may be a chemical method, a physical method, an electrical method, or the like. Resins for laminates include phenolic resin, cresol resin, epoxy resin, unsaturated polyester resin,
Melamine resin, polyimide, polybutadiene, polyamide, polyamideoid, polysulfone, polybutylene terephthalate, polyether ether ketone, fluorinated resin, etc. alone, modified products, mixtures, etc. are used.Water, methyl, etc. are used to adjust the viscosity as necessary. It contains solvents such as alcohol, acetone, cyclo-bexanone, and styrene, and can be used as base materials for laminates, such as inorganic fibers such as glass and asbestos, organic synthetic fibers such as polyester, polyamide, polyvinyl alcohol, and acrylic, and cotton. A woven fabric, nonwoven fabric, mat, paper, or a combination of these base materials made of natural fibers, etc., impregnated with the above laminate base material, and piled up with the required number of dried resin-impregnated base materials. A laminate with the copper foil of the present invention placed on one or both sides is laminated and formed into an electrical fft.
llil plate is obtained. At this time, adhesive may be applied to the rough surface of the steel foil as necessary.
以下本発明を実施例にもとすいて説明する。The present invention will be explained below using examples.
実施例
片面にクロム酸系薬品処理によって平均２０ミクロンの
粗面を有する銅箔を、更にブラシ朋磨によって平均５ミ
クロンの粗面を有する本発明の銅箔を得た。別に硬化剤
含有エポキシ樹脂液を厚さ０、０１８鰭のガラス布に含
浸、乾燥して樹脂含有輩４５重′に１％ の樹脂き浸基
材を得、該樹脂含浸基材６枚を重ねた史に上、下面に上
記本発明の銅箔を粗面側を樹脂含浸基材側と対向させて
夫々載置した積層体を成形プレート間φこ挾み成形圧カ
フ０υ、成形温度１６５℃で１２０分間積ＪＶｉ成形し
て厚さ１．６ｍの電気用積層板を得た。Example A copper foil of the present invention having an average roughness of 20 microns on one side by treatment with a chromic acid-based chemical was obtained, and a copper foil of the present invention having an average roughness of 5 microns by polishing with a brush. Separately, a glass cloth with a thickness of 0.018 fin was impregnated with an epoxy resin solution containing a hardening agent, and dried to obtain a 1% resin-impregnated base material with a resin-containing layer of 45%, and six sheets of the resin-impregnated base material were stacked. On the top and bottom surfaces of the copper foils of the present invention, the laminates were respectively placed with the rough side facing the resin-impregnated base material side, and the laminates were sandwiched between molding plates with a molding pressure of 0υ and a molding temperature of 165°C. JVi molding was carried out for 120 minutes to obtain an electrical laminate having a thickness of 1.6 m.
従来例１
実施例の銅箔として粗面化処理していない通常鋼箔を用
いた以外は実施例と同様番こ処理して厚さ１．６−の電
気用、ｆ！！層板を得た。Conventional Example 1 Electrical use of 1.6-thickness, f! ! A laminate was obtained.
従来例２
実施例の銅箔として平均２０ミクロンの粗面を有する銅
９１′ｉを用いた以外は実施例と同様に処理して厚さ１
．６Ｂの電気用積層板を得た。Conventional Example 2 The copper foil used in the example was treated in the same manner as in the example except that copper 91'i having a rough surface of 20 microns on average was used to obtain a thickness of 1.
．． A 6B electrical laminate was obtained.
実施例及び従来例１と２の電気用積層板の性能は第１表
に明白なように本発明の銅箔を用いた電気用積層板の銅
薄接着力はよく且つバラツキが少な（史に板厚精度もよ
く本発明の優れていることを確ｄ忍した。As shown in Table 1, the performance of the electrical laminates of Examples and Conventional Examples 1 and 2 is as follows. The plate thickness accuracy was also good, confirming the superiority of the present invention.
Claims (1)
とする銅箔。 （２）樹脂含浸基材の所要枚数を重ねた片面又は両面に
銀箔を載置した積層体を積層成形してなる電気用積層板
において、片面に１〜１０ミクロンの粗面を設けた銅箔
を用いたことを特徴とする電気用積層板。[Claims] 0) A copper foil characterized by having a rough surface of 1 to 10 microns on one side. (2) In an electrical laminate formed by laminating and molding a laminate in which the required number of resin-impregnated substrates are laminated and silver foil is placed on one or both sides, a copper foil with a rough surface of 1 to 10 microns on one side. An electrical laminate characterized by using.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP21183382A JPS59101356A (en) | 1982-12-01 | 1982-12-01 | Copper foil and laminated board for electricity using said foil |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP21183382A JPS59101356A (en) | 1982-12-01 | 1982-12-01 | Copper foil and laminated board for electricity using said foil |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| JPS59101356A true JPS59101356A (en) | 1984-06-11 |
Family
ID=16612343
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP21183382A Pending JPS59101356A (en) | 1982-12-01 | 1982-12-01 | Copper foil and laminated board for electricity using said foil |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPS59101356A (en) |
Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPH05500136A (en) * | 1989-08-23 | 1993-01-14 | ザイコン コーポレーション | Capacitor laminate for printed wiring board |
| US6242079B1 (en) | 1997-07-08 | 2001-06-05 | Ibiden Co., Ltd. | Printed wiring board and method for manufacturing the same |
-
1982
- 1982-12-01 JP JP21183382A patent/JPS59101356A/en active Pending
Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPH05500136A (en) * | 1989-08-23 | 1993-01-14 | ザイコン コーポレーション | Capacitor laminate for printed wiring board |
| US6242079B1 (en) | 1997-07-08 | 2001-06-05 | Ibiden Co., Ltd. | Printed wiring board and method for manufacturing the same |
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