JPS6218276B2 - - Google Patents

Info

Publication number: JPS6218276B2
Authority: JP; Japan
Prior art keywords: brazing; surface roughness; filler metal; measurement results; graph showing
Prior art date: 1981-03-11
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.): Expired

Application number

JP3377981A

Other languages

English (en)

Japanese (ja)

Other versions

JPS57149093A (en

Inventor

Takashi Nara

Hiroto Daigo

Osamu Watanabe

Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)

Tokuriki Honten Co Ltd

Original Assignee

Tokuriki Honten Co Ltd

Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)

1981-03-11

Filing date

1981-03-11

Publication date

1987-04-22

1981-03-11 Application filed by Tokuriki Honten Co Ltd filed Critical Tokuriki Honten Co Ltd

1981-03-11 Priority to JP3377981A priority Critical patent/JPS57149093A/ja

1982-09-14 Publication of JPS57149093A publication Critical patent/JPS57149093A/ja

1987-04-22 Publication of JPS6218276B2 publication Critical patent/JPS6218276B2/ja

Status Granted legal-status Critical Current

Links

238000005219 brazing Methods 0.000 claims description 31
229910052751 metal Inorganic materials 0.000 claims description 19
239000002184 metal Substances 0.000 claims description 19
239000000945 filler Substances 0.000 claims description 15
229910052748 manganese Inorganic materials 0.000 claims description 6
229910052759 nickel Inorganic materials 0.000 claims description 5
229910052709 silver Inorganic materials 0.000 claims description 5
BQCADISMDOOEFD-UHFFFAOYSA-N Silver Chemical compound [Ag] BQCADISMDOOEFD-UHFFFAOYSA-N 0.000 claims description 4
229910052744 lithium Inorganic materials 0.000 claims description 4
239000004332 silver Substances 0.000 claims description 4
229910052718 tin Inorganic materials 0.000 claims description 4
229910052738 indium Inorganic materials 0.000 claims description 3
230000003746 surface roughness Effects 0.000 description 16
238000004439 roughness measurement Methods 0.000 description 11
239000000463 material Substances 0.000 description 7
229910000679 solder Inorganic materials 0.000 description 6
229910017944 Ag—Cu Inorganic materials 0.000 description 5
238000000034 method Methods 0.000 description 4
229910017888 Cu—P Inorganic materials 0.000 description 3
UFHFLCQGNIYNRP-UHFFFAOYSA-N Hydrogen Chemical compound [H][H] UFHFLCQGNIYNRP-UHFFFAOYSA-N 0.000 description 3
230000000694 effects Effects 0.000 description 3
229910052739 hydrogen Inorganic materials 0.000 description 3
239000001257 hydrogen Substances 0.000 description 3
238000002844 melting Methods 0.000 description 3
230000008018 melting Effects 0.000 description 3
150000002739 metals Chemical class 0.000 description 3
229910000881 Cu alloy Inorganic materials 0.000 description 2
KDLHZDBZIXYQEI-UHFFFAOYSA-N Palladium Chemical compound [Pd] KDLHZDBZIXYQEI-UHFFFAOYSA-N 0.000 description 2
229910045601 alloy Inorganic materials 0.000 description 2
239000000956 alloy Substances 0.000 description 2
229910052802 copper Inorganic materials 0.000 description 2
230000007423 decrease Effects 0.000 description 2
238000007872 degassing Methods 0.000 description 2
238000004519 manufacturing process Methods 0.000 description 2
BASFCYQUMIYNBI-UHFFFAOYSA-N platinum Chemical compound [Pt] BASFCYQUMIYNBI-UHFFFAOYSA-N 0.000 description 2
238000005476 soldering Methods 0.000 description 2
238000007711 solidification Methods 0.000 description 2
230000008023 solidification Effects 0.000 description 2
238000012360 testing method Methods 0.000 description 2
239000002253 acid Substances 0.000 description 1
239000000654 additive Substances 0.000 description 1
230000000996 additive effect Effects 0.000 description 1
238000005266 casting Methods 0.000 description 1
238000013329 compounding Methods 0.000 description 1
238000005260 corrosion Methods 0.000 description 1
230000007797 corrosion Effects 0.000 description 1
239000013078 crystal Substances 0.000 description 1
230000003247 decreasing effect Effects 0.000 description 1
238000005238 degreasing Methods 0.000 description 1
239000007789 gas Substances 0.000 description 1
PCHJSUWPFVWCPO-UHFFFAOYSA-N gold Chemical compound [Au] PCHJSUWPFVWCPO-UHFFFAOYSA-N 0.000 description 1
229910052737 gold Inorganic materials 0.000 description 1
239000010931 gold Substances 0.000 description 1
210000001503 joint Anatomy 0.000 description 1
238000005259 measurement Methods 0.000 description 1
229910052763 palladium Inorganic materials 0.000 description 1
238000005554 pickling Methods 0.000 description 1
238000007747 plating Methods 0.000 description 1
229910052697 platinum Inorganic materials 0.000 description 1
238000003892 spreading Methods 0.000 description 1
238000004154 testing of material Methods 0.000 description 1

Classifications

- B—PERFORMING OPERATIONS; TRANSPORTING
- B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
- B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
- B23K35/00—Rods, electrodes, materials, or media, for use in soldering, welding, or cutting
- B23K35/22—Rods, electrodes, materials, or media, for use in soldering, welding, or cutting characterised by the composition or nature of the material
- B23K35/24—Selection of soldering or welding materials proper
- B23K35/30—Selection of soldering or welding materials proper with the principal constituent melting at less than 1550 degrees C
- B23K35/3006—Ag as the principal constituent

Landscapes

Engineering & Computer Science (AREA)
Mechanical Engineering (AREA)
Conductive Materials (AREA)

JP3377981A 1981-03-11 1981-03-11 Silver solder material Granted JPS57149093A (en)

Priority Applications (1)

Application Number	Priority Date	Filing Date	Title
JP3377981A JPS57149093A (en)	1981-03-11	1981-03-11	Silver solder material

Applications Claiming Priority (1)

Application Number	Priority Date	Filing Date	Title
JP3377981A JPS57149093A (en)	1981-03-11	1981-03-11	Silver solder material

Related Child Applications (1)

Application Number	Title	Priority Date	Filing Date
JP6438186A Division JPS61216888A (ja)	1986-03-22	1986-03-22	銀ろう材

Publications (2)

Publication Number	Publication Date
JPS57149093A JPS57149093A (en)	1982-09-14
JPS6218276B2 true JPS6218276B2 (zh)	1987-04-22

Family

ID=12395937

Family Applications (1)

Application Number	Title	Priority Date	Filing Date
JP3377981A Granted JPS57149093A (en)	1981-03-11	1981-03-11	Silver solder material

Country Status (1)

Country	Link
JP (1)	JPS57149093A (zh)

Families Citing this family (6)

* Cited by examiner, † Cited by third party
Publication number	Priority date	Publication date	Assignee	Title
JPS6092095A (ja) *	1983-10-26	1985-05-23	Tanaka Kikinzoku Kogyo Kk	Ｐｄろうのろう付け方法
JPS6220792U (zh) *	1985-07-24	1987-02-07
US6596229B2 (en)	2000-12-29	2003-07-22	United Technologies Corporation	Silver braze alloy
CN103567658B (zh) *	2012-08-09	2016-06-08	广东威特真空电子制造有限公司	一种银钎焊料及其制备方法
EP2756914A1 (de)	2013-01-18	2014-07-23	Umicore AG & Co. KG	Lotlegierung
US9731384B2 (en) *	2014-11-18	2017-08-15	Baker Hughes Incorporated	Methods and compositions for brazing

1981
- 1981-03-11 JP JP3377981A patent/JPS57149093A/ja active Granted

Also Published As

Publication number	Publication date
JPS57149093A (en)	1982-09-14

Publication	Publication Date	Title
JP2000015476A (ja)	2000-01-18	無鉛はんだ
Foster	1963	Embrittlement of solder by gold from plated surfaces
US2235634A (en)	1941-03-18	Silver solder
US4135656A (en)	1979-01-23	Nickel base brazing alloy
JPS6247117B2 (zh)	1987-10-06
JPS6218275B2 (zh)	1987-04-22
JP2008030047A (ja)	2008-02-14	無鉛ハンダ
JPH02101132A (ja)	1990-04-12	低融点ハンダ合金
JPS6218276B2 (zh)	1987-04-22
JP3081230B2 (ja)	2000-08-28	ろう付け充填金属として使用される銅合金
TW315339B (zh)	1997-09-11
KR100620368B1 (ko)	2006-09-06	주석 및 니켈을 함유한 인동합금 경납땜봉
WO1982000790A1 (en)	1982-03-18	Low-silver cu-ag alloy solder having good soldering properties and low vapor pressure
JPS63159B2 (zh)	1988-01-05
JPS61242787A (ja)	1986-10-29	銀ろう材
JPS6247119B2 (zh)	1987-10-06
JPS6254599B2 (zh)	1987-11-16
JP3501700B2 (ja)	2004-03-02	銅くわれ防止無鉛はんだ
JPS6397394A (ja)	1988-04-28	銀ろう材
JP2001225188A (ja)	2001-08-21	ハンダ合金
JPS6219264B2 (zh)	1987-04-27
JPS6397393A (ja)	1988-04-28	銀ろう材
JPS6313690A (ja)	1988-01-20	銀ろう材
JPS5865597A (ja)	1983-04-19	ろう付け部表面性状のすぐれたＡｇ合金ろう材
JPH02179387A (ja)	1990-07-12	低融点Ａｇはんだ