JPS6218276B2 - - Google Patents
Info
- Publication number
- JPS6218276B2 JPS6218276B2 JP3377981A JP3377981A JPS6218276B2 JP S6218276 B2 JPS6218276 B2 JP S6218276B2 JP 3377981 A JP3377981 A JP 3377981A JP 3377981 A JP3377981 A JP 3377981A JP S6218276 B2 JPS6218276 B2 JP S6218276B2
- Authority
- JP
- Japan
- Prior art keywords
- brazing
- surface roughness
- filler metal
- measurement results
- graph showing
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired
Links
- 238000005219 brazing Methods 0.000 claims description 31
- 229910052751 metal Inorganic materials 0.000 claims description 19
- 239000002184 metal Substances 0.000 claims description 19
- 239000000945 filler Substances 0.000 claims description 15
- 229910052748 manganese Inorganic materials 0.000 claims description 6
- 229910052759 nickel Inorganic materials 0.000 claims description 5
- 229910052709 silver Inorganic materials 0.000 claims description 5
- BQCADISMDOOEFD-UHFFFAOYSA-N Silver Chemical compound [Ag] BQCADISMDOOEFD-UHFFFAOYSA-N 0.000 claims description 4
- 229910052744 lithium Inorganic materials 0.000 claims description 4
- 239000004332 silver Substances 0.000 claims description 4
- 229910052718 tin Inorganic materials 0.000 claims description 4
- 229910052738 indium Inorganic materials 0.000 claims description 3
- 230000003746 surface roughness Effects 0.000 description 16
- 238000004439 roughness measurement Methods 0.000 description 11
- 239000000463 material Substances 0.000 description 7
- 229910000679 solder Inorganic materials 0.000 description 6
- 229910017944 Ag—Cu Inorganic materials 0.000 description 5
- 238000000034 method Methods 0.000 description 4
- 229910017888 Cu—P Inorganic materials 0.000 description 3
- UFHFLCQGNIYNRP-UHFFFAOYSA-N Hydrogen Chemical compound [H][H] UFHFLCQGNIYNRP-UHFFFAOYSA-N 0.000 description 3
- 230000000694 effects Effects 0.000 description 3
- 229910052739 hydrogen Inorganic materials 0.000 description 3
- 239000001257 hydrogen Substances 0.000 description 3
- 238000002844 melting Methods 0.000 description 3
- 230000008018 melting Effects 0.000 description 3
- 150000002739 metals Chemical class 0.000 description 3
- 229910000881 Cu alloy Inorganic materials 0.000 description 2
- KDLHZDBZIXYQEI-UHFFFAOYSA-N Palladium Chemical compound [Pd] KDLHZDBZIXYQEI-UHFFFAOYSA-N 0.000 description 2
- 229910045601 alloy Inorganic materials 0.000 description 2
- 239000000956 alloy Substances 0.000 description 2
- 229910052802 copper Inorganic materials 0.000 description 2
- 230000007423 decrease Effects 0.000 description 2
- 238000007872 degassing Methods 0.000 description 2
- 238000004519 manufacturing process Methods 0.000 description 2
- BASFCYQUMIYNBI-UHFFFAOYSA-N platinum Chemical compound [Pt] BASFCYQUMIYNBI-UHFFFAOYSA-N 0.000 description 2
- 238000005476 soldering Methods 0.000 description 2
- 238000007711 solidification Methods 0.000 description 2
- 230000008023 solidification Effects 0.000 description 2
- 238000012360 testing method Methods 0.000 description 2
- 239000002253 acid Substances 0.000 description 1
- 239000000654 additive Substances 0.000 description 1
- 230000000996 additive effect Effects 0.000 description 1
- 238000005266 casting Methods 0.000 description 1
- 238000013329 compounding Methods 0.000 description 1
- 238000005260 corrosion Methods 0.000 description 1
- 230000007797 corrosion Effects 0.000 description 1
- 239000013078 crystal Substances 0.000 description 1
- 230000003247 decreasing effect Effects 0.000 description 1
- 238000005238 degreasing Methods 0.000 description 1
- 239000007789 gas Substances 0.000 description 1
- PCHJSUWPFVWCPO-UHFFFAOYSA-N gold Chemical compound [Au] PCHJSUWPFVWCPO-UHFFFAOYSA-N 0.000 description 1
- 229910052737 gold Inorganic materials 0.000 description 1
- 239000010931 gold Substances 0.000 description 1
- 210000001503 joint Anatomy 0.000 description 1
- 238000005259 measurement Methods 0.000 description 1
- 229910052763 palladium Inorganic materials 0.000 description 1
- 238000005554 pickling Methods 0.000 description 1
- 238000007747 plating Methods 0.000 description 1
- 229910052697 platinum Inorganic materials 0.000 description 1
- 238000003892 spreading Methods 0.000 description 1
- 238000004154 testing of material Methods 0.000 description 1
Classifications
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
- B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
- B23K35/00—Rods, electrodes, materials, or media, for use in soldering, welding, or cutting
- B23K35/22—Rods, electrodes, materials, or media, for use in soldering, welding, or cutting characterised by the composition or nature of the material
- B23K35/24—Selection of soldering or welding materials proper
- B23K35/30—Selection of soldering or welding materials proper with the principal constituent melting at less than 1550 degrees C
- B23K35/3006—Ag as the principal constituent
Landscapes
- Engineering & Computer Science (AREA)
- Mechanical Engineering (AREA)
- Conductive Materials (AREA)
Description
本発明は真空中もしくは雰囲気中で使用する銀
ろう材に関する。
従来より金属のろう付には銀ろう、金ろう、パ
ラジウムろう、白金ろう等が用いられている。そ
の中でも銀ろうは融点が比較的低く作業性がよい
こと及び価格が比較的低廉であることから特殊な
場合を除いては広く用いられている。銀ろうの中
でも特に72Ag〜Cu合金（BAg−８）が電子管や
真空管等の電子部品などをはじめとして多用され
ており、また、融点あるいは価格を考慮して銀の
含有量を増減させたAg−Cu合金が使用されてい
る。
しかしながら、特に電子工業の分野において
は、ろう付後の工程の関係からろう付後の表面の
平滑度が要求される。それは、ろう付後の表面の
粗さの度合が大きいとその後のはんだ付工程の作
業性が低下し、まためつき工程において前処理の
脱脂が充分に行なわれなかつたり、酸洗処理の酸
が表面に残留して表面が腐食されたりしてめつき
不良をきたす等の問題を起す虞れがあるからであ
り、できるだけ平滑な表面に仕上がるろう材が要
求されている。
そしてろう付表面の粗さの原因は以下の二つに
よるものと考えられる。(i)ろう材凝固時に生ずる
ガスによつて表面が粗される。(ii)ろう材凝固時の
金属組織が微細化しないことにより粗される。
従つて上記の原因を取除くことによりろう付面
の表面の平滑さは得られることになる。
本発明は上記の要求を満すことを目的とし、
Ag−CuにMnおよびNiを加えこれにＰを加えて
ろう材とするか、さらにこれにIn、Sn、Li等を
一種または二種以上添加してろう材とすることに
より平滑なろう付表面が得られることを特徴とす
る。
以下本発明について説明する。
なお、以下の元素の配合比はすべて重量％とし
て説明する。
Agを50〜95％、Cuを５〜50％、Mnおよびも
しくはNiを0.005〜１％加えこれにＰを0.001〜0.5
％加えてろう材とするか、さらにこれにIn、
Sn、Li等を一種または二種以上を0.005〜５％添
加してろう材とする。
ここで、添加するMn、Ni、In、Sn、Liは蒸気
圧の低い金属であり、その添加量は0.005％未満
であると結晶の微細化および表面を粗さない効果
を上げることはできず、また上記所定量を越える
と、(i)融点の上昇が大きくろう付使用に不便とな
る。(ii)流動性が低下する。(iii)加工性が低下して鋳
造後の製造工程に支障をきたす。(iv)価格が高くな
りすぎる。等の欠点の内の少なくとも１つの欠点
が生ずる。
Ｐはろう材製造中及びろう材使用中の脱ガス効
果特に脱酸効果があり、さらに流動性を改善す
る。しかしＰを添加することによつて強度は従来
のろう材より弱まる。しかし、Mn、Ni等の混合
によつて強度の低下をおさえることができる。
次に本発明の実施例について説明する。
(A) Ag85％ Cu13.4％ P0.3％ Mn0.1％
Ni0.2％ Sn1.0％
(B) Ag72％ Cu25.15％ P0.05％ Mn0.5％
Ni0.2％ In2.0％ Li0.1％
(C) Ag60％ Cu38.99％ P0.01％ Mn0.5％
Ni0.5％
以上の本発明の試料について従来品及びその従
来品にＰを添加した試料とを性能を比較してみ
た。
従来品及び従来品にＰを添加した試料について
以下の６種を挙げる。
(D) Ag85％ Cu15％（85Ag−Cu）
(E) Ag 72％ Cu28％（BAg−８）
(F) Ag 60％ Cu 40％（60Ag−Cu）
(G) Ag85％ Cu14.7 P0.3％
(H) Ag72％ Cu27.95％ P0.05％
(I) Ag60％ Cu38.99％ P0.01
(1) ろう材の引張強度について下記のような結果
を得た。
The present invention relates to a silver brazing material used in vacuum or atmosphere. Conventionally, silver solder, gold solder, palladium solder, platinum solder, etc. have been used for brazing metals. Among these, silver solder is widely used except in special cases because it has a relatively low melting point, good workability, and a relatively low price. Among silver solders, 72Ag-Cu alloy (BAg-8) is particularly widely used in electronic components such as electron tubes and vacuum tubes.Also, Ag-Cu alloys with increased or decreased silver content in consideration of melting point or price are widely used. Cu alloy is used. However, especially in the electronic industry, the smoothness of the surface after brazing is required due to the post-brazing process. If the degree of roughness of the surface after brazing is large, the workability of the subsequent soldering process will be reduced, and the degreasing in the pretreatment may not be carried out sufficiently in the soldering process, or the acid in the pickling process may not be sufficient. This is because there is a risk that the brazing filler metal may remain on the surface and cause problems such as corrosion of the surface and poor plating, and there is a need for a brazing filler metal that can finish as smooth a surface as possible. The roughness of the brazed surface is thought to be due to the following two reasons. (i) The surface is roughened by the gas generated during solidification of the brazing material. (ii) The metal structure during solidification of the brazing material is not refined and becomes rough. Therefore, by eliminating the above-mentioned causes, the surface smoothness of the brazed surface can be obtained. The present invention aims to meet the above requirements,
A smooth brazing surface can be achieved by adding Mn and Ni to Ag-Cu and adding P to this to make a brazing material, or by adding one or more of In, Sn, Li, etc. to this to make a brazing material. It is characterized by that it can be obtained. The present invention will be explained below. In addition, all the compounding ratios of the following elements are explained as weight %. Add 50-95% Ag, 5-50% Cu, 0.005-1% Mn and/or Ni, and add 0.001-0.5% P.
% to make a brazing filler metal, or add In,
One or more of Sn, Li, etc. are added in an amount of 0.005 to 5% to form a brazing filler metal. Here, Mn, Ni, In, Sn, and Li are metals with low vapor pressure, and if the amount added is less than 0.005%, it will not be possible to refine the crystals and prevent the surface from becoming rough. If the amount exceeds the above-mentioned predetermined amount, (i) the melting point will rise significantly, making it inconvenient for brazing. (ii) liquidity decreases; (iii) Workability deteriorates, causing problems in the manufacturing process after casting. (iv) Prices become too high. At least one of the following disadvantages occurs. P has a degassing effect, especially a deoxidizing effect, during the manufacture and use of the brazing material, and further improves fluidity. However, by adding P, the strength becomes weaker than that of conventional brazing filler metals. However, the decrease in strength can be suppressed by mixing Mn, Ni, etc. Next, examples of the present invention will be described. (A) Ag85% Cu13.4% P0.3% Mn0.1%
Ni0.2% Sn1.0% (B) Ag72% Cu25.15% P0.05% Mn0.5%
Ni0.2% In2.0% Li0.1% (C) Ag60% Cu38.99% P0.01% Mn0.5%
The performance of the sample of the present invention containing 0.5% or more Ni was compared with a conventional product and a sample in which P was added to the conventional product. The following six types of conventional products and samples with P added to the conventional product are listed below. (D) Ag85% Cu15% (85Ag−Cu) (E) Ag 72% Cu28% (BAg−8) (F) Ag 60% Cu 40% (60Ag−Cu) (G) Ag85% Cu14.7 P0.3 % (H) Ag72% Cu27.95% P0.05% (I) Ag60% Cu38.99% P0.01 (1) The following results were obtained regarding the tensile strength of the brazing filler metal.
【表】
但し
アムスラー材料試験機により行ない、各試料
の液相温度より40℃高い温度にて真空中または
水素雰囲気中でろう付を行なつた。
断面が４×４mmの突合わせ継手を測定した。
(2) 拡がり試験については下記のような結果を得
た。[Table] However, brazing was performed using an Amsler material testing machine, and brazing was performed in vacuum or in a hydrogen atmosphere at a temperature 40°C higher than the liquidus temperature of each sample. A butt joint with a cross section of 4 x 4 mm was measured. (2) Regarding the spread test, the following results were obtained.
【表】
但し、
拡がり試験は厚さ0.1mm、10mm角のろう材を
用い、各ろう材の液相温度より40℃高い温度に
て真空中または水素雰囲気中で行ない、２分間
保持した。
(3) 表面粗さの測定結果は第１図〜第９図に示す
通りである。
但し、各ろう材の流動後の表面粗さは、表面
粗さ測定機により測定を行なつた。各ろう材は
Ni板でその液相温度より40℃高い温度におい
て真空中または水素雰囲気中で流動させた。
以上の第１表から第２表に示す如く本発明によ
るろう材の基本的性能は、添加金属の種類や添加
量によつて若干の変動はあるが、ろう材引張強度
は
Ag−Cu−Ｐ−Ｘ≧Ag−Cu＞Ag−Cu−Ｐ
（ＸはＰ以外の添加物）
となり、拡がり面積は
Ag−Cu−Ｐ−Ｘ≧Ag−Cu−Ｐ＞Ag−Cu
となる。
そして、ろう付後の表面粗さは第１図〜第９図
に示す如く本発明のろう材は明らかに表面のざら
つきが改良されることがわかる。
以上の如く本発明はAg−Cu系のろう材の基本
的性能を損うことなく、ろう付後の表面の状態を
改善し、多方面に亘つて有用なろう材となる。
さらにAg−Cu系合金の脱ガス効果を計つたこ
とにより、表面のざらつきを改善し、その結果電
子工業の分野はもちろん装飾品についてもより美
しい外観を与えることになる。[Table] However, the spreading test was conducted using a 10 mm square brazing filler metal with a thickness of 0.1 mm, at a temperature 40°C higher than the liquidus temperature of each brazing filler metal, in a vacuum or in a hydrogen atmosphere, and held for 2 minutes. (3) The measurement results of surface roughness are as shown in Figs. 1 to 9. However, the surface roughness of each brazing filler metal after flowing was measured using a surface roughness measuring device. Each filler metal
A Ni plate was flowed in vacuum or in a hydrogen atmosphere at a temperature 40°C higher than its liquidus temperature. As shown in Tables 1 and 2 above, the basic performance of the brazing filler metal according to the present invention varies slightly depending on the type and amount of added metal, but the tensile strength of the brazing filler metal is Ag-Cu-P. -X≧Ag-Cu>Ag-Cu-P (X is an additive other than P), and the spread area becomes Ag-Cu-P-X≧Ag-Cu-P>Ag-Cu. The surface roughness after brazing is shown in FIGS. 1 to 9, and it can be seen that the brazing material of the present invention has clearly improved surface roughness. As described above, the present invention improves the surface condition after brazing without impairing the basic performance of Ag--Cu based brazing filler metal, making it a brazing filler metal useful in many fields. Furthermore, by measuring the degassing effect of the Ag-Cu alloy, the roughness of the surface can be improved, resulting in a more beautiful appearance not only in the electronic industry but also in decorative items.
第１図は従来品(D)の表面粗さ測定結果を示すグ
ラフ、第２図は従来品にＰを加えた試料(G)の表面
粗さ測定結果を示すグラフ、第３図は本発明の試
料(A)の表面粗さ測定結果を示すグラフ、第４図は
従来品(E)の表面粗さ測定結果を示すグラフ、第５
図は従来品にＰを加えた試料(H)の表面粗さ測定結
果を示すグラフ、第６図は本発明の試料(B)の表面
粗さ測定結果を示すグラフ、第７図は従来品(F)の
表面粗さ測定結果を示すグラフ、第８図は従来品
にＰを加えた試料(I)の表面粗さ測定結果を示すグ
ラフ、第９図は本発明の試料(C)の表面粗さ測定結
果を示すグラフである。
Fig. 1 is a graph showing the surface roughness measurement results of the conventional product (D), Fig. 2 is a graph showing the surface roughness measurement results of the sample (G) in which P is added to the conventional product, and Fig. 3 is the graph showing the surface roughness measurement results of the conventional product (D). Figure 4 is a graph showing the surface roughness measurement results of sample (A). Figure 4 is a graph showing the surface roughness measurement results of conventional product (E).
The figure is a graph showing the surface roughness measurement results of the sample (H) in which P is added to the conventional product. Figure 6 is a graph showing the surface roughness measurement results of the sample (B) of the present invention. Figure 7 is the conventional product. A graph showing the surface roughness measurement results of (F), Fig. 8 a graph showing the surface roughness measurement results of the sample (I) in which P was added to the conventional product, and Fig. 9 a graph showing the surface roughness measurement results of the sample (C) of the present invention. It is a graph showing surface roughness measurement results.
Claims (1)
MnおよびNiを0.005〜１重量％、Ｐを0.001〜0.5
重量％加えたことを特徴とする銀ろう材。 ２ Agを50〜95重量％、Cuを５〜50重量％、
MnおよびNiを0.005〜１重量％、Ｐを0.001〜0.05
重量％、さらにIn、Sn、Liの一種または二種以
上を0.005〜５重量％加えたことを特徴とする銀
ろう材。[Claims] 1 50 to 95% by weight of Ag, 5 to 50% by weight of Cu,
Mn and Ni 0.005-1% by weight, P 0.001-0.5
A silver brazing filler metal characterized by adding % by weight. 2 Ag 50-95% by weight, Cu 5-50% by weight,
Mn and Ni 0.005-1% by weight, P 0.001-0.05
% by weight, and further contains 0.005 to 5% by weight of one or more of In, Sn, and Li.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP3377981A JPS57149093A (en) | 1981-03-11 | 1981-03-11 | Silver solder material |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP3377981A JPS57149093A (en) | 1981-03-11 | 1981-03-11 | Silver solder material |
Related Child Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP6438186A Division JPS61216888A (en) | 1986-03-22 | 1986-03-22 | Silver brazing filler metal |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| JPS57149093A JPS57149093A (en) | 1982-09-14 |
| JPS6218276B2 true JPS6218276B2 (en) | 1987-04-22 |
Family
ID=12395937
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP3377981A Granted JPS57149093A (en) | 1981-03-11 | 1981-03-11 | Silver solder material |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPS57149093A (en) |
Families Citing this family (6)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS6092095A (en) * | 1983-10-26 | 1985-05-23 | Tanaka Kikinzoku Kogyo Kk | Pd solder |
| JPS6220792U (en) * | 1985-07-24 | 1987-02-07 | ||
| US6596229B2 (en) | 2000-12-29 | 2003-07-22 | United Technologies Corporation | Silver braze alloy |
| CN103567658B (en) * | 2012-08-09 | 2016-06-08 | 广东威特真空电子制造有限公司 | A kind of silver solder and its preparation method |
| EP2756914A1 (en) | 2013-01-18 | 2014-07-23 | Umicore AG & Co. KG | Solder alloy |
| US9731384B2 (en) * | 2014-11-18 | 2017-08-15 | Baker Hughes Incorporated | Methods and compositions for brazing |
-
1981
- 1981-03-11 JP JP3377981A patent/JPS57149093A/en active Granted
Also Published As
| Publication number | Publication date |
|---|---|
| JPS57149093A (en) | 1982-09-14 |
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