JPS6313690A - Silver brazing filler metal - Google Patents
Silver brazing filler metalInfo
- Publication number
- JPS6313690A JPS6313690A JP15507686A JP15507686A JPS6313690A JP S6313690 A JPS6313690 A JP S6313690A JP 15507686 A JP15507686 A JP 15507686A JP 15507686 A JP15507686 A JP 15507686A JP S6313690 A JPS6313690 A JP S6313690A
- Authority
- JP
- Japan
- Prior art keywords
- silver
- metal
- brazing
- brazing filler
- copper
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Granted
Links
- 238000005219 brazing Methods 0.000 title claims abstract description 70
- 239000002184 metal Substances 0.000 title claims abstract description 56
- 229910052751 metal Inorganic materials 0.000 title claims abstract description 56
- BQCADISMDOOEFD-UHFFFAOYSA-N Silver Chemical compound [Ag] BQCADISMDOOEFD-UHFFFAOYSA-N 0.000 title claims abstract description 38
- 229910052709 silver Inorganic materials 0.000 title claims abstract description 38
- 239000004332 silver Substances 0.000 title claims abstract description 38
- 239000000945 filler Substances 0.000 title claims abstract description 33
- BUGBHKTXTAQXES-UHFFFAOYSA-N Selenium Chemical compound [Se] BUGBHKTXTAQXES-UHFFFAOYSA-N 0.000 claims abstract description 13
- 239000010949 copper Substances 0.000 claims abstract description 13
- 229910052711 selenium Inorganic materials 0.000 claims abstract description 13
- 239000011669 selenium Substances 0.000 claims abstract description 13
- RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical compound [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 claims abstract description 12
- 229910052802 copper Inorganic materials 0.000 claims abstract description 12
- 239000011573 trace mineral Substances 0.000 claims abstract description 12
- 235000013619 trace mineral Nutrition 0.000 claims abstract description 12
- OAICVXFJPJFONN-UHFFFAOYSA-N Phosphorus Chemical compound [P] OAICVXFJPJFONN-UHFFFAOYSA-N 0.000 claims abstract description 8
- 229910052698 phosphorus Inorganic materials 0.000 claims abstract description 8
- 239000011574 phosphorus Substances 0.000 claims abstract description 8
- 239000000463 material Substances 0.000 claims description 31
- 239000000203 mixture Substances 0.000 claims description 11
- 230000000694 effects Effects 0.000 abstract description 16
- 238000005260 corrosion Methods 0.000 abstract description 7
- 230000007797 corrosion Effects 0.000 abstract description 7
- 230000003746 surface roughness Effects 0.000 abstract description 7
- 239000000853 adhesive Substances 0.000 abstract 1
- 230000001070 adhesive effect Effects 0.000 abstract 1
- 150000002739 metals Chemical class 0.000 description 12
- 238000000034 method Methods 0.000 description 12
- 238000005304 joining Methods 0.000 description 5
- 230000007423 decrease Effects 0.000 description 4
- 239000006185 dispersion Substances 0.000 description 4
- 238000002844 melting Methods 0.000 description 4
- 230000008018 melting Effects 0.000 description 4
- 229910000679 solder Inorganic materials 0.000 description 4
- 229910000881 Cu alloy Inorganic materials 0.000 description 3
- 238000007872 degassing Methods 0.000 description 3
- 238000004519 manufacturing process Methods 0.000 description 3
- 238000007747 plating Methods 0.000 description 3
- 239000000126 substance Substances 0.000 description 3
- 239000002253 acid Substances 0.000 description 2
- 229910045601 alloy Inorganic materials 0.000 description 2
- 239000000956 alloy Substances 0.000 description 2
- 230000008901 benefit Effects 0.000 description 2
- 238000005516 engineering process Methods 0.000 description 2
- 239000007769 metal material Substances 0.000 description 2
- 230000002093 peripheral effect Effects 0.000 description 2
- 238000005554 pickling Methods 0.000 description 2
- 229910017944 Ag—Cu Inorganic materials 0.000 description 1
- UFHFLCQGNIYNRP-UHFFFAOYSA-N Hydrogen Chemical compound [H][H] UFHFLCQGNIYNRP-UHFFFAOYSA-N 0.000 description 1
- 239000011248 coating agent Substances 0.000 description 1
- 238000000576 coating method Methods 0.000 description 1
- 238000011109 contamination Methods 0.000 description 1
- 230000000593 degrading effect Effects 0.000 description 1
- 238000005238 degreasing Methods 0.000 description 1
- 238000009826 distribution Methods 0.000 description 1
- 238000002474 experimental method Methods 0.000 description 1
- 230000002349 favourable effect Effects 0.000 description 1
- 239000007789 gas Substances 0.000 description 1
- 229910052739 hydrogen Inorganic materials 0.000 description 1
- 239000001257 hydrogen Substances 0.000 description 1
- 238000009776 industrial production Methods 0.000 description 1
- 230000000977 initiatory effect Effects 0.000 description 1
- 238000003892 spreading Methods 0.000 description 1
Landscapes
- Conductive Materials (AREA)
Abstract
Description
【発明の詳細な説明】
〈産業上の利用分野〉
開示技術は真空中、或は、所定のカス雰囲気中で電気製
品や電子部品等の接合に使用する銀ろう材の組成の技術
分野に属する。[Detailed Description of the Invention] <Industrial Application Field> The disclosed technology belongs to the technical field of composition of silver braze used for joining electrical products, electronic parts, etc. in vacuum or in a predetermined gas atmosphere. .
〈要旨の概要〉
而して、この出願の発明は電気製品や電子部品の電気伝
導度を良好に維持する接合材として用いられる銀ろう材
であって、その組成の基材を成す銀に対しろう材として
の機能の重要なろう流れ性を良好にする他の元素を添加
すると共に、金属組織を微細、且つ、緻密化するために
、微量元素を添加した銀ろう材に関する発明であり、特
に、各元素の添加重量％において、上記他の元素として
ろう材の基本的な流動特性を向上させるべく銅を５〜５
０％、そして、ろう材の金属組織の緻密微細化、分散化
を良好に現出することが出来るようにセレンを０．００
１〜０．１％、或は、更に、これに対して燐を０．００
１〜０．５％添加し、残量は全組成重量 ｉｏｏ％以内
で銀を５０〜９５％とするようにした銀ろう材に係る発
明である。<Summary> The invention of this application is a silver brazing material used as a bonding material to maintain good electrical conductivity in electrical products and electronic parts, which This invention relates to a silver brazing material in which trace elements are added in order to make the metal structure fine and dense, as well as other elements to improve the flowability of the solder, which is important for its function as a brazing material. In order to improve the basic flow characteristics of the brazing filler metal, copper is added as the other element by 5 to 5% by weight of each element.
0%, and 0.00% selenium so that the metal structure of the brazing filler metal can be finely refined and dispersed well.
1 to 0.1%, or even 0.00 phosphorus to this
This invention relates to a silver brazing material in which silver is added in an amount of 1 to 0.5%, and the remaining amount is 50 to 95% of silver within ioo% of the total composition weight.
〈従来技術〉
周知の如く、金属相Ｈの物理、化学的特性を維持しなが
ら接合を図るには所謂ろう材が広く用いられており、接
合金属の性質や目的に応じて各種のろう祠が種々開発さ
れて広く用いられている。<Prior art> As is well known, so-called brazing fillers are widely used to achieve bonding while maintaining the physical and chemical properties of the metal phase H, and various brazing fillers are used depending on the properties and purpose of the bonding metal. Various types have been developed and are widely used.
このうちでも、電気製品の接合等には融点が低く、加工
性や作業性が良いうえに資材供給が安定し、価格も比較
的に低廉である等の利点から銀ろう材が広範囲に用いら
れており、就中、７２％ＡＱＣｕ合金（所謂ＢＡＱ−８
＞はエレクトロニクス産業の隆盛に伴って電子部品接合
等に極めて広く用いられており、電子工業や精密機械産
業においては融点、或は、電気伝導特性等の物理化学的
性質、及び、］ス］〜を考慮してろう祠の素材組成のう
ち最も大きな含有量を有する銀の量を所定に設泪したＡ
Ｑ−Ｃｕ合金等の銀ろう材がかなりの間で用いられてい
る。Among these, silver brazing filler metal is widely used for joining electrical products because of its low melting point, good processability and workability, stable supply of materials, and relatively low price. Among them, 72% AQCu alloy (so-called BAQ-8
With the rise of the electronics industry, it has been extremely widely used for joining electronic parts, etc., and in the electronics industry and precision machinery industry, it has been used for physicochemical properties such as melting point or electrical conductivity, and Taking into consideration the amount of silver that has the largest content in the material composition of the wax shrine, A
Silver fillers such as Q-Cu alloys have been used for quite some time.
〈発明が解決しようとする問題点〉
而して、各種の工業製品、就中、電子工業製品において
は、中に複数の金属素材をろう材によって甲に接合する
ばかりでないことは周知の通りであり、特に、エレクト
ロニクス製品を中心とする電子工業においてはろう材に
よる複数金属の接合後において多くの機械的、物理的、
化学的な複数の工程をたどる場合が多く、したかつて、
ろう付は後の各工程での接合素材の強度や化学的安定性
が強く望まれ、ろう材（こよる接合時のろう材の用材に
対するぬれ性とろう付は後の表面の平滑度が厳しく要求
されるようになってきている。<Problem to be solved by the invention> As is well known, in various industrial products, especially electronic industrial products, it is not only necessary to bond a plurality of metal materials to the shell using a brazing material. In particular, in the electronics industry, which mainly produces electronic products, there are many mechanical, physical, and
Often involves multiple chemical steps,
In brazing, the strength and chemical stability of the joining materials in each subsequent process are strongly desired, and the wettability of the brazing material to the material during joining and the smoothness of the surface after brazing are critical. It is becoming more and more required.
蓋し、ろう付は工程におけるろう材のぬれ性が悪く、ろ
う付は後の母材表面に対する面あらざが大きいと、上述
ろう付は後の各工程での加工性が低下したり、作業性を
阻害したりし、製品精度を低下する欠点があるからであ
る。When brazing with a lid, the wettability of the brazing material during the process is poor, and when brazing has large surface roughness on the surface of the base material afterward, the above-mentioned brazing may reduce workability in each subsequent process or cause work problems. This is because they have the disadvantage of impeding performance and reducing product accuracy.
例えば、ろう付は後のメッキ工程において、ろう付けの
ぬれ性が悪いことによって、メッキの前工程における脱
脂が充分でなかったり、酸洗処理工程での酸が表面に残
留してその後の各工程中における、或は、製品における
経時的な腐蝕を招来する等の難点があり、結果的に製品
歩留を低下し、信頼度が低下したりする不利点があった
。For example, in brazing, the wettability of brazing is poor, so degreasing in the pre-plating process may not be sufficient, or the acid in the pickling process may remain on the surface, resulting in subsequent steps. There are disadvantages such as corrosion over time in the interior or in the product, which results in a decrease in product yield and reliability.
さりながら、これまでに開発されてきた銀ろう材、特に
、Ａ Ｃ１−Ｃｕろう材においては微細、月つ、精密な
電子部品に対するろう付は時のぬれ性が充分でなく、／
￥１４４金属組成に対する接合性に乏しく、金属組織に
お（プる微細金属の分散性が充分でないために、母材に
対する而あらさが大きいという不臭合があった。However, the silver brazing filler metals that have been developed so far, especially the A C1-Cu brazing filler metals, do not have sufficient wettability over time for brazing fine, thin, and precision electronic components.
￥144 Poor bondability to the metal composition and insufficient dispersibility of the fine metals in the metal structure, resulting in a large roughness to the base material and an unpleasant odor.
〈発明の目的〉
この出願の発明の目的は上述従来技術に基づく精密機械
工業や電子工業におけるろう材、特に、銀ろう材の問題
点を解決すべき技術的課題とし、△ｒｒ−Ｃｕ合金ろう
材の電気伝導度や熱伝導性のろう材としての基本的初期
特性を充分に維持しながらも加工時における流動性が良
く、ぬれ性に冨み、充分な設計通りの平滑度を保持し、
ろう付は後の各処理工程における加工性や作業性を向上
させ、しかも、製品の精度に対する信頼度を向上させる
ことが出来るようにして、機械工業、電子工業等の先端
産業における加工処理技術利用分野に益する優れた銀ろ
う材を提供ゼんとするものである。<Objective of the Invention> The object of the invention of this application is to solve the problems of brazing filler metals, especially silver brazing fillers, in the precision machinery industry and electronics industry based on the above-mentioned prior art, and to solve the problems of △rr-Cu alloy brazing filler metals. While fully maintaining the basic initial properties of the material as a brazing material, such as electrical conductivity and thermal conductivity, it has good fluidity during processing, is rich in wettability, and maintains sufficient smoothness as designed.
Brazing improves workability and workability in subsequent processing steps, and also improves reliability in product accuracy, making it suitable for use in processing technology in cutting-edge industries such as the mechanical and electronic industries. We aim to provide excellent silver brazing filler metals that will benefit the field.
く問題点を解決するための手段・作用〉上述目的に沿い
先述特許請求の範囲を要旨とするこの出願の発明の構成
は前）ホ問題点を解決するために、基本的なＡｇ−Ｃｕ
ｔ合金の銀ろう材素材に対し、更に、ぬれ性等のろう付
は特性を向上させる微量元素を添加するようにして精密
機械工業やエレクトロニクスを中心とする電子工業にお
いて、複数の金属素材を接合する銀ろうイ・４がその組
成を全組成重量１００％において電気伝導と熱伝導等の
基本的基材の特性に与る銀の融点を下げ、加工性に冨む
べく流動性を良くし、併せて耐蝕性を充分に保つように
機能する銅を５〜５０％の範囲にし、接合金属に対する
ぬれ性と面あらざを低くし、後工程における各処理段階
での加工性や作業性を向上する微量元素としてセレンを
０．００１〜０．１％、或は、更に、セレンに加えてろ
う材自体の製造、及び、素材金属に対するろう付けに際
して脱ガス効果を促進させ、更には、脱酸効果を具備し
、銅の流動性を促進させるように燐を０．００１〜０．
５％添加し、銀ろう材の基本的性質である電気伝導度や
熱伝導性を充分に維持する銀を５０〜９５％の範囲で残
量とした銀ろう材として加工性に優れると共−〇 −
に作業性を阻害せず、ぬれ性が良く、而あらざは極めて
低くすることが出来るようにした技術的手段を講じたも
のである。In order to solve the above problems, the structure of the invention of this application, which is based on the scope of the preceding patent claims, is based on the basic Ag-Cu
Trace elements are added to the t-alloy silver brazing material to improve brazing properties such as wettability, which is used to join multiple metal materials in the precision machinery industry and the electronics industry, mainly electronics. Silver solder I-4 lowers the melting point of silver, which contributes to basic base material properties such as electrical conduction and thermal conduction, and improves fluidity to enhance processability at a total composition weight of 100%. In addition, the content of copper, which functions to maintain sufficient corrosion resistance, is within the range of 5 to 50%, reducing wettability and surface roughness for bonded metals, and improving processability and workability at each processing stage in the post-process. Selenium is added as a trace element of 0.001 to 0.1%, or in addition to selenium, to promote the degassing effect during the manufacture of the brazing filler metal itself and during brazing to the raw metal, and furthermore, to deoxidize. Phosphorus is added in an amount of 0.001 to 0.0 to have a good effect and promote the fluidity of copper.
It has excellent workability as a silver brazing filler metal with a residual amount of silver in the range of 50 to 95%, which sufficiently maintains the electrical conductivity and thermal conductivity, which are the basic properties of silver brazing filler metal. 〇 - Technical measures have been taken to ensure that the workability is not hindered, the wettability is good, and the occurrence of roughness is extremely low.
尚、組成重量、及び、その重量範囲についてはその背與
的理由は理論、及び、実験に基づいて次のように得られ
たものである。The reasons behind the composition weight and its weight range were obtained as follows based on theory and experiment.
即ち、銅についてはろう材の基本的な初期特性の流動性
を保証するものであり、５％未満では流動性が悪く、５
０％を越えると融点が上昇し、ろう付は条件が悪化し、
耐蝕性も低下して製品に対する信頼性が落ちるからであ
る。In other words, as for copper, it guarantees the fluidity of the basic initial characteristic of the brazing filler metal, and if it is less than 5%, the fluidity is poor;
If it exceeds 0%, the melting point will rise and the brazing conditions will deteriorate.
This is because the corrosion resistance also decreases and the reliability of the product decreases.
又、セレンについては、金属組織を微細化して均一分散
化を促進し、而あらさを著しく低下させ、又、ろう流れ
性を改善し、ろう材のぬれ性を向上するのに著しく奇与
し、その含有量が０．００１％未満ではぬれ性改善の効
果が期待出来ず、又、０．１％を越えるとセレン自体が
比較的蒸気圧の高い金属であるためにろう付は工程にお
ける周辺機器や作業環境を汚染し、更に、接合金属に対
するろう付は特性を■害するからで、その最も良好な範
囲が０．００１〜０．１％の微量元素としたものである
。Regarding selenium, it refines the metal structure, promotes uniform dispersion, significantly reduces roughness, improves the flowability of the solder, and improves the wettability of the brazing material. If the content is less than 0.001%, the effect of improving wettability cannot be expected, and if it exceeds 0.1%, selenium itself is a metal with a relatively high vapor pressure, so brazing is not necessary for peripheral equipment in the process. This is because brazing the bonded metals pollutes the working environment and impairs the properties of the metals to be joined. Therefore, the most favorable range of trace elements is 0.001 to 0.1%.
又、燐については銀ろう材自体の製造時や接合金属に対
するろう付は時に脱ガス効果が著しく、特に、脱酸効果
に優れ、ろう材の流動性を改善するのに極めて有効であ
り、その添加量は０．００１％未満では良好な効果が期
待出来ず、０．５％を越えるとろう付は強度が低下する
ために、０．００１〜０．５％の微量元素の範囲にした
ものである。In addition, regarding phosphorus, the degassing effect is sometimes remarkable during the manufacture of the silver brazing filler metal itself and when brazing the joining metals.In particular, it has an excellent deoxidizing effect and is extremely effective in improving the fluidity of the brazing filler metal. If the amount added is less than 0.001%, a good effect cannot be expected, and if it exceeds 0.5%, the strength of brazing will decrease, so the trace element content is set in the range of 0.001 to 0.5%. It is.
そして、先述した如く、銀ろう材の基本的特性の電気伝
導度や熱伝導性に基本的に与る銀はその中心的組成とし
て残量とし、１（）０％重量範囲において５０〜９５％
としたものである。As mentioned above, silver, which basically contributes to electrical conductivity and thermal conductivity, which are the basic characteristics of silver brazing filler metal, is the central composition and the remaining amount is 50 to 95% in the 1()0% weight range.
That is.
〈実施例〉
次に、この出願の発明の実施例を図面を参照して説明す
れば以下の通りである。<Embodiments> Next, embodiments of the invention of this application will be described below with reference to the drawings.
まず、この出願の発明の実施例と従来材料のろ表１
そして、上記表１に示すこの出願の発明の銀ろうＩＮと
従来態様のろう材とについてそれぞれ試験月利は２．５
調の立方体のろう材試験材を用い、各ろう材の液相点温
度より４０°高い温度で真空中、及び、水素雰囲気中で
５分間維持して行ったものであり、引張り強度が２Ｘ１
５ｍの断面を有する突き合１！継手をアムスラー型引張
試験器を用いて測定し、その広がり面積、及び、引張り
強度についての試験結果は次の表２に示す通りである。First, filter table 1 of the embodiments of the invention of this application and conventional materials.Then, the test monthly yield for the silver solder IN of the invention of this application and the conventional brazing material shown in Table 1 above is 2.5.
The tests were conducted using cube-shaped brazing filler metal test materials and maintaining the temperature 40° higher than the liquidus temperature of each brazing filler metal in a vacuum and in a hydrogen atmosphere for 5 minutes, and the tensile strength was 2X1.
Butt 1 with a cross section of 5m! The joint was measured using an Amsler type tensile tester, and the test results regarding the spread area and tensile strength are as shown in Table 2 below.
表２
上述衣２によってもこの出願の発明の銀ろう材が在来態
様のろう材に比して広がり面積、即ち、流動性が良く、
引張り強度についてもバラつきがなく、金属組織の微細
化平均的分散によって表面の平滑性に優れ、ぬれ性が良
いことが分る。Table 2 According to the above-mentioned coating 2, the silver brazing material of the invention of this application has a better spreading area, that is, better fluidity than the conventional brazing material,
It can be seen that there is no variation in tensile strength, and the surface smoothness is excellent due to the fine and average distribution of the metal structure, and the wettability is good.
又、上記各試料についてろう材の表面あらざの試料縦断
面の拡大形状について示すに各試料番号と図面番号を同
一序列に示すと、第１〜６図に示す通りである。Further, the enlarged shape of the longitudinal cross-section of the surface roughness of the brazing filler metal for each of the above-mentioned samples is as shown in FIGS. 1 to 6, when each sample number and drawing number are shown in the same order.
即ち、第１〜４図に示すこの出願の発明の銀ろう材の表
面あらさば滑かであり、又、平均した分散度を有してい
るのに対し第５．６図に示す在来態様のろう材において
はその面あらざが相当に大きく、そして、バラつきのあ
る分散度であることが分る。That is, the surface roughness of the silver brazing material of the invention of this application shown in FIGS. 1 to 4 is smooth and has an average degree of dispersion, whereas the conventional embodiment shown in FIG. 5.6 It can be seen that the surface roughness of the brazing filler metal is quite large and the degree of dispersion varies.
尚、この出願の発明の実施態様は上述各実施例に限るも
のでないことは勿論であり、例えば、銀、銅、セレン、
燐についての組成重量％の配合比は上述実施例以外のも
のも用途別等により採用出来る等種々の態様が採用可能
である。It goes without saying that the embodiments of the invention of this application are not limited to the above-mentioned embodiments. For example, silver, copper, selenium,
Regarding the composition weight % of phosphorus, various embodiments can be adopted, such as those other than those in the above-mentioned embodiments, depending on the application.
〈発明の効果〉
以上、この出願の発明によれば、精密機械工業製品やエ
レクトロニクスを中心とする工業部品等の素材金属接合
に用いる銀ろう材において従来のＡＣＩ−Ｃｕ合金に対
し、微量元素を添加し、特に、先述特許請求の範囲の組
成重量％にして添加する−ことにより、在来のろう材に
比し引張り強度を充分に有し、しかも、相当な広がり性
に基づく良好なぬれ性を有し、又、金属組織の微細化、
分散化によって表面の平滑性が向上し、これによりろう
付は後のメッキ工程等における加工がし易く、酸洗いに
よる酸の表面残留による腐蝕かない等の優れた効果が奏
され、結果的に製品に対する信頼性が向上するという優
れた効果か奏される。<Effects of the Invention> As described above, according to the invention of this application, trace elements can be added to the conventional ACI-Cu alloy in the silver brazing filler metal used for joining material metals of precision machinery industrial products and industrial parts mainly for electronics. By adding the filler metal, particularly in the composition weight % as claimed in the above claims, it has sufficient tensile strength compared to conventional brazing filler metals, and also has good wettability based on considerable spreadability. It also has a finer metal structure,
Dispersion improves the surface smoothness, which makes it easier to process the brazing process in the subsequent plating process, and has excellent effects such as no corrosion due to acid residue on the surface due to pickling, and as a result, the product This has an excellent effect of improving reliability.
又、ろう付は俊の各工程における加工性が良いことによ
り、素材金属の歩留も向上し、製品］ストを下げる等工
業生産上に極めて有利な効果が奏されるものである。In addition, since brazing has good workability in each process, it has extremely advantageous effects on industrial production, such as improving the yield of raw metal and lowering product costs.
而して、銅の所定重量％範囲内の添加により銀ろう材の
初期流動性が向上し、ろう付は条件も低下することなく
耐蝕性に優れるようにすることが出来る優れた効果が奏
される。Therefore, the addition of copper within a predetermined weight percent range improves the initial fluidity of the silver brazing material, and has the excellent effect of providing excellent corrosion resistance without degrading brazing conditions. Ru.
又、微量元素にセレンを用いて所定の重量％の範囲で添
加することにより、ろう材の金属組織がより微細化し、
ぬれ性改善が向上し、メッキ処理等の工程における金属
蒸気が周辺汚染等せず、作業環境を向上し周辺機器への
汚染を防止することが出来るという利点もある。In addition, by adding selenium as a trace element in a predetermined weight percent range, the metal structure of the brazing material becomes finer,
There is also the advantage that wettability is improved, metal vapor in processes such as plating treatment does not contaminate the surrounding area, and the working environment can be improved and contamination of peripheral equipment can be prevented.
又、セレンに伴って燐を設定範囲内で添加することによ
り、ろう付は後の、或は、ろう材そのもの製造時におい
て、脱ガス効果が奏され、特に、脱酸効果が向上し、流
動性も改善されるという効果があり、ろう付は強度も低
下せず、接合素材の部品組付は性を常に維持することが
出来、この点からも製品に対する信頼度が向上するとい
う優れた効果が秦される。In addition, by adding phosphorus within a set range along with selenium, a degassing effect can be achieved after brazing or during the manufacturing of the brazing material itself, and in particular, the deoxidizing effect is improved and fluidity is improved. This has the effect of improving the strength of the product, brazing does not reduce the strength, and assembling parts of bonded materials can always maintain the strength, which is also an excellent effect of improving the reliability of the product. is conquered by Qin.
図面はこの出願の発明、及び、在来態様のろう材の表面
あらさについての縦断面拡大図であり、第１〜４図はこ
の出願の発明の銀ろう材の縦断面拡大図、第５．６図は
従来技術に基づく縦断面拡大図である。
出願人 石福金属興業株式会社
第１図
第２図
第３図
￥二一The drawings are enlarged longitudinal cross-sectional views of the surface roughness of the invention of this application and the conventional brazing filler metal, and FIGS. 1 to 4 are enlarged longitudinal cross-sectional views of the silver brazing filler metal of the invention of this application, and FIG. FIG. 6 is an enlarged vertical cross-sectional view based on the prior art. Applicant: Ishifuku Metal Kogyo Co., Ltd. Figure 1 Figure 2 Figure 3 ¥21
Claims (2)
する微量元素を添加した銀ろう材において、全組成重量
１００％で上記他の元素として銅を５〜５０％、微量元
素としてセレンを０．００１〜０．１％、残量を銀とし
たことを特徴とする銀ろう材。(1) In a silver brazing filler metal in which other elements that improve fluidity and trace elements that improve metal structure are added to silver, the total composition weight is 100%, and copper is added as the other elements in the amount of 5 to 50% as trace elements. A silver brazing material characterized by containing 0.001 to 0.1% selenium and the remaining amount being silver.
する微量元素を添加した銀ろう材において、全組成重量
１００％で上記他の元素として銅を５〜５０％、微量元
素として燐を０．００１〜０．５％、更にセレンを０．
００１〜０．１％、残量を銀としたことを特徴とする銀
ろう材。(2) In a silver brazing filler metal in which other elements that improve fluidity and trace elements that improve metal structure are added to silver, the total composition weight is 100%, and copper is added as the other elements in the amount of 5 to 50% as trace elements. Phosphorus is 0.001-0.5%, and selenium is 0.001% to 0.5%.
001 to 0.1%, the remaining amount being silver.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP15507686A JPS6313690A (en) | 1986-07-03 | 1986-07-03 | Silver brazing filler metal |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP15507686A JPS6313690A (en) | 1986-07-03 | 1986-07-03 | Silver brazing filler metal |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| JPS6313690A true JPS6313690A (en) | 1988-01-20 |
| JPH0469519B2 JPH0469519B2 (en) | 1992-11-06 |
Family
ID=15598129
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP15507686A Granted JPS6313690A (en) | 1986-07-03 | 1986-07-03 | Silver brazing filler metal |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPS6313690A (en) |
Cited By (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS63313697A (en) * | 1987-06-15 | 1988-12-21 | Ngk Spark Plug Co Ltd | Silver alloy filler metal for brazing |
| CN102554508A (en) * | 2012-02-22 | 2012-07-11 | 南京航空航天大学 | Silver solder suitable for brazing of lead-free free cutting copper alloy |
| CN102581510A (en) * | 2012-02-22 | 2012-07-18 | 金华市双环钎焊材料有限公司 | Silver solder for lead-free free-cutting copper alloy soldering |
| US20130094990A1 (en) * | 2003-10-16 | 2013-04-18 | Ishifuku Metal Industry Co., Ltd. | Sputtering target material |
-
1986
- 1986-07-03 JP JP15507686A patent/JPS6313690A/en active Granted
Cited By (5)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS63313697A (en) * | 1987-06-15 | 1988-12-21 | Ngk Spark Plug Co Ltd | Silver alloy filler metal for brazing |
| US20130094990A1 (en) * | 2003-10-16 | 2013-04-18 | Ishifuku Metal Industry Co., Ltd. | Sputtering target material |
| US8858877B2 (en) * | 2003-10-16 | 2014-10-14 | Ishifuku Metal Industry Co., Ltd. | Sputtering target material |
| CN102554508A (en) * | 2012-02-22 | 2012-07-11 | 南京航空航天大学 | Silver solder suitable for brazing of lead-free free cutting copper alloy |
| CN102581510A (en) * | 2012-02-22 | 2012-07-18 | 金华市双环钎焊材料有限公司 | Silver solder for lead-free free-cutting copper alloy soldering |
Also Published As
| Publication number | Publication date |
|---|---|
| JPH0469519B2 (en) | 1992-11-06 |
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