JPS6092095A - Pd solder - Google Patents

Abstract

PURPOSE:To obtain secure and stable brazing without formation of an unstable layer having a low m.p. by adding a specific amt. of P or Sb to specifically composed Pd solder thereby suppressing the diffusion between the solder component and the base metal component. CONSTITUTION:P is added at 0.1-3wt% or Sb is added at 0.1-5wt% to Pd solder consisting of 52-70wt% Ag, 20-30wt% Cu, 5-26wt% Pd without changing the compsn ratio thereof. If a Cu alloy is brazed by using such Pd solder, the diffusion of the Pd in the solder component to the Cu alloy side and the diffusion of the Cu alloy component to the solder layer are prevented by the effect of P or Sb, by which the formation of the two layers; a Pd-Cu layer and an Ag- rich layer is prevented.

Description

【発明の詳細な説明】 一般にＣｕおよびＣｕ合金のろう付にはリンＣｕろうが
広く用いられているが高温強度を要求される場合、ある
いはステップろうイ１の様にろう付層の作業工程におい
てろう材融点近くの高温にさらされる場合、融点が高く
且耐熱性の優れたΔｇ５２−７０ｗｔ％、Ｃｕ　２０〜
３５ｗｔ％、Ｐ　ｄ　５〜２６ｗｔ％がら成るＰｄろう
が使用される場合が多い。DETAILED DESCRIPTION OF THE INVENTION In general, phosphorus-Cu solder is widely used for brazing Cu and Cu alloys, but it is used when high-temperature strength is required, or in the work process of the brazing layer as in Step Brazing 1. When exposed to high temperatures near the melting point of the brazing material, the melting point is high and the heat resistance is excellent.Δg52-70wt%, Cu20~
A Pd wax consisting of 35 wt% and 5 to 26 wt% Pd is often used.

しかしながらＣｕ−Ｔｅ、Ｃｕ−３ｎ等のＣｕ合金をＰ
ｄろうを用いてろう付すると、ろう成分中のＩ）ｄがＣ
ｕ合金母月側に拡１１にシ、母＋、ＩのＣりとむずびつ
いてろう（＝ｊ界面に））　ｄ−Ｃｕ　Ｉ＠を生成する
と同時に、母材合金中の添加元素がろう側に拡散し、ろ
う付層の中央部にこの元素を含むＡｇリッチの層を生成
し、ろう１１部が２Ｎに分離する現象がある。However, Cu alloys such as Cu-Te and Cu-3n are
When brazing using d wax, I) d in the wax component becomes C
d-Cu At the same time as I@ is produced, the additive elements in the base alloy are transferred to the solder side. There is a phenomenon in which the brazing layer 11 is separated into 2N, and an Ag-rich layer containing this element is formed in the center of the brazing layer.

このＡｇリッチ層はＰ’ｄ濃度が低下し、融点が下る為
、耐熱性、高温強度が劣化し所期の効果を期待すること
が困難となる。Since this Ag-rich layer has a lower P'd concentration and a lower melting point, heat resistance and high-temperature strength deteriorate, making it difficult to expect the desired effect.

本発明はこの問題を解決する為になされたもので、上記
のＩ）　ｄろうにＰを０．１〜３ｗｔ％又はｓｂを０．
１〜５ｗｔ％添加して成るＰｄろうである。The present invention was made to solve this problem, and includes the above I) d wax with 0.1 to 3 wt% of P or 0.1 wt% of sb.
It is a Pd wax containing 1 to 5 wt%.

このＰｄろうを使ってＣｕ合金をろう付すると、Ｐ又は
ｓｂの効果により、ろう成分中のＰ　ｄ　Ｏ）　Ｃｕ合
金側への拡散、Ｃｕ合金成分のろう層への拡散を防ぎ、
Ｐｄ−ＣｕＪ値、Ａｇリッチ層の２層の生成を阻止でき
る。When a Cu alloy is brazed using this Pd solder, the effect of P or sb prevents the diffusion of P d O) in the solder component into the Cu alloy side and the diffusion of the Cu alloy component into the solder layer.
Generation of two layers, Pd-CuJ value and Ag rich layer, can be prevented.

したがって、ろう付層はろう自体の組成を維持しており
融点の低下、高温強度の劣化もなく、ろう自体の所期の
性能を維持することが出来る。Therefore, the brazing layer maintains the composition of the solder itself, and there is no decrease in melting point or deterioration in high-temperature strength, and the desired performance of the solder itself can be maintained.

本発明においてＰの添加量を０．１層％〜３ｗｔ％。In the present invention, the amount of P added is 0.1% to 3% by weight.

ｓｂの添加量を０．１ｗｔ％〜５ｗｔ％としたのは、下
限値未満では、Ｐｄろう中のＦ’ｄのＣｕ合金側への拡
散及びＣｕ合金中の低融点元素のろう層への拡散を防止
する効果を期待出来ない為で、上限値を超えるとＰｄろ
うの融点の低下が大きくなりろう自体の高温強度の劣化
を期たし、所期の機能をそこなう為である。The reason why the amount of sb added is set to 0.1 wt% to 5 wt% is that below the lower limit, F'd in the Pd solder will diffuse to the Cu alloy side and low melting point elements in the Cu alloy will diffuse into the solder layer. This is because if the upper limit is exceeded, the melting point of the Pd solder will decrease significantly, leading to deterioration of the high temperature strength of the solder itself, which will impair its intended function.

次に本発明の実施例及び従来例について説明する。Next, embodiments of the present invention and conventional examples will be described.

〔実施例〕〔Example〕

Ａ　ｇ　５６．５％、ＰｄｌＯ％、Ｃｕ３３％、　Ｐ　
Ｏ，５％からなるＰｄろう（液相線８１０℃、固相線８
００°Ｃ）及びＡ　ｇ　５７．６％、Ｃｕ３１％、Ｐｄ
　９．９％、Ｓｂ１．５％からなるＰｄろう（液相線８
２６℃、同相線８０５℃）を用いてＣｕ−Ｔｅ４ｗｔ％
合金母材をろう付したところ、ろう付部には新しい層の
生成はなく、ろう自体の組成であり、高温強度を測定し
たところ約８１０℃（母材が取れる温度）であった。ス
テップろう（＝ｊとして次工程でＡｇ　Ｃｕ共晶ろうで
ろう付したが、剥離する現象はみられなかった。A g 56.5%, PdlO%, Cu33%, P
Pd wax consisting of O, 5% (liquidus 810°C, solidus 8
00°C) and A g 57.6%, Cu 31%, Pd
Pd wax consisting of 9.9% and 1.5% Sb (liquidus line 8
Cu-Te4wt% using 26℃, common mode line 805℃)
When the alloy base material was brazed, no new layer was formed in the brazed area, which was due to the composition of the braze itself, and the high temperature strength was measured at approximately 810° C. (the temperature at which the base material can be removed). Step solder (=j) was used for brazing with Ag-Cu eutectic solder in the next step, but no peeling phenomenon was observed.

〔従来例〕[Conventional example]

Ａ　ｇ　５８．５％、Ｐｄ、１０％、Ｃｕ３Ｌ、５％力
１ら成るＰｄろう（液相線８５０℃、固相線８２５°Ｃ
）をＪＮＩ、ＳてＣｕ−Ｔｅ４ｔｍｔ％合金母材をろう
何したところ、ろう付部にｐｄ−ＣｕＪｉｉとＡｇす・
ノチのＡｇ　ｐｄ−Ｃｕ−Ｔｅ層の二層を生成した。こ
のＡ　ｇ　ＩＪ　−ノチ層の高温強度を測定したところ
約７９０’Ｃ（母＋４力へ取れる温度）で、ろう自体の
固相”より３５”Ｃもの低下をきたし、ステ・ノブろう
付の様Ｇこ次工４里でＡｇ−ＣＬＪ共晶ろう（融点７８
０°Ｃ）でろうイ寸し／こ場合にこのＡｇリンチ層から
剥離する現象を生した。Pd wax consisting of A g 58.5%, Pd, 10%, Cu 3L, 5% strength 1 (liquidus 850°C, solidus 825°C
) was brazed with Cu-Te4tmt% alloy base material using JNI, S, pd-CuJii and Ag were added to the brazed part.
Two layers of Nochi Ag pd-Cu-Te layers were produced. When the high-temperature strength of this A g IJ-notch layer was measured, it was found to be approximately 790'C (the temperature that can reach the base + 4 strength), which was 35'C lower than the solid phase of the wax itself, and it was similar to Ste-knob brazing. Ag-CLJ eutectic wax (melting point 78
In this case, a phenomenon of peeling off from this Ag lynch layer occurred.

上述の様に本発明のＰｄろうＧよＣＬＩ合金母材をろう
付する際に、ろう成分と母材成’ｙ＞　ＩＭＩのｌ広敗
を抑制し、融点の低い不安定な１輔を生成することフ、
ｉく、強固で安定なろう付を得ること力（ＩＪ３来る。As mentioned above, when brazing the Pd solder G of the present invention with the CLI alloy base material, the brazing component and the base material composition suppress the widespread failure of IMI and produce an unstable solder with a low melting point. What to do,
It is possible to obtain strong and stable brazing (IJ3).

出願人　田中貴金属工業株式会社Applicant Tanaka Kikinzoku Kogyo Co., Ltd.

Claims (1)

【特許請求の範囲】[Claims] Ａ　ｇ　５２〜７０ｗｔ％、　Ｃｕ　２０〜３５ｗｔ％
、Ｐｄ５〜２６ｗｔ％のＰｄろうに、その組成比に変更
を加えずに、Ｐを０．１〜３　ｗｔ％又はｓｂを０．Ｌ
〜５　ｗｔ％添カリカリカるＰｄろう。Ag 52-70wt%, Cu 20-35wt%
, 0.1 to 3 wt% of P or 0.1 to 3 wt% of sb to a Pd wax containing 5 to 26 wt% of Pd without changing the composition ratio. L
~5 wt% added crunchy Pd wax.