JPS6092095A - Pd solder - Google Patents
Pd solderInfo
- Publication number
- JPS6092095A JPS6092095A JP20045383A JP20045383A JPS6092095A JP S6092095 A JPS6092095 A JP S6092095A JP 20045383 A JP20045383 A JP 20045383A JP 20045383 A JP20045383 A JP 20045383A JP S6092095 A JPS6092095 A JP S6092095A
- Authority
- JP
- Japan
- Prior art keywords
- solder
- layer
- alloy
- component
- brazing
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Granted
Links
Classifications
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
- B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
- B23K35/00—Rods, electrodes, materials, or media, for use in soldering, welding, or cutting
- B23K35/22—Rods, electrodes, materials, or media, for use in soldering, welding, or cutting characterised by the composition or nature of the material
- B23K35/24—Selection of soldering or welding materials proper
- B23K35/30—Selection of soldering or welding materials proper with the principal constituent melting at less than 1550 degrees C
- B23K35/3006—Ag as the principal constituent
Landscapes
- Engineering & Computer Science (AREA)
- Mechanical Engineering (AREA)
- Die Bonding (AREA)
- Ceramic Products (AREA)
- Electric Connection Of Electric Components To Printed Circuits (AREA)
Abstract
Description
【発明の詳細な説明】
一般にCuおよびCu合金のろう付にはリンCuろうが
広く用いられているが高温強度を要求される場合、ある
いはステップろうイ1の様にろう付層の作業工程におい
てろう材融点近くの高温にさらされる場合、融点が高く
且耐熱性の優れたΔg52−70wt%、Cu 20〜
35wt%、P d 5〜26wt%がら成るPdろう
が使用される場合が多い。DETAILED DESCRIPTION OF THE INVENTION In general, phosphorus-Cu solder is widely used for brazing Cu and Cu alloys, but it is used when high-temperature strength is required, or in the work process of the brazing layer as in Step Brazing 1. When exposed to high temperatures near the melting point of the brazing material, the melting point is high and the heat resistance is excellent.Δg52-70wt%, Cu20~
A Pd wax consisting of 35 wt% and 5 to 26 wt% Pd is often used.
しかしながらCu−Te、Cu−3n等のCu合金をP
dろうを用いてろう付すると、ろう成分中のI)dがC
u合金母月側に拡11にシ、母+、IのCりとむずびつ
いてろう(=j界面に)) d−Cu I@を生成する
と同時に、母材合金中の添加元素がろう側に拡散し、ろ
う付層の中央部にこの元素を含むAgリッチの層を生成
し、ろう11部が2Nに分離する現象がある。However, Cu alloys such as Cu-Te and Cu-3n are
When brazing using d wax, I) d in the wax component becomes C
d-Cu At the same time as I@ is produced, the additive elements in the base alloy are transferred to the solder side. There is a phenomenon in which the brazing layer 11 is separated into 2N, and an Ag-rich layer containing this element is formed in the center of the brazing layer.
このAgリッチ層はP’d濃度が低下し、融点が下る為
、耐熱性、高温強度が劣化し所期の効果を期待すること
が困難となる。Since this Ag-rich layer has a lower P'd concentration and a lower melting point, heat resistance and high-temperature strength deteriorate, making it difficult to expect the desired effect.
本発明はこの問題を解決する為になされたもので、上記
のI) dろうにPを0.1〜3wt%又はsbを0.
1〜5wt%添加して成るPdろうである。The present invention was made to solve this problem, and includes the above I) d wax with 0.1 to 3 wt% of P or 0.1 wt% of sb.
It is a Pd wax containing 1 to 5 wt%.
このPdろうを使ってCu合金をろう付すると、P又は
sbの効果により、ろう成分中のP d O) Cu合
金側への拡散、Cu合金成分のろう層への拡散を防ぎ、
Pd−CuJ値、Agリッチ層の2層の生成を阻止でき
る。When a Cu alloy is brazed using this Pd solder, the effect of P or sb prevents the diffusion of P d O) in the solder component into the Cu alloy side and the diffusion of the Cu alloy component into the solder layer.
Generation of two layers, Pd-CuJ value and Ag rich layer, can be prevented.
したがって、ろう付層はろう自体の組成を維持しており
融点の低下、高温強度の劣化もなく、ろう自体の所期の
性能を維持することが出来る。Therefore, the brazing layer maintains the composition of the solder itself, and there is no decrease in melting point or deterioration in high-temperature strength, and the desired performance of the solder itself can be maintained.
本発明においてPの添加量を0.1層%〜3wt%。In the present invention, the amount of P added is 0.1% to 3% by weight.
sbの添加量を0.1wt%〜5wt%としたのは、下
限値未満では、Pdろう中のF’dのCu合金側への拡
散及びCu合金中の低融点元素のろう層への拡散を防止
する効果を期待出来ない為で、上限値を超えるとPdろ
うの融点の低下が大きくなりろう自体の高温強度の劣化
を期たし、所期の機能をそこなう為である。The reason why the amount of sb added is set to 0.1 wt% to 5 wt% is that below the lower limit, F'd in the Pd solder will diffuse to the Cu alloy side and low melting point elements in the Cu alloy will diffuse into the solder layer. This is because if the upper limit is exceeded, the melting point of the Pd solder will decrease significantly, leading to deterioration of the high temperature strength of the solder itself, which will impair its intended function.
次に本発明の実施例及び従来例について説明する。Next, embodiments of the present invention and conventional examples will be described.
A g 56.5%、PdlO%、Cu33%、 P
O,5%からなるPdろう(液相線810℃、固相線8
00°C)及びA g 57.6%、Cu31%、Pd
9.9%、Sb1.5%からなるPdろう(液相線8
26℃、同相線805℃)を用いてCu−Te4wt%
合金母材をろう付したところ、ろう付部には新しい層の
生成はなく、ろう自体の組成であり、高温強度を測定し
たところ約810℃(母材が取れる温度)であった。ス
テップろう(=jとして次工程でAg Cu共晶ろうで
ろう付したが、剥離する現象はみられなかった。A g 56.5%, PdlO%, Cu33%, P
Pd wax consisting of O, 5% (liquidus 810°C, solidus 8
00°C) and A g 57.6%, Cu 31%, Pd
Pd wax consisting of 9.9% and 1.5% Sb (liquidus line 8
Cu-Te4wt% using 26℃, common mode line 805℃)
When the alloy base material was brazed, no new layer was formed in the brazed area, which was due to the composition of the braze itself, and the high temperature strength was measured at approximately 810° C. (the temperature at which the base material can be removed). Step solder (=j) was used for brazing with Ag-Cu eutectic solder in the next step, but no peeling phenomenon was observed.
A g 58.5%、Pd、10%、Cu3L、5%力
1ら成るPdろう(液相線850℃、固相線825°C
)をJNI、SてCu−Te4tmt%合金母材をろう
何したところ、ろう付部にpd−CuJiiとAgす・
ノチのAg pd−Cu−Te層の二層を生成した。こ
のA g IJ −ノチ層の高温強度を測定したところ
約790’C(母+4力へ取れる温度)で、ろう自体の
固相”より35”Cもの低下をきたし、ステ・ノブろう
付の様Gこ次工4里でAg−CLJ共晶ろう(融点78
0°C)でろうイ寸し/こ場合にこのAgリンチ層から
剥離する現象を生した。Pd wax consisting of A g 58.5%, Pd, 10%, Cu 3L, 5% strength 1 (liquidus 850°C, solidus 825°C
) was brazed with Cu-Te4tmt% alloy base material using JNI, S, pd-CuJii and Ag were added to the brazed part.
Two layers of Nochi Ag pd-Cu-Te layers were produced. When the high-temperature strength of this A g IJ-notch layer was measured, it was found to be approximately 790'C (the temperature that can reach the base + 4 strength), which was 35'C lower than the solid phase of the wax itself, and it was similar to Ste-knob brazing. Ag-CLJ eutectic wax (melting point 78
In this case, a phenomenon of peeling off from this Ag lynch layer occurred.
上述の様に本発明のPdろうGよCLI合金母材をろう
付する際に、ろう成分と母材成’y> IMIのl広敗
を抑制し、融点の低い不安定な1輔を生成することフ、
iく、強固で安定なろう付を得ること力(IJ3来る。As mentioned above, when brazing the Pd solder G of the present invention with the CLI alloy base material, the brazing component and the base material composition suppress the widespread failure of IMI and produce an unstable solder with a low melting point. What to do,
It is possible to obtain strong and stable brazing (IJ3).
出願人 田中貴金属工業株式会社Applicant Tanaka Kikinzoku Kogyo Co., Ltd.
Claims (1)
、Pd5〜26wt%のPdろうに、その組成比に変更
を加えずに、Pを0.1〜3 wt%又はsbを0.L
〜5 wt%添カリカリカるPdろう。Ag 52-70wt%, Cu 20-35wt%
, 0.1 to 3 wt% of P or 0.1 to 3 wt% of sb to a Pd wax containing 5 to 26 wt% of Pd without changing the composition ratio. L
~5 wt% added crunchy Pd wax.
Priority Applications (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP20045383A JPS6092095A (en) | 1983-10-26 | 1983-10-26 | Pd solder |
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP20045383A JPS6092095A (en) | 1983-10-26 | 1983-10-26 | Pd solder |
Publications (2)
Publication Number | Publication Date |
---|---|
JPS6092095A true JPS6092095A (en) | 1985-05-23 |
JPH0325276B2 JPH0325276B2 (en) | 1991-04-05 |
Family
ID=16424551
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
JP20045383A Granted JPS6092095A (en) | 1983-10-26 | 1983-10-26 | Pd solder |
Country Status (1)
Country | Link |
---|---|
JP (1) | JPS6092095A (en) |
Citations (1)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPS57149093A (en) * | 1981-03-11 | 1982-09-14 | Tokuriki Honten Co Ltd | Silver solder material |
-
1983
- 1983-10-26 JP JP20045383A patent/JPS6092095A/en active Granted
Patent Citations (1)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPS57149093A (en) * | 1981-03-11 | 1982-09-14 | Tokuriki Honten Co Ltd | Silver solder material |
Also Published As
Publication number | Publication date |
---|---|
JPH0325276B2 (en) | 1991-04-05 |
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