JPS62182157A - Ceramic composition for electric circuit substrate - Google Patents
Ceramic composition for electric circuit substrateInfo
- Publication number
- JPS62182157A JPS62182157A JP61024990A JP2499086A JPS62182157A JP S62182157 A JPS62182157 A JP S62182157A JP 61024990 A JP61024990 A JP 61024990A JP 2499086 A JP2499086 A JP 2499086A JP S62182157 A JPS62182157 A JP S62182157A
- Authority
- JP
- Japan
- Prior art keywords
- weight
- electric circuit
- ceramic composition
- circuit substrate
- porcelain
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Granted
Links
- 239000000203 mixture Substances 0.000 title claims description 15
- 239000000919 ceramic Substances 0.000 title claims description 13
- 239000000758 substrate Substances 0.000 title description 11
- 229910000272 alkali metal oxide Inorganic materials 0.000 claims description 2
- 239000004020 conductor Substances 0.000 description 12
- 229910052573 porcelain Inorganic materials 0.000 description 11
- 238000005245 sintering Methods 0.000 description 9
- 238000005452 bending Methods 0.000 description 8
- 239000000463 material Substances 0.000 description 7
- 230000001590 oxidative effect Effects 0.000 description 7
- 239000010949 copper Substances 0.000 description 5
- IJGRMHOSHXDMSA-UHFFFAOYSA-N Atomic nitrogen Chemical compound N#N IJGRMHOSHXDMSA-UHFFFAOYSA-N 0.000 description 4
- PNEYBMLMFCGWSK-UHFFFAOYSA-N aluminium oxide Inorganic materials [O-2].[O-2].[O-2].[Al+3].[Al+3] PNEYBMLMFCGWSK-UHFFFAOYSA-N 0.000 description 4
- 239000011230 binding agent Substances 0.000 description 4
- 229910052802 copper Inorganic materials 0.000 description 4
- 230000000694 effects Effects 0.000 description 4
- 238000004519 manufacturing process Methods 0.000 description 4
- 239000002994 raw material Substances 0.000 description 4
- 229910052709 silver Inorganic materials 0.000 description 4
- 229910052799 carbon Inorganic materials 0.000 description 3
- 238000010304 firing Methods 0.000 description 3
- 229910052759 nickel Inorganic materials 0.000 description 3
- 229910052760 oxygen Inorganic materials 0.000 description 3
- 239000000843 powder Substances 0.000 description 3
- ZOXJGFHDIHLPTG-UHFFFAOYSA-N Boron Chemical compound [B] ZOXJGFHDIHLPTG-UHFFFAOYSA-N 0.000 description 2
- RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical compound [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 description 2
- 239000010953 base metal Substances 0.000 description 2
- 229910052796 boron Inorganic materials 0.000 description 2
- 238000001354 calcination Methods 0.000 description 2
- 239000012159 carrier gas Substances 0.000 description 2
- 238000006243 chemical reaction Methods 0.000 description 2
- 230000007423 decrease Effects 0.000 description 2
- 239000011521 glass Substances 0.000 description 2
- 238000010030 laminating Methods 0.000 description 2
- 238000002844 melting Methods 0.000 description 2
- 230000008018 melting Effects 0.000 description 2
- 229910052757 nitrogen Inorganic materials 0.000 description 2
- 229910052763 palladium Inorganic materials 0.000 description 2
- 239000002245 particle Substances 0.000 description 2
- 239000011148 porous material Substances 0.000 description 2
- 238000010298 pulverizing process Methods 0.000 description 2
- WUOACPNHFRMFPN-SECBINFHSA-N (S)-(-)-alpha-terpineol Chemical compound CC1=CC[C@@H](C(C)(C)O)CC1 WUOACPNHFRMFPN-SECBINFHSA-N 0.000 description 1
- 229910002929 BaSnO3 Inorganic materials 0.000 description 1
- OKTJSMMVPCPJKN-UHFFFAOYSA-N Carbon Chemical compound [C] OKTJSMMVPCPJKN-UHFFFAOYSA-N 0.000 description 1
- 239000001856 Ethyl cellulose Substances 0.000 description 1
- ZZSNKZQZMQGXPY-UHFFFAOYSA-N Ethyl cellulose Chemical compound CCOCC1OC(OC)C(OCC)C(OCC)C1OC1C(O)C(O)C(OC)C(CO)O1 ZZSNKZQZMQGXPY-UHFFFAOYSA-N 0.000 description 1
- ZOKXTWBITQBERF-UHFFFAOYSA-N Molybdenum Chemical compound [Mo] ZOKXTWBITQBERF-UHFFFAOYSA-N 0.000 description 1
- 239000000654 additive Substances 0.000 description 1
- OVKDFILSBMEKLT-UHFFFAOYSA-N alpha-Terpineol Natural products CC(=C)C1(O)CCC(C)=CC1 OVKDFILSBMEKLT-UHFFFAOYSA-N 0.000 description 1
- 229940088601 alpha-terpineol Drugs 0.000 description 1
- QVGXLLKOCUKJST-UHFFFAOYSA-N atomic oxygen Chemical compound [O] QVGXLLKOCUKJST-UHFFFAOYSA-N 0.000 description 1
- 150000001721 carbon Chemical class 0.000 description 1
- 229910010293 ceramic material Inorganic materials 0.000 description 1
- 239000011195 cermet Substances 0.000 description 1
- 238000002485 combustion reaction Methods 0.000 description 1
- 150000001875 compounds Chemical class 0.000 description 1
- 238000007606 doctor blade method Methods 0.000 description 1
- 238000005516 engineering process Methods 0.000 description 1
- 229920001249 ethyl cellulose Polymers 0.000 description 1
- 235000019325 ethyl cellulose Nutrition 0.000 description 1
- 230000008020 evaporation Effects 0.000 description 1
- 238000001704 evaporation Methods 0.000 description 1
- 238000005259 measurement Methods 0.000 description 1
- 238000000034 method Methods 0.000 description 1
- 238000013508 migration Methods 0.000 description 1
- 230000005012 migration Effects 0.000 description 1
- 238000002156 mixing Methods 0.000 description 1
- 229910052750 molybdenum Inorganic materials 0.000 description 1
- 239000011733 molybdenum Substances 0.000 description 1
- 230000003647 oxidation Effects 0.000 description 1
- 238000007254 oxidation reaction Methods 0.000 description 1
- -1 oxides of Si Chemical class 0.000 description 1
- 239000001301 oxygen Substances 0.000 description 1
- 238000007639 printing Methods 0.000 description 1
- 229910052814 silicon oxide Inorganic materials 0.000 description 1
- 229910052708 sodium Inorganic materials 0.000 description 1
- 238000011282 treatment Methods 0.000 description 1
- WFKWXMTUELFFGS-UHFFFAOYSA-N tungsten Chemical compound [W] WFKWXMTUELFFGS-UHFFFAOYSA-N 0.000 description 1
- 229910052721 tungsten Inorganic materials 0.000 description 1
- 239000010937 tungsten Substances 0.000 description 1
- XLYOFNOQVPJJNP-UHFFFAOYSA-N water Chemical compound O XLYOFNOQVPJJNP-UHFFFAOYSA-N 0.000 description 1
Landscapes
- Inorganic Insulating Materials (AREA)
- Compositions Of Oxide Ceramics (AREA)
Abstract
(57)【要約】本公報は電子出願前の出願データであるた
め要約のデータは記録されません。(57) [Summary] This bulletin contains application data before electronic filing, so abstract data is not recorded.
Description
【発明の詳細な説明】
（産業上の利用分野）
本発明は、電気回路基板用磁器組成物、特に、複数のシ
ート状磁器を積層し、磁器間に回路を形成してなる多層
電気回路基板に適した・磁器組成物に関する。Detailed Description of the Invention (Field of Industrial Application) The present invention relates to a ceramic composition for an electric circuit board, particularly a multilayer electric circuit board formed by laminating a plurality of sheet-shaped porcelains and forming a circuit between the porcelains. Concerning porcelain compositions suitable for.
（従来の技術）
一般に、電子機器の小型化に伴い、電気回路を構成する
各種電子部品を実装するのに磁器基板が汎用され、最近
では、実装密度をさらに高めるため、表面に導電材料で
電気回路を形成してなる磁器シートを複数枚積層してな
る多層磁器基板が開発されている。この種の多層磁器基
板の磁器材料としては、アルミナが採用されているが、
焼結温度が１５００〜１６００℃と高温であることに起
因して、種々の問題があった。即ち、焼結に多大のエネ
ルギーを要し、多層基板の製造コストが高くなる他、基
板内部に形成される内部回路等の導電材料がアルミナの
焼結温度にまで加熱されるため、内部導電材料として高
融点材料、例えば、タングステンやモリブデン等を用い
なければならず、必然的に、内部回路等の抵抗そのもの
が大きくなるという問題がある。(Prior technology) Generally, as electronic devices become smaller, ceramic substrates are widely used to mount various electronic components that make up electric circuits. A multilayer ceramic substrate has been developed, which is made by laminating a plurality of ceramic sheets each forming a circuit. Alumina is used as the porcelain material for this type of multilayer porcelain substrate, but
There were various problems due to the high sintering temperature of 1,500 to 1,600°C. In other words, sintering requires a large amount of energy, increasing the manufacturing cost of the multilayer board, and the internal conductive material, such as the internal circuit formed inside the board, is heated to the sintering temperature of alumina. A high melting point material, such as tungsten or molybdenum, must be used as the material, which inevitably causes the problem that the resistance itself of the internal circuit becomes large.
これらの問題を解決するため、低温で焼結させることが
できる基板用磁器材料として、アルミナに多量の結晶化
ガラス成分を添加したもの、あるいはＢａＳｎＯ３にホ
ウ素を多ｍに添加したものなどが提案されている（例え
ば、特開昭５７−１８４２８９号）。To solve these problems, ceramic materials for substrates that can be sintered at low temperatures have been proposed, such as alumina with a large amount of crystallized glass added, or BaSnO3 with a large amount of boron added. (For example, Japanese Patent Application Laid-Open No. 57-184289).
（発明が解決しようとする問題点）
しかしながら、アルミナに多重の結晶化ガラス成分を添
加した前者のものでは、得られた磁器に空孔が多数存在
し、空孔を介して導体路間のマイグレーションか発生す
るという問題があり、また、後者のらのでは仮焼物がガ
ラス状となり、仮焼物の粉砕が困難となるばかりでなく
、ホウ素の蒸発が激しく、焼成時に導電材料と反応した
り炉の材料に損傷を与えるという問題がある。(Problems to be Solved by the Invention) However, in the former method in which multiple crystallized glass components are added to alumina, there are many pores in the resulting porcelain, and migration between conductor paths occurs through the pores. In addition, in the latter case, the calcined material becomes glassy, which not only makes it difficult to crush the calcined material, but also causes rapid evaporation of boron, which may react with conductive materials during firing and cause damage to the furnace. There is a problem of damaging the material.
従って、本発明は、低融点で低抵抗の導電材料を内部導
電材料として使用できるように、より低い温度で焼成で
きると同時に、高比抵抗かつ低誘電率で、誘電体損失の
少ない多層磁器基板を得ることができる磁気組成物を提
供することを目的とする。Therefore, the present invention provides a multilayer porcelain substrate that can be fired at a lower temperature, has high resistivity, low dielectric constant, and low dielectric loss so that a conductive material with a low melting point and low resistance can be used as an internal conductive material. The object of the present invention is to provide a magnetic composition that can obtain the following.
（問題点を解決するための手段）
本発明は、前記問題を解決する手段として、Ｓ＋０ｔ２
５〜７０重徂％、Ａｌｔｏ３１〜３０重量％、ＢａＯ３
１，５〜５重量％、および５ｒＯ２５〜６０重量％また
はＳｒＯとＢａＯ２５〜７０重爪％からなることを特徴
とする電気回路基板用磁器組成物を提供するものである
。なお、散型添加物としてＬＬＯｌＫ、Ｏ及びＮａ、Ｏ
などのアルカリ金属酸化物の少なくとも一種を１．０重
重％以下添加するようにしても良い。(Means for solving the problem) The present invention provides S+0t2 as a means for solving the problem.
5-70% by weight, Alto31-30% by weight, BaO3
The present invention provides a ceramic composition for an electric circuit board characterized by comprising 1.5 to 5% by weight of SrO and 25 to 60% by weight of 5rO or 25 to 70% of SrO and BaO. In addition, LLOLK, O and Na, O are used as powder additives.
At least one kind of alkali metal oxide such as 1.0% by weight or less may be added.
本発明に係る電気回路基板用磁器組成物を用いて電気回
路基板を製造する場合、例えば、Ｓｉ、ＡＩ、Ｉ３およ
びＳｒまたはＳｒおよびＢａの酸化物らしくは焼成時に
分解して酸化物となる化合物の粉末を秤量、調合し、そ
の原料混合物を８５０〜９５０℃で仮焼した後、粉砕し
、その粉末をバインダーと混練してからシート状に成形
し、次いで、得られたグリーンシートを酸化性雰囲気あ
るいは非酸化性もしくは還元性雰囲気中、８５０〜２Ｏ
００℃で焼成すれば良い。また、多層電気回路基板を製
造する場合、グリーンシート上にＡｇ、Ａｇ−Ｐｄ、Ｃ
ｕ、Ｎｉなどの導電材料を含有する導電性ペーストで回
路を印刷し、それらを複数積層してから、導電性ペース
トを構成する導電材料に応じた雰囲気中で焼成すれば良
い。内部導電材料としてＣｕやＮｉなどの卑金属を使用
する場合、それらの酸化を防止するため、非酸化性らし
くは還元性の雰囲気中で焼成するのが好ましい。例えば
、窒素をキャリアガスとして水蒸気（７０℃）中を通過
させ、酸素及び水素の含有量を微量含有させた窒素−水
蒸気雰囲気（通常、Ｎ、９９．７〜９９．８％）中、８
５０〜２Ｏ００℃で焼成するのが好ましい。なお、酸素
を微量含有させるのは、グリーンシートの形成に使用す
るバインダーが仮焼しても、炭素として残存しているた
め、これを完全燃焼させて除去するためである。When manufacturing an electric circuit board using the ceramic composition for electric circuit boards according to the present invention, for example, compounds such as oxides of Si, AI, I3 and Sr or Sr and Ba that decompose into oxides during firing are used. The raw material mixture is calcined at 850 to 950°C, then pulverized, and the powder is kneaded with a binder and formed into a sheet. Next, the obtained green sheet is oxidized. 850-2O in atmosphere or non-oxidizing or reducing atmosphere
It is sufficient to bake at 00°C. In addition, when manufacturing multilayer electric circuit boards, Ag, Ag-Pd, and C
A circuit may be printed using a conductive paste containing a conductive material such as u, Ni, etc., a plurality of them may be laminated, and then the circuit may be fired in an atmosphere depending on the conductive material constituting the conductive paste. When using base metals such as Cu and Ni as the internal conductive material, it is preferable to sinter in a non-oxidizing but reducing atmosphere in order to prevent their oxidation. For example, water vapor (70°C) is passed through with nitrogen as a carrier gas, and 8
It is preferable to bake at a temperature of 50 to 2000°C. Note that the reason why a small amount of oxygen is included is that even if the binder used to form the green sheet is calcined, it remains as carbon, so that this carbon can be removed by complete combustion.
本発明に係る電気回路基板用磁器組成物の組成を前記範
囲に限定したのは次の理由による。The reason why the composition of the ceramic composition for electric circuit boards according to the present invention is limited to the above range is as follows.
即ち、５ｉＯｚを２５〜７０重量％とじたのは、５ｉＯ
１が２５重量％未満では誘電率が２Ｏよりも高くなって
使用周波数が高い場合に電子機器の特性の低下を招き、
７０重量％を越えると抗折強度が実用可能な下限値、即
ち、１５００ ｋｇｌ’／ｃｍ２より小さくなると同時
に、焼結温度が２Ｏ００°Ｃ以上になって内部導電材料
としてＡｇ−ＰｄやＣｕ等を使用できなくなり本発明の
目的を達成し難いからである。That is, 25 to 70% by weight of 5iOz is 5iOz.
If 1 is less than 25% by weight, the dielectric constant will be higher than 2O, leading to a decrease in the characteristics of electronic equipment when the operating frequency is high.
If it exceeds 70% by weight, the bending strength becomes smaller than the practical lower limit, that is, 1500 kgl'/cm2, and at the same time, the sintering temperature becomes 2000°C or higher, making it difficult to use Ag-Pd, Cu, etc. as the internal conductive material. This is because it becomes unusable, making it difficult to achieve the object of the present invention.
Ａ ｌ ｔ ＯＳは焼結温度及び誘電率を低下させる効
果があるが、その含有量が１重量％未満では、添加効果
があまり認められず焼結温度が２Ｏ００℃よりも高くな
り、また３０重量％を越えると、誘電体損失が０．２％
を越えて大きくなるので１〜３０重量％以下とした。Al t OS has the effect of lowering the sintering temperature and dielectric constant, but if its content is less than 1% by weight, the effect of addition is not so noticeable and the sintering temperature becomes higher than 2000°C, and if the content is less than 1% by weight. %, dielectric loss is 0.2%
Since it becomes larger than the above, it is set to 1 to 30% by weight or less.
また、Ｂ、０１を１．５〜５重量％をしたのは、１６５
重量％未満では焼結温度が２Ｏ００℃よりも高くなり、
５重量％を越えると抗折強度が１５００ ｋｇｆ／ｃ＋
＋＋’より小さくなるからである。In addition, B, 01 was 1.5 to 5% by weight, 165
If it is less than % by weight, the sintering temperature will be higher than 2000℃,
If it exceeds 5% by weight, the bending strength will be 1500 kgf/c+
This is because it is smaller than ++'.
ＳｒＯ単独の場合、その含有量を２５〜６０重爪％とじ
たのは、その含有量か２５重量％未満では焼結温度がｔ
ｏｏｏ℃を越え、６０重量％を越えると、誘電率り月０
を越えて増大するからである。In the case of SrO alone, the content is limited to 25 to 60% by weight because if the content is less than 25% by weight, the sintering temperature is t.
When the temperature exceeds ooo℃ and exceeds 60% by weight, the dielectric constant decreases to 0.
This is because it increases beyond .
ＢａＯはＳｒＯと併添加されることにより抗折強度を向
上させるが、ＳｒＯとＢａＯの合計の含Ｋｍが、２５重
量％未満では抗折強度が実用可能なＩ５００ ｋｇｆ／
ｃｎ＋”より小さくなると共に焼結温度が２Ｏ００℃
を越え、また７０重量％を越えると、誘電率がＩＯより
大きくなるので２５〜７０重量％の範囲とした。BaO improves the flexural strength by being added together with SrO, but if the total Km content of SrO and BaO is less than 25% by weight, the flexural strength will not reach a practical level of I500 kgf/
cn+” and the sintering temperature is 2000℃.
If it exceeds 70% by weight, the dielectric constant becomes larger than that of IO, so the range is set to 25 to 70% by weight.
以下、本発明の実施例について説明する。Examples of the present invention will be described below.
（実施例１）
原料として、５ｉＯａ、Ａ ！ ｔ Ｏ３、ｌ３ｔＯ３
またはＢＮもしくはＢ、Ｃ，５ｒＣＯｓまたはＳｒＯ，
およびＢ ａ ＣＯ３またはＢａＯを用い、これらの原
料を第１表に示す組成比率の磁器が得られるように秤量
、調合した。得られた各原料混合物を８５０〜９５０℃
で仮焼し、粉砕した後、有機バインダーを加えて混練し
、ドクターブレード法にて厚さｌ＋ｎｍのソート状に成
形した。得られたグリーンシートを３０ＸＩＯｍｍの角
板状にカットし、これを空気中８５０〜Ｉ ０５０℃で
１時間焼成して磁器を得、試験片とした。各試験片につ
いて比抵抗、誘電率、誘電体損失及び抗折強度を測定し
た。(Example 1) As a raw material, 5iOa, A! tO3, l3tO3
or BN or B, C, 5rCOs or SrO,
and B a CO3 or BaO, these raw materials were weighed and mixed so as to obtain porcelain having the composition ratio shown in Table 1. Each obtained raw material mixture was heated to 850 to 950°C.
After calcining and pulverizing, an organic binder was added and kneaded, and the mixture was formed into a sorted shape with a thickness of 1+nm using a doctor blade method. The obtained green sheet was cut into a rectangular plate shape of 30×IO mm, and this was fired in air at 850 to 1050° C. for 1 hour to obtain porcelain, which was used as a test piece. Specific resistance, dielectric constant, dielectric loss, and bending strength were measured for each test piece.
得られた結果を第１表に示す。The results obtained are shown in Table 1.
第１表中の値は、それぞれ試験片２Ｏ９Ｉについての平
均値であり、各特性の測定条件は次の通りである。The values in Table 1 are average values for test piece 2O9I, and the measurement conditions for each characteristic are as follows.
比抵抗： 直流 ＋００Ｖ 誘電率： ｌ ＭＨｚ 誘電体損失： ＩＭＩ−１ｚ また、抗折強度は次式により求めた。Specific resistance: DC +00V Dielectric constant: MHz Dielectric loss: IMI-1z Further, the bending strength was determined by the following formula.
式中、Ｐは試験片が折断したときの荷重（ｋｇ）、Ｑは
支点間距離（ｃｍ）、ｂは試験片の幅（ｃｍ）、ｄは試
験片の厚さくｃｍ）である。In the formula, P is the load (kg) when the test piece is broken, Q is the distance between the supports (cm), b is the width of the test piece (cm), and d is the thickness of the test piece (cm).
第１表の結果から明らかなように、本発明に係る多層基
板用磁器は、高い比抵抗と低い誘電率を有し、誘電体損
失も小さいなど優れた電気的特性を示すだけでなく、抗
折強度が大きいなど優れた機械的特性を示す。As is clear from the results in Table 1, the ceramic for multilayer substrates according to the present invention not only has excellent electrical properties such as high resistivity and low dielectric constant, and low dielectric loss, but also has excellent resistance. It exhibits excellent mechanical properties such as high bending strength.
また、これとは別に厚さ０．３〜０．４ｍｍのグリーン
シートを成形する一方、粒径５μｍ以下のＡｇまたはＡ
ｇ−Ｐｄの導電材料粉末と有機質ビヒクルとを重量比８
０：２０の割合で混合して導電性ベーストを調製し、前
記グリーンシートの表面に各導電性ペーストを全面に印
刷し、これを３枚情層して熱圧着し、空気中８５０〜２
Ｏ００℃で焼成した。なお、有機質ビヒクルは、エチル
セルロースをα−テレピネオールで２Ｏ倍に希釈したも
のを使用した。Separately, a green sheet with a thickness of 0.3 to 0.4 mm is formed, while Ag or A with a particle size of 5 μm or less is formed.
The weight ratio of g-Pd conductive material powder and organic vehicle is 8.
A conductive paste was prepared by mixing at a ratio of 0:20, each conductive paste was printed on the entire surface of the green sheet, three sheets were thermally pressed together, and the paste was heated to 850 to 2
It was fired at 000°C. The organic vehicle used was ethyl cellulose diluted 20 times with α-terpineol.
得られた多層磁器基板について、磁器とＡｇまたはＡｇ
−Ｐｄとの反応を分析したところ、両者間での反応は見
られず、ＡｇおよびＡｇ−Ｐｄはいずれも良好な導電性
を示し、Ａｇの面積抵抗は２ｍΩ／口で、Ａｇ−Ｐｄの
面積抵抗は２０ｍΩ／口であっ（実施例２）
実施例Ｉで作成した１ｍｍ厚のグリーンシートを用い、
３０Ｘ２Ｏｍｍの角板状にカットし、これを６００℃に
加熱してバインダーを予備燃焼させた後、９００℃で完
全燃焼させ、次いで水蒸気（７０°Ｃ）中に通過させた
窒素をキャリヤガスとする窒素−水蒸気の還元性もしく
は非酸化性雰囲気中、９５０〜２Ｏ００℃で１時間焼成
して磁器を得、試験片とした。実施例１と同様にして各
試験片について比抵抗、誘電率、誘電体損失及び抗折強
度を測定した。得られた結果を第２表に示す。Regarding the obtained multilayer porcelain substrate, porcelain and Ag or Ag
- When the reaction with Pd was analyzed, no reaction was observed between the two, and both Ag and Ag-Pd showed good conductivity, the area resistance of Ag was 2 mΩ/mouth, and the area resistance of Ag-Pd The resistance was 20 mΩ/mouth (Example 2) Using the 1 mm thick green sheet prepared in Example I,
Cut into a square plate shape of 30 x 2 Omm, heat it to 600°C to pre-combust the binder, then completely burn it at 900°C, and then use nitrogen passed through steam (70°C) as a carrier gas. Porcelain was fired for 1 hour at 950 to 2000°C in a reducing or non-oxidizing atmosphere of nitrogen-steam, and used as a test piece. The specific resistance, dielectric constant, dielectric loss, and bending strength of each test piece were measured in the same manner as in Example 1. The results obtained are shown in Table 2.
第２表の結果から明らかなように、本発明に係る基板用
磁器は、非酸化性雰囲気中で焼成しても、特性の変化が
無く、酸化性雰囲気中で焼成した場合と同様、高い比抵
抗と低い誘電率とを有し、誘電体損失が小さいだけでな
く、高い抗折強度を示す。As is clear from the results in Table 2, the porcelain for substrates according to the present invention has no change in properties even when fired in a non-oxidizing atmosphere, and has a high ratio similar to that when fired in an oxidizing atmosphere. It has low resistance and dielectric constant, and exhibits not only low dielectric loss but also high bending strength.
また、実施例Ｉで作成した０、３〜０．４ｍｍ厚のグリ
ーンシートを用い、実施例１と同様にして、その表面上
に粒径５μｍ以下の銅粉末と有機質ビヒクルとを重量比
８０：２０の割合で混合した銅ペーストを印刷し、これ
を３枚積み重ねて熱圧着し、前記の場合と同じ窒素−水
蒸気中、９５０〜２Ｏ００℃で焼成した。Further, using the green sheet with a thickness of 0.3 to 0.4 mm prepared in Example I, in the same manner as in Example 1, copper powder with a particle size of 5 μm or less and an organic vehicle were coated on the surface at a weight ratio of 80: Copper paste mixed in a ratio of 20:20 was printed, three sheets of this were stacked and bonded by thermocompression, and fired at 950 to 2000°C in the same nitrogen-steam atmosphere as in the previous case.
得られた多層磁器基板のＣｕ導体は酸化されていす、良
好な導電性を示し、その面積抵抗は２ｍΩ／口であった
。The Cu conductor of the obtained multilayer ceramic substrate was oxidized and exhibited good electrical conductivity, and its sheet resistance was 2 mΩ/hole.
（発明の効果）
以上の説明から明らかなように、本発明によれば、２Ｏ
００℃以下の温度で焼成でき、高比抵抗、かつ低誘電率
で、誘電体損失の少ない多層磁器基板を得ることができ
る。また、製造過程において、仮焼後の粉砕等の処理か
行い易く、しから酸化性雰囲気あるいは非酸化性雰囲気
のいずれの雰囲気中で焼成しても、比抵抗などの電気的
特性、抗折強度などの機械的特性、さらには熱的特性の
変化が無く、内部導体との反応ら見られないので、Ａｇ
やＡｇ−Ｐｄなどの他、ＣｕやＮｉなどの卑金属も使用
することができ、多層基板のコストダウンを図ることも
できる。さらに、導体としてサーメット抵抗材料などを
印刷して、抵抗体をも形成ずろことができるなど、優れ
た効果が得られる。(Effect of the invention) As is clear from the above explanation, according to the present invention, 2O
It is possible to obtain a multilayer ceramic substrate that can be fired at a temperature of 00° C. or lower, has high specific resistance, low dielectric constant, and little dielectric loss. In addition, in the manufacturing process, it is easy to carry out treatments such as pulverization after calcination, and even when firing in either an oxidizing atmosphere or a non-oxidizing atmosphere, electrical properties such as specific resistance, bending strength, etc. Ag
In addition to Ag--Pd, base metals such as Cu and Ni can also be used, and the cost of the multilayer board can be reduced. Furthermore, excellent effects can be obtained, such as printing a cermet resistance material or the like as a conductor, and making it possible to form a resistor as well.
Claims (2)
〜３０重量％、Ｂ＿２Ｏ＿３１．５〜５重量％、および
ＳｒＯ２５〜６０重量％またはＳｒＯとＢａＯ２５〜７
０重量％からなることを特徴とする電気回路基板用磁器
組成物。(1) SiO_225-70% by weight, Al_2O_31
~30 wt%, B_2O_31.5-5 wt%, and SrO25-60 wt% or SrO and BaO25-7
A ceramic composition for an electric circuit board, characterized in that the composition comprises 0% by weight.
量％以下含有する特許請求の範囲第１項記載の電気回路
基板用磁器組成物。(2) The ceramic composition for an electric circuit board according to claim 1, which contains at least 1.0% by weight of at least one alkali metal oxide.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP61024990A JPH0674168B2 (en) | 1986-02-06 | 1986-02-06 | Porcelain composition for electric circuit board |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP61024990A JPH0674168B2 (en) | 1986-02-06 | 1986-02-06 | Porcelain composition for electric circuit board |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| JPS62182157A true JPS62182157A (en) | 1987-08-10 |
| JPH0674168B2 JPH0674168B2 (en) | 1994-09-21 |
Family
ID=12153416
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP61024990A Expired - Lifetime JPH0674168B2 (en) | 1986-02-06 | 1986-02-06 | Porcelain composition for electric circuit board |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPH0674168B2 (en) |
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| WO2016185921A1 (en) * | 2015-05-15 | 2016-11-24 | 株式会社村田製作所 | Low-temperature-sintering ceramic material, ceramic sintered body, and ceramic electronic component |
-
1986
- 1986-02-06 JP JP61024990A patent/JPH0674168B2/en not_active Expired - Lifetime
Cited By (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| WO2016185921A1 (en) * | 2015-05-15 | 2016-11-24 | 株式会社村田製作所 | Low-temperature-sintering ceramic material, ceramic sintered body, and ceramic electronic component |
| JPWO2016185921A1 (en) * | 2015-05-15 | 2018-01-18 | 株式会社村田製作所 | Low temperature sintered ceramic materials, ceramic sintered bodies and ceramic electronic components |
| US10906839B2 (en) | 2015-05-15 | 2021-02-02 | Murata Manufacturing Co., Ltd. | Low temperature cofired ceramic material, ceramic sintered body, and ceramic electronic component |
Also Published As
| Publication number | Publication date |
|---|---|
| JPH0674168B2 (en) | 1994-09-21 |
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